JP4551561B2 - 真空成膜装置用部品とそれを用いた真空成膜装置、およびターゲット装置 - Google Patents

真空成膜装置用部品とそれを用いた真空成膜装置、およびターゲット装置 Download PDF

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Publication number
JP4551561B2
JP4551561B2 JP2000399263A JP2000399263A JP4551561B2 JP 4551561 B2 JP4551561 B2 JP 4551561B2 JP 2000399263 A JP2000399263 A JP 2000399263A JP 2000399263 A JP2000399263 A JP 2000399263A JP 4551561 B2 JP4551561 B2 JP 4551561B2
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Japan
Prior art keywords
film
sprayed
vacuum
forming apparatus
film forming
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Expired - Lifetime
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JP2000399263A
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English (en)
Japanese (ja)
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JP2001247957A5 (https=
JP2001247957A (ja
Inventor
道雄 佐藤
洋一郎 矢部
隆 中村
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Toshiba Corp
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Toshiba Corp
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Priority to JP2000399263A priority Critical patent/JP4551561B2/ja
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Publication of JP2001247957A5 publication Critical patent/JP2001247957A5/ja
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  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP2000399263A 1999-12-28 2000-12-27 真空成膜装置用部品とそれを用いた真空成膜装置、およびターゲット装置 Expired - Lifetime JP4551561B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000399263A JP4551561B2 (ja) 1999-12-28 2000-12-27 真空成膜装置用部品とそれを用いた真空成膜装置、およびターゲット装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP37568799 1999-12-28
JP11-375687 1999-12-28
JP37568699 1999-12-28
JP11-375686 1999-12-28
JP2000399263A JP4551561B2 (ja) 1999-12-28 2000-12-27 真空成膜装置用部品とそれを用いた真空成膜装置、およびターゲット装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004287003A Division JP4686159B2 (ja) 1999-12-28 2004-09-30 真空成膜装置用部品とそれを用いた真空成膜装置およびターゲット装置

Publications (3)

Publication Number Publication Date
JP2001247957A JP2001247957A (ja) 2001-09-14
JP2001247957A5 JP2001247957A5 (https=) 2005-06-23
JP4551561B2 true JP4551561B2 (ja) 2010-09-29

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JP2000399263A Expired - Lifetime JP4551561B2 (ja) 1999-12-28 2000-12-27 真空成膜装置用部品とそれを用いた真空成膜装置、およびターゲット装置

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JP (1) JP4551561B2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4825366B2 (ja) * 2001-05-31 2011-11-30 株式会社東芝 真空成膜装置用部品とそれを用いた真空成膜装置
US7554052B2 (en) * 2005-07-29 2009-06-30 Applied Materials, Inc. Method and apparatus for the application of twin wire arc spray coatings
JP4910465B2 (ja) * 2006-04-18 2012-04-04 東ソー株式会社 真空装置部材、その製造方法および真空装置
JP5206199B2 (ja) * 2008-07-28 2013-06-12 東ソー株式会社 真空装置用部品及びその製造方法
JP2010229434A (ja) * 2009-03-25 2010-10-14 Kansai Coke & Chem Co Ltd 成膜装置用部品および該成膜装置用部品に付着した付着膜の除去方法
US8968537B2 (en) * 2011-02-09 2015-03-03 Applied Materials, Inc. PVD sputtering target with a protected backing plate
JP5654939B2 (ja) * 2011-04-20 2015-01-14 株式会社アルバック 成膜装置
JP5269942B2 (ja) * 2011-04-28 2013-08-21 株式会社東芝 真空成膜装置用部品の製造方法
JP6229136B2 (ja) * 2012-03-09 2017-11-15 株式会社ユーテック Ｃｖｄ装置
JP5983428B2 (ja) * 2013-01-23 2016-08-31 住友金属鉱山株式会社 防着部材及びこれを備えた成膜装置並びに防着部材の整備方法
KR20190040103A (ko) * 2014-09-30 2019-04-16 가부시끼가이샤 도시바 스퍼터링 타깃 구조체
JP7417367B2 (ja) * 2019-05-27 2024-01-18 アルバックテクノ株式会社 成膜装置用部品及びこれを備えた成膜装置

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