JP4549937B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP4549937B2 JP4549937B2 JP2005177254A JP2005177254A JP4549937B2 JP 4549937 B2 JP4549937 B2 JP 4549937B2 JP 2005177254 A JP2005177254 A JP 2005177254A JP 2005177254 A JP2005177254 A JP 2005177254A JP 4549937 B2 JP4549937 B2 JP 4549937B2
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- Prior art keywords
- film
- silicon oxide
- oxide film
- silicon nitride
- semiconductor device
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
- H01L28/57—Capacitors with a dielectric comprising a perovskite structure material comprising a barrier layer to prevent diffusion of hydrogen or oxygen
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Memories (AREA)
Description
本発明に係る第1の実施形態について、図1及び図2を参照しながら説明する。図1(a)〜(f)、図2(a)〜(b)は、第1の実施形態に係る半導体装置の製造方法を示す工程断面図である。
本発明に係る第2の実施形態について、図3を参照しながら説明する。但し、第1の実施形態と同一部分については、詳細な説明を省略する。図3(a)〜(b)は、第2の実施形態に係る半導体装置の製造方法を示す工程断面図である。但し、図1及び図2と同一構成要素は、同符号を付して説明を省略する。
105 シリコン窒化膜
106 第2のシリコン酸化膜
108 密着層
109 コンタクトプラグ
113 リセス
Claims (5)
- 基板上に、下から順に、第1のシリコン酸化膜、シリコン窒化膜、及び第2のシリコン酸化膜からなる積層膜を形成する工程(a)と、
前記積層膜に、前記基板に達するコンタクトホールを形成する工程(b)と、
CVD法により、前記コンタクトホールの内面にチタンを含む密着層を形成し、その後、 前記コンタクトホール内に導電膜を充填する工程(c)と、
CMP法により、前記第2のシリコン酸化膜上の前記導電膜及び前記密着層を除去する工程(d)と、
前記シリコン窒化膜上の前記第2のシリコン酸化膜を除去し、コンタクトプラグを形成する工程(e)を備え、
前記第2のシリコン酸化膜の膜厚は、前記工程(d)の結果、前記コンタクトホールの上部に形成される、前記導電膜及び前記密着層と前記第2のシリコン酸化膜とのリセス深さに相当する値である半導体装置の製造方法。 - 前記工程(e)は、CMP法又はエッチバック法を用いることを特徴とする請求項1記載の半導体装置の製造方法。
- 前記工程(e)は、前記CMP法又はエッチバック法を用いて、前記シリコン窒化膜に対する前記第2のシリコン酸化膜の選択比の値が1より大きい条件下で行なうことを特徴とする請求項2記載の半導体装置の製造方法。
- 前記導電膜は、タングステン又はポリシリコンからなることを特徴とする請求項1記載の半導体装置の製造方法。
- 前記密着層は、下から順に、チタン膜及び窒化チタン膜よりなる積層膜であることを特徴とする請求項1記載の半導体装置の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005177254A JP4549937B2 (ja) | 2005-06-17 | 2005-06-17 | 半導体装置の製造方法 |
KR1020060021314A KR20060132439A (ko) | 2005-06-17 | 2006-03-07 | 비휘발성 반도체기억장치의 제조방법 |
US11/377,452 US7344976B2 (en) | 2005-06-17 | 2006-03-17 | Method for fabricating nonvolatile semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005177254A JP4549937B2 (ja) | 2005-06-17 | 2005-06-17 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006351899A JP2006351899A (ja) | 2006-12-28 |
JP4549937B2 true JP4549937B2 (ja) | 2010-09-22 |
Family
ID=37573905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005177254A Active JP4549937B2 (ja) | 2005-06-17 | 2005-06-17 | 半導体装置の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7344976B2 (ja) |
JP (1) | JP4549937B2 (ja) |
KR (1) | KR20060132439A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10840257B2 (en) | 2018-08-27 | 2020-11-17 | Toshiba Memory Corporation | Semiconductor memory device |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6465373B1 (en) * | 2000-08-31 | 2002-10-15 | Micron Technology, Inc. | Ultra thin TCS (SiCl4) cell nitride for DRAM capacitor with DCS (SiH2Cl2) interface seeding layer |
JP5391594B2 (ja) * | 2008-07-02 | 2014-01-15 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
US8703612B2 (en) * | 2011-09-08 | 2014-04-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Process for forming contact plugs |
KR102211143B1 (ko) | 2014-11-13 | 2021-02-02 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
US9640544B2 (en) * | 2015-04-24 | 2017-05-02 | Sandisk Technologies Llc | Integrated circuit with hydrogen absorption structure |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0917787A (ja) * | 1995-07-03 | 1997-01-17 | Oki Electric Ind Co Ltd | 配線構造の形成方法 |
JP2001007303A (ja) * | 1999-06-18 | 2001-01-12 | Toshiba Corp | 半導体装置およびその製造方法 |
JP2002334926A (ja) * | 2001-03-23 | 2002-11-22 | Texas Instruments Inc | 微細構造のための金属化を容易にする犠牲層の使用 |
JP2005217412A (ja) * | 2004-01-28 | 2005-08-11 | Samsung Electronics Co Ltd | 半導体素子の配線方法及び配線構造体 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3326698B2 (ja) * | 1993-03-19 | 2002-09-24 | 富士通株式会社 | 集積回路装置の製造方法 |
JP2001185542A (ja) * | 1999-12-27 | 2001-07-06 | Hitachi Ltd | プラズマ処理装置及びそれを用いたプラズマ処理方法 |
JP2001351918A (ja) * | 2000-06-05 | 2001-12-21 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
US6781184B2 (en) * | 2001-11-29 | 2004-08-24 | Symetrix Corporation | Barrier layers for protecting metal oxides from hydrogen degradation |
US6440840B1 (en) * | 2002-01-25 | 2002-08-27 | Taiwan Semiconductor Manufactoring Company | Damascene process to eliminate copper defects during chemical-mechanical polishing (CMP) for making electrical interconnections on integrated circuits |
-
2005
- 2005-06-17 JP JP2005177254A patent/JP4549937B2/ja active Active
-
2006
- 2006-03-07 KR KR1020060021314A patent/KR20060132439A/ko not_active Application Discontinuation
- 2006-03-17 US US11/377,452 patent/US7344976B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0917787A (ja) * | 1995-07-03 | 1997-01-17 | Oki Electric Ind Co Ltd | 配線構造の形成方法 |
JP2001007303A (ja) * | 1999-06-18 | 2001-01-12 | Toshiba Corp | 半導体装置およびその製造方法 |
JP2002334926A (ja) * | 2001-03-23 | 2002-11-22 | Texas Instruments Inc | 微細構造のための金属化を容易にする犠牲層の使用 |
JP2005217412A (ja) * | 2004-01-28 | 2005-08-11 | Samsung Electronics Co Ltd | 半導体素子の配線方法及び配線構造体 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10840257B2 (en) | 2018-08-27 | 2020-11-17 | Toshiba Memory Corporation | Semiconductor memory device |
US11462556B2 (en) | 2018-08-27 | 2022-10-04 | Kioxia Corporation | Semiconductor memory device |
Also Published As
Publication number | Publication date |
---|---|
KR20060132439A (ko) | 2006-12-21 |
US7344976B2 (en) | 2008-03-18 |
JP2006351899A (ja) | 2006-12-28 |
US20060286720A1 (en) | 2006-12-21 |
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