JP4555612B2 - 容量型力学量センサ - Google Patents
容量型力学量センサ Download PDFInfo
- Publication number
- JP4555612B2 JP4555612B2 JP2004163087A JP2004163087A JP4555612B2 JP 4555612 B2 JP4555612 B2 JP 4555612B2 JP 2004163087 A JP2004163087 A JP 2004163087A JP 2004163087 A JP2004163087 A JP 2004163087A JP 4555612 B2 JP4555612 B2 JP 4555612B2
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- JP
- Japan
- Prior art keywords
- electrode
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- substrate
- mechanical quantity
- quantity sensor
- Prior art date
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Gyroscopes (AREA)
- Pressure Sensors (AREA)
Description
振動体(梁4と錘5)を形成したシリコン基板2を上下より挟み込む上下硝子基板1、3の一部には、貫通穴8が形成され、これら貫通穴8を通して、上下硝子1,3の内側に形成した電極を外側に引き出す構造をしている。貫通穴8の外側には、導電性材料9が積層されており、硝子内(微小隙間6,7)は封止される。上下硝子基板1,3の内側に形成された励起用固定電極10、検出用固定電極11及び基板電極12は、貫通穴8の側壁に形成した配線を通し、この導電性材料9から外へ取り出している。
ここで、実施例1、2において角速度センサを例にあげたが、それに限らず、加速度センサや圧力センサ等の容量変化検出型の力学量センサ全般に当てはまる。
2 シリコン基板
3 下部硝子基板
4 梁
5 錘
6、7 微小隙間
8 貫通穴
9 導電性材料
10 励起用固定電極
11 検出用固定電極
12 基板電極
31 凹み
41、42、71 コンタクト電極
61 溝
81 接続部
91 錘
92 梁
93 半導体基板
94 上側基板
95 下側基板
96、97 微小隙間
98 固定電極
99 コンタクト部
100 接合しない領域
Claims (7)
- 梁により支持され、外部より印加される力学量により変位する錘を有する半導体基板と、
前記錘に対向する位置に微小隙間を隔てて配置された固定電極、及び前記半導体基板の一部と接する基板電極を積層させた硝子基板と、
前記半導体基板と前記硝子基板とが接する部分に配置された、前記半導体基板と前記基板電極とが電気的に接する領域において、両者が接する面積以上の大きさを有する凹みと、
前記凹み内に配置された前記基板電極および前記基板電極に接するコンタクト電極と、
を有し、
前記コンタクト電極の一部に、複数の溝、若しくは複数の穴が形成されており、前記凹みが前記基板電極の厚みより深く、且つ前記コンタクト電極と前記基板電極の厚みの和が、前記凹みの深さより大きい、前記錘の変位により、前記固定電極の容量変化から前記力学量を測定する容量型力学量センサ。 - 前記複数の溝、若しくは複数の穴が等間隔に配置されている請求項1に記載の容量型力学量センサ。
- 前記凹み内の前記コンタクト電極は複数個である請求項1または2に記載の容量型力学量センサ。
- 前記複数個であるコンタクト電極が等間隔に配置されている請求項3に記載の容量型力学量センサ。
- 前記コンタクト電極が隣り合うコンタクト電極と略同電位である請求項3に記載の容量型力学量センサ。
- 前記コンタクト電極が隣り合うコンタクト電極とコンタクト電極と同材料で接続されている請求項3に記載の容量型力学量センサ。
- 前記コンタクト電極がアルミニウムを含む請求項3に記載の容量型力学量センサ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004163087A JP4555612B2 (ja) | 2004-01-21 | 2004-06-01 | 容量型力学量センサ |
TW094101696A TWI355750B (en) | 2004-01-21 | 2005-01-20 | Capacitive sensor for dynamical quantity |
US11/039,500 US7216541B2 (en) | 2004-01-21 | 2005-01-20 | Capacitive sensor for dynamical quantity |
CN2005100509277A CN1645152B (zh) | 2004-01-21 | 2005-01-21 | 用于测量动力学参量的电容传感器 |
KR1020050005912A KR101068341B1 (ko) | 2004-01-21 | 2005-01-21 | 용량형 역학량 센서 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004012899 | 2004-01-21 | ||
JP2004163087A JP4555612B2 (ja) | 2004-01-21 | 2004-06-01 | 容量型力学量センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005233926A JP2005233926A (ja) | 2005-09-02 |
JP4555612B2 true JP4555612B2 (ja) | 2010-10-06 |
Family
ID=34752132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004163087A Expired - Fee Related JP4555612B2 (ja) | 2004-01-21 | 2004-06-01 | 容量型力学量センサ |
Country Status (5)
Country | Link |
---|---|
US (1) | US7216541B2 (ja) |
JP (1) | JP4555612B2 (ja) |
KR (1) | KR101068341B1 (ja) |
CN (1) | CN1645152B (ja) |
TW (1) | TWI355750B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7669359B2 (en) * | 2005-06-22 | 2010-03-02 | Surefire, Llc | Machine gun accessory mount adapter |
JP4839747B2 (ja) * | 2005-09-20 | 2011-12-21 | 三菱電機株式会社 | 静電容量型加速度センサ |
JP4692373B2 (ja) * | 2006-04-28 | 2011-06-01 | パナソニック電工株式会社 | 静電容量式センサ |
US8919199B2 (en) * | 2010-12-01 | 2014-12-30 | Analog Devices, Inc. | Apparatus and method for anchoring electrodes in MEMS devices |
JP2013250133A (ja) * | 2012-05-31 | 2013-12-12 | Seiko Epson Corp | 電子デバイス及びその製造方法、並びに電子機器 |
US9709595B2 (en) | 2013-11-14 | 2017-07-18 | Analog Devices, Inc. | Method and apparatus for detecting linear and rotational movement |
US9599471B2 (en) | 2013-11-14 | 2017-03-21 | Analog Devices, Inc. | Dual use of a ring structure as gyroscope and accelerometer |
US10746548B2 (en) | 2014-11-04 | 2020-08-18 | Analog Devices, Inc. | Ring gyroscope structural features |
CN105241584A (zh) * | 2015-10-14 | 2016-01-13 | 华东光电集成器件研究所 | 一种电容式压力传感器 |
US11656077B2 (en) | 2019-01-31 | 2023-05-23 | Analog Devices, Inc. | Pseudo-extensional mode MEMS ring gyroscope |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62199092A (ja) * | 1986-02-27 | 1987-09-02 | 関西日本電気株式会社 | ハイブリツドic |
JPH06160420A (ja) * | 1992-11-19 | 1994-06-07 | Omron Corp | 半導体加速度センサ及びその製造方法 |
JPH08122359A (ja) * | 1994-10-21 | 1996-05-17 | Fuji Electric Co Ltd | 半導体加速度センサとその製造方法および試験方法 |
JPH08136576A (ja) * | 1994-11-08 | 1996-05-31 | Omron Corp | 半導体物理量センサ |
JP2001349731A (ja) * | 2000-06-06 | 2001-12-21 | Matsushita Electric Ind Co Ltd | マイクロマシンデバイスおよび角加速度センサおよび加速度センサ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3114570B2 (ja) * | 1995-05-26 | 2000-12-04 | オムロン株式会社 | 静電容量型圧力センサ |
JPH10300775A (ja) * | 1997-04-30 | 1998-11-13 | Matsushita Electric Works Ltd | 静電容量型加速度センサ及びその製造方法 |
JP2002055117A (ja) | 2000-08-10 | 2002-02-20 | Yazaki Corp | 静電容量型加速度センサ |
WO2002103368A1 (en) * | 2001-06-13 | 2002-12-27 | Mitsubishi Denki Kabushiki Kaisha | Silicon device |
CN100492015C (zh) * | 2002-04-12 | 2009-05-27 | 中国科学院上海微系统与信息技术研究所 | 湿法腐蚀制造的微机械电容式加速度传感器 |
EP1522521B1 (en) * | 2003-10-10 | 2015-12-09 | Infineon Technologies AG | Capacitive sensor |
-
2004
- 2004-06-01 JP JP2004163087A patent/JP4555612B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-20 TW TW094101696A patent/TWI355750B/zh not_active IP Right Cessation
- 2005-01-20 US US11/039,500 patent/US7216541B2/en active Active
- 2005-01-21 CN CN2005100509277A patent/CN1645152B/zh not_active Expired - Fee Related
- 2005-01-21 KR KR1020050005912A patent/KR101068341B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62199092A (ja) * | 1986-02-27 | 1987-09-02 | 関西日本電気株式会社 | ハイブリツドic |
JPH06160420A (ja) * | 1992-11-19 | 1994-06-07 | Omron Corp | 半導体加速度センサ及びその製造方法 |
JPH08122359A (ja) * | 1994-10-21 | 1996-05-17 | Fuji Electric Co Ltd | 半導体加速度センサとその製造方法および試験方法 |
JPH08136576A (ja) * | 1994-11-08 | 1996-05-31 | Omron Corp | 半導体物理量センサ |
JP2001349731A (ja) * | 2000-06-06 | 2001-12-21 | Matsushita Electric Ind Co Ltd | マイクロマシンデバイスおよび角加速度センサおよび加速度センサ |
Also Published As
Publication number | Publication date |
---|---|
KR101068341B1 (ko) | 2011-09-28 |
TWI355750B (en) | 2012-01-01 |
KR20050076717A (ko) | 2005-07-26 |
JP2005233926A (ja) | 2005-09-02 |
US20050155428A1 (en) | 2005-07-21 |
TW200529455A (en) | 2005-09-01 |
CN1645152B (zh) | 2011-09-14 |
CN1645152A (zh) | 2005-07-27 |
US7216541B2 (en) | 2007-05-15 |
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