JP4637861B2 - 電子素子を検査・回転させる装置 - Google Patents
電子素子を検査・回転させる装置 Download PDFInfo
- Publication number
- JP4637861B2 JP4637861B2 JP2006552596A JP2006552596A JP4637861B2 JP 4637861 B2 JP4637861 B2 JP 4637861B2 JP 2006552596 A JP2006552596 A JP 2006552596A JP 2006552596 A JP2006552596 A JP 2006552596A JP 4637861 B2 JP4637861 B2 JP 4637861B2
- Authority
- JP
- Japan
- Prior art keywords
- rotating
- support
- rotation
- electronic
- optical device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims description 36
- 239000004065 semiconductor Substances 0.000 description 16
- 238000007689 inspection Methods 0.000 description 9
- 230000000007 visual effect Effects 0.000 description 2
- 238000011437 continuous method Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
2、12: ダイイジェクタ
3: 回動部
4、17: 回動点
5: フリップヘッド
6: ピックアップ要素
7、23: ウエハ光学カメラ
8: 配置装置
9: ピックアップ要素
11a: 支持体面
13: 支持体の移動方向
14: 回動部
15、15a、16: 回転動作
18a、18b: 第1および第2の突出部
19: 第1のピックアップ要素
20: 第2のピックアップ要素
21: 配置装置
22: 真空ピペット
23: カメラ
23a: 光学的な接続ライン
24: 配置装置の移動方向
25: 吊りカメラ上のダイ
26: インデクサ
27: 配置用光学カメラ
28: 貫通チャネル
29: 穿孔
30: 検査窓の最大の大きさ
31、32: 回動部の全回転
33、34: 回転方向
35、36: 検査領域
37、38: 角度部
Claims (10)
- 電子素子、特にフリップチップを検査し回転させるための装置であって、前記電子素子を回転させるための回動部が、回動点に取り付けられ、前記回動部の外側には、単一の電子素子を支持体から取り上げ前記回動部の回転動作中に保持するための第1のピックアップ要素が、固定され、
第2のピックアップ要素が、前記回動点に対して前記第1のピックアップ要素と反対側の前記回動部の外側に配置され、この配置は、前記回動部が180°回転するごとに、1つのピックアップ要素が、支持体に対向するように行われ、
前記回動部において、貫通開口部が、前記ピックアップ要素同士の間に配置され、この配置は、前記回動部が90°または270°回転して、前記貫通開口部が前記支持体に対向するように行われ、
前記支持体と反対側の前記回動部の1つの側には、前記支持体上に配置されている前記電子素子の面および適正位置を、ピックアップ前に、光学的に検査するための第1の光学装置が、配置されている装置。 - 前記第1のピックアップ要素が、第1の突出部に取り付けられ、前記第2のピックアップ要素が、前記回動部の第2の突出部に取り付けられることを特徴とする請求項1に記載の装置。
- 前記貫通開口部は、前記突出部同士の間に、1つの長い側面が開口した貫通チャネルとして形成されることを特徴とする請求項2に記載の装置。
- 前記回動部は、反時計回り方向への180°回転に続いて、時計回り方向への180°回転を行うように配置されることを特徴とする請求項1に記載の装置。
- 前記貫通開口部は、前記回動部の回転動作中において、前記第1の光学装置と前記支持体上に配置されている電子素子との間の光学的な接続が可能になるように形成されることを特徴とする請求項4に記載の装置。
- 回転し載せられる電子素子の適正位置を検査するための第2の光学装置を特徴とする請求項1に記載の装置。
- 電子素子、特にフリップチップを検査および回転させる方法であって、
前記電子素子は、回動部に配置された第1のピックアップ要素により、支持体上においてサンドイッチ構造にされている前記複数の電子素子から、別々にピックアップされ、回転位置に置かれ、前記回動部は、前記回動部を90°または270°回転して前記支持体に対向する貫通開口部を備え、前記支持体上に配置されている単一の素子の前記面および適正位置を検査するための第1の光学装置と、前記支持体との間に配置されるステップと、
前記回動部を180°回転中に、前記支持体上に配置されている単一の電子素子を、前記第1のピックアップ要素によりピックアップするステップと、
前記回動部が90°または270°の位置を回転している間に、前記光学装置と前記回動部に配置された前記貫通開口部とにより、前記支持体上に配置されている別の電子素子の面および適正位置を検査するステップと、
前記回動部を180°回転させた後、前記第1のピックアップ要素により保持された前記電子素子を配置装置に載せるステップと、
同時に、前記回動部の前記第1のピックアップ要素と反対の外側に配置された第2のピックアップ要素により、前記支持体上に配置されているさらに別個の電子素子をさらにピックアップするステップと、
を行う方法。 - 180°の回転を行った後、反対方向への180°の回転が行われることを特徴とする請求項7に記載の方法。
- 第2の光学装置により、回転し載せられた素子の適正位置が、搬送中にまたは搬送後に、検査され、調節されることを特徴とする請求項7に記載の方法。
- 前記第1の光学装置は、前記第1の光学装置となお前記支持体上に配置されている前記電子素子との間の光学的な接続ライン内へ前記貫通開口部を回転させた後、所定の時間の遅延を伴って、作動することを特徴とする請求項7に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004007703A DE102004007703B3 (de) | 2004-02-16 | 2004-02-16 | Vorrichtung und Verfahren zum Überprüfen und Umdrehen elektronischer Bauelemente |
PCT/EP2005/050388 WO2005078768A1 (de) | 2004-02-16 | 2005-01-31 | Vorrichtung und verfahren zum überprüfen und umdrehen elektronischer bauelemente |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007524852A JP2007524852A (ja) | 2007-08-30 |
JP4637861B2 true JP4637861B2 (ja) | 2011-02-23 |
Family
ID=34609628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006552596A Active JP4637861B2 (ja) | 2004-02-16 | 2005-01-31 | 電子素子を検査・回転させる装置 |
Country Status (8)
Country | Link |
---|---|
US (2) | US7603765B2 (ja) |
EP (1) | EP1716586B1 (ja) |
JP (1) | JP4637861B2 (ja) |
KR (1) | KR100894051B1 (ja) |
CN (1) | CN100481318C (ja) |
AT (1) | ATE548753T1 (ja) |
DE (1) | DE102004007703B3 (ja) |
WO (1) | WO2005078768A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007048445A1 (de) * | 2005-10-26 | 2007-05-03 | Alphasem Gmbh | Verfahren und vorrichtung zum ablegen von elektronischen bauteilen, insbesondere halbleiterchips auf einem substrat |
SG147353A1 (en) * | 2007-05-07 | 2008-11-28 | Mfg Integration Technology Ltd | Apparatus for object processing |
US8167524B2 (en) * | 2007-11-16 | 2012-05-01 | Asm Assembly Automation Ltd | Handling system for inspecting and sorting electronic components |
KR100979721B1 (ko) * | 2008-12-04 | 2010-09-03 | (주)에이피텍 | 반도체 다이의 검사 및 분류 일체화장치 |
CN104752283B (zh) * | 2015-04-07 | 2018-02-13 | 嘉兴景焱智能装备技术有限公司 | 芯片倒装装置 |
WO2017043696A1 (ko) * | 2015-09-09 | 2017-03-16 | (주)에이피텍 | 플립 장치 |
DE102015013495B4 (de) * | 2015-10-16 | 2018-04-26 | Mühlbauer Gmbh & Co. Kg | Empfangseinrichtung für Bauteile und Verfahren zum Entnehmen fehlerhafter Bauteile aus dieser |
MX2018009183A (es) * | 2016-02-17 | 2018-11-19 | Wheelabrator Group Inc | Mecanismo de rotacion de un sistema transportador de una maquina de rueda de chorro. |
CN108155124A (zh) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | 一种芯片贴装装置及方法 |
JP7349636B2 (ja) * | 2019-10-11 | 2023-09-25 | パナソニックIpマネジメント株式会社 | 部品供給装置 |
CN113921450B (zh) * | 2021-10-13 | 2024-01-12 | 深圳市哈德胜精密科技股份有限公司 | 一种芯片吸取方法及双吸头芯片吸取装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4151945A (en) * | 1977-12-08 | 1979-05-01 | Universal Instruments Corporation | Automated hybrid circuit board assembly apparatus |
US4627787A (en) * | 1984-03-22 | 1986-12-09 | Thomson Components-Mostek Corporation | Chip selection in automatic assembly of integrated circuit |
US4915565A (en) * | 1984-03-22 | 1990-04-10 | Sgs-Thomson Microelectronics, Inc. | Manipulation and handling of integrated circuit dice |
NL8900027A (nl) * | 1989-01-06 | 1990-08-01 | Philips Nv | Werkwijze en inrichting voor het plaatsen van onderdelen op een drager. |
JP2517178B2 (ja) * | 1991-03-04 | 1996-07-24 | 松下電器産業株式会社 | 電子部品の実装方法 |
JPH09130084A (ja) * | 1995-11-06 | 1997-05-16 | Matsushita Electric Ind Co Ltd | 部品実装装置および部品実装設備 |
EP1057388B1 (de) * | 1998-02-17 | 2001-10-17 | Datacon Semiconductor Equipment GmbH | Einrichtung zum positionieren von auf einer folie angeordneten elktronischen schaltungen |
JP3475776B2 (ja) * | 1998-04-07 | 2003-12-08 | 三菱電機株式会社 | フリップチップボンディング装置及びフリップチップボンディング方法 |
JP3504166B2 (ja) * | 1998-11-25 | 2004-03-08 | 株式会社新川 | フリップチップボンディング装置 |
JP3636127B2 (ja) * | 2001-10-12 | 2005-04-06 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
SG104292A1 (en) * | 2002-01-07 | 2004-06-21 | Advance Systems Automation Ltd | Flip chip bonder and method therefor |
DE10203601A1 (de) | 2002-01-30 | 2003-08-14 | Siemens Ag | Chipentnahmevorrichtung, Chipentnahmesystem, Bestücksystem und Verfahren zum Entnehmen von Chips von einem Wafer |
-
2004
- 2004-02-16 DE DE102004007703A patent/DE102004007703B3/de not_active Expired - Fee Related
-
2005
- 2005-01-31 KR KR1020067019217A patent/KR100894051B1/ko active IP Right Grant
- 2005-01-31 EP EP05701621A patent/EP1716586B1/de not_active Not-in-force
- 2005-01-31 AT AT05701621T patent/ATE548753T1/de active
- 2005-01-31 US US10/589,429 patent/US7603765B2/en active Active
- 2005-01-31 WO PCT/EP2005/050388 patent/WO2005078768A1/de active Application Filing
- 2005-01-31 JP JP2006552596A patent/JP4637861B2/ja active Active
- 2005-01-31 CN CNB200580004952XA patent/CN100481318C/zh active Active
-
2009
- 2009-05-06 US US12/436,433 patent/US8256109B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1716586B1 (de) | 2012-03-07 |
US8256109B2 (en) | 2012-09-04 |
JP2007524852A (ja) | 2007-08-30 |
ATE548753T1 (de) | 2012-03-15 |
US7603765B2 (en) | 2009-10-20 |
WO2005078768A1 (de) | 2005-08-25 |
CN1926661A (zh) | 2007-03-07 |
CN100481318C (zh) | 2009-04-22 |
EP1716586A1 (de) | 2006-11-02 |
KR100894051B1 (ko) | 2009-04-20 |
KR20060122964A (ko) | 2006-11-30 |
US20090213365A1 (en) | 2009-08-27 |
DE102004007703B3 (de) | 2005-06-23 |
US20070209198A1 (en) | 2007-09-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4637861B2 (ja) | 電子素子を検査・回転させる装置 | |
US10699923B2 (en) | Transfer system for flipping and multiple checking of electronic devices | |
JP7145029B2 (ja) | 半導体資材の切断装置 | |
US9510460B2 (en) | Method for aligning electronic components | |
KR100881894B1 (ko) | 전자 부품 탑재 장치 및 전자 부품 탑재 방법 | |
JP2003309155A (ja) | ウェーハ裏面検査装置及び検査方法 | |
JP2007107941A (ja) | 検査工程の搬送装置及び検査工程の搬送方法 | |
US6976616B2 (en) | Circuit board transferring apparatus and method and solder ball mounting method | |
JP2007329266A (ja) | チップの実装装置及び実装方法 | |
JP2001244288A (ja) | バンプ形成システムおよび真空吸着ヘッド | |
KR101460626B1 (ko) | 반도체 자재 공급장치 | |
JP2978860B2 (ja) | 電子部品の外観検査装置 | |
JP3818146B2 (ja) | 電子部品搭載装置および電子部品搭載方法 | |
KR102228290B1 (ko) | 전기부품을 테스트하기 위한 테스트 어셈블리 및 방법 | |
TWI853092B (zh) | 晶圓之處理方法以及晶片測量裝置 | |
KR102375465B1 (ko) | 카메라 모듈 실장 장치 | |
JP7550632B2 (ja) | 撮像方法、及び撮像装置 | |
JPH11204989A (ja) | バルクフィーダ | |
JP2003051668A (ja) | 電子部品の製造方法と製造装置 | |
JP2002261144A (ja) | 基板の受け渡し方法及び装置 | |
JP2007501516A (ja) | コンポーネント配置装置及び方法 | |
JP3755458B2 (ja) | 電子部品搭載装置および電子部品搭載方法 | |
JP2963891B2 (ja) | B・g・a、c・s・pのicパッケージ用の基板の導通検査装置への同基板の供給装置 | |
JP2008016465A (ja) | 小型部品取出装置 | |
KR20230156413A (ko) | 처리 장치 및 위치 결정 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090909 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091201 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100707 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101005 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20101102 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20101124 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131203 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4637861 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |