JP4627357B2 - 電子デバイス用冷却装置 - Google Patents

電子デバイス用冷却装置 Download PDF

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Publication number
JP4627357B2
JP4627357B2 JP2000243865A JP2000243865A JP4627357B2 JP 4627357 B2 JP4627357 B2 JP 4627357B2 JP 2000243865 A JP2000243865 A JP 2000243865A JP 2000243865 A JP2000243865 A JP 2000243865A JP 4627357 B2 JP4627357 B2 JP 4627357B2
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JP
Japan
Prior art keywords
heat sink
partition member
heat
sink device
thermally conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000243865A
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English (en)
Japanese (ja)
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JP2001085587A5 (https=
JP2001085587A (ja
Inventor
ガイ・アール・ワグナー
スティーブン・イー・ハンツリク
Original Assignee
アバゴ・テクノロジーズ・ジェネラル・アイピー（シンガポール）プライベート・リミテッド
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Application filed by アバゴ・テクノロジーズ・ジェネラル・アイピー（シンガポール）プライベート・リミテッド filed Critical アバゴ・テクノロジーズ・ジェネラル・アイピー（シンガポール）プライベート・リミテッド
Publication of JP2001085587A publication Critical patent/JP2001085587A/ja
Publication of JP2001085587A5 publication Critical patent/JP2001085587A5/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2000243865A 1999-08-13 2000-08-11 電子デバイス用冷却装置 Expired - Fee Related JP4627357B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/373664 1999-08-13
US09/373,664 US6157539A (en) 1999-08-13 1999-08-13 Cooling apparatus for electronic devices

Publications (3)

Publication Number Publication Date
JP2001085587A JP2001085587A (ja) 2001-03-30
JP2001085587A5 JP2001085587A5 (https=) 2007-09-27
JP4627357B2 true JP4627357B2 (ja) 2011-02-09

Family

ID=23473343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000243865A Expired - Fee Related JP4627357B2 (ja) 1999-08-13 2000-08-11 電子デバイス用冷却装置

Country Status (2)

Country Link
US (1) US6157539A (https=)
JP (1) JP4627357B2 (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6282091B1 (en) * 1999-11-11 2001-08-28 Sunonwealth Electric Machine Industry Co. Ltd Mounting devices for a heat-generating element and a heat-dissipating device
US20030175091A1 (en) * 2000-03-10 2003-09-18 Aukzemas Thomas V. Floating captive screw
US6374906B1 (en) * 2000-04-11 2002-04-23 Hewlett-Packard Company Heat sink having a captive handle
US6441631B1 (en) * 2000-06-02 2002-08-27 Advanced Micro Devices, Inc. Processor module heatsink mounting guide posts for function test
JP2002134973A (ja) * 2000-10-19 2002-05-10 Matsushita Electric Ind Co Ltd ヒートシンク装置及び電子機器
US6769175B2 (en) * 2001-05-01 2004-08-03 Agilent Technologies, Inc. Heat sink device manufacture
US6535389B2 (en) * 2001-06-07 2003-03-18 Agilent Technologies, Inc. Heat sink mounting assembly
AU2002316430A1 (en) * 2001-06-27 2003-03-03 Advanced Rotary Systems, Llc Cooler for electronic devices
US6505680B1 (en) 2001-07-27 2003-01-14 Hewlett-Packard Company High performance cooling device
US6557675B2 (en) * 2001-07-31 2003-05-06 Compaq Information Technologies Group, L.P. Tunable vibration damper for processor packages
FR2831018B1 (fr) * 2001-10-17 2003-12-19 Bull Sa Dispositif de maintien d'au moins deux composants electroniques disposes en vis-a-vis de part et d'autre d'une carte de connexion
EP1343362A1 (en) * 2002-03-07 2003-09-10 Hewlett-Packard Company (a Delaware corporation) Cooling system for elecronic devices
US6785138B1 (en) 2002-09-05 2004-08-31 Added Communications Of Georgia, Inc. Repeater case for HDSL modules
US6830097B2 (en) 2002-09-27 2004-12-14 Modine Manufacturing Company Combination tower and serpentine fin heat sink device
TWM245517U (en) * 2003-10-30 2004-10-01 Quanta Comp Inc Computer device and its modular structure
CN2713636Y (zh) * 2004-06-11 2005-07-27 鸿富锦精密工业（深圳）有限公司 散热器扣合装置
US6948555B1 (en) * 2004-06-22 2005-09-27 Hewlett-Packard Development Company, L.P. Heat dissipating system and method
US20060011324A1 (en) * 2004-07-13 2006-01-19 Rogers C J Wound, louvered fin heat sink device
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
US20060054311A1 (en) * 2004-09-15 2006-03-16 Andrew Douglas Delano Heat sink device with independent parts
US20100142136A1 (en) * 2008-12-08 2010-06-10 Sun Microsystems, Inc. Method and apparatus that isolates a computer system from vibrations generated by internal fans
US8829700B2 (en) * 2009-12-01 2014-09-09 Vestas Wind Systems A/S Wind turbine nacelle comprising a heat exchanger assembly
EP2762766B1 (en) * 2011-10-02 2017-02-15 Nanker (Guang Zhou) Semiconductor Manufacturing Corp. Led photo-electric source assembly and led road lamp improved from traditional road lamp
US11107962B2 (en) * 2018-12-18 2021-08-31 Soulnano Limited UV LED array with power interconnect and heat sink
EP4096376B1 (en) * 2021-05-24 2025-09-24 Aptiv Technologies AG Cooling device and heatsink assembly incorporating the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715438A (en) * 1986-06-30 1987-12-29 Unisys Corporation Staggered radial-fin heat sink device for integrated circuit package
US5019880A (en) * 1988-01-07 1991-05-28 Prime Computer, Inc. Heat sink apparatus
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
US5484262A (en) * 1992-10-23 1996-01-16 Nidec Corporation Low profile fan body with heat transfer characteristics
US5445215A (en) * 1992-12-22 1995-08-29 Herbert; Edward Fan assembly with heat sink
JP2880646B2 (ja) * 1994-05-18 1999-04-12 株式会社ピーエフユー ファン付きヒートシンク
FR2729045B1 (fr) * 1994-12-29 1997-01-24 Bull Sa Procede et dispositif de fixation de deux elements tels qu'un radiateur de circuit integre a une carte de circuits imprimes
JP3058818B2 (ja) * 1995-10-05 2000-07-04 山洋電気株式会社 電子部品冷却用ヒートシンク
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
US5896917A (en) * 1996-02-22 1999-04-27 Lemont Aircraft Corporation Active heat sink structure with flow augmenting rings and method for removing heat
JP2773732B2 (ja) * 1996-04-05 1998-07-09 日本電気株式会社 電子部品の冷却構造
JP3768598B2 (ja) * 1996-05-31 2006-04-19 山洋電気株式会社 発熱体冷却装置
JP3206436B2 (ja) * 1996-07-03 2001-09-10 松下電器産業株式会社 ヒートシンク装置
JPH10154889A (ja) * 1996-11-25 1998-06-09 Yaskawa Electric Corp 冷却装置
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths

Also Published As

Publication number Publication date
JP2001085587A (ja) 2001-03-30
US6157539A (en) 2000-12-05

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