JP4552705B2 - Electronic component mounting apparatus and level adjustment method for its base - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that operates on a substrate positioned in a positioning portion on a base and a level adjustment method for the base.

  The electronic component mounting apparatus operates on a substrate positioned at a positioning portion on a base. In such an electronic component mounting apparatus, it is necessary to make the upper surface of the base a horizontal plane without inclination before starting the mounting operation. In addition, the height (level) of the upper surface of the base of the electronic component mounting apparatus is determined based on the devices (paste solder printing device, bond coating device, electronic component mounting device, appearance inspection device, reflow, etc.) that constitute the electronic component mounting line. It is desirable to match the height of the base in the apparatus).

Therefore, conventionally, before starting the mounting operation of the electronic component mounting apparatus, the operator takes out the tilt sensor (level) from the equipment store, puts it on the base, and visually checks the tilt sensor. The presence or absence of the inclination of the upper surface is visually confirmed, and if there is an inclination, the upper surface of the base is adjusted to be horizontal by operating the elevating parts provided at the four corners of the base. Further, the level of the upper surface of the base has been adjusted by operating the elevating parts at the four corners so as to be at the same level as the upper surface of the base of the device in the pre-process and the post-process.
JP 2004-235518 A

  However, since the above-mentioned conventional method is performed manually by the operator, it is difficult to make a quick and accurate adjustment, and the burden on the operator is large.

  Accordingly, an object of the present invention is to provide an electronic component mounting apparatus capable of automatically and accurately performing level adjustment of the upper surface of a base and a level adjustment method for the base.

The electronic component mounting apparatus according to claim 1 is a base, a support frame for the base, a positioning part for the board provided on the base, and a working part for working on the board positioned on the positioning part. A base lift provided at the four corners of the base, a tilt sensor disposed on the base for detecting the tilt of the upper surface, and the base of the base based on an output signal of the tilt sensor A control unit for controlling the driving of each of the elevating units to level the upper surface, the elevating unit includes nuts provided at four corners of the base, vertical feed screws that are screwed to the nuts, and A leveling motor for driving a feed screw, and the base is provided by protruding the nut, the feed screw, a support portion standing on the side of the support frame, and the support portion. And a bracket for supporting the leveling motor. It is supported in a floating state on the support frame.

  The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, further comprising a height confirmation sensor for the base, and for adjusting the height of the upper surface of the base. Based on the output signal of the height confirmation sensor, the control unit controls the driving of all the elevating units.

  The base level adjustment method according to claim 3 is the electronic component mounting apparatus according to claim 2, wherein each of the elevating parts is driven based on an output signal of the tilt sensor so that the upper surface of the base is horizontal. After that, all the elevating parts are driven to set the height of the upper surface of the base to a predetermined height.

According to the present invention having the above-described configuration, the upper surface of the base is leveled by operating the lifting portions at the four corners based on the output signals of the inclination sensor and the height confirmation sensor provided in the electronic component mounting apparatus. The work and the work of adjusting the height of the upper surface to a predetermined level can be performed quickly and accurately. Furthermore, if the base level automatic adjustment mechanism of the present invention is adopted in all the devices constituting the mounting line, the start-up time at the time of layout change due to production form variation can be shortened.

  1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a front view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic circuit according to an embodiment of the present invention. 4 is a side view of the component mounting apparatus, FIG. 4 is a block diagram of a control system of the electronic component mounting apparatus in one embodiment of the present invention, and FIG. 5 is a level adjustment of a base of the electronic component mounting apparatus in one embodiment of the present invention. It is a flowchart of.

  First, the overall configuration of the electronic component mounting apparatus will be described. In FIG. 1, two guide rails 2 are disposed at the center of a base 1, and the substrate 3 is conveyed along the guide rails 2 in the X direction. The guide rail 2 serves as a positioning portion for positioning the substrate 3 at a predetermined position.

  Two electronic component supply units 4 are arranged on the left and right sides of the base 1. The electronic component supply unit 4 is provided with a parts feeder 5 such as a tape feeder. Two recognition units 6 are arranged between the guide rail 2 and the electronic component supply unit 4. The recognition unit 6 includes a chip recognition camera (hereinafter also abbreviated as “camera”) 7 and a light source 8 (see also FIG. 3). Two transfer heads 10 are provided on the left and right, and move horizontally in the X and Y directions independently of each other by a moving table. In FIG. 2, reference numeral 13 denotes a Y-direction feed screw that constitutes the moving table. The movement table is publicly known, and detailed description thereof is omitted. 2 and 3, the transfer head 10 includes a multiple nozzle 11 and a substrate recognition camera 12.

  In FIG. 1, a discard unit 15 made of a container or the like is provided on both sides of the base 1. When the chips of the parts feeder 5 are picked up, the left and right transfer heads 10 move to above the recognition unit 6 on each side and recognize the chips held by vacuum suction on the lower end of the nozzle 11. As a result of this recognition, when the control unit 31 determines that the chip is defective, the transfer head 10 moves above the discard unit 15 and collects the chip by dropping it to the discard unit 15. The recognition unit 6 and the control unit 31 serve as pass / fail judgment means for judging pass / fail of the chip.

  1 to 3, four feed screws 20 are erected vertically at four corners of the base 1. The lower part of the feed screw 20 is screwed into nuts 21 provided at the four corners of the base 1. The feed screw 20 is driven to rotate by a leveling motor 22. The motor 22 is supported by a placket 24 protruding from a frame 23 erected on the side surface of the base 1. In FIG. 1, a tilt sensor 25 composed of a level is installed on the upper surface of the base 1, and detects the tilt in the X direction and the Y direction of the upper surface. The tilt sensor 25 is permanently installed on the upper surface of the base 1. Of course, you may provide at the time of use, without installing permanently.

  2 and 3, reference numeral 30 denotes a support frame of the base 1, which is installed on the floor surface by legs 31. A support portion 23 is provided on a side portion of the support frame 30, and the bracket 24 is coupled to the upper portion of the support portion 23. Accordingly, the base 1 is supported in a floating state on the support frame 30 via the nut 21, the feed screw 20, the support portion 23, and the bracket 24. Therefore, when the motor 22 is driven and the feed screw 20 rotates, the corner of the base 1 on which the feed screw 20 and the nut 21 are provided moves up and down. That is, the feed screw 20, the nut 21, and the motor 22 are elevating parts that elevate and lower the corners of the base 1 independently of each other.

1 to 3, a rod-like support portion 40 is erected at the center of both side portions in the X direction of the support frame 30, and a light receiving portion (height confirmation sensor) 41 is provided at the upper end portion thereof. . In addition, the mounting portion 43 on the base 1 is provided with a light emitting portion 42 that faces the light receiving portion 41. The light receiving unit 41 and the light emitting unit 42 serve as a height confirmation unit that detects the height (level) of the upper surface of the base 1.

  In FIG. 4, a control unit 51, a driving unit 52 of the leveling motor 22, a height confirmation unit 53 to which a light receiving unit (height confirmation sensor) 41 is connected, and a level measurement unit to which a tilt sensor 25 is connected are connected to the bus 50. 54 is connected. The height confirmation unit 53 and the level measurement unit 54 convert detection signals output from the light receiving unit 41 and the inclination sensor 25 into electrical signals, respectively. The converted electrical signal is input to the control unit 51 through the bus 50. The controller 51 controls the driving of the motors 22 at the four corners based on the input signal.

  This electronic component mounting apparatus has the above-described configuration. Next, with reference to the flowchart of FIG. 5, the level adjustment operation on the upper surface of the base 1 executed before the mounting operation of the electronic component will be described. In FIG. 5, the tilt sensor 25 measures the tilt of the upper surface of the base 1 in the X direction and Y direction (step 1), and based on the measurement result, a drive command is output from the control unit 51 to the drive unit 52. The corresponding motors 22 in the two are individually driven and controlled to rotate (step 2). The control unit 51 drives the motor 22 so that the level measurement result is OK, that is, the upper surface of the base 1 is a flat horizontal surface (step 3).

  If YES at step 3, the level (height) of the upper surface of the base 1 is confirmed by the height confirmation sensor (light receiving unit 41) (step 4), and then the height confirmation sensor (light receiving unit 41). Based on the output signal, all the motors 22 at the four corners are driven to raise and lower the base 1 so that the upper surface of the base 1 is at a predetermined level (step 5), until the height confirmation result becomes OK. This is continued (step 6). As described above, the upper surface of the base 1 is leveled and is at the same level as the upper surface of the base of the pre-process or post-process apparatus (correctly, the level of the guide rail 2 is provided in the pre-process or post-process apparatus. The level of the base 1 is adjusted so that it is at the same level as the guide rail of the substrate.

  The embodiment of the present invention has been described by taking an example of an electronic component mounting apparatus that mounts electronic components on a substrate. However, the present invention can be applied to each apparatus constituting an electronic component mounting line, such as a solder printing apparatus and a bond coating apparatus. is there.

  According to the present invention, the operation of leveling the upper surface of the base or the upper surface by actuating the lifting parts at the four corners based on the output signals of the inclination sensor and the height confirmation sensor provided in the electronic component mounting apparatus. Electronic parts that require the level of the upper surface of the base to be matched with the height of the bases of the various pre- and post-process devices. This is useful as a mounting device and a method for adjusting the level of its base.

The top view of the electronic component mounting apparatus in one embodiment of this invention The front view of the electronic component mounting apparatus in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The block diagram of the control system of the electronic component mounting apparatus in one embodiment of this invention Flow chart of level adjustment of base of electronic component mounting apparatus in one embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 2 Guide rail 3 Board | substrate 4 Electronic component supply part 10 Transfer head 20 Feed screw 21 Nut 22 Motor 25 Inclination sensor 41 Light-receiving part (height confirmation sensor)
51 Control unit

Claims (3)

A base, a support frame of the base, a positioning part of the substrate provided on the base, a working part for working on the substrate positioned on the positioning part, and bases provided at the four corners of the base A lifting / lowering portion of the base, a tilt sensor disposed on the base and detecting the tilt of the upper surface thereof, and driving of the lifting / lowering portions to level the upper surface of the base based on an output signal of the tilt sensor and a control unit for controlling,
The elevating part comprises nuts provided at the four corners of the base, vertical feed screws that are screwed into the nuts, and a leveling motor that drives the feed screws,
The base includes the nut, the feed screw, a support portion erected on a side portion of the support frame, and a bracket that protrudes from the support portion and supports the leveling motor. The electronic component mounting apparatus is supported in a floating state on the support frame .   In order to adjust the height of the upper surface of the base, the control unit controls the driving of all the lifting units based on the output signal of the height confirmation sensor. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is configured as described above. The level adjustment method for the upper surface of the base of the electronic component mounting apparatus according to claim 2, wherein after the elevating unit is driven based on the output signal of the tilt sensor to level the upper surface of the base, A base level adjusting method for an electronic component mounting apparatus, wherein all the elevating parts are driven to set a height of an upper surface of the base to a predetermined height.

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