JP4659929B2 - 固体材料の薄膜形成方法及び該方法の応用 - Google Patents

固体材料の薄膜形成方法及び該方法の応用 Download PDF

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JP4659929B2
JP4659929B2 JP54059597A JP54059597A JP4659929B2 JP 4659929 B2 JP4659929 B2 JP 4659929B2 JP 54059597 A JP54059597 A JP 54059597A JP 54059597 A JP54059597 A JP 54059597A JP 4659929 B2 JP4659929 B2 JP 4659929B2
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substrate
thin film
support
layer
ferroelectric material
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JP2000510284A (ja
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ブリュエール，ミシェル
アスパー，ベルナール
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コミッサリア ア レネルジー アトミーク エ オ ゼネルジ ザルタナテイヴ
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/48—Ion implantation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
    • H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H10P90/1916—Preparing SOI wafers using bonding with separation or delamination along an ion implanted layer, e.g. Smart-cut
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Semiconductor Memories (AREA)
  • Physical Vapour Deposition (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP54059597A 1996-05-15 1997-05-13 固体材料の薄膜形成方法及び該方法の応用 Expired - Lifetime JP4659929B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR96/06085 1996-05-15
FR9606085A FR2748850B1 (fr) 1996-05-15 1996-05-15 Procede de realisation d'un film mince de materiau solide et applications de ce procede
PCT/FR1997/000842 WO1997043461A1 (fr) 1996-05-15 1997-05-13 Procede de realisation d'un film mince de materiau solide et applications de ce procede

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008213117A Division JP2009010409A (ja) 1996-05-15 2008-08-21 固体材料の薄膜形成方法及び該方法の応用

Publications (2)

Publication Number Publication Date
JP2000510284A JP2000510284A (ja) 2000-08-08
JP4659929B2 true JP4659929B2 (ja) 2011-03-30

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Family Applications (2)

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JP54059597A Expired - Lifetime JP4659929B2 (ja) 1996-05-15 1997-05-13 固体材料の薄膜形成方法及び該方法の応用
JP2008213117A Pending JP2009010409A (ja) 1996-05-15 2008-08-21 固体材料の薄膜形成方法及び該方法の応用

Family Applications After (1)

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JP2008213117A Pending JP2009010409A (ja) 1996-05-15 2008-08-21 固体材料の薄膜形成方法及び該方法の応用

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Country Link
US (1) US6190998B1 (https=)
EP (1) EP0902843B1 (https=)
JP (2) JP4659929B2 (https=)
KR (1) KR20000011051A (https=)
DE (1) DE69701571T2 (https=)
FR (1) FR2748850B1 (https=)
WO (1) WO1997043461A1 (https=)

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Also Published As

Publication number Publication date
WO1997043461A1 (fr) 1997-11-20
US6190998B1 (en) 2001-02-20
EP0902843A1 (fr) 1999-03-24
JP2000510284A (ja) 2000-08-08
FR2748850B1 (fr) 1998-07-24
KR20000011051A (ko) 2000-02-25
DE69701571T2 (de) 2000-10-19
EP0902843B1 (fr) 2000-03-29
JP2009010409A (ja) 2009-01-15
FR2748850A1 (fr) 1997-11-21
DE69701571D1 (de) 2000-05-04

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