JP4637006B2 - Component mounting device - Google Patents

Description

  The present invention relates to a component mounting device, in particular, a device breakage caused by an abnormal operation of a mounting head even if an abnormality such as a power failure occurs during an operation of automatically mounting a component such as an electronic component on a substrate such as a printed circuit board. The present invention relates to a component mounting apparatus that is suitable for application in preventing the occurrence of the above.

  FIG. 5 is a perspective view schematically showing an image of a drive system provided in the chip mounter (component mounting apparatus), and FIG. 6 is a block diagram showing an outline of the in-device power supply system and the control drive system.

  In general, a chip mounter includes a mounting head 1 for mounting electronic components and the like on a printed circuit board and the like. The mounting head 1 is moved in the X direction by an X axis (X driving unit) 3 driven by an X axis motor 2. The Y axis (Y drive unit) 5 that is moved and driven by the Y axis motor 4 is moved in the Y direction integrally with the X axis 3. Thus, the mounting head 1 is attracted in advance to the lower end of the Z-axis 7 driven in the vertical direction by the attached Z-axis motor 6 by being moved to a predetermined position in the XY direction (planar direction). The mounting operation of mounting a certain component on the substrate that has been positioned is automatically performed.

  For such a chip mounter, the X-axis motor 2 and the Y-axis motor, which are servo motors, are supplied by AC power supplied via a transformer 10 for stepping down the factory equipment power supply to a required potential in the apparatus. 4, a Z-axis motor 6 and a θ-axis motor 11 to be described later are driven to rotate by motor drivers 12A to 12D, respectively, and a part thereof is converted to DC power by a DC power source 13 to control a device, The control board 14 having a motor controller is supplied to the control board 14, and the control board 14 controls the drivers 12A to 12D for driving the servo motor. The transformer 10 may not be used depending on the voltage of the factory facility power supply.

  In general, when the power supply voltage is suddenly cut off during the operation of the chip mounter, it becomes difficult to operate the control system itself such as the control board 14 and the drivers 12A to 12D constituting the controller for controlling the servo motor. In order to stop the rotation, it is common to use a dynamic brake by the action of the counter electromotive force accompanying the power supply voltage OFF.

  However, if the servo motor is rotating at a high speed at the timing of a power failure or if an operation is performed with a component with a large load inertia, it is not possible to stop the operation instantaneously with just the dynamic brake. Is possible.

  Therefore, for example, when a power failure occurs during the operation of mounting the component on the substrate, the Z axis 7 for mounting the component adsorbed on the lower end is lowered to the height of the substrate surface, or It may happen that the descending operation cannot be stopped and it descends. At this time, since the substrate surface height is at the same position as the transport rail for transporting the substrate, there is a problem that the Z-axis 7 interferes with members (apparatus members) constituting the transport rail. .

  As a countermeasure in this case, there is a method of attaching a UPS (uninterruptible power supply) and supplementing the power from the UPS at the time of a power failure to continue the control of the chip mounter so as not to cause interference with the Z-axis 7 (for example, a patent) Reference 1).

  Further, a method is conceivable in which a spring is interposed in the Z-axis 7 so that the Z-axis 7 is always pushed upward when there is no load.

JP 2004-363506 A

  However, the method of supplementing power from the UPS has to use a large-capacity UPS, and therefore has a problem that it becomes expensive equipment.

  In addition, when adopting a structure in which the Z-axis 7 is pushed upward by a spring, it becomes a load of normal Z-axis operation when mounting parts, etc., and the load becomes non-constant. There is a problem that problems such as hindering high-speed driving occur.

  Further, the interference of the Z-axis 7 with the components of the transport rail is not limited to the case where the power supply voltage is cut off, but the device abnormality such as a voltage lower than the reference voltage at which normal operation can be maintained or a failure of the drive system. The same occurs when the error occurs.

  It is a first object of the present invention to provide a component mounting apparatus that can prevent the Z-axis from interfering with apparatus members such as a transport rail even when a power supply voltage is interrupted during a mounting operation. .

  It is a second object of the present invention to provide a component mounting apparatus that can similarly prevent the Z-axis from interfering with apparatus constituent members even when an apparatus abnormality occurs during the mounting operation.

  According to a first aspect of the present invention, there is provided a component mounting apparatus including a mounting head that is moved in a plane direction by an XY driving unit and mounts a component on a substrate at a predetermined position. A first base that is movably mounted in a vertical direction by a drive unit; a second base that supports the first base so as to be movable in a vertical direction; and is fixed to the XY drive unit; and the second base On the other hand, the first base is moved and held at a lower mounting position where the mounting operation by the Z axis is possible and an upper retracted position where the Z axis does not interfere with the apparatus member. And the air cylinder moves the first base to the mounting position when power is turned on, and moves the first base to the retracted position when the power supply voltage becomes a reference value or less. It is the issue that was resolved.

  According to a second aspect of the present invention, there is provided a component mounting apparatus including a mounting head that is moved in a planar direction by an XY driving unit and mounts a component on a substrate at a predetermined position. A first base that is movably mounted in a vertical direction by a drive unit; a second base that supports the first base so as to be movable in a vertical direction; and is fixed to the XY drive unit; and the second base On the other hand, the first base is moved and held at a lower mounting position where the mounting operation by the Z axis is possible and an upper retracted position where the Z axis does not interfere with the apparatus member. An abnormality detecting means for detecting an apparatus abnormality that occurs during the mounting operation, and the air cylinder moves the first base to the mounting position when the power is turned on. More device abnormality is detected, by providing an air cylinder control means for moving the retracted position, it is obtained by solving the second problem.

  According to the first aspect of the present invention, when the power supply voltage is cut off during the mounting operation, the Z-axis does not interfere with the device member by the cylinder on the first base to which the Z-axis that moves up and down when the component is mounted. Since it is forcibly raised to the retreat position, it is possible to reliably prevent damage to the device or the like even if a voltage OFF state occurs due to a power failure or the like.

  Further, according to the second aspect of the invention, when the apparatus abnormality occurs during the mounting operation, the control for forcibly raising the first base to the retracted position is performed, so that the apparatus is similarly damaged. This can be surely prevented.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a side view showing an outline of a mounting head provided in a chip mounter (component mounting apparatus) according to a first embodiment of the present invention.

  The chip mounter of the present embodiment is substantially the same as that shown in FIGS. 5 and 6 except that the mounting head shown in FIG. 1 is provided. Reference numerals are used and detailed description is omitted.

  In the mounting head 1 according to the present embodiment, the Z-axis 7 that sucks and holds a component (not shown) at the lower end is fixed to the slide bracket 20, and the slide bracket 20 is fixed to the first head plate (first base) 22. The first head plate 22 is moved to the first head plate 22 by the action of a ball screw 28 rotated via a timing belt 26 by a Z-axis motor 6 supported and fixed to the upper frame 24 and a nut 28A fixed to the slide bracket 20. It is guided by a fixed linear way 30 and is moved in the vertical direction.

  The Z-axis 7 is rotated about the axis by the timing belt 34 by the θ-axis motor 11 supported and fixed to the lower frame 32 fixed to the first head plate 22 so that the suction angle of the components can be adjusted. It has become.

  In the present embodiment, as described above, the Z-axis 7 that sucks and holds the components, the Z-axis motor (Z drive unit) 6 that moves the Z-axis 7 in the vertical direction, and the θ-axis motor 11 that rotates the Z-axis 7. The first head plate 22 is attached to the second head plate (second base) 36 via a linear guide 38 so as to be movable in the vertical direction. It is fixed to the X axis (XY drive unit) 3 and is movable in the XY directions.

  In the present embodiment, with respect to the second head plate 36 fixed to the X-axis 3, the first head plate 22 can be mounted at a lower position where the Z-axis 7 can be mounted, and the Z-axis 7. Is provided with an air cylinder 40 that is moved and held at the upper retracted position shown in FIG. 1 so as not to interfere with the apparatus members. The air cylinder 40 moves (lowers) the first head plate 22 to the mounting position when the power is turned on, and moves (rises) to the retracted position when the power supply voltage falls below a preset reference value. It has a function to make it.

  The mounting head 1 having the above configuration will be further described. When the power supply of the chip mounter is OFF, the air cylinder 40 is in a state in which the shaft (rod) 42 protrudes by the compressed air supplied from the factory to the chip mounter. It has become. In this state, as shown in FIG. 1, the first head plate 22 is pushed up to the upper retracted position by the shaft 42 of the air cylinder 40, and therefore each other Z axis (not shown) attached to the first head plate 22 is shown. Is also supported upward.

  Thus, in the state where the first head plate 22 is held at the upper retracted position, the Z-axis 7 does not interfere with a rigid body made up of other device members in the mounter even if the Z-axis 7 is lowered to the full operating range. Designed to be

  Next, the operation of the mounting head 1 from the state shown in FIG. 1 will be specifically described with reference to the flowchart of FIG. 2 and the time chart of FIG.

  First, at timing T0, the power of the chip mounter is turned on (step 1), and when the DC power supply 13 in the mounter rises at T1 (step 2), the air cylinder is turned on at T2 (step 3). At T3, the air cylinder operation is changed from the upper head holding to the lower holding (step 4), the shaft 42 is retracted (not shown), and the head height is set to the normal position (step 5). As a result, the upper position of the first head plate 22 in the retracted position is eliminated, and the first head plate 22 is held in the mounting position where it can operate as a normal chip mounter.

  In this case, the first head plate 22 can be positioned downward due to its own weight, but it is possible that the first head plate 22 may move up and down due to the vibration of the mounter or the like only by its own weight. The cylinder 40 performs a head lowering holding operation that forcibly pushes down the first head plate 22. In order to realize stable component mounting, driving of the air cylinder 40 is important.

  In the present embodiment, for example, a power failure occurs at the timing of T4 during the component mounting operation on the board (step 6), and the mounter control circuit and the servo motor driver control circuit cannot operate normally. Even if it falls, if the output of the DC power supply 13 in the mounter drops from the normal value at the time T5 (step 7), the air cylinder is turned off at T6 without being influenced by the abnormal operation of the mounter control circuit. (Step 8). As a result, at T7 at substantially the same time, the cylinder operation is switched to the head upward holding (step 9), and the shaft 42 of the air cylinder 40 protrudes to the state shown in FIG. 1 to move the first head plate 22 upward. Thus, the head height, that is, the absolute height of the Z-axis 7 can be pushed up to the upper retracted position without interfering with the apparatus member (step 10).

  However, the upward movement speed of the first head plate 22 when the voltage is turned off at the time of a power failure or the like must be higher than the speed corresponding to the lowering speed of the Z-axis 7. If a power failure occurs when the Z-axis 7 is descending due to component mounting, the lowering of the Z-axis 7 is suppressed to some extent by the dynamic brake, but the position where it should originally stop is greatly increased by normal operation. It is thought that it is below. Therefore, if the operating speed of the air cylinder 40 is not higher than the speed corresponding to the descending speed of the Z-axis 7 at the time of a power failure or the like, the absolute height of the Z-axis 7 is lowered and an interference accident occurs. This is because there is a risk of losing.

  In the present embodiment, when the voltage is turned off simultaneously with a power failure or the like, the operation mode of the air cylinder 40 is automatically switched, the shaft 42 is protruded by the constantly supplied pressurized air, and the first head plate 22 is moved to the retracted position. Since the high speed is raised, the occurrence of the interference accident can be reliably prevented even when the Z-axis 7 is in the middle of lowering.

  In general, when a power failure occurs, the supply of compressed air is expected to be stopped due to the stop of the factory equipment. However, since the amount of compressed air required by the air cylinder 40 is very small, there is no particular problem. If a shortage of compressed air is expected, the problem can be avoided by arranging an inexpensive air tank.

  According to the embodiment described in detail above, even if the control cannot be normally performed due to the voltage OFF at the time of a power failure or the like, the height of the Z-axis 7 is forcibly moved to the upper retracted position and held. Therefore, it is possible to reliably prevent an accident in which the Z-axis 7 interferes with a rigid body made up of components in the mounter.

  In addition, the Z-axis 7 interference accident prevention can be achieved at a lower cost than a measure that compensates the servo motor operation at the time of power failure using UPS or the like.

  FIG. 4 is a block diagram corresponding to FIG. 6 showing an outline of the control drive system of the chip mounter according to the second embodiment of the present invention.

  The chip mounter of this embodiment includes a voltage detector 50 that monitors the power supply voltage input via the transformer 10 and each motor driver 12A that drives and controls each of the four servo motors in the control block of the first embodiment. A determination unit (OR circuit) 52 that determines that an abnormality has occurred in any one of the drive units is added from the signals output from ~ 12D, and the abnormality detection signals (error signals) A and B based on these determination units are added. The control board 14 corresponds to a configuration in which an air cylinder driver 54 for driving and controlling the air cylinder 40 of the mounting head 1 is added.

  According to the present embodiment, when an abnormality occurs in the monitoring result of the input voltage or the operation status of the servo motor and its driver when the components are mounted, the air cylinder 40 is actively controlled and the first head plate 22 is mounted. Since it is forcibly moved from the position to the retracted position, even if an abnormality other than a power failure occurs and the chip mounter cannot be controlled normally, the Z-axis 7 interference accident is surely generated. It is possible to prevent the occurrence of damage to the apparatus.

  Note that this air cylinder control may be applied to the first embodiment. In this case, air cylinder control at the time of a power failure can be performed earlier, and if necessary, air cylinder control can be performed based on the error content in the chip mounter to enhance accident prevention.

The side view which shows the outline | summary of the mounting head with which the component mounting apparatus of 1st Embodiment which concerns on this invention is provided. Flow chart showing the operation of the first embodiment Time chart showing the operation of the first embodiment The block diagram which shows the outline | summary of the control drive system of the component mounting apparatus of 2nd Embodiment which concerns on this invention. A perspective view schematically showing a drive system of a normal component mounting apparatus Block diagram showing the outline of the control drive system of a normal component mounting device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mounting head 2 ... X-axis motor 3 ... X-axis 4 ... Y-axis motor 5 ... Y-axis 6 ... Z-axis motor 7 ... Z-axis 10 ... Transformer 11 ... θ-axis motor 12 ... Motor driver 13 ... DC power supply 14 ... Control Substrate 20 ... Slide bracket 22 ... First head plate (first base)
36 ... Second head plate (second base)
38 ... Linear guide 40 ... Air cylinder 42 ... Shaft (rod)
50 ... Voltage detector 52 ... Error determination unit 54 ... Air cylinder driver

Claims (2)

In a component mounting apparatus including a mounting head that is moved in the plane direction by an XY drive unit and mounts a component on a substrate at a predetermined position.
The mounting head is
A first base on which a Z-axis for sucking and holding a component is attached so as to be movable in the vertical direction by a Z drive unit;
A second base fixed to the XY drive unit and supporting the first base so as to be movable in the vertical direction;
With respect to the second base, the first base is moved to a lower mounting position where the mounting operation by the Z axis is possible and an upper retracted position where the Z axis does not interfere with the apparatus member. And an air cylinder for holding
The component mounting apparatus, wherein the air cylinder moves the first base to the mounting position when power is turned on, and moves the first base to the retracted position when a power supply voltage becomes a reference value or less. In a component mounting apparatus including a mounting head that is moved in the plane direction by an XY drive unit and mounts a component on a substrate at a predetermined position.
The mounting head is
A first base on which a Z-axis for sucking and holding a component is attached so as to be movable in the vertical direction by a Z drive unit;
A second base fixed to the XY drive unit and supporting the first base so as to be movable in the vertical direction;
With respect to the second base, the first base is moved to a lower mounting position where the mounting operation by the Z-axis is possible and an upper retracted position where the Z-axis does not interfere with the apparatus member. And an air cylinder for holding
An anomaly detecting means for detecting an apparatus anomaly that occurs during the mounting operation;
The air cylinder includes an air cylinder control unit that moves the first base to the mounting position when power is turned on, and moves the first base to the retracted position when an abnormality is detected by the abnormality detection unit. A component mounting device.

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