JP2009534202A5 - - Google Patents
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- Publication number
- JP2009534202A5 JP2009534202A5 JP2009506684A JP2009506684A JP2009534202A5 JP 2009534202 A5 JP2009534202 A5 JP 2009534202A5 JP 2009506684 A JP2009506684 A JP 2009506684A JP 2009506684 A JP2009506684 A JP 2009506684A JP 2009534202 A5 JP2009534202 A5 JP 2009534202A5
- Authority
- JP
- Japan
- Prior art keywords
- structural
- layer
- polishing
- polishing layer
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims 18
- 238000005296 abrasive Methods 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive Effects 0.000 claims 5
- 239000000463 material Substances 0.000 claims 4
- 239000011230 binding agent Substances 0.000 claims 3
- 239000002131 composite material Substances 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- 229920001169 thermoplastic Polymers 0.000 claims 3
- 239000004416 thermosoftening plastic Substances 0.000 claims 3
- 238000004049 embossing Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Claims (3)
前記第一主表面と接触し、同一の広がりを持ち、固定される任意の接着層と、
前記基材の第一主表面又は任意の接着層と接触し、同一の広がりを持ち、固定される構造研磨層であって、前記構造研磨層は、研磨粒子及びバインダを含む、外側に突出するように精密形状化された研磨複合体から成り、前記基材及び構造研磨層の双方は重ね合わせのエンボス形状構成を有する、前記構造研磨層と、
前記第二主表面に固定される、任意の取り付け型境界層と、から成るエンボス構造研磨物品であって、
前記エンボス構造研磨物品は多孔質弾性要素を含まない、エンボス構造研磨物品。 A substrate having first and second major surfaces and comprising an inelastic high density thermoplastic film;
An optional adhesive layer that contacts the first major surface, has the same extent and is fixed;
A structural polishing layer that contacts, is coextensive and fixed, in contact with the first major surface of the substrate or any adhesive layer, wherein the structural polishing layer includes an abrasive particle and a binder and protrudes outward. The structural polishing layer comprising a precisely shaped polishing composite, wherein both the substrate and the structural polishing layer have a superposed embossed configuration;
An embossed structured abrasive article comprising an optional attached boundary layer secured to the second major surface,
The embossed structured abrasive article does not include a porous elastic element.
前記第一主表面に接触し、同一の広がりを持つように接着層を固定する工程と、
前記接着層に接触し、同一の広がりを持つように前記構造研磨層を固定する工程であって、前記構造研磨層が、研磨粒子及びバインダを含んだ、外側に突出するように精密形状化された研磨複合体から構成される、固定する工程と、
前記基材及び前記構造研磨層において、前記基材及び前記構造研磨層をエンボス加工し、重ね合わせのエンボス形状構成を提供する工程と、
前記第二主表面に取り付け型境界層を任意で固定する工程と、を含み、
これにより、多孔質弾性要素を含まないエンボス構造研磨物品を提供する、エンボス構造研磨物品の製造方法。 Providing a substrate having first and second major surfaces and comprising an inelastic high-density thermoplastic film;
Contacting the first main surface and fixing the adhesive layer to have the same extent;
A step of fixing the structural polishing layer so as to be in contact with the adhesive layer and to have the same spread, wherein the structural polishing layer includes abrasive particles and a binder and is precision-shaped so as to protrude outwardly; A fixing step comprising a polishing composite comprising:
In the base material and the structural polishing layer, embossing the base material and the structural polishing layer, and providing a superposed embossed shape configuration;
Optionally fixing a mounting boundary layer to the second main surface,
Thereby, the manufacturing method of an embossed structure abrasive | polishing article which provides the embossed structure abrasive | polishing article which does not contain a porous elastic element.
構造研磨層を前記基材に固定する工程であって、前記構造研磨層が、前記接着層と接触し、同一の広がりを持ち、研磨粒子及びバインダを含んだ、外側に突出するように精密形状化された研磨複合体から構成される、工程と、
前記基材及び前記構造研磨層において、前記基材及び前記構造研磨層をエンボス加工し、重ね合わせのエンボス形状構成を提供する工程と、
前記第二主表面に取り付け型境界層を任意で固定する工程と、を含み、
これにより、多孔質弾性要素を含まないエンボス構造研磨物品を提供する、エンボス構造研磨物品の製造方法。 Providing an inelastic high density thermoplastic film substrate having first and second major surfaces;
A step of fixing the structural polishing layer to the substrate, wherein the structural polishing layer is in contact with the adhesive layer, has the same spread, includes abrasive particles and a binder, and has a precise shape so as to protrude outward A process composed of a structured abrasive composite;
In the base material and the structural polishing layer, embossing the base material and the structural polishing layer, and providing a superposed embossed shape configuration;
Optionally fixing a mounting boundary layer to the second main surface,
Thereby, the manufacturing method of an embossed structure abrasive | polishing article which provides the embossed structure abrasive | polishing article which does not contain a porous elastic element.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/379,087 US20070243798A1 (en) | 2006-04-18 | 2006-04-18 | Embossed structured abrasive article and method of making and using the same |
PCT/US2007/066285 WO2007121155A2 (en) | 2006-04-18 | 2007-04-10 | Embossed structured abrasive article and method of making and using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009534202A JP2009534202A (en) | 2009-09-24 |
JP2009534202A5 true JP2009534202A5 (en) | 2010-05-27 |
Family
ID=38605384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009506684A Pending JP2009534202A (en) | 2006-04-18 | 2007-04-10 | Embossed structure abrasive article and method for producing and using the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070243798A1 (en) |
EP (1) | EP2007551A4 (en) |
JP (1) | JP2009534202A (en) |
KR (1) | KR20080109854A (en) |
CN (1) | CN101426619B (en) |
RU (1) | RU2449881C2 (en) |
WO (1) | WO2007121155A2 (en) |
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CN110905955B (en) * | 2019-12-05 | 2021-07-16 | 江苏长顺高分子材料研究院有限公司 | Melamine aldehyde resin brake pad and preparation method thereof |
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-
2006
- 2006-04-18 US US11/379,087 patent/US20070243798A1/en not_active Abandoned
-
2007
- 2007-04-10 KR KR1020087025363A patent/KR20080109854A/en not_active Application Discontinuation
- 2007-04-10 CN CN2007800141633A patent/CN101426619B/en not_active Expired - Fee Related
- 2007-04-10 JP JP2009506684A patent/JP2009534202A/en active Pending
- 2007-04-10 RU RU2008141238/02A patent/RU2449881C2/en not_active IP Right Cessation
- 2007-04-10 WO PCT/US2007/066285 patent/WO2007121155A2/en active Application Filing
- 2007-04-10 EP EP07760363A patent/EP2007551A4/en not_active Withdrawn
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