JP4676859B2 - 電子部品パッケージ用プリント配線板及びその製造方法 - Google Patents
電子部品パッケージ用プリント配線板及びその製造方法 Download PDFInfo
- Publication number
- JP4676859B2 JP4676859B2 JP2005295344A JP2005295344A JP4676859B2 JP 4676859 B2 JP4676859 B2 JP 4676859B2 JP 2005295344 A JP2005295344 A JP 2005295344A JP 2005295344 A JP2005295344 A JP 2005295344A JP 4676859 B2 JP4676859 B2 JP 4676859B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- wire bonding
- pad portion
- plating
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000007747 plating Methods 0.000 claims description 118
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 94
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 68
- 239000010931 gold Substances 0.000 claims description 62
- 229910052737 gold Inorganic materials 0.000 claims description 62
- 229910052759 nickel Inorganic materials 0.000 claims description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 41
- 229910052802 copper Inorganic materials 0.000 claims description 40
- 239000010949 copper Substances 0.000 claims description 40
- 238000005530 etching Methods 0.000 claims description 25
- 238000009713 electroplating Methods 0.000 claims description 9
- 238000004381 surface treatment Methods 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 55
- 230000015572 biosynthetic process Effects 0.000 description 21
- 229910000679 solder Inorganic materials 0.000 description 12
- 239000011229 interlayer Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- -1 ammonium ions Chemical class 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
また、本発明の電子部品パッケージ用プリント配線板の製造方法によれば、斯かる品質に優れた電子部品パッケージ用プリント配線板を効率良く製造することができる。
2:絶縁材
3:回路配線
4:ワイヤーボンディングパッド部
5:有底孔
6:層間接続部
7:リード配線
8:回路部
9:リード配線接続部
11:ソルダーレジスト
12:耐金めっき用レジスト
15:金めっき
16:銅
51:電子部品
52:ワイヤーボンディングパッド部
53:層間接続部
54:ソルダーレジスト
55:金ワイヤー
56:回路配線
57:はんだ
58:接着材
59:封止材
60:断裁線
61:リード配線
64:ニッケル/金めっき
P1:プリント配線板
Claims (5)
- ワイヤーボンディングパッド部の表面に電解めっきをするための電源供給用のリード配線が除去され、かつワイヤーボンディングパッド部が残存している電子部品パッケージ用プリント配線板であって、当該ワイヤーボンディングパッド部が、除去された電源供給用のリード配線とはエッチング条件の異なる金属材料からなることを特徴とする電子部品パッケージ用プリント配線板。
- 前記ワイヤーボンディングパッド部の表面に、電解型の金めっきが施されていることを特徴とする請求項1に記載の電子部品パッケージ用プリント配線板。
- 電解型の金めっきが表面処理されるワイヤーボンディングパッド部及び当該ワイヤーボンディングパッド部に接続される電源供給用のリード配線を有する電子部品パッケージ用プリント配線板であって、当該ワイヤーボンディングパッド部と当該電源供給用のリード配線とがエッチング条件の異なる金属材料からなることを特徴とする電子部品パッケージ用プリント配線板。
- 前記ワイヤーボンディングパッド部がニッケルからなり、かつ当該電源供給用のリード配線が銅からなることを特徴とする請求項3に記載の電子部品パッケージ用プリント配線板。
- 電解型の金めっきが表面処理されたワイヤーボンディングパッド部を有する電子部品パッケージ用プリント配線板の製造方法であって、ニッケルからなるワイヤーボンディングパッド部及び回路配線を形成する工程と、当該ワイヤーボンディングパッド部に接続する電解金めっきをするための電源供給用のリード配線を銅めっきにより形成する工程と、金めっきレジストを張合せて当該リード配線を保護した後に、前記ワイヤーボンディングパッド部に電解型の金めっき表面処理をする工程と、選択的にエッチング加工により前記リード配線のみをエッチング除去し、前記ワイヤーボンディングパッド部を残存させる工程とを備えていることを特徴とする電子部品パッケージ用プリント配線板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005295344A JP4676859B2 (ja) | 2005-10-07 | 2005-10-07 | 電子部品パッケージ用プリント配線板及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005295344A JP4676859B2 (ja) | 2005-10-07 | 2005-10-07 | 電子部品パッケージ用プリント配線板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007103868A JP2007103868A (ja) | 2007-04-19 |
JP4676859B2 true JP4676859B2 (ja) | 2011-04-27 |
Family
ID=38030473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005295344A Active JP4676859B2 (ja) | 2005-10-07 | 2005-10-07 | 電子部品パッケージ用プリント配線板及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4676859B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8528200B2 (en) | 2009-12-18 | 2013-09-10 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing printed wiring board |
CN103747636A (zh) * | 2013-12-24 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | 镀金线路板引线回蚀的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002016347A (ja) * | 2000-06-27 | 2002-01-18 | Mitsui Chemicals Inc | プリント回路板の製造方法 |
JP2005005409A (ja) * | 2003-06-11 | 2005-01-06 | Matsushita Electric Ind Co Ltd | 半導体装置 |
-
2005
- 2005-10-07 JP JP2005295344A patent/JP4676859B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002016347A (ja) * | 2000-06-27 | 2002-01-18 | Mitsui Chemicals Inc | プリント回路板の製造方法 |
JP2005005409A (ja) * | 2003-06-11 | 2005-01-06 | Matsushita Electric Ind Co Ltd | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2007103868A (ja) | 2007-04-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7227250B2 (en) | Ball grid array substrate having window and method of fabricating same | |
US20060060558A1 (en) | Method of fabricating package substrate using electroless nickel plating | |
JP2006188745A (ja) | 内部ビアホールの充填メッキ構造及びその製造方法 | |
JP2005322868A (ja) | プリント回路基板の電解金メッキ方法 | |
CN100518444C (zh) | 利用激光钻孔机的过孔形成方法 | |
JP2008004862A (ja) | プリント配線板及びその製造方法 | |
JP4488187B2 (ja) | ビアホールを有する基板の製造方法 | |
JP4676859B2 (ja) | 電子部品パッケージ用プリント配線板及びその製造方法 | |
KR100772432B1 (ko) | 인쇄 회로 기판 제조 방법 | |
JPH1187931A (ja) | プリント配線板の製造方法 | |
JP4129665B2 (ja) | 半導体パッケージ用基板の製造方法 | |
JP4730222B2 (ja) | 配線基板の製造方法 | |
JP4137279B2 (ja) | プリント配線板及びその製造方法 | |
JP2006186059A (ja) | 多層プリント配線板及びその製造方法 | |
US20040141299A1 (en) | Burrless castellation via process and product for plastic chip carrier | |
WO2014024754A1 (ja) | 半導体パッケージ用回路基板及びその製造方法 | |
JP2005209775A (ja) | 多層配線基板の製造方法及び多層配線基板 | |
JP5040346B2 (ja) | プリント配線板の製造方法 | |
JP2005159330A (ja) | 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ | |
JP2005217216A (ja) | 半導体装置用両面配線テープキャリアおよびその製造方法 | |
JP2011061161A (ja) | プリント配線板の製造方法 | |
JP2001230507A (ja) | プラスチックパッケージ及びその製造方法 | |
JPH1187886A (ja) | プリント配線板の製造方法 | |
KR20100072921A (ko) | 양면 연성회로기판의 제조방법 | |
JP2004319994A (ja) | プリント配線板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080919 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090226 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101124 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101227 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110125 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110128 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140204 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4676859 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |