JP4598124B2 - ワーク自動作業装置 - Google Patents

ワーク自動作業装置 Download PDF

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Publication number
JP4598124B2
JP4598124B2 JP2008517733A JP2008517733A JP4598124B2 JP 4598124 B2 JP4598124 B2 JP 4598124B2 JP 2008517733 A JP2008517733 A JP 2008517733A JP 2008517733 A JP2008517733 A JP 2008517733A JP 4598124 B2 JP4598124 B2 JP 4598124B2
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JP
Japan
Prior art keywords
work
unit
case
transport
horizontal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008517733A
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English (en)
Japanese (ja)
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JPWO2007138671A1 (ja
Inventor
敬隆 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirata Corp
Original Assignee
Hirata Corp
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Publication date
Application filed by Hirata Corp filed Critical Hirata Corp
Publication of JPWO2007138671A1 publication Critical patent/JPWO2007138671A1/ja
Application granted granted Critical
Publication of JP4598124B2 publication Critical patent/JP4598124B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008517733A 2006-05-30 2006-05-30 ワーク自動作業装置 Expired - Fee Related JP4598124B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/310720 WO2007138671A1 (fr) 2006-05-30 2006-05-30 Dispositif d'usinage automatique d'une pièce

Publications (2)

Publication Number Publication Date
JPWO2007138671A1 JPWO2007138671A1 (ja) 2009-10-01
JP4598124B2 true JP4598124B2 (ja) 2010-12-15

Family

ID=38778200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008517733A Expired - Fee Related JP4598124B2 (ja) 2006-05-30 2006-05-30 ワーク自動作業装置

Country Status (3)

Country Link
JP (1) JP4598124B2 (fr)
CN (1) CN101449639B (fr)
WO (1) WO2007138671A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5317615B2 (ja) * 2008-09-29 2013-10-16 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5173708B2 (ja) * 2008-09-29 2013-04-03 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
EP2302670A1 (fr) * 2009-09-28 2011-03-30 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Station d'emplacement pour machine bras-transfert
JP5525071B2 (ja) * 2013-01-18 2014-06-18 東レエンジニアリング株式会社 多軸位置決め装置
CN105247656B (zh) * 2013-05-24 2017-09-26 雅马哈发动机株式会社 印刷基板用作业装置
JP7143045B2 (ja) 2020-10-26 2022-09-28 三菱電機株式会社 チップマウンター、電子回路基板の製造方法、およびパワーモジュールの製造方法
JP7030928B2 (ja) * 2020-10-26 2022-03-07 三菱電機株式会社 チップマウンター、電子回路基板の製造方法、およびパワーモジュールの製造方法
WO2023152984A1 (fr) * 2022-02-14 2023-08-17 株式会社Fuji Machine de mise en oeuvre pour substrat et procédé de production de substrat de circuit électrique

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006080131A (ja) * 2004-09-07 2006-03-23 Matsushita Electric Ind Co Ltd ボンディング装置及び方法、並びに電子素子

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06151267A (ja) * 1992-11-05 1994-05-31 Shin Meiwa Ind Co Ltd クリーン自動作業装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006080131A (ja) * 2004-09-07 2006-03-23 Matsushita Electric Ind Co Ltd ボンディング装置及び方法、並びに電子素子

Also Published As

Publication number Publication date
JPWO2007138671A1 (ja) 2009-10-01
CN101449639B (zh) 2011-11-30
CN101449639A (zh) 2009-06-03
WO2007138671A1 (fr) 2007-12-06

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