JP4653395B2 - プラズマ処理装置 - Google Patents
プラズマ処理装置 Download PDFInfo
- Publication number
- JP4653395B2 JP4653395B2 JP2003401178A JP2003401178A JP4653395B2 JP 4653395 B2 JP4653395 B2 JP 4653395B2 JP 2003401178 A JP2003401178 A JP 2003401178A JP 2003401178 A JP2003401178 A JP 2003401178A JP 4653395 B2 JP4653395 B2 JP 4653395B2
- Authority
- JP
- Japan
- Prior art keywords
- voltage
- plasma
- frequency
- voltage waveform
- substrate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003401178A JP4653395B2 (ja) | 2000-09-29 | 2003-12-01 | プラズマ処理装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000302824 | 2000-09-29 | ||
| JP2000364537 | 2000-11-27 | ||
| JP2003401178A JP4653395B2 (ja) | 2000-09-29 | 2003-12-01 | プラズマ処理装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001286051A Division JP3563054B2 (ja) | 2000-09-29 | 2001-09-20 | プラズマ処理装置および方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004140391A JP2004140391A (ja) | 2004-05-13 |
| JP2004140391A5 JP2004140391A5 (enExample) | 2008-10-23 |
| JP4653395B2 true JP4653395B2 (ja) | 2011-03-16 |
Family
ID=32475092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003401178A Expired - Lifetime JP4653395B2 (ja) | 2000-09-29 | 2003-12-01 | プラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4653395B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4607930B2 (ja) | 2007-09-14 | 2011-01-05 | 株式会社東芝 | プラズマ処理装置およびプラズマ処理方法 |
| JP2012104382A (ja) * | 2010-11-10 | 2012-05-31 | Tokyo Electron Ltd | プラズマ処理装置及びプラズマ処理方法並びにプラズマ処理のバイアス電圧決定方法 |
| KR101111963B1 (ko) | 2010-12-02 | 2012-02-14 | 한국기초과학지원연구원 | 축전결합 플라즈마원의 바이어스 위상제어에 의한 포텐셜 분석 방법 |
| US8598040B2 (en) * | 2011-09-06 | 2013-12-03 | Lam Research Corporation | ETCH process for 3D flash structures |
| KR102201886B1 (ko) * | 2013-06-11 | 2021-01-12 | 세메스 주식회사 | 기판 처리 장치 및 플라즈마 발생 방법 |
| US10546724B2 (en) | 2017-05-10 | 2020-01-28 | Mks Instruments, Inc. | Pulsed, bidirectional radio frequency source/load |
| KR20240073030A (ko) * | 2021-10-04 | 2024-05-24 | 램 리써치 코포레이션 | 유도 커플링 플라즈마 (inductively coupled plasma) 에서 이온 에너지를 향상시키고 이온 에너지 확산을 감소시키기 위한 방법 및 장치 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06338476A (ja) * | 1993-03-31 | 1994-12-06 | Tokyo Electron Ltd | プラズマ処理方法 |
| JPH07249614A (ja) * | 1994-03-10 | 1995-09-26 | Kokusai Electric Co Ltd | プラズマエッチング方法及びその装置 |
| US6252354B1 (en) * | 1996-11-04 | 2001-06-26 | Applied Materials, Inc. | RF tuning method for an RF plasma reactor using frequency servoing and power, voltage, current or DI/DT control |
-
2003
- 2003-12-01 JP JP2003401178A patent/JP4653395B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004140391A (ja) | 2004-05-13 |
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