JP2007318000A - Surface-mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface-mounting apparatus capable of reducing a dedicated area of a series of apparatuses including an apparatus adjacent to the surface mounting apparatus in a factory. <P>SOLUTION: The surface-mounting apparatus includes a conveying device 3 for conveying a printed wiring board 4 in an X-direction; an electronic component feeding device 9; and a first direction moving member 25 having a supporting member 32 extending in a Y-direction on the upper part of the conveying device, and moving in the X-direction. The apparatus includes a head unit 24 having a mounting head and moving in the Y-direction, while being supported by the supporting member 32. The apparatus includes first-third moving units 21-23 each consisting of the head unit 24 and the first direction moving member 25. Any one of the moving units 21-23 is equipped with a functional head having a function different from mounting of electronic components and to be used in a mounting line in at least one of the moving unit 21-23. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a surface mounter in which a head unit is movably provided on a support member that extends in a direction crossing a direction in which a printed wiring board is conveyed, and the support member is moved in the direction in which the printed wiring board is conveyed.

  As a conventional surface mounter of this type, there is one disclosed in Patent Document 1, for example. The surface mounting machine shown in this Patent Document 1 includes a base, a conveyor that conveys a printed wiring board from one end of the base to the other end, and parts feeders that are positioned on both sides of the conveyor. And a plurality of electronic component transfer units for transferring the electronic components from the electronic component supply device onto a printed wiring board.

  These electronic component transfer units include a plurality of support members that move along two X-direction guide rails that extend in the conveyance direction of the printed wiring board (hereinafter, this direction is simply referred to as the X direction), and the support members And a head unit provided. The X-direction guide rails are separated from each other in a direction intersecting with a direction in which the printed wiring board is conveyed (hereinafter, this direction is simply referred to as a Y direction), and are held at positions spaced upward from the base. Yes.

  Each of the plurality of support members is formed to extend in a direction perpendicular to the X direction, and is supported to be movable in the X direction while being suspended from the X direction guide rail. These support members are arranged in the X direction, and move along the X direction guide rail by driving by the X direction driving device.

This X-direction drive device is constituted by a linear motor having a structure extending along the X-direction guide rail. This linear motor includes a stator extending in the X direction and a movable element provided for each support member.
Each of the support members is provided with the head unit having a plurality of suction heads so as to be movable in the Y direction. The suction head includes a suction nozzle that sucks an electronic component, and moves the suction nozzle in the vertical direction and rotates it around an axis in the vertical direction.

  The head unit is movably supported by a Y-direction guide rail provided on the support member so as to extend in the Y direction, and moves along the Y-direction guide rail by driving by a Y-direction drive device. The Y-direction drive device is constituted by a linear motor having a structure extending along the Y-direction guide rail.

  The stator of the linear motor is formed so as to extend in the Y direction, and the mover is provided in the head unit. In addition, all the head units equipped in this conventional surface mounter are positioned on one side of the support member in the X direction (one end positioned on the upstream side in the transport direction of the printed wiring board).

In the conventional surface mounter configured as described above, a plurality of electronic component transfer units each including a support member extending in the Y direction and a head unit movably provided in the Y direction on the support member are provided. Electronic components can be mounted on a printed wiring board. In addition, in this surface mounter, electronic components can be mounted on one printed wiring board simultaneously by two component transfer units.
JP 2003-243896 A

  Since the conventional surface mounting machine described above mounts electronic components on a printed wiring board, in order to manufacture a printed wiring board using this, in addition to the surface mounting machine in the factory, before mounting. Forms a mounting line that includes a device that prints or applies cream solder on the printed wiring board and a device that melts and solidifies the solder on the printed wiring board after mounting and solders the electronic components to the printed wiring board. There is a need to.

In other words, in this mounting line, as a pre-process device of the surface mounting machine
1. Solder printer 2. 2. Solder printer, solder printing inspection machine 3. Solder printer, dispenser or solder printer, solder printing inspection machine, dispenser 4. Solder printer, dispenser, pre-mounting board inspection device One of solder printing machine, solder printing inspection machine, dispenser, pre-mounting board inspection device, etc.
As a post-process device for surface mounters,
1. 1. Reflow furnace Either a post-mounting board inspection device or a reflow furnace must be installed.
For this reason, in order to use the conventional surface mounter, there is a problem that an installation space for the device adjacent to the surface mounter must be taken in the factory.

  The present invention has been made in order to solve such a problem, and the area occupied by a series of devices including a device adjacent to a surface mounter in a factory can be reduced, or the device as a mounting line can be reduced. An object of the present invention is to provide a surface mounter that can be simplified.

  In order to achieve this object, a surface mounter according to the present invention includes a transport device that transports a printed wiring board in a first direction on a base, and the first direction intersects the transport device. An electronic component supply device which is a part spaced apart in the second direction and provided on at least one side of the transport device, a support member extending in the second direction above the transport device, and the support member A surface mounting machine having a first direction moving member that moves in a first direction, and a head unit that moves in a second direction while being supported by the supporting member, the supporting member, A plurality of moving units each including the first direction moving member and the head unit are provided, and at least one of these moving units is provided with a functional head having a function different from mounting of an electronic component and used in a mounting line. One in which the.

  A surface mounter according to a second aspect of the present invention is the surface mounter according to the first aspect, wherein a functional head is constituted by an inspection head having an imaging device for imaging a printed wiring board, and the inspection head is sucked. The moving unit equipped with the head is equipped with the head unit of at least one of the moving unit located on the upstream side in the conveyance direction of the printed wiring board and the moving unit located on the downstream side.

  A surface mounter according to a third aspect of the present invention is the surface mounter according to the first aspect, wherein the surface mounter has a functional head by an inspection head having an image pickup device for picking up an image of a printed wiring board before being coated with at least cream solder. The inspection head is mounted on a moving unit located on the upstream side in the transport direction of the printed wiring board with respect to the moving unit equipped with the suction head.

  A surface mounter according to a fourth aspect of the present invention is the surface mounter according to the first aspect, wherein the functional head is provided by a dispenser head having a coating nozzle for applying cream solder or an adhesive for electronic components to a printed wiring board. The dispenser head is configured such that the head of at least one of the moving unit located on the upstream side in the conveyance direction of the printed wiring board and the moving unit located on the downstream side with respect to the moving unit equipped with the suction head. It is equipped with the unit.

  A surface mounter according to a fifth aspect of the present invention is the surface mounter according to the first aspect, comprising: a dispenser head having a coating nozzle as a functional head; and an inspection head having an imaging device for imaging a printed wiring board. In this order, the moving unit equipped with the suction head is arranged on the upstream side in the transport direction of the printed wiring board.

  A surface mounter according to a sixth aspect of the present invention is the surface mounter according to the fourth or fifth aspect, wherein the surface mounter is used for inspecting a mounting board in which an imaging device for imaging a printed wiring board after mounting is arranged as an inspection head. The inspection unit is arranged on the downstream side in the conveyance direction of the printed wiring board with respect to the moving unit equipped with the suction head.

According to the present invention, the function of the device that performs the pre-process of mounting and the function of the device that performs the post-process can be provided to the functional head constituting the moving unit disposed on the common base. It is not necessary to provide a device having a position adjacent to the surface mounter.
Therefore, according to the present invention, it is possible to provide a surface mounter in which the area occupied by a series of devices including a device adjacent to the surface mounter is reduced in the factory. Moreover, according to the present invention, it is possible to provide a surface mounter that can simplify the apparatus as a mounting line.

  According to the second and third aspects of the present invention, the inspection head is mounted on the moving unit located upstream in the conveyance direction of the printed wiring board so that the printed circuit board can be printed before the electronic component is mounted. Alternatively, the position of the applied cream solder can be detected. For this reason, it is possible to discriminate between good and bad cream solder printing or application before mounting electronic components, and to correct the mounting position of electronic components on the surface mounter to correspond to the position of cream solder Can do. By mounting the inspection head on the moving unit on the downstream side in the conveyance direction of the printed wiring board, it is possible to inspect the mounting position and mounting state of the electronic components mounted on the printed wiring board.

  Therefore, according to the surface mounting machine according to the present invention, printing of cream solder exclusively as a device for performing the pre-process, a printing inspection device for inspecting application, and a solder position detecting device exclusively for detecting the position of cream solder, As an apparatus for performing the post-process, an inspection apparatus for inspecting the mounting position and mounting state of the electronic component after mounting is not required. As a result, according to the present invention, the area occupied by the factory can be reduced as compared with the case where these devices are installed, and the device as a mounting line can be simplified. .

  According to the invention of claim 4, by installing the dispenser head in the moving unit located on the upstream side in the transport direction of the printed wiring board, the solder paste is applied to the printed wiring board before the electronic component is mounted. An adhesive for temporarily fixing the electronic component to the printed wiring board can be applied. In addition, by mounting the dispenser head on the moving unit located on the downstream side in the transport direction of the printed wiring board, the electronic component mounted on the printed wiring board can be fixed with an adhesive.

  Therefore, according to the surface mounter of the present invention, a dispenser that exclusively applies cream solder or adhesive as a device for performing the pre-process, or a dispenser that exclusively applies adhesive as a device for performing the post-process is not required. . As a result, according to the present invention, the area occupied by the factory can be reduced as compared with the case where these devices are installed, and the device as a mounting line can be simplified.

  According to the invention described in claim 5, it is possible to perform the application of the cream solder and the adhesive and the inspection of the application in one surface mounter. According to the invention described in claim 6, after the mounting, Inspection of printed wiring boards can be performed in one surface mounter. For this reason, compared with the case where the apparatus which has these functions is installed, the exclusive area in a factory can be made narrow and the simplification of the apparatus as a mounting line can be achieved.

(First embodiment)
Hereinafter, an embodiment of a surface mounter according to the present invention will be described in detail with reference to FIGS.
1 is a plan view of a surface mounter according to the present invention, FIG. 2 is a front view of the same, FIG. 3 is a sectional view taken along line III-III in FIG. 1, FIG. 4 is a plan view of a head unit on which a suction head is mounted, FIG. FIG. 6 is a plan view showing a state in which the head unit mounting the suction head is divided, FIG. 6 is a front view of the head unit mounting the suction head, and FIG. 7 is a side view of the head unit mounting the suction head.
8 is a cross-sectional view of a hollow motor, FIG. 9 is a plan view showing a state when a small printed wiring board is used, FIG. 10 is a plan view showing a state when a large printed wiring board is used, and FIG. FIG. 12 is a perspective view illustrating a schematic configuration of a surface mounter according to the present invention, FIG. 12 is a diagram illustrating a state during maintenance, and FIG.

  In these drawings, the reference numeral 1 indicates a surface mounter according to this embodiment. The surface mounter 1 is configured by mounting each device described later on a base 2. On the base 2, a transfer device 3 extending in the left-right direction in FIG. 1 is provided. The conveying device 3 conveys the printed wiring board 4 from one end portion (right end portion in FIG. 1) of the base 2 to the other end portion, and includes a pair of conveyors 5 and 6.

  The direction in which the transport device 3 transports the printed wiring board 4 is the first direction in the present invention, and the direction orthogonal to the first direction is the second direction. In the following, the first direction is simply referred to as the X direction, and the second direction is simply referred to as the Y direction. Further, in FIG. 1, the lower side is referred to as the apparatus front side, and the upper side is referred to as the apparatus rear side.

  The transport device 3 is positioned at the center of the base 2 in the Y direction. Of the pair of conveyors 5 and 6 constituting the transfer device 3, the conveyor 5 on the front side of the apparatus is fixed to the base 2 so as not to move in the Y direction, and the conveyor 6 on the rear side of the apparatus is provided. Is configured to be movable in the Y direction by the width changing device 7 (see FIG. 3). The transport device 3 according to this embodiment sequentially transports three printed wiring boards 4 from the downstream portion in the X direction, or transports a plurality or all of them simultaneously and positions and holds them at three mounting positions. It is configured to be able to.

  On both sides of the transport device 3 on the base 2, an electronic component supply device 9 including a number of parts feeders 8, 8... Is provided at an end portion on the front side of the device and an end portion on the rear side of the device. As shown in FIG. 3, the height of the electronic component supply unit 8 a of these parts feeders 8 is positioned at substantially the same height as the printed wiring board 4 on the transport device 3. 3, what is indicated by reference numeral 10 located above the electronic component supply device 9 located on the front side of the device (left side in the figure) is supported by the base 2 and includes a display device and an operation input device. An operating device for operating the surface mounter 1.

  On the base 2, as shown in FIGS. 1 to 3, second and second electronic components 11 (see FIGS. 6 and 7) are transferred from the electronic component supply device 9 to the printed wiring board 4. Third moving units 22 and 23 and a first moving unit 21 for inspecting cream solder / adhesive printed or applied on the printed wiring board 4 are provided. The second moving unit 22 and the third moving unit 23 are symmetrical with respect to a vertical plane in the Y direction, but the basic configuration is the same.

  Among these first to third moving units 21 to 23, the first moving unit 21 located first and second from the upstream side in the transport direction of the printed wiring board 4 (hereinafter referred to as the board transport direction). As shown in FIGS. 1 and 2, the second moving unit 22 is configured such that a head unit 24 described later is located on the downstream side of the substrate transport direction with respect to the support member 32. On the other hand, the third moving unit 23 is configured such that the head unit 24 is positioned on the side upstream of the support member 32 in the substrate transport direction.

  As shown in FIGS. 3 and 11, the first to third moving units 21 to 23 include an X-direction moving member 25 formed so as to extend upward from the base 2, and a lower portion of the X-direction moving member 25. And the head unit 24 and the Y-direction drive device 27 provided above the X-direction moving member 25. The X direction moving member 25 constitutes a first direction moving member in the present invention.

As shown in FIGS. 3 and 11, the X-direction moving member 25 includes a pair of leg members 31 extending in the vertical direction, and a support member 32 extending in the Y direction so as to connect the upper ends of these leg members 31. It is composed of
The leg member 31 is movably supported by a pair of X-direction guide rails 33 provided on the base 2. As shown in FIGS. 1 and 2, the X-direction guide rail 33 is fixed on the base 2 so as to extend from one end in the X direction of the base 2 to the other end.

  As shown in FIG. 2, the lower end portion 31 a of the leg member 31 protrudes to one side in the X direction as compared with the upper end portion 31 b and is formed to have a longer length in the X direction. The lower end 31a protrudes to one side in the X direction where the head unit 24 is located with respect to the upper end 31b. In this embodiment, the length of the lower end portion 31 a in the X direction is formed such that the tip end surface of the lower end portion 31 a in the X direction is located on the same plane as the end surface of the head unit 24.

  The lower end portion 31a of the leg member 31 is provided with a hollow motor 34 of an X-direction drive device 26 which will be described later, and there is a component at the center in the vertical direction of the leg member 31 of the second and third moving units 22 and 23. A recognition device 35 is provided. The component recognition device 35 is for imaging the electronic component 11 sucked by a suction nozzle 36 (to be described later) of the head unit 24 from below. The component recognizing device 35 includes a camera 37 (see FIG. 1) oriented in the X direction and a reflecting mirror 38 for guiding light from above to the camera 37. When the head unit 24 moves above the reflecting mirror 38 in the Y direction from above the electronic component supply device 9, the camera 37 instantaneously captures the images of the tip portions of the plurality of suction nozzles simultaneously by the CCD area sensor. Note that the camera unit of the component recognition device 35 may be configured by a line sensor. In this case, when the head unit 24 passes above the light receiving slit of the line sensor, it is not necessary to reduce the speed.

  As shown in FIGS. 2 and 3, the support member 32 is fixed to the leg member 31 while being placed on the upper end portion of the leg member 31. Further, both end portions in the Y direction of the support member 32 are formed so as to protrude from the leg member 31 to the front side and the rear side of the device. The positions of both ends in the Y direction of the support member 32 are positioned so as to face above the parts feeder 8 as shown in FIGS.

  As shown in FIGS. 1 to 3, the X-direction driving device 26 that drives the X-direction moving member 25 is provided on the base 2 so as to make a pair in the Y direction so that the leg member 31 can move freely. The X-direction guide rails 33 to be supported, the X-direction ball screw shaft 41 positioned at a portion adjacent to the X-direction guide rails 33, and a ball nut 42 screwed into the X-direction ball screw shaft 41 (FIG. 8). Reference) and a hollow motor 34 attached to the lower end of the leg member 31.

  As shown in FIGS. 1 and 2, the X-direction ball screw shaft 41 is formed to extend from one end portion in the X direction of the base 2 to the other end portion, and mounting members 44 provided at both end portions. Is fixed near the upper surface of the base 2. The X direction ball screw shaft 41 is provided in the vicinity of the inside of the pair of X direction guide rails 33 so as to make a pair in the Y direction. The X-direction guide rail 33 and the X-direction ball screw shaft 41 are shared by the first to third moving units 21 to 23, and move the first to third moving units 21 to 23 in the X direction. Used for.

The ball nut 42 has the same structure as that provided in a general ball screw mechanism, and is attached to a rotor 45 of a hollow motor 34 described later, as shown in FIG.
The hollow motor 34 is a brushless servomotor, and as shown in FIG. 8, a rotor 45 through which the X-direction ball screw shaft 41 penetrates in a loosely fitted state and the rotor 45 is rotatably supported by bearings 46 and 47. The stator 48 is used.

  The rotor 45 includes a rotating shaft 45a formed in a cylindrical shape and a permanent magnet 45b fixed to the outer peripheral portion of the rotating shaft 45a. A large-diameter portion 45c is formed at one end portion (upper end portion in FIG. 8) in the axial direction of the rotating shaft 45a so that the outer diameter is larger than that of other portions. The large diameter portion 45c is fixed by a fixing bolt 49 in a state where the ball nut 42 is fitted.

The stator 48 includes a coil 48a facing the permanent magnet 45b, an encoder (not shown) for detecting rotation, and the like, and is attached to a motor support bracket 50 projecting from the leg member 31.
In the leg member 31 to which the hollow motor 34 is attached in this way, the rotor 45 of the hollow motor 34 rotates, and the ball nut 42 rotates integrally with the rotor 45 and moves in the X direction with respect to the X direction ball screw shaft 41. By doing so, it moves integrally with the stator 48 in the X direction along the X direction guide rail 33.

  2 and 3, the head unit 24 is movable in the Y direction on the support member 32 by a Y-direction guide rail 51 provided on one side surface (one end surface in the X direction) of the support member 32. It is supported. The Y-direction guide rail 51 is formed to extend from one end portion in the Y direction of the support member 32 to the other end portion, and is attached to the one side surface of the support member 32 so as to form a pair in the vertical direction.

  As shown in FIG. 4, the head unit 24 equipped in the second moving unit 22 and the third moving unit 23 is supported by the Y-direction guide rail 51 through a slider 52 so as to be movable. The first and second support plates 53 and 54, a plurality of suction heads 55 supported by the support plates 53 and 54, a single lower imaging camera 56, and the like.

  As shown in FIG. 4, the first support plate 53 and the second support plate 54 are formed to extend in the vertical direction in parallel with the side surface (one end surface in the X direction) of the support member 32. The slider 52 is supported by the support member 32 via the Y direction guide rail 51 so as to be movable in the Y direction. The first and second support plates 53 and 54 are connected to each other in a state of being arranged in the Y direction, and are connected so as not to be separated by a connecting member 57 provided at the upper end portion. .

  The connecting member 57 is fixed to the first support plate 53 and the second support plate 54 by bolts 58. In this embodiment, in order to position the second support plate 54 in the X direction and the up and down direction with respect to the first support plate 53, a positioning pin is provided at the connecting portion of both the plates 53 and 54. 59 is provided. The positioning pin 59 is erected at an end portion of the first support plate 53 connected to the second support plate 54, and a pin hole 59 a drilled in the second support plate 54. (See FIG. 5).

  Of the first and second support plates 53 and 54, the lower imaging camera 56 is attached to the first support plate 53 located on the lower side in FIG. This camera 56 detects the fiducial mark position of the electronic component 11 in the electronic component supply unit 8a of the parts feeder 8 and the printed wiring board 4, and adsorbs the electronic component 11 or a predetermined on the printed wiring board 4. This is for correcting the position of the head unit 24 when the electronic component 11 is mounted at the position.

  In this embodiment, the camera 56 is an end of the first support plate 53 on the Y-direction second support plate 54 side, and is the side of the X-direction opposite to the support member 32. Installed on. The camera 56 according to this embodiment is positioned at the center in the Y direction of the assembly formed by attaching the second support plate 54 to the first support plate 53. The first support plate 53 is formed with a camera storage recess 53a to prevent the camera 56 from projecting greatly on the side opposite to the support member 32. The camera 56 is attached to the first support plate 53 with a part thereof facing the recess 53a.

  In this embodiment, eight suction heads 55 are provided. As shown in FIG. 4, a first frame 61 provided on the first support plate 53 and a second support plate are provided. The second frame 62 is supported by the second frame 62. The eight suction heads 55 are all of the same structure, although there are differences in shape due to different mounting positions on the first and second frames 61 and 62.

  The first frame 61 and the second frame 62 are formed so as to extend from the first and second support plates 53 and 54 in the X direction and on the opposite side of the support member 32. The leading ends of the first and second frames 61 and 62 in the X direction are connected to each other via a connecting member 63. The connecting member 63 is attached to the first and second frames 61 and 62 by bolts 64. Each of the first frame 61 and the second frame 62 is provided with four suction heads 55 arranged in the X direction.

  The four suction heads 55 on the first frame 61 side are provided on the side of the first frame 61 that faces the second frame 62. The four suction heads 55 on the second frame 62 side are provided on the side of the second frame 62 facing the first frame 61. Of the four suction heads 55 arranged in the X direction, the two suction heads 55, 55 located at the center are provided at positions that are offset outward in the Y direction as compared to the two suction heads 55, 55 on both sides. It has been.

As shown in FIGS. 6 and 7, each suction head 55 includes an elevating member 67 supported by first and second frames 61 and 62 via a guide rail 65 and a slider 66 extending in the vertical direction so as to be movable up and down. The vertical drive device 68 for raising and lowering the lift member 67 and the rotary drive device 69 provided at the lower end of the lift member 67 are configured. The suction nozzle 36 is detachably attached to the lower end portion (suction nozzle holding member) of the rotation driving device 69, and the rotation driving device 69 rotates the suction nozzle 36 about the vertical axis.
The rotation driving device 69 is constituted by a motor located on the same axis as the suction nozzle 36. Although not shown, the rotation shaft of the motor is connected to a shaft member that supports the suction nozzle 36. Reference numeral 70 denotes a negative pressure supply pipe that guides a negative pressure to the suction nozzle 36 via the rotation driving device 69.

  The vertical drive device 68 includes a ball screw shaft 71 rotatably supported by the first and second frames 61 and 62 in a state of passing through the lifting member 67 in the vertical direction, and an upper end of the ball screw shaft 71. And a lifting motor 72 that rotates the ball screw shaft 71, and a ball nut 73 that is screwed to the ball screw shaft 71 and fixed to the lifting member 67.

In the suction head 55 according to this embodiment, the suction nozzle 36 moves in the vertical direction by driving by the vertical driving device 68, and the suction nozzle 36 rotates about the vertical axis by driving by the rotary driving device 69.
As shown in FIG. 4, the rotation driving device 69 and the suction nozzle 36 are positioned at the center of the head unit 24 in plan view. Specifically, the suction nozzles 36 of the four suction heads 55 mounted on the first frame 61 are arranged in a line in the X direction at a position adjacent to the lower imaging camera 56. Further, the suction nozzles 36 of the four suction heads 55 mounted on the second frame 62 are aligned in the X direction at positions adjacent to the four suction nozzles 36 on the first frame 61 side in the Y direction. Are lined up.

  That is, the head unit 24 according to this embodiment is provided with four suction nozzles 36 arranged in the X direction so as to form two rows in the Y direction. The lower imaging camera 56 is positioned in the middle of the two rows of suction nozzles 36 in the Y direction. The interval (nozzle pitch) in the X direction of these suction nozzles 36 is set to coincide with the interval (feeder pitch) between the parts feeders 8.

  On the other hand, the head unit 24 mounted on the first moving unit 21 is supported by the pair of upper and lower Y-direction guide rails 51 via a pair of upper and lower sliders 75, as shown in FIGS. The third support plate 76 and an inspection head 77 supported by the support plate 76 are included. In this embodiment, the inspection head 77 constitutes a functional head referred to in the present invention.

The inspection head 77 is for detecting the position of the cream solder that is printed or applied in advance on the printed wiring board, and includes an imaging device (not shown) that images the cream solder from above. The cream solder is printed or applied to lands (electrode portions to which electronic components are soldered) of a printed wiring board by a cream solder printing apparatus that performs a pre-process.
The surface mounter 1 corrects the position where the electronic component is mounted in correspondence with the position of the cream solder detected by the inspection head 77. Further, the surface mounter 1 determines whether or not the cream solder is printed or applied based on the image captured by the inspection head 77.

  The Y-direction drive device 27 that moves the head unit 24 in the Y direction with respect to the support member 32 is provided on the support member 32 and can freely move the head unit 24 in the Y direction, as shown in FIGS. The Y-direction guide rails 51 and 51 supported on the Y-direction guide rail 51, the Y-direction ball screw shaft 81 positioned between the Y-direction guide rails 51 and 51, and the Y-direction ball screw shaft 81 are screwed together. A ball nut (not shown), a hollow motor 82 (see FIG. 4) supported by the first support plate 53 of the head unit 24, and a secondary connected to one end of the Y-direction ball screw shaft 81. And a drive motor 83. A case for supporting a stator (not shown) of the sub drive motor 83 is fixed to the support member 32 through a case of the bearing member 85.

  As shown in FIG. 3, the Y-direction ball screw shaft 81 is formed so as to extend from one end portion in the Y direction of the support member 32 to the other end portion, and is supported by bearing members 84 provided at both end portions. 32 is supported in a state that it can rotate freely and movement is restricted in the Y direction.

  The ball nut and the hollow motor 82 of the Y-direction drive device 27 have the same structure as the hollow motor 34 used in the X-direction drive device 26 described above. As shown in FIGS. 4 and 5, the hollow motor 34 is attached to a bracket 85 protruding from the first support plate 53.

  The auxiliary drive motor 83 receives a reaction force when the ball nut rotates by driving the hollow motor 82, and fixes the Y-direction ball screw shaft 81 to the support member 32; The second operation state in which the Y-direction ball screw shaft 81 is rotated in the direction opposite to the direction in which the ball nut rotates by driving the hollow motor 82 is configured to be switched.

  When the sub drive motor 83 is in the first operating state, the head unit 24 moves in the Y direction with respect to the support member 32 only by being driven by the hollow motor 82. Further, if the sub drive motor 83 is in the second operation state when the head unit 24 is moved by the drive by the hollow motor 82, the head unit 24 is faster than the case where the head unit 24 is moved by the drive of the hollow motor 82 alone. Will move in.

  In the surface mounting machine 1 configured as described above, the electronic component 11 is mounted on the printed wiring board 4 so that the mounting efficiency is always increased by adopting a mounting form corresponding to the size of the printed wiring board 4. . For example, as shown in FIG. 9, when the printed wiring board 4 is relatively small, the electronic components 11 are mounted on the two printed wiring boards 4 by the second and third moving units 22 and 23, respectively. . The inspection head 77 of the first moving unit 21 detects the position of the cream solder on the printed wiring board 4 located on the upstream side in the transport direction during this mounting.

  The mounting of the electronic component 11 is performed in parallel in the second and third moving units 22 and 23. In each moving unit 22, 23, the X-direction moving member 25 moves in the X direction by driving by the X-direction driving device 26, and the head unit 24 moves in the Y direction by driving by the Y-direction driving device 27. Further, the suction nozzle 36 is moved up and down by driving the head unit 24 by the vertical driving device 68, and the suction nozzle 36 is rotated by driving by the rotation driving device 69.

  When the electronic component 11 is sucked by the suction nozzle 36 of each moving unit 22, 23, the electronic component supply device 9 provided at one end of the base 2 in the Y direction and the electronic component provided at the other end Both the supply device 9 can be used.

In the surface mounter 1 according to this embodiment, since the nozzle pitch and the feeder pitch coincide with each other, the four suction nozzles 36 arranged in the X direction when the electronic component supply device 9 sucks the electronic component 11. Thus, a maximum of four electronic components 11 can be sucked at a time.
After the eight suction nozzles 36 suck the electronic component 11, the head unit 24 moves from the upper side of the electronic component supply device 9 over the X-direction guide rail 33 to the transport device 3 side.

  At this time, the head unit 24 crosses over the component recognition device 35, and the component recognition device 35 images eight electronic components 11 at a time from below. A suction position of each electronic component 11 with respect to the suction nozzle 36 is detected based on the imaging result, and the position of the head unit 24 is corrected based on the detected suction position deviation amount, and each electronic component 11 is printed on the printed wiring board. 4 is mounted at a predetermined mounting position. When the head unit 24 moves in the Y direction over a long distance, the head unit 24 is moved at a high speed by driving by the hollow motor 82 of the Y direction driving device 27 and driving by the sub driving motor 83.

  In the example shown in FIG. 9, since a relatively wide space is formed between the first moving unit 21 and the second moving unit 22, the printed wiring board 4 is temporarily placed here. be able to. The printed wiring board 4 is the printed wiring board 4 after the position of the cream solder is detected by the first moving unit 21.

  On the other hand, when the printed wiring board 4 is large, the electronic component 11 is simultaneously mounted on one printed wiring board 4 by the second and third moving units 22 and 23 as shown in FIG. In this case, two large printed wiring boards 4 are held on the transport device 3, and the position of the cream solder is detected on the other printed wiring board 4 by the first moving unit 21.

  In the surface mounter 1 according to this embodiment, the maintenance of the suction head 55 provided in the head unit 24 is performed with the head unit 24 disassembled as shown in FIG. At this time, the bolts 58 and 64 of the connecting members 57 and 63 are removed to separate the second support plate 54 from the first support plate 53, and the second frame 62 is separated from the first frame 61.

  The first support plate 53 and the second support plate 54 are movably supported by the Y-direction guide rail 51 via sliders 52, respectively. Therefore, by moving the second support plate 54 away from the first support plate 53, the four head units 24 on the first frame 61 side and the second frame 62 side are moved. The space between the four head units 24 can be widely opened.

  Maintenance of each suction head 55 can be performed in this wide space by the operator M extending his / her hand from the front side of the apparatus or the rear side of the apparatus as shown in FIG. At this time, since there are only the X-direction guide rail 33 and the X-direction ball screw shaft 41 on the base 2 between the worker M and the head unit 24, other parts do not get in the way.

  In the plurality of moving units 21 to 23 of the surface mounter 1 according to the above-described embodiment, a suction head 55 having a suction nozzle 36 and an inspection head 77 having a function (inspection function) different from the mounting of the electronic component 11 are provided. Is equipped as a mounting head. For this reason, according to this embodiment, the position of the cream solder printed or applied to the printed wiring board 4 can be detected before the electronic component 11 is mounted.

  Therefore, according to the surface mounting machine 1 shown in this embodiment, it is possible to determine whether the cream solder is printed or applied before mounting the electronic component 11, and to correspond to the position of the cream solder. In addition, the mounting position of the electronic component 11 can be corrected. As a result, by using this surface mounter, as a pre-process device, a print inspection device that exclusively inspects cream solder printing, or before solder solder printing or application inspection including application by a dispenser Since the substrate inspection apparatus is not necessary, the area occupied by the factory can be reduced as compared with the case where these apparatuses are installed. Further, the base of the inspection machine / inspection apparatus and the guide rail for moving the inspection head 77 in the X direction can be shared with those for the suction head 55, and the structure can be simplified.

  As shown in FIG. 13, the head unit 24 can be equipped with mounting heads such as other types of suction heads and functional heads having other functions. That is, in the head unit 24, as shown in FIG. 13, a chip component head 91, an odd-shaped component head 92, a dispenser head 93, a load control head 94, an inspection head 95, and other special heads 96 are provided. And can be equipped with.

The chip component head 91 is used exclusively for mounting relatively small chip components (not shown), and can be mounted on the first to third moving units 21 to 23. The suction head 55 shown in the above-described embodiment constitutes the chip component head 91.
The odd-shaped component head 92 is for mounting exclusively an electronic component (not shown) having a shape different from that of the chip component, and can be mounted on the first to third moving units 21 to 23.

  The dispenser head 93 is equipped with a syringe for storing cream solder and adhesive and an application nozzle at the bottom. A pressure device is connected to the upper part of the syringe, and the syringe is pressurized at a desired position in the X and Y directions of the dispenser head, and cream solder or an adhesive is applied onto the printed wiring board 4. The dispenser head 93 can be mounted on the first moving unit 21.

  Equipped with the dispenser head 93 in this manner eliminates the need for a dispenser that exclusively applies cream solder or adhesive as a device for performing the pre-process, or a dispenser that exclusively applies adhesive as a device for the post-process. As compared with the case where these devices are installed, the exclusive area in the factory can be reduced. In addition, by providing the dispenser head 93, the base of the dispenser and the guide rail for moving the dispenser head in the X direction can be shared with those for the suction head 55, and the structure can be simplified.

  The load control head 94 can control the magnitude of the load when the electronic component 11 is placed on the printed wiring board 4, and can be installed in the third moving unit 23. The reason why only the third moving unit 23 can be equipped in this way is that the electronic component 11 that requires the load control is supplied from the parts feeder 8 located on the downstream side in the transport direction.

  In addition to the inspection head 77 (which inspects the shape and printing position of cream solder preprinted on the printed wiring board 4), the inspection head 95 is mounted on the surface mounter 1 according to this embodiment. There are some which inspect the mounting position and mounting state of the electronic component 11 after mounting the electronic component 11 on the printed wiring board 4. The electronic component inspection head 95 is provided in the third moving unit 23. The inspection head 95 for electronic parts can be used in combination with the inspection head 77. In this case, mounting is performed only by the second moving unit 22, or the number of moving units is increased from 3, for example, 5 or 6, and a plurality of suction heads are mounted on each moving unit.

  By installing the inspection head 95 for the electronic component on the third moving unit 23, an inspection device for inspecting the mounting position and mounting state of the electronic component 11 after mounting as a device for performing a post-process becomes unnecessary. Therefore, the exclusive area in the factory can be reduced as compared with the case of installing this apparatus.

The other special head 96 is for mounting the electronic component 11 having a special shape, and can be mounted on the first to third moving units 21 to 23.
By mounting the various heads 91 to 96 on the head unit 24 as described above, the three moving units 21 to 23 are used for mounting the electronic component 11 and applying cream solder or adhesive, or inspection. Can be done simultaneously.

It is a top view of the surface mounting machine concerning the present invention. It is a front view of the surface mounting machine concerning the present invention. It is the III-III sectional view taken on the line in FIG. It is a top view of the head unit carrying a suction head. It is a top view which shows the state which divided | segmented the head unit which mounts a suction head. It is a front view of the head unit carrying a suction head. It is a side view of the head unit carrying a suction head. It is sectional drawing of a hollow motor. It is a top view which shows the state in the case of using a small printed wiring board. It is a top view which shows the state in the case of using a large sized printed wiring board. It is a perspective view which shows schematic structure of the surface mounting machine which concerns on this invention. It is a block diagram which shows the state at the time of a maintenance. It is a figure for demonstrating the kind of adsorption head or a functional head.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Surface mounter, 2 ... Base, 3 ... Conveyor apparatus, 9 ... Electronic component supply apparatus, 21-23 ... 1st-3rd moving unit, 24 ... Head unit, 25 ... X direction moving member, 26 ... X direction drive device 32 ... support member 33 ... X direction guide rail 34 ... hollow motor 36 ... adsorption nozzle 41 ... X direction ball screw shaft 51 ... Y direction guide rail 55 ... adsorption head 77 ... inspection A head 91 for a chip component, 92 a head for atypical component, 93 a dispenser head, 94 a load control head, 95 an inspection head, 96 a special head.

Claims (6)

A transport device for transporting a printed wiring board in a first direction on a base;
An electronic component supply device provided at a side of at least one side of the transfer device, which is a part spaced apart in a second direction intersecting the first direction with respect to the transfer device;
A support member extending in a second direction above the transport device;
A surface mounting machine having a first direction moving member that moves the support member in a first direction, and a head unit that moves in a second direction while being supported by the support member,
A plurality of moving units comprising the support member, the first direction moving member and the head unit;
A surface mounter characterized in that at least one of these mobile units is equipped with a functional head having a function different from mounting of electronic components and used in a mounting line. The surface mounting machine according to claim 1, wherein the functional head is constituted by an inspection head having an imaging device for imaging a printed wiring board,
This inspection head is installed in the head unit of at least one of the moving unit located on the upstream side in the transport direction of the printed wiring board and the moving unit located on the downstream side of the moving unit equipped with the suction head. A surface-mount machine characterized by The surface mounter according to claim 1,
A functional head is constituted by an inspection head having an image pickup device for picking up an image of a printed wiring board before mounting to which at least cream solder is applied,
A surface mounting machine characterized in that this inspection head is mounted on a moving unit located upstream in the conveyance direction of a printed wiring board with respect to a moving unit equipped with a suction head. The surface mounting machine according to claim 1, wherein a functional head is constituted by a dispenser head having an application nozzle for applying cream solder or an adhesive for electronic parts to a printed wiring board,
The dispenser head is mounted on the head unit of at least one of the moving unit located on the upstream side in the conveyance direction of the printed wiring board and the moving unit located on the downstream side with respect to the moving unit equipped with the suction head. A surface-mount machine characterized by   2. The surface mounter according to claim 1, wherein a dispenser head having a coating nozzle as a functional head and an inspection head having an imaging device for imaging a printed wiring board are arranged in this order with respect to a moving unit equipped with a suction head. A surface mounting machine characterized in that it is arranged on the upstream side in the board conveying direction.   6. The surface mounting machine according to claim 4, wherein an inspection unit for inspecting a mounting board in which an image pickup device for picking up an image of a printed wiring board after mounting is provided as an inspection head with respect to a moving unit equipped with a suction head. A surface mounter, which is disposed downstream of the printed wiring board in the conveying direction.

Images