JP2006344416A5 - - Google Patents
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- JP2006344416A5 JP2006344416A5 JP2005167034A JP2005167034A JP2006344416A5 JP 2006344416 A5 JP2006344416 A5 JP 2006344416A5 JP 2005167034 A JP2005167034 A JP 2005167034A JP 2005167034 A JP2005167034 A JP 2005167034A JP 2006344416 A5 JP2006344416 A5 JP 2006344416A5
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- fine particles
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005167034A JP4589810B2 (ja) | 2005-06-07 | 2005-06-07 | 導電性微粒子及び異方性導電材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005167034A JP4589810B2 (ja) | 2005-06-07 | 2005-06-07 | 導電性微粒子及び異方性導電材料 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006344416A JP2006344416A (ja) | 2006-12-21 |
| JP2006344416A5 true JP2006344416A5 (enExample) | 2008-03-06 |
| JP4589810B2 JP4589810B2 (ja) | 2010-12-01 |
Family
ID=37641232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005167034A Expired - Lifetime JP4589810B2 (ja) | 2005-06-07 | 2005-06-07 | 導電性微粒子及び異方性導電材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4589810B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4877230B2 (ja) * | 2005-11-18 | 2012-02-15 | 日立化成工業株式会社 | 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法 |
| JP6345075B2 (ja) * | 2013-10-23 | 2018-06-20 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3696429B2 (ja) * | 1999-02-22 | 2005-09-21 | 日本化学工業株式会社 | 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料 |
| JP2003234020A (ja) * | 2002-02-06 | 2003-08-22 | Sekisui Chem Co Ltd | 導電性微粒子 |
| JP2004296322A (ja) * | 2003-03-27 | 2004-10-21 | Sekisui Chem Co Ltd | 導電性微粒子及び液晶表示素子 |
| JP4387175B2 (ja) * | 2003-07-07 | 2009-12-16 | 積水化学工業株式会社 | 被覆導電性粒子、異方性導電材料及び導電接続構造体 |
| JP5247968B2 (ja) * | 2003-12-02 | 2013-07-24 | 日立化成株式会社 | 回路接続材料、及びこれを用いた回路部材の接続構造 |
| JP4674096B2 (ja) * | 2005-02-15 | 2011-04-20 | 積水化学工業株式会社 | 導電性微粒子及び異方性導電材料 |
| JP2006241499A (ja) * | 2005-03-02 | 2006-09-14 | Nippon Chem Ind Co Ltd | 導電性無電解めっき粉体の製造方法 |
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2005
- 2005-06-07 JP JP2005167034A patent/JP4589810B2/ja not_active Expired - Lifetime