JP4558301B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4558301B2 JP4558301B2 JP2003368242A JP2003368242A JP4558301B2 JP 4558301 B2 JP4558301 B2 JP 4558301B2 JP 2003368242 A JP2003368242 A JP 2003368242A JP 2003368242 A JP2003368242 A JP 2003368242A JP 4558301 B2 JP4558301 B2 JP 4558301B2
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- Prior art keywords
- wiring
- power supply
- bypass capacitor
- wirings
- semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5223—Capacitor integral with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Geometry (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Description
図に示すように半導体装置は、バイパスコンデンサ101の上方に、コンタクト102で接続された上下2層の電源配線103a,103bと、コンタクト104で接続された上下2層の電源配線105a,105bが形成されている。また、電源配線103a,105aの上方には、NAND回路106が形成されている。
図に示すようにパッケージ111に半導体チップ112が搭載されている。半導体チップ112には、バイパスコンデンサ113a,113b、I/Oセル114a,114b、電源配線115a,115b、およびパッド116a,116bが形成されている。パッケージ111には、リード117a,117bが設けられている。パッド116a,116bとリード117a,117bには、ボンディングによってワイヤ118a,118bが接続されている。
図1は、第1の実施の形態に係る半導体装置の断面図である。
図に示すように半導体装置は、バイパスコンデンサ1、電源配線2,3,4a,4b,5a,5b、コンタクト6a,6b,7a,7b,8a,8b,10a,10b、およびNAND回路9を有している。
さらに、コンタクト6a,6b,7a,7bを、配線が除かれている側の電源配線4a,4b,5a,5bの端に配置して、下層の電源配線2,3に接続することにより、電源配線2,3のバイパスコンデンサ1から離れた所に、ノイズが不要に乗ることを防止できる。
図2は、第2の実施の形態に係る半導体装置の平面図である。
図に示すように半導体装置は、パッケージ22に半導体チップ21が搭載されている。半導体チップ21には、バイパスコンデンサ11a,11b、電源配線12,13,14a〜14c,15a〜15c、I/Oセル16a,16b、配線17a,17b、パッド18a,18bが形成されている。パッケージ22には、半導体装置が基板に実装されるとき、基板上の配線と接続されるリード20a,20bが設けられている。パッド18a,18bとリード20a,20bには、ボンディングによって、ワイヤ19a,19bが接続されている。
2,3,4a,4b,5a,5b,12,13,14a〜14c,15a〜15c 電源配線
6a,6b,7a,7b,8a,8b,10a,10b コンタクト
9 NAND回路
16a,16b I/Oセル
17a,17b 配線
18a,18b パッド
19a,19b ワイヤ
20a,20b リード
21 半導体チップ
22 パッケージ
Claims (1)
- 半導体基板の上方に形成されたバイパスコンデンサと、
第1電位が供給される第1配線と、
前記第1配線の上方であって、前記第1電位が供給される第2配線と、
前記第1配線と前記第2配線とを相互に接続する第3配線と、
前記第1配線の上方であって、前記第2配線とは分断され、前記第1電位が供給される第4配線と、
前記第1配線と前記第4配線とを相互に接続する第5配線と、
前記バイパスコンデンサの上方であって、第2電位が供給される第6配線と、
前記第6配線の上方であって、前記第2電位が供給される第7配線と、
前記第6配線と前記第7配線とを相互に接続する第8配線と、
前記第6配線の上方であって、前記第7配線とは分断され、前記第2電位が供給される第9配線と、
前記第6配線と前記第9配線とを相互に接続する第10配線と、
前記第1配線と前記バイパスコンデンサの第1電極とを接続する第11配線と、
前記第6配線と前記バイパスコンデンサの第2電極とを接続する第12配線と、
を有し、
前記第11配線は、前記第1配線と前記第3配線との接続点と、前記第1配線と前記第5配線の接続点との間において、前記第1配線と接続され、
前記第12配線は、前記第6配線と前記第8配線との接続点と、前記第6配線と前記第10配線の接続点との間において、前記第2配線と接続されることを特徴とする半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003368242A JP4558301B2 (ja) | 2003-10-29 | 2003-10-29 | 半導体装置 |
US10/811,488 US7157752B2 (en) | 2003-10-29 | 2004-03-29 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003368242A JP4558301B2 (ja) | 2003-10-29 | 2003-10-29 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005136014A JP2005136014A (ja) | 2005-05-26 |
JP4558301B2 true JP4558301B2 (ja) | 2010-10-06 |
Family
ID=34543771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003368242A Expired - Fee Related JP4558301B2 (ja) | 2003-10-29 | 2003-10-29 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7157752B2 (ja) |
JP (1) | JP4558301B2 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003060037A (ja) * | 2001-08-10 | 2003-02-28 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置における積層異幅電源幹線 |
JP2003224195A (ja) * | 2002-01-30 | 2003-08-08 | Ricoh Co Ltd | スタンダードセルまたはマクロセルを含む半導体集積回路、およびその配置配線方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3432963B2 (ja) * | 1995-06-15 | 2003-08-04 | 沖電気工業株式会社 | 半導体集積回路 |
JP3236583B2 (ja) * | 1999-06-24 | 2001-12-10 | ローム株式会社 | 半導体集積回路装置 |
-
2003
- 2003-10-29 JP JP2003368242A patent/JP4558301B2/ja not_active Expired - Fee Related
-
2004
- 2004-03-29 US US10/811,488 patent/US7157752B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003060037A (ja) * | 2001-08-10 | 2003-02-28 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置における積層異幅電源幹線 |
JP2003224195A (ja) * | 2002-01-30 | 2003-08-08 | Ricoh Co Ltd | スタンダードセルまたはマクロセルを含む半導体集積回路、およびその配置配線方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2005136014A (ja) | 2005-05-26 |
US20050093051A1 (en) | 2005-05-05 |
US7157752B2 (en) | 2007-01-02 |
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