JP4683233B2 - 半導体ウェーハの製造方法 - Google Patents

半導体ウェーハの製造方法 Download PDF

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Publication number
JP4683233B2
JP4683233B2 JP2006537796A JP2006537796A JP4683233B2 JP 4683233 B2 JP4683233 B2 JP 4683233B2 JP 2006537796 A JP2006537796 A JP 2006537796A JP 2006537796 A JP2006537796 A JP 2006537796A JP 4683233 B2 JP4683233 B2 JP 4683233B2
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JP
Japan
Prior art keywords
cleaning
wafer
polishing
water
chemical
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Active
Application number
JP2006537796A
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English (en)
Japanese (ja)
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JPWO2006035865A1 (ja
Inventor
秀樹 宗像
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to JP2006537796A priority Critical patent/JP4683233B2/ja
Publication of JPWO2006035865A1 publication Critical patent/JPWO2006035865A1/ja
Application granted granted Critical
Publication of JP4683233B2 publication Critical patent/JP4683233B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2006537796A 2004-09-30 2005-09-29 半導体ウェーハの製造方法 Active JP4683233B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006537796A JP4683233B2 (ja) 2004-09-30 2005-09-29 半導体ウェーハの製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004288178 2004-09-30
JP2004288178 2004-09-30
PCT/JP2005/017936 WO2006035865A1 (fr) 2004-09-30 2005-09-29 Procédé de fabrication de plaquettes semi-conductrices et plaquette semi-conductrice
JP2006537796A JP4683233B2 (ja) 2004-09-30 2005-09-29 半導体ウェーハの製造方法

Publications (2)

Publication Number Publication Date
JPWO2006035865A1 JPWO2006035865A1 (ja) 2008-05-15
JP4683233B2 true JP4683233B2 (ja) 2011-05-18

Family

ID=36119010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006537796A Active JP4683233B2 (ja) 2004-09-30 2005-09-29 半導体ウェーハの製造方法

Country Status (2)

Country Link
JP (1) JP4683233B2 (fr)
WO (1) WO2006035865A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5680846B2 (ja) * 2009-12-04 2015-03-04 株式会社Sumco エピタキシャルウェーハの製造方法
JP6311446B2 (ja) * 2014-05-19 2018-04-18 株式会社Sumco シリコンウェーハの製造方法
JP6432497B2 (ja) * 2015-12-10 2018-12-05 信越半導体株式会社 研磨方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283182A (ja) * 1994-04-12 1995-10-27 Nippon Steel Corp 半導体基板の洗浄方法
JP2001326210A (ja) * 2000-05-18 2001-11-22 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2002203824A (ja) * 2000-12-28 2002-07-19 Super Silicon Kenkyusho:Kk ウエハ洗浄方法
JP2003022993A (ja) * 2001-07-05 2003-01-24 Sony Corp 基板洗浄方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02100320A (ja) * 1988-10-06 1990-04-12 Fujitsu Ltd シリコンウエハーの製造方法
JPH07263384A (ja) * 1994-03-23 1995-10-13 Mitsubishi Materials Corp 半導体装置の製造方法
JP3225273B2 (ja) * 1997-03-26 2001-11-05 株式会社スーパーシリコン研究所 ウエハ基板の総合研磨装置
JP2004087666A (ja) * 2002-08-26 2004-03-18 Hitachi Cable Ltd 半導体ウェハの洗浄方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283182A (ja) * 1994-04-12 1995-10-27 Nippon Steel Corp 半導体基板の洗浄方法
JP2001326210A (ja) * 2000-05-18 2001-11-22 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2002203824A (ja) * 2000-12-28 2002-07-19 Super Silicon Kenkyusho:Kk ウエハ洗浄方法
JP2003022993A (ja) * 2001-07-05 2003-01-24 Sony Corp 基板洗浄方法

Also Published As

Publication number Publication date
WO2006035865A1 (fr) 2006-04-06
JPWO2006035865A1 (ja) 2008-05-15

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