JP4635836B2 - シート状電子回路モジュール - Google Patents

シート状電子回路モジュール Download PDF

Info

Publication number
JP4635836B2
JP4635836B2 JP2005328380A JP2005328380A JP4635836B2 JP 4635836 B2 JP4635836 B2 JP 4635836B2 JP 2005328380 A JP2005328380 A JP 2005328380A JP 2005328380 A JP2005328380 A JP 2005328380A JP 4635836 B2 JP4635836 B2 JP 4635836B2
Authority
JP
Japan
Prior art keywords
insulating resin
sheet
resin layer
wiring board
semiconductor chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005328380A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007134618A5 (enrdf_load_stackoverflow
JP2007134618A (ja
Inventor
学 田崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2005328380A priority Critical patent/JP4635836B2/ja
Publication of JP2007134618A publication Critical patent/JP2007134618A/ja
Publication of JP2007134618A5 publication Critical patent/JP2007134618A5/ja
Application granted granted Critical
Publication of JP4635836B2 publication Critical patent/JP4635836B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2005328380A 2005-11-14 2005-11-14 シート状電子回路モジュール Expired - Fee Related JP4635836B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005328380A JP4635836B2 (ja) 2005-11-14 2005-11-14 シート状電子回路モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005328380A JP4635836B2 (ja) 2005-11-14 2005-11-14 シート状電子回路モジュール

Publications (3)

Publication Number Publication Date
JP2007134618A JP2007134618A (ja) 2007-05-31
JP2007134618A5 JP2007134618A5 (enrdf_load_stackoverflow) 2008-09-25
JP4635836B2 true JP4635836B2 (ja) 2011-02-23

Family

ID=38156003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005328380A Expired - Fee Related JP4635836B2 (ja) 2005-11-14 2005-11-14 シート状電子回路モジュール

Country Status (1)

Country Link
JP (1) JP4635836B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102034798B (zh) * 2009-09-28 2013-09-04 日月光半导体制造股份有限公司 封装结构以及封装制程
KR102403468B1 (ko) 2016-05-06 2022-05-31 스몰텍 에이비 어셈블리 플랫폼
CN106793707B (zh) * 2017-01-17 2023-03-14 扬州扬杰电子科技股份有限公司 一种二极管模块的框架及其加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3714286B2 (ja) * 2002-05-28 2005-11-09 松下電器産業株式会社 回路部品モジュールおよびその製造方法
JP2004363406A (ja) * 2003-06-06 2004-12-24 Honda Motor Co Ltd 樹脂封止電子部品ユニット及びその製造方法

Also Published As

Publication number Publication date
JP2007134618A (ja) 2007-05-31

Similar Documents

Publication Publication Date Title
KR100408616B1 (ko) 반도체 장치, 전자 기기의 제조 방법, 전자 기기 및 휴대정보 단말
JP5192825B2 (ja) 半導体装置およびその製造方法、ならびに積層半導体装置の製造方法
JP4504798B2 (ja) 多段構成半導体モジュール
JP2790122B2 (ja) 積層回路基板
US6022761A (en) Method for coupling substrates and structure
US6846699B2 (en) Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
CN101278383B (zh) 电子电路装置及其制造方法
US20100084762A1 (en) Memory card
JP2006303114A (ja) 多段構成半導体モジュールおよびその製造方法
JP2004362602A (ja) Ｒｆｉｄタグ
JP2012028408A (ja) ソケット及びその製造方法
JP5980566B2 (ja) 半導体装置及びその製造方法
US20080248611A1 (en) Manufacturing method of semiconductor device
KR20170016550A (ko) 반도체 패키지의 제조 방법
JP2002270717A (ja) 半導体装置
KR20120058118A (ko) 적층 패키지의 제조 방법, 및 이에 의하여 제조된 적층 패키지의 실장 방법
JP4360240B2 (ja) 半導体装置と半導体装置用多層基板
JP4635836B2 (ja) シート状電子回路モジュール
JP2005340393A (ja) 小型実装モジュール及びその製造方法
KR20010063682A (ko) 플립 칩 본딩 기술을 이용한 반도체 칩 실장 방법
KR100769204B1 (ko) 반도체 패키지 및 그 제조방법
JPH07226455A (ja) 半導体パッケージおよびその製造方法
WO2001033623A1 (en) Semiconductor device and its manufacturing method
CN115050658B (zh) 覆晶薄膜的封装方法及覆晶薄膜
KR101392765B1 (ko) 반도체 패키지 및 그 제조 방법

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080807

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080807

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090701

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20091126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100202

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100309

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100427

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100527

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100622

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100705

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20101026

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20101108

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131203

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131203

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees