JP4617889B2 - 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 - Google Patents

蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 Download PDF

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Publication number
JP4617889B2
JP4617889B2 JP2005007207A JP2005007207A JP4617889B2 JP 4617889 B2 JP4617889 B2 JP 4617889B2 JP 2005007207 A JP2005007207 A JP 2005007207A JP 2005007207 A JP2005007207 A JP 2005007207A JP 4617889 B2 JP4617889 B2 JP 4617889B2
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JP
Japan
Prior art keywords
light
phosphor
emitting device
group
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005007207A
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English (en)
Japanese (ja)
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JP2005226068A5 (enExample
JP2005226068A (ja
Inventor
孝俊 瀬戸
直人 木島
正彦 吉野
昌義 三上
統之 茂岩
宏之 伊村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Priority to JP2005007207A priority Critical patent/JP4617889B2/ja
Publication of JP2005226068A publication Critical patent/JP2005226068A/ja
Publication of JP2005226068A5 publication Critical patent/JP2005226068A5/ja
Application granted granted Critical
Publication of JP4617889B2 publication Critical patent/JP4617889B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
JP2005007207A 2004-01-16 2005-01-14 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 Expired - Fee Related JP4617889B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005007207A JP4617889B2 (ja) 2004-01-16 2005-01-14 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004009769 2004-01-16
JP2005007207A JP4617889B2 (ja) 2004-01-16 2005-01-14 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

Publications (3)

Publication Number Publication Date
JP2005226068A JP2005226068A (ja) 2005-08-25
JP2005226068A5 JP2005226068A5 (enExample) 2007-06-21
JP4617889B2 true JP4617889B2 (ja) 2011-01-26

Family

ID=35001028

Family Applications (1)

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JP2005007207A Expired - Fee Related JP4617889B2 (ja) 2004-01-16 2005-01-14 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

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JP (1) JP4617889B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7489073B2 (en) * 2005-04-15 2009-02-10 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Blue to yellow-orange emitting phosphor, and light source having such a phosphor
JP5315616B2 (ja) * 2006-02-10 2013-10-16 三菱化学株式会社 発光装置、バックライト用白色発光体、及び画像表示装置
JP2008095091A (ja) * 2006-09-15 2008-04-24 Mitsubishi Chemicals Corp 蛍光体及びその製造方法、蛍光体含有組成物、発光装置、並びに画像表示装置及び照明装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3257942B2 (ja) * 1996-01-22 2002-02-18 化成オプトニクス株式会社 蓄光性蛍光体
JP2000282032A (ja) * 1999-03-30 2000-10-10 Taiheiyo Keizai Kaihatsu:Kk 蓄光性蛍光体組成物
DE10036940A1 (de) * 2000-07-28 2002-02-07 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Lumineszenz-Konversions-LED
JP4168776B2 (ja) * 2002-02-15 2008-10-22 三菱化学株式会社 発光装置及びそれを用いた照明装置
DE10259946A1 (de) * 2002-12-20 2004-07-15 Tews, Walter, Dipl.-Chem. Dr.rer.nat.habil. Leuchtstoffe zur Konversion der ultravioletten oder blauen Emission eines lichtemittierenden Elementes in sichtbare weiße Strahlung mit sehr hoher Farbwiedergabe

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JP2005226068A (ja) 2005-08-25

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