JP4651367B2 - 半導体装置および半導体装置の製造方法 - Google Patents

半導体装置および半導体装置の製造方法 Download PDF

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Publication number
JP4651367B2
JP4651367B2 JP2004350646A JP2004350646A JP4651367B2 JP 4651367 B2 JP4651367 B2 JP 4651367B2 JP 2004350646 A JP2004350646 A JP 2004350646A JP 2004350646 A JP2004350646 A JP 2004350646A JP 4651367 B2 JP4651367 B2 JP 4651367B2
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Prior art keywords
bump
bumps
lead
semiconductor chip
chip
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Expired - Fee Related
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JP2004350646A
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Japanese (ja)
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JP2006013421A5 (enrdf_load_stackoverflow
JP2006013421A (ja
Inventor
誠一 市原
伸弥 金光
信治 東條
寿雄 中村
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Renesas Electronics Corp
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Renesas Electronics Corp
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JP2004350646A 2004-05-27 2004-12-03 半導体装置および半導体装置の製造方法 Expired - Fee Related JP4651367B2 (ja)

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JP2004350646A JP4651367B2 (ja) 2004-05-27 2004-12-03 半導体装置および半導体装置の製造方法

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JP2004157929 2004-05-27
JP2004350646A JP4651367B2 (ja) 2004-05-27 2004-12-03 半導体装置および半導体装置の製造方法

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JP2006013421A JP2006013421A (ja) 2006-01-12
JP2006013421A5 JP2006013421A5 (enrdf_load_stackoverflow) 2008-01-10
JP4651367B2 true JP4651367B2 (ja) 2011-03-16

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105974703A (zh) * 2016-07-13 2016-09-28 武汉华星光电技术有限公司 液晶显示面板
US11537014B2 (en) 2020-06-22 2022-12-27 Samsung Display Co., Ltd. Display device
US11627660B2 (en) 2020-03-31 2023-04-11 Samsung Display Co., Ltd. Flexible circuit board and display apparatus including ihe same

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196528A (ja) * 2005-01-11 2006-07-27 Seiko Epson Corp 半導体装置
JP4116055B2 (ja) * 2006-12-04 2008-07-09 シャープ株式会社 半導体装置
JP5001731B2 (ja) 2007-07-02 2012-08-15 日東電工株式会社 配線回路基板と電子部品との接続構造
JP2009094361A (ja) * 2007-10-10 2009-04-30 Nitto Denko Corp Ｃｏｆ基板
KR101415567B1 (ko) 2007-12-11 2014-07-04 삼성디스플레이 주식회사 가요성 인쇄 회로막 및 이를 포함하는 표시 장치
JP5395407B2 (ja) * 2008-11-12 2014-01-22 ルネサスエレクトロニクス株式会社 表示装置駆動用半導体集積回路装置および表示装置駆動用半導体集積回路装置の製造方法
JP5547427B2 (ja) * 2009-06-17 2014-07-16 株式会社ジャパンディスプレイ 表示装置
JP6028908B2 (ja) * 2012-07-27 2016-11-24 セイコーエプソン株式会社 半導体装置
JP6698369B2 (ja) 2016-02-10 2020-05-27 シナプティクス・ジャパン合同会社 表示ドライバ及び表示パネルモジュール
KR102751172B1 (ko) 2016-11-30 2025-01-07 삼성디스플레이 주식회사 표시 장치
TWI672774B (zh) 2018-11-08 2019-09-21 友達光電股份有限公司 覆晶薄膜封裝結構及顯示裝置
TWI726675B (zh) * 2020-04-09 2021-05-01 南茂科技股份有限公司 薄膜覆晶封裝結構

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3781967B2 (ja) * 2000-12-25 2006-06-07 株式会社日立製作所 表示装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105974703A (zh) * 2016-07-13 2016-09-28 武汉华星光电技术有限公司 液晶显示面板
US11627660B2 (en) 2020-03-31 2023-04-11 Samsung Display Co., Ltd. Flexible circuit board and display apparatus including ihe same
US11537014B2 (en) 2020-06-22 2022-12-27 Samsung Display Co., Ltd. Display device

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Publication number Publication date
JP2006013421A (ja) 2006-01-12

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