JP2006344416A5 - - Google Patents

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Publication number
JP2006344416A5
JP2006344416A5 JP2005167034A JP2005167034A JP2006344416A5 JP 2006344416 A5 JP2006344416 A5 JP 2006344416A5 JP 2005167034 A JP2005167034 A JP 2005167034A JP 2005167034 A JP2005167034 A JP 2005167034A JP 2006344416 A5 JP2006344416 A5 JP 2006344416A5
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JP
Japan
Prior art keywords
fine particles
conductive
projections
protrusion
height
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JP2005167034A
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Japanese (ja)
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JP4589810B2 (en
JP2006344416A (en
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Priority to JP2005167034A priority Critical patent/JP4589810B2/en
Priority claimed from JP2005167034A external-priority patent/JP4589810B2/en
Publication of JP2006344416A publication Critical patent/JP2006344416A/en
Publication of JP2006344416A5 publication Critical patent/JP2006344416A5/ja
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Publication of JP4589810B2 publication Critical patent/JP4589810B2/en
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Claims (2)

基材微粒子と、前記基材微粒子の表面に形成された導電層とからなる導電性微粒子であって、前記導電層は、表面に高さが２００〜４００ｎｍの突起Ａと５０〜１００ｎｍの突起Ｂとを有し、突起Ａは芯材を有しており、突起Ａの数をａ、突起Ｂの数をｂとするとき、３＜ａ／ｂ＜１０を満たす
ことを特徴とする導電性微粒子。 Conductive fine particles comprising substrate fine particles and a conductive layer formed on the surface of the substrate fine particles, wherein the conductive layer has a protrusion A having a height of 200 to 400 nm and a protrusion B having a height of 50 to 100 nm on the surface. And the projection A has a core, and the conductive fine particles satisfying 3 <a / b <10, where a is the number of projections A and b is the number of projections B . 請求項１記載の導電性微粒子が樹脂バインダーに分散されてなることを特徴とする異方性導電材料。An anisotropic conductive material comprising the conductive fine particles according to claim 1 dispersed in a resin binder.
JP2005167034A 2005-06-07 2005-06-07 Conductive fine particles and anisotropic conductive materials Active JP4589810B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005167034A JP4589810B2 (en) 2005-06-07 2005-06-07 Conductive fine particles and anisotropic conductive materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005167034A JP4589810B2 (en) 2005-06-07 2005-06-07 Conductive fine particles and anisotropic conductive materials

Publications (3)

Publication Number Publication Date
JP2006344416A JP2006344416A (en) 2006-12-21
JP2006344416A5 true JP2006344416A5 (en) 2008-03-06
JP4589810B2 JP4589810B2 (en) 2010-12-01

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ID=37641232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005167034A Active JP4589810B2 (en) 2005-06-07 2005-06-07 Conductive fine particles and anisotropic conductive materials

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JP (1) JP4589810B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101309993B (en) * 2005-11-18 2012-06-27 日立化成工业株式会社 Adhesive composition, circuit connecting material, connecting structure and circuit member connecting method
JP6345075B2 (en) * 2013-10-23 2018-06-20 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3696429B2 (en) * 1999-02-22 2005-09-21 日本化学工業株式会社 Conductive electroless plating powder, method for producing the same, and conductive material comprising the plating powder
JP2003234020A (en) * 2002-02-06 2003-08-22 Sekisui Chem Co Ltd Conductive minute particle
JP2004296322A (en) * 2003-03-27 2004-10-21 Sekisui Chem Co Ltd Conductive particulate and liquid crystal display element
JP4387175B2 (en) * 2003-07-07 2009-12-16 積水化学工業株式会社 Coated conductive particles, anisotropic conductive material, and conductive connection structure
JP5247968B2 (en) * 2003-12-02 2013-07-24 日立化成株式会社 Circuit connection material and circuit member connection structure using the same
JP4674096B2 (en) * 2005-02-15 2011-04-20 積水化学工業株式会社 Conductive fine particles and anisotropic conductive materials
JP2006241499A (en) * 2005-03-02 2006-09-14 Nippon Chem Ind Co Ltd Method for producing powder electroless-plated with electroconductive substance

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