JP4668280B2 - アクティブマトリクス基板、表示装置、テレビジョン受像機 - Google Patents
アクティブマトリクス基板、表示装置、テレビジョン受像機 Download PDFInfo
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- JP4668280B2 JP4668280B2 JP2007550077A JP2007550077A JP4668280B2 JP 4668280 B2 JP4668280 B2 JP 4668280B2 JP 2007550077 A JP2007550077 A JP 2007550077A JP 2007550077 A JP2007550077 A JP 2007550077A JP 4668280 B2 JP4668280 B2 JP 4668280B2
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- 239000000758 substrate Substances 0.000 title claims description 76
- 239000011159 matrix material Substances 0.000 title claims description 72
- 239000004065 semiconductor Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 229910052715 tantalum Inorganic materials 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 8
- 230000035515 penetration Effects 0.000 claims description 5
- 230000005669 field effect Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 53
- 239000010408 film Substances 0.000 description 46
- 239000004973 liquid crystal related substance Substances 0.000 description 33
- 238000000605 extraction Methods 0.000 description 24
- 239000003990 capacitor Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000003860 storage Methods 0.000 description 11
- 230000007423 decrease Effects 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Substances CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 229910021417 amorphous silicon Inorganic materials 0.000 description 8
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 238000001259 photo etching Methods 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 235000019557 luminance Nutrition 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- -1 IZO Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Description
5 刳り貫き部
7 ドレイン引き出し電極(電極領域)
8 ドレイン電極
11 コンタクトホール
12 TFT
15 データ信号線
16 走査信号線
17 画素電極
55 切り欠き部
Claims (14)
- トランジスタと、画素電極と、上記トランジスタの一方の導通電極に接続する電極領域と、該電極領域および上記画素電極を接続するコンタクトホールとを備えたアクティブマトリクス基板であって、
上記電極領域には光透過部となる刳り貫き部が設けられ、上記コンタクトホールの開口部が上記刳り貫き部と交差していることを特徴とするアクティブマトリクス基板。 - トランジスタと、画素電極と、上記トランジスタの一方の導通電極に接続する電極領域と、該電極領域および上記画素電極を接続するコンタクトホールとを備えたアクティブマトリクス基板であって、
上記電極領域には光透過部となる切り欠き部が設けられ、上記コンタクトホールの開口部が上記切り欠き部と交差していることを特徴とするアクティブマトリクス基板。 - 上記刳り貫き部および上記開口部の少なくとも一方が延伸形状であることを特徴とする請求項1記載のアクティブマトリクス基板。
- 上記切り欠き部および上記開口部の少なくとも一方が延伸形状であることを特徴とする請求項2記載のアクティブマトリクス基板。
- 上記延伸形状が長方形形状であることを特徴とする請求項3記載のアクティブマトリクス基板。
- 上記開口部および刳り貫き部がともに延伸形状を有しており、
上記開口部の延伸方向と刳り貫き部の延伸方向とが略直角に交差していることを特徴とする請求項3記載のアクティブマトリクス基板。 - 1つの画素電極に対して複数のコンタクトホールと各コンタクトホールに対応する刳り抜き部とが設けられ、各コンタクトホールの開口部が延伸形状に形成されるとともに対応する刳り抜き部と交差していることを特徴とする請求項1記載のアクティブマトリクス基板。
- 各コンタクトホールの開口部の延伸方向が互いに直交することを特徴とする請求項7記載のアクティブマトリクス基板。
- 上記トランジスタは電界効果トランジスタであり、上記電極領域は電界効果トランジスタのドレイン電極に接続していることを特徴とする請求項1記載のアクティブマトリクス基板。
- コンタクトホール内において、上記電極領域の下層に該電極領域に接触する半導体層が設けられていることを特徴とする請求項1記載のアクティブマトリクス基板。
- 上記電極領域は、Alを主成分とする金属層とTiあるいはTaを主成分とする金属層との積層構造を有し、該TiあるいはTaを主成分とする金属層が上記画素電極に接続されていることを特徴とする請求項1記載のアクティブマトリクス基板。
- 上記半導体層は、高抵抗半導体層と低抵抗半導体層との積層構造を有することを特徴とする請求項10記載のアクティブマトリクス基板。
- 請求項1から12のいずれか1項に記載のアクティブマトリクス基板を備えることを特徴とする表示装置。
- 請求項13記載の表示装置と、テレビジョン放送を受信するチューナとを備えることを特徴とするテレビジョン受像機。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005362192 | 2005-12-15 | ||
JP2005362192 | 2005-12-15 | ||
PCT/JP2006/314987 WO2007069362A1 (ja) | 2005-12-15 | 2006-07-28 | アクティブマトリクス基板、表示装置、テレビジョン受像機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007069362A1 JPWO2007069362A1 (ja) | 2009-05-21 |
JP4668280B2 true JP4668280B2 (ja) | 2011-04-13 |
Family
ID=38162680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007550077A Active JP4668280B2 (ja) | 2005-12-15 | 2006-07-28 | アクティブマトリクス基板、表示装置、テレビジョン受像機 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8089574B2 (ja) |
JP (1) | JP4668280B2 (ja) |
CN (1) | CN101326560B (ja) |
WO (1) | WO2007069362A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150026402A (ko) * | 2013-09-03 | 2015-03-11 | 삼성디스플레이 주식회사 | 표시 기판 및 표시 기판을 포함하는 액정표시장치 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009142089A1 (ja) * | 2008-05-20 | 2009-11-26 | シャープ株式会社 | 表示パネル用の基板、この基板を備える表示パネル、表示パネル用の基板の製造方法および表示パネルの製造方法 |
TWI402596B (zh) * | 2009-10-01 | 2013-07-21 | Chunghwa Picture Tubes Ltd | 具有電容補償的畫素結構 |
US20130009160A1 (en) * | 2010-03-19 | 2013-01-10 | Sharp Kabushiki Kaisha | Active matrix substrate |
US9599868B2 (en) * | 2012-02-17 | 2017-03-21 | Sharp Kabushiki Kaisha | Liquid crystal display panel comprising a contact site for a pixel electrode that is wider than a line portion of a lead-out line when viewed in a plan view |
CN103531096B (zh) | 2013-10-17 | 2016-07-06 | 京东方科技集团股份有限公司 | 显示基板及其制作方法、显示面板和显示装置 |
CN106340245B (zh) * | 2016-11-14 | 2019-06-14 | 厦门天马微电子有限公司 | 显示装置 |
CN109240017B (zh) * | 2018-11-22 | 2021-09-28 | 上海天马微电子有限公司 | 显示面板和显示装置 |
CN112435619B (zh) * | 2020-11-26 | 2023-06-06 | 武汉天马微电子有限公司 | 显示模组及显示模组的测试方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001272698A (ja) * | 2000-03-27 | 2001-10-05 | Sharp Corp | 液晶表示装置の製造方法 |
JP2002329726A (ja) * | 2001-04-26 | 2002-11-15 | Advanced Display Inc | Tftアレイ基板及びこれを用いた液晶表示装置 |
JP2003248441A (ja) * | 2002-02-26 | 2003-09-05 | Sanyo Electric Co Ltd | 表示装置 |
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US5058995A (en) * | 1990-03-15 | 1991-10-22 | Thomson Consumer Electronics, Inc. | Pixel electrode structure for liquid crystal display devices |
JP3036513B2 (ja) * | 1998-06-10 | 2000-04-24 | 日本電気株式会社 | 液晶表示装置 |
JP3463006B2 (ja) * | 1998-10-26 | 2003-11-05 | シャープ株式会社 | 液晶表示装置の製造方法および液晶表示装置 |
TW578028B (en) | 1999-12-16 | 2004-03-01 | Sharp Kk | Liquid crystal display and manufacturing method thereof |
JP4107047B2 (ja) | 2002-10-24 | 2008-06-25 | セイコーエプソン株式会社 | 半透過型液晶表示装置 |
TWI271870B (en) * | 2005-10-24 | 2007-01-21 | Chunghwa Picture Tubes Ltd | Thin film transistor, pixel structure and repairing method thereof |
US7688392B2 (en) * | 2006-04-06 | 2010-03-30 | Chunghwa Picture Tubes, Ltd. | Pixel structure including a gate having an opening and an extension line between the data line and the source |
-
2006
- 2006-07-28 JP JP2007550077A patent/JP4668280B2/ja active Active
- 2006-07-28 WO PCT/JP2006/314987 patent/WO2007069362A1/ja active Application Filing
- 2006-07-28 CN CN2006800458865A patent/CN101326560B/zh not_active Expired - Fee Related
- 2006-07-28 US US12/095,938 patent/US8089574B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001272698A (ja) * | 2000-03-27 | 2001-10-05 | Sharp Corp | 液晶表示装置の製造方法 |
JP2002329726A (ja) * | 2001-04-26 | 2002-11-15 | Advanced Display Inc | Tftアレイ基板及びこれを用いた液晶表示装置 |
JP2003248441A (ja) * | 2002-02-26 | 2003-09-05 | Sanyo Electric Co Ltd | 表示装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150026402A (ko) * | 2013-09-03 | 2015-03-11 | 삼성디스플레이 주식회사 | 표시 기판 및 표시 기판을 포함하는 액정표시장치 |
KR102085151B1 (ko) * | 2013-09-03 | 2020-04-16 | 삼성디스플레이 주식회사 | 표시 기판 및 표시 기판을 포함하는 액정표시장치 |
Also Published As
Publication number | Publication date |
---|---|
WO2007069362A1 (ja) | 2007-06-21 |
CN101326560B (zh) | 2010-09-15 |
CN101326560A (zh) | 2008-12-17 |
US8089574B2 (en) | 2012-01-03 |
JPWO2007069362A1 (ja) | 2009-05-21 |
US20100214490A1 (en) | 2010-08-26 |
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