JP4682858B2 - 電子機器用の冷却装置 - Google Patents

電子機器用の冷却装置 Download PDF

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Publication number
JP4682858B2
JP4682858B2 JP2006027838A JP2006027838A JP4682858B2 JP 4682858 B2 JP4682858 B2 JP 4682858B2 JP 2006027838 A JP2006027838 A JP 2006027838A JP 2006027838 A JP2006027838 A JP 2006027838A JP 4682858 B2 JP4682858 B2 JP 4682858B2
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Japan
Prior art keywords
heat
refrigerant liquid
heat exchanger
cooling
flow
Prior art date
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Expired - Fee Related
Application number
JP2006027838A
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English (en)
Japanese (ja)
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JP2007208154A5 (https=
JP2007208154A (ja
Inventor
繁男 大橋
憲治 荻路
洋典 及川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
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Hitachi Ltd
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Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2006027838A priority Critical patent/JP4682858B2/ja
Publication of JP2007208154A publication Critical patent/JP2007208154A/ja
Publication of JP2007208154A5 publication Critical patent/JP2007208154A5/ja
Application granted granted Critical
Publication of JP4682858B2 publication Critical patent/JP4682858B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2006027838A 2006-02-06 2006-02-06 電子機器用の冷却装置 Expired - Fee Related JP4682858B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006027838A JP4682858B2 (ja) 2006-02-06 2006-02-06 電子機器用の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006027838A JP4682858B2 (ja) 2006-02-06 2006-02-06 電子機器用の冷却装置

Publications (3)

Publication Number Publication Date
JP2007208154A JP2007208154A (ja) 2007-08-16
JP2007208154A5 JP2007208154A5 (https=) 2009-03-12
JP4682858B2 true JP4682858B2 (ja) 2011-05-11

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ID=38487329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006027838A Expired - Fee Related JP4682858B2 (ja) 2006-02-06 2006-02-06 電子機器用の冷却装置

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JP (1) JP4682858B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012038010A (ja) * 2010-08-05 2012-02-23 Fujitsu Ltd 受熱器、液冷ユニット及び電子機器
JP2014075563A (ja) * 2012-10-02 2014-04-24 Nakamura Mfg Co Ltd 沸騰冷却器の沸騰伝熱面及びその形成方法
JP6503909B2 (ja) * 2015-06-12 2019-04-24 株式会社デンソー 半導体装置
CN109227977A (zh) * 2018-10-25 2019-01-18 天津职业技术师范大学 半导体冷冲系统
CN113163696A (zh) * 2021-05-13 2021-07-23 黑龙江祥辉通信工程有限公司 一种基于5g的自动化散热通信装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368892A (ja) * 1989-08-07 1991-03-25 Takashige Yokoyama 競技用のタイマー
JP3654326B2 (ja) * 1996-11-25 2005-06-02 株式会社デンソー 沸騰冷却装置
JP2001077566A (ja) * 1999-09-07 2001-03-23 Matsushita Electric Ind Co Ltd 冷却素子
JP2001352020A (ja) * 2000-06-06 2001-12-21 Ricchisutoon:Kk 放熱素子の製造方法
JP2002110878A (ja) * 2000-09-28 2002-04-12 Matsushita Refrig Co Ltd 冷却モジュールとその冷却モジュールを使用した冷却システム
JP3908705B2 (ja) * 2003-08-29 2007-04-25 株式会社東芝 液冷装置及び液冷システム

Also Published As

Publication number Publication date
JP2007208154A (ja) 2007-08-16

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