JP4579670B2 - 部品の圧着装置及び圧着方法 - Google Patents

部品の圧着装置及び圧着方法 Download PDF

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Publication number
JP4579670B2
JP4579670B2 JP2004364745A JP2004364745A JP4579670B2 JP 4579670 B2 JP4579670 B2 JP 4579670B2 JP 2004364745 A JP2004364745 A JP 2004364745A JP 2004364745 A JP2004364745 A JP 2004364745A JP 4579670 B2 JP4579670 B2 JP 4579670B2
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Prior art keywords
crimping
circuit board
display panel
electronic component
arm body
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Expired - Fee Related
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JP2004364745A
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Japanese (ja)
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JP2006173396A (ja
JP2006173396A5 (enExample
Inventor
徳和 冨樫
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2004364745A priority Critical patent/JP4579670B2/ja
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JP2004364745A 2004-12-16 2004-12-16 部品の圧着装置及び圧着方法 Expired - Fee Related JP4579670B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004364745A JP4579670B2 (ja) 2004-12-16 2004-12-16 部品の圧着装置及び圧着方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004364745A JP4579670B2 (ja) 2004-12-16 2004-12-16 部品の圧着装置及び圧着方法

Publications (3)

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JP2006173396A JP2006173396A (ja) 2006-06-29
JP2006173396A5 JP2006173396A5 (enExample) 2009-12-03
JP4579670B2 true JP4579670B2 (ja) 2010-11-10

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JP2004364745A Expired - Fee Related JP4579670B2 (ja) 2004-12-16 2004-12-16 部品の圧着装置及び圧着方法

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5265099B2 (ja) * 2006-09-11 2013-08-14 オリンパス株式会社 基板検査装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4338883B2 (ja) * 2000-08-11 2009-10-07 芝浦メカトロニクス株式会社 部品実装装置および部品実装方法

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Publication number Publication date
JP2006173396A (ja) 2006-06-29

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