JP2006013421A5 - - Google Patents

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Publication number
JP2006013421A5
JP2006013421A5 JP2004350646A JP2004350646A JP2006013421A5 JP 2006013421 A5 JP2006013421 A5 JP 2006013421A5 JP 2004350646 A JP2004350646 A JP 2004350646A JP 2004350646 A JP2004350646 A JP 2004350646A JP 2006013421 A5 JP2006013421 A5 JP 2006013421A5
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JP
Japan
Prior art keywords
bumps
semiconductor device
leads
bump
chip
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Application number
JP2004350646A
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English (en)
Japanese (ja)
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JP4651367B2 (ja
JP2006013421A (ja
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Publication date
Application filed filed Critical
Priority to JP2004350646A priority Critical patent/JP4651367B2/ja
Priority claimed from JP2004350646A external-priority patent/JP4651367B2/ja
Publication of JP2006013421A publication Critical patent/JP2006013421A/ja
Publication of JP2006013421A5 publication Critical patent/JP2006013421A5/ja
Application granted granted Critical
Publication of JP4651367B2 publication Critical patent/JP4651367B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004350646A 2004-05-27 2004-12-03 半導体装置および半導体装置の製造方法 Expired - Fee Related JP4651367B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004350646A JP4651367B2 (ja) 2004-05-27 2004-12-03 半導体装置および半導体装置の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004157929 2004-05-27
JP2004350646A JP4651367B2 (ja) 2004-05-27 2004-12-03 半導体装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006013421A JP2006013421A (ja) 2006-01-12
JP2006013421A5 true JP2006013421A5 (enrdf_load_stackoverflow) 2008-01-10
JP4651367B2 JP4651367B2 (ja) 2011-03-16

Family

ID=35780249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004350646A Expired - Fee Related JP4651367B2 (ja) 2004-05-27 2004-12-03 半導体装置および半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4651367B2 (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196528A (ja) * 2005-01-11 2006-07-27 Seiko Epson Corp 半導体装置
JP4116055B2 (ja) * 2006-12-04 2008-07-09 シャープ株式会社 半導体装置
JP5001731B2 (ja) 2007-07-02 2012-08-15 日東電工株式会社 配線回路基板と電子部品との接続構造
JP2009094361A (ja) * 2007-10-10 2009-04-30 Nitto Denko Corp Ｃｏｆ基板
KR101415567B1 (ko) 2007-12-11 2014-07-04 삼성디스플레이 주식회사 가요성 인쇄 회로막 및 이를 포함하는 표시 장치
JP5395407B2 (ja) * 2008-11-12 2014-01-22 ルネサスエレクトロニクス株式会社 表示装置駆動用半導体集積回路装置および表示装置駆動用半導体集積回路装置の製造方法
JP5547427B2 (ja) * 2009-06-17 2014-07-16 株式会社ジャパンディスプレイ 表示装置
JP6028908B2 (ja) * 2012-07-27 2016-11-24 セイコーエプソン株式会社 半導体装置
JP6698369B2 (ja) 2016-02-10 2020-05-27 シナプティクス・ジャパン合同会社 表示ドライバ及び表示パネルモジュール
CN105974703A (zh) * 2016-07-13 2016-09-28 武汉华星光电技术有限公司 液晶显示面板
KR102751172B1 (ko) 2016-11-30 2025-01-07 삼성디스플레이 주식회사 표시 장치
TWI672774B (zh) 2018-11-08 2019-09-21 友達光電股份有限公司 覆晶薄膜封裝結構及顯示裝置
KR102832988B1 (ko) 2020-03-31 2025-07-14 삼성디스플레이 주식회사 연성 회로 기판 및 이를 포함한 표시 장치
TWI726675B (zh) * 2020-04-09 2021-05-01 南茂科技股份有限公司 薄膜覆晶封裝結構
KR102788713B1 (ko) 2020-06-22 2025-04-02 삼성디스플레이 주식회사 표시장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3781967B2 (ja) * 2000-12-25 2006-06-07 株式会社日立製作所 表示装置

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