JP4589810B2 - 導電性微粒子及び異方性導電材料 - Google Patents

導電性微粒子及び異方性導電材料 Download PDF

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Publication number
JP4589810B2
JP4589810B2 JP2005167034A JP2005167034A JP4589810B2 JP 4589810 B2 JP4589810 B2 JP 4589810B2 JP 2005167034 A JP2005167034 A JP 2005167034A JP 2005167034 A JP2005167034 A JP 2005167034A JP 4589810 B2 JP4589810 B2 JP 4589810B2
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fine particles
conductive
resin
plating
conductive fine
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Japanese (ja)
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JP2006344416A5 (enExample
JP2006344416A (ja
Inventor
浩也 石田
敬士 久保田
暁舸 王
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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JP2005167034A 2005-06-07 2005-06-07 導電性微粒子及び異方性導電材料 Expired - Lifetime JP4589810B2 (ja)

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JP2005167034A JP4589810B2 (ja) 2005-06-07 2005-06-07 導電性微粒子及び異方性導電材料

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JP2005167034A JP4589810B2 (ja) 2005-06-07 2005-06-07 導電性微粒子及び異方性導電材料

Publications (3)

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JP2006344416A JP2006344416A (ja) 2006-12-21
JP2006344416A5 JP2006344416A5 (enExample) 2008-03-06
JP4589810B2 true JP4589810B2 (ja) 2010-12-01

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JP2005167034A Expired - Lifetime JP4589810B2 (ja) 2005-06-07 2005-06-07 導電性微粒子及び異方性導電材料

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101049609B1 (ko) * 2005-11-18 2011-07-14 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로 접속 재료, 접속 구조 및 회로부재의접속방법
JP6345075B2 (ja) * 2013-10-23 2018-06-20 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3696429B2 (ja) * 1999-02-22 2005-09-21 日本化学工業株式会社 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP2003234020A (ja) * 2002-02-06 2003-08-22 Sekisui Chem Co Ltd 導電性微粒子
JP2004296322A (ja) * 2003-03-27 2004-10-21 Sekisui Chem Co Ltd 導電性微粒子及び液晶表示素子
JP4387175B2 (ja) * 2003-07-07 2009-12-16 積水化学工業株式会社 被覆導電性粒子、異方性導電材料及び導電接続構造体
JP5247968B2 (ja) * 2003-12-02 2013-07-24 日立化成株式会社 回路接続材料、及びこれを用いた回路部材の接続構造
JP4674096B2 (ja) * 2005-02-15 2011-04-20 積水化学工業株式会社 導電性微粒子及び異方性導電材料
JP2006241499A (ja) * 2005-03-02 2006-09-14 Nippon Chem Ind Co Ltd 導電性無電解めっき粉体の製造方法

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