JP2014508650A5 - - Google Patents
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- Publication number
- JP2014508650A5 JP2014508650A5 JP2013551260A JP2013551260A JP2014508650A5 JP 2014508650 A5 JP2014508650 A5 JP 2014508650A5 JP 2013551260 A JP2013551260 A JP 2013551260A JP 2013551260 A JP2013551260 A JP 2013551260A JP 2014508650 A5 JP2014508650 A5 JP 2014508650A5
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- flexible backing
- replicated microstructure
- abrasive article
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005296 abrasive Methods 0.000 claims 14
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive Effects 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 3
- 239000011230 binding agent Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 230000000717 retained Effects 0.000 claims 1
Claims (5)
少なくとも１つのバインダー中に保持される複数の研磨粒子を備える研磨材層であって、前記可撓性裏材の前記第１の主表面上に配置される、研磨材層と、
接着剤と、を備え、
前記接着剤が、実質的に前記複製されたミクロ構造の前記陥凹部内に収容される、研磨物品。 A flexible backing having opposing first and second major surfaces, wherein at least a portion of the second major surface of the flexible backing includes a replicated microstructure having a recess. A flexible backing;
An abrasive layer comprising a plurality of abrasive particles retained in at least one binder, the abrasive layer disposed on the first major surface of the flexible backing;
An adhesive, and
An abrasive article, wherein the adhesive is substantially contained within the recess of the replicated microstructure.
前記被加工物を研磨物品と接触させることであって、
前記研磨物品が、可撓性裏材、研磨材層、接着剤、及び剛性の基材を備え、
前記可撓性裏材が、対向する第１及び第２の主表面を有し、前記第２の主表面の少なくとも一部が陥凹部を有する複製されたミクロ構造を含み、
前記研磨材層が、少なくとも１つのバインダー中に保持される複数の研磨粒子を有し、
前記研磨材層が、前記可撓性裏材の前記第１の主表面上に配置されており、
前記基材が、前記複製されたミクロ構造の少なくとも一部と接触しており、かつ
前記接着剤が、前記複製されたミクロ構造の前記陥凹部内に実質的に収容される、ことと、
前記研磨物品を前記被加工物に対して動かすことと、を含む、研磨方法。 Providing a workpiece to be polished;
Contacting the workpiece with an abrasive article,
The abrasive article comprises a flexible backing, an abrasive layer, an adhesive, and a rigid substrate.
The flexible backing includes first and second major surfaces facing each other, and at least a portion of the second major surface includes a replicated microstructure having a recess;
The abrasive layer has a plurality of abrasive particles held in at least one binder ;
The abrasive layer is disposed on the first main surface of the flexible backing ;
Wherein the substrate, in contact with at least a portion of the replicated microstructure, and wherein the adhesive, Ru is substantially accommodated in the recess portion of the replicated microstructure, and this,
Moving the abrasive article relative to the workpiece.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161436407P | 2011-01-26 | 2011-01-26 | |
| US61/436,407 | 2011-01-26 | ||
| PCT/US2012/022142 WO2012102978A1 (en) | 2011-01-26 | 2012-01-23 | Abrasive article with replicated microstructured backing and method of using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014508650A JP2014508650A (en) | 2014-04-10 |
| JP2014508650A5 true JP2014508650A5 (en) | 2015-02-12 |
Family
ID=45755505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013551260A Pending JP2014508650A (en) | 2011-01-26 | 2012-01-23 | Abrasive article comprising a backing having a replicated microstructure and method of using the same |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20130295821A1 (en) |
| JP (1) | JP2014508650A (en) |
| KR (1) | KR20140018880A (en) |
| CN (1) | CN103328158A (en) |
| SG (1) | SG191978A1 (en) |
| TW (1) | TW201238716A (en) |
| WO (1) | WO2012102978A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3086903B1 (en) * | 2013-12-23 | 2019-09-11 | 3M Innovative Properties Company | A coated abrasive article maker apparatus |
| CN104369120B (en) * | 2014-09-15 | 2016-11-09 | 西安德谦新材料科技发展有限公司 | A kind of diamond implanted based on grinding unit or CBN grinding tool preparation method |
| EP3224000B1 (en) * | 2014-11-26 | 2020-11-04 | 3M Innovative Properties Company | Abrasive articles, assemblies, and methods with gripping material |
| CN104403575B (en) * | 2014-12-23 | 2016-09-21 | 包头市华辰稀土材料有限公司 | A kind of preparation method of high accuracy aluminum oxide polishing powder |
| WO2016209651A1 (en) * | 2015-06-22 | 2016-12-29 | 3M Innovative Properties Company | Abrasive articles, assemblies, and methods with gripping material |
| CN105500186A (en) * | 2016-01-21 | 2016-04-20 | 苏州新美光纳米科技有限公司 | Polishing pad for wafer polishing and self-absorption method thereof |
| CN105751090A (en) * | 2016-04-15 | 2016-07-13 | 常州市金牛研磨有限公司 | Anti-skid strengthened abrasive belt |
| US10849660B2 (en) * | 2017-02-21 | 2020-12-01 | Diamabrush Llc | Sanding screen device |
| US20200164484A1 (en) * | 2017-08-04 | 2020-05-28 | 3M Innovative Properties Company | Microreplicated polishing surface with enhanced co-planarity |
| TWI674947B (en) * | 2018-04-19 | 2019-10-21 | 智勝科技股份有限公司 | Polishing pad, manufacturing method of polishing pad and polishing method |
| CN108747876B (en) * | 2018-06-11 | 2021-03-19 | 河北思瑞恩新材料科技有限公司 | Preparation method of paint surface grinding sand disc |
| US10954803B2 (en) * | 2019-01-17 | 2021-03-23 | Rolls-Royce Corporation | Abrasive coating for high temperature mechanical systems |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5318083A (en) * | 1976-08-04 | 1978-02-18 | Sankyo Rikagaku Co | Grinding instruments of multiilayer structure |
| US4629473A (en) * | 1985-06-26 | 1986-12-16 | Norton Company | Resilient abrasive polishing product |
| US5152917B1 (en) * | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
| CA2113318A1 (en) * | 1993-01-28 | 1994-07-29 | Robert J. Jantschek | Abrasive attachment system for rotative abrading applications |
| US5692950A (en) * | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| CN101092024A (en) * | 2000-04-28 | 2007-12-26 | 3M创新有限公司 | Abrasive article and methods for grinding glass |
| US6632129B2 (en) * | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
| US6838142B2 (en) * | 2001-05-18 | 2005-01-04 | 3M Innovative Properties Company | Specular laminates |
| US6846232B2 (en) * | 2001-12-28 | 2005-01-25 | 3M Innovative Properties Company | Backing and abrasive product made with the backing and method of making and using the backing and abrasive product |
| CN1411038A (en) * | 2002-05-30 | 2003-04-16 | 株式会社日立制作所 | Polishing method and apparatus |
| US6755878B2 (en) * | 2002-08-02 | 2004-06-29 | 3M Innovative Properties Company | Abrasive articles and methods of making and using the same |
| WO2008079708A1 (en) * | 2006-12-20 | 2008-07-03 | 3M Innovative Properties Company | Coated abrasive disc and method of making the same |
| WO2008079932A2 (en) * | 2006-12-21 | 2008-07-03 | Saint-Gobain Abrasives, Inc. | Abrasive article with cured backsize layer |
| US20100022174A1 (en) * | 2008-07-28 | 2010-01-28 | Kinik Company | Grinding tool and method for fabricating the same |
-
2012
- 2012-01-23 CN CN2012800056627A patent/CN103328158A/en active Pending
- 2012-01-23 WO PCT/US2012/022142 patent/WO2012102978A1/en active Application Filing
- 2012-01-23 US US13/979,233 patent/US20130295821A1/en not_active Abandoned
- 2012-01-23 SG SG2013054051A patent/SG191978A1/en unknown
- 2012-01-23 KR KR1020137022016A patent/KR20140018880A/en not_active Application Discontinuation
- 2012-01-23 JP JP2013551260A patent/JP2014508650A/en active Pending
- 2012-01-30 TW TW101102916A patent/TW201238716A/en unknown
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