JP4662053B2 - 複数の検出器を有する走査電子顕微鏡および複数の検出器ベースのイメージング方法 - Google Patents
複数の検出器を有する走査電子顕微鏡および複数の検出器ベースのイメージング方法 Download PDFInfo
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- JP4662053B2 JP4662053B2 JP2005507924A JP2005507924A JP4662053B2 JP 4662053 B2 JP4662053 B2 JP 4662053B2 JP 2005507924 A JP2005507924 A JP 2005507924A JP 2005507924 A JP2005507924 A JP 2005507924A JP 4662053 B2 JP4662053 B2 JP 4662053B2
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- 238000003384 imaging method Methods 0.000 title description 4
- 238000010894 electron beam technology Methods 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 25
- 238000001514 detection method Methods 0.000 claims description 24
- 230000003287 optical effect Effects 0.000 claims description 23
- 230000005686 electrostatic field Effects 0.000 claims description 18
- 230000007547 defect Effects 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 4
- 238000011144 upstream manufacturing Methods 0.000 claims 2
- 239000002245 particle Substances 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 125000003821 2-(trimethylsilyl)ethoxymethyl group Chemical group [H]C([H])([H])[Si](C([H])([H])[H])(C([H])([H])[H])C([H])([H])C(OC([H])([H])[*])([H])[H] 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2446—Position sensitive detectors
- H01J2237/24465—Sectored detectors, e.g. quadrants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/24475—Scattered electron detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2449—Detector devices with moving charges in electric or magnetic fields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/24495—Signal processing, e.g. mixing of two or more signals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2809—Scanning microscopes characterised by the imaging problems involved
- H01J2237/281—Bottom of trenches or holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2814—Measurement of surface topography
- H01J2237/2815—Depth profile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
Description
Claims (14)
- カラムを介して光軸に沿って伝搬するように一次電子ビームを向けるステップと、
前記一次電子ビームが内側レンズ検出器を回り込んで伝搬するように、前記一次電子ビームを偏向して、前記一次電子ビームの伝搬方向に関して内側レンズ検出器の上流側で前記一次電子ビームを前記光軸から遠ざけて、そして前記一次電子ビームの伝搬方向に関して前記内側レンズ検出器の下流側で前記光軸に沿って伝搬するように前記一次電子ビームを戻し、前記一次電子ビームをオブジェクトに衝突させて、前記オブジェクトからの前記一次電子ビームの反射および散乱の少なくとも1つの結果として得られる電子を生成するステップと、
前記生成された電子の第1の部分を複数のレンズ内検出器によって検出するステップと、
実質的な静電界を導入することによって、初期軌跡が前記光軸にほぼ一致する前記生成された電子の第2の部分の軌跡を、内側レンズ検出器アセンブリに方向付けるステップと、
前記生成された電子の第2の部分を、前記内側レンズアセンブリによって検出するステップと、
を備える方法。 - 実質的な静電界を導入するステップが、前記オブジェクトと前記カラムの第1の部分間の第1の電圧電位差を導入する工程と、前記カラムの第2の部分と前記オブジェクト間の第2の電圧電位差を導入する工程と、を備える、請求項1に記載の方法。
- 前記カラムの前記第1の部分が前記第2の部分より下方に位置決めされており、前記第1の電圧電位差が前記第2の電圧電位差よりも小さい、請求項2に記載の方法。
- 検出信号を処理して、欠陥またはプロセスバリエーションについての指示を提供するステップを更に備える、請求項1に記載の方法。
- 前記実質的な静電界を変更して、前記レンズ内検出器および前記内側レンズ検出器の1つ以上の収集ゾーンを改めるステップを更に備える、請求項1に記載の方法。
- 前記オブジェクトの被検査エリアが前記実質的な静電界内に位置決めされる、請求項1に記載の方法。
- 検出された電子が、高アスペクト比のホールの下部部分からの電子を含む、請求項1に記載の方法。
- カラムを介して光軸に沿って伝搬するように一次電子ビームを向ける手段と、
前記一次電子ビームが内側レンズ検出器を回り込んで伝搬するように、前記一次電子ビームを偏向して、前記一次電子ビームの伝搬方向に関して内側レンズ検出器の上流側で前記一次電子ビームを前記光軸から遠ざけて、そして前記一次電子ビームの伝搬方向に関して前記内側レンズ検出器の下流側で前記光軸に沿って伝搬するように前記一次電子ビームを戻し、前記一次電子ビームをオブジェクトに衝突させて、当該オブジェクトからの前記一次電子ビーム反射および散乱の少なくとも1つの結果として得られる電子を生成する手段と、
前記生成された電子の第1の部分を検出する複数のレンズ内検出器と、
実質的な静電界を導入することによって、初期軌跡が前記光軸にほぼ一致する前記生成された電子の第2の部分の軌跡を、内側レンズ検出器アセンブリに方向付ける手段と、
前記生成された電子の第2の部分を検出するための内側レンズ検出器アセンブリと、
を備えるシステム。 - 前記カラムが、第1の電圧レベルと関連した第1の部分と、第2の電圧レベルと関連した第2の部分とを備える、請求項8に記載のシステム。
- 前記カラムの前記第1の部分が前記第2の部分より下方に位置決めされている、請求項9に記載のシステム。
- 前記実質的な静電界を変更して、前記レンズ内検出器および前記内側レンズ検出器の1つ以上の収集ゾーンを改めるように更に適合された、請求項8に記載のシステム。
- 前記オブジェクトの被検査エリアが前記実質的な静電レンズ内に位置決めされる、請求項8に記載のシステム。
- 前記一次電子ビームと前記被検査エリア間に傾斜を導入することが更に可能な、請求項12に記載のシステム。
- 前記生成された電子が、高アスペクト比のホールの下部部分からの電子を含む、請求項12に記載のシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US49161803P | 2003-07-30 | 2003-07-30 | |
PCT/US2003/033648 WO2005017511A1 (en) | 2003-07-30 | 2003-10-22 | Scanning electron microscope having multiple detectors and a method for multiple detector based imaging |
Publications (2)
Publication Number | Publication Date |
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JP2007521461A JP2007521461A (ja) | 2007-08-02 |
JP4662053B2 true JP4662053B2 (ja) | 2011-03-30 |
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JP2005507924A Expired - Lifetime JP4662053B2 (ja) | 2003-07-30 | 2003-10-22 | 複数の検出器を有する走査電子顕微鏡および複数の検出器ベースのイメージング方法 |
Country Status (6)
Country | Link |
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US (1) | US7847267B2 (ja) |
JP (1) | JP4662053B2 (ja) |
KR (1) | KR101041661B1 (ja) |
CN (1) | CN1820194B (ja) |
AU (1) | AU2003284339A1 (ja) |
WO (1) | WO2005017511A1 (ja) |
Families Citing this family (11)
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EP2518755B1 (en) * | 2011-04-26 | 2014-10-15 | FEI Company | In-column detector for particle-optical column |
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EP2706554B1 (en) * | 2012-09-10 | 2016-05-25 | Fei Company | Method of using a compound particle-optical lens |
CN104091745B (zh) * | 2014-07-18 | 2016-06-01 | 镇江乐华电子科技有限公司 | 一种集成tem荧光屏和stem探测器的一体化结构 |
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CN108807118A (zh) * | 2018-06-08 | 2018-11-13 | 聚束科技(北京)有限公司 | 一种扫描电子显微镜系统及样品探测方法 |
US11280749B1 (en) * | 2020-10-23 | 2022-03-22 | Applied Materials Israel Ltd. | Holes tilt angle measurement using FIB diagonal cut |
CN113096118B (zh) * | 2021-04-30 | 2022-09-13 | 上海众壹云计算科技有限公司 | 晶圆表面粗糙度测量的方法、系统、电子设备和存储介质 |
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2003
- 2003-10-22 JP JP2005507924A patent/JP4662053B2/ja not_active Expired - Lifetime
- 2003-10-22 WO PCT/US2003/033648 patent/WO2005017511A1/en active Application Filing
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09171791A (ja) * | 1995-10-19 | 1997-06-30 | Hitachi Ltd | 走査形電子顕微鏡 |
JPH10294074A (ja) * | 1997-04-18 | 1998-11-04 | Hitachi Ltd | 走査電子顕微鏡 |
JP2001110351A (ja) * | 1999-10-05 | 2001-04-20 | Hitachi Ltd | 走査電子顕微鏡 |
JP2003157790A (ja) * | 2001-11-20 | 2003-05-30 | Advantest Corp | 微細凹凸量測定装置及び走査型電子顕微鏡 |
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JP2007521461A (ja) | 2007-08-02 |
US20060054814A1 (en) | 2006-03-16 |
CN1820194A (zh) | 2006-08-16 |
CN1820194B (zh) | 2012-06-13 |
WO2005017511A1 (en) | 2005-02-24 |
KR101041661B1 (ko) | 2011-06-14 |
US7847267B2 (en) | 2010-12-07 |
KR20060056964A (ko) | 2006-05-25 |
AU2003284339A1 (en) | 2005-03-07 |
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