JP4584783B2 - 基板処理装置および基板処理方法、ならびにコンピュータ読取可能な記憶媒体 - Google Patents

基板処理装置および基板処理方法、ならびにコンピュータ読取可能な記憶媒体 Download PDF

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Publication number
JP4584783B2
JP4584783B2 JP2005182320A JP2005182320A JP4584783B2 JP 4584783 B2 JP4584783 B2 JP 4584783B2 JP 2005182320 A JP2005182320 A JP 2005182320A JP 2005182320 A JP2005182320 A JP 2005182320A JP 4584783 B2 JP4584783 B2 JP 4584783B2
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Japan
Prior art keywords
processing unit
substrate
pure water
drying
fluid
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Expired - Fee Related
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JP2005182320A
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English (en)
Japanese (ja)
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JP2007005478A5 (enrdf_load_stackoverflow
JP2007005478A (ja
Inventor
幸吉 広城
裕二 上川
孝之 戸島
尚樹 新藤
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2005182320A priority Critical patent/JP4584783B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to KR1020077025994A priority patent/KR101124049B1/ko
Priority to KR1020117002762A priority patent/KR101133394B1/ko
Priority to EP06766790A priority patent/EP1909313A4/en
Priority to US11/922,502 priority patent/US8015984B2/en
Priority to PCT/JP2006/312102 priority patent/WO2006137330A1/ja
Priority to TW095122476A priority patent/TW200717632A/zh
Publication of JP2007005478A publication Critical patent/JP2007005478A/ja
Publication of JP2007005478A5 publication Critical patent/JP2007005478A5/ja
Application granted granted Critical
Publication of JP4584783B2 publication Critical patent/JP4584783B2/ja
Priority to US13/206,186 priority patent/US8303724B2/en
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Expired - Fee Related legal-status Critical Current

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JP2005182320A 2005-06-22 2005-06-22 基板処理装置および基板処理方法、ならびにコンピュータ読取可能な記憶媒体 Expired - Fee Related JP4584783B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2005182320A JP4584783B2 (ja) 2005-06-22 2005-06-22 基板処理装置および基板処理方法、ならびにコンピュータ読取可能な記憶媒体
KR1020117002762A KR101133394B1 (ko) 2005-06-22 2006-06-16 기판 처리 장치 및 기판 처리 방법과 컴퓨터 판독 가능한 기억 매체
EP06766790A EP1909313A4 (en) 2005-06-22 2006-06-16 SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
US11/922,502 US8015984B2 (en) 2005-06-22 2006-06-16 Substrate processing apparatus including a drying mechanism using a fluid mixture of purified water and a volatile organic solvent
KR1020077025994A KR101124049B1 (ko) 2005-06-22 2006-06-16 기판 처리 장치 및 기판 처리 방법과 컴퓨터 판독 가능한기억 매체
PCT/JP2006/312102 WO2006137330A1 (ja) 2005-06-22 2006-06-16 基板処理装置および基板処理方法
TW095122476A TW200717632A (en) 2005-06-22 2006-06-22 Substrate processing apparatus and substrate processing method, and computer-readable storage medium
US13/206,186 US8303724B2 (en) 2005-06-22 2011-08-09 Substrate processing method and non-transitory storage medium for carrying out such method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005182320A JP4584783B2 (ja) 2005-06-22 2005-06-22 基板処理装置および基板処理方法、ならびにコンピュータ読取可能な記憶媒体

Publications (3)

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JP2007005478A JP2007005478A (ja) 2007-01-11
JP2007005478A5 JP2007005478A5 (enrdf_load_stackoverflow) 2008-07-31
JP4584783B2 true JP4584783B2 (ja) 2010-11-24

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JP2005182320A Expired - Fee Related JP4584783B2 (ja) 2005-06-22 2005-06-22 基板処理装置および基板処理方法、ならびにコンピュータ読取可能な記憶媒体

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JP (1) JP4584783B2 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110289795A1 (en) * 2010-02-16 2011-12-01 Tomoatsu Ishibashi Substrate drying apparatus, substrate drying method and control program
JP5635422B2 (ja) * 2010-02-16 2014-12-03 株式会社荏原製作所 基板乾燥方法、制御プログラム及び基板乾燥装置
JP5522028B2 (ja) 2010-03-09 2014-06-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6228800B2 (ja) * 2013-09-30 2017-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2019160957A (ja) * 2018-03-12 2019-09-19 東京エレクトロン株式会社 基板乾燥装置
JP7281925B2 (ja) * 2019-03-07 2023-05-26 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
KR102267912B1 (ko) * 2019-05-14 2021-06-23 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
JP6956924B2 (ja) * 2019-08-29 2021-11-02 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7511375B2 (ja) * 2020-04-10 2024-07-05 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN116222199B (zh) * 2023-03-03 2025-03-18 上海至纯洁净系统科技股份有限公司 一种解决马兰格尼干燥模组震动造成颗粒污染的优化装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3204503B2 (ja) * 1990-09-13 2001-09-04 株式会社日立製作所 蒸気洗浄方法及びその装置
JP2000040686A (ja) * 1998-07-22 2000-02-08 Mitsubishi Electric Corp 半導体製造方法、半導体製造装置、及び混合ガス生成装置
JP3869671B2 (ja) * 2001-03-22 2007-01-17 大日本スクリーン製造株式会社 基板処理方法および基板処理装置

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