JP4549382B2 - 新規シルフェニレン化合物およびその製造方法 - Google Patents
新規シルフェニレン化合物およびその製造方法 Download PDFInfo
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- JP4549382B2 JP4549382B2 JP2007323032A JP2007323032A JP4549382B2 JP 4549382 B2 JP4549382 B2 JP 4549382B2 JP 2007323032 A JP2007323032 A JP 2007323032A JP 2007323032 A JP2007323032 A JP 2007323032A JP 4549382 B2 JP4549382 B2 JP 4549382B2
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- 0 *[*+](C(COO1)C1=O)c(cc1)ccc1[S+]*C(C1)COC1=O Chemical compound *[*+](C(COO1)C1=O)c(cc1)ccc1[S+]*C(C1)COC1=O 0.000 description 2
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
- C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
- C07F7/0812—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te comprising a heterocyclic ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
Description
[1] 下記一般式(1)で表されることを特徴とするシルフェニレン化合物。
[2] 下記一般式(2)で表されるシラン化合物と下記一般式(3)で表されるコハク酸無水物誘導体とを付加反応させることを特徴とする上記[1]記載のシルフェニレン化合物の製造方法。
[3]上記[1]に記載のシルフェニレン化合物をモノマーとして製造したことを特徴とする、ポリイミド樹脂。
攪拌機、温度計およびコンデンサーを備えた500mlフラスコにアリルコハク酸無水物101.6g(0.726モル)、2質量%塩化白金酸のエタノール溶液1gおよびトルエン150gを投入し、オイルバスを用いて内温が70℃になるように加熱撹拌した。次に1,4−ビス(ジメチルシリル)ベンゼン58.2g(0.33モル)を20分かけて滴下した。滴下終了後、90℃で3時間撹拌した。得られた反応物をガスクロマトグラフィーにて分析したところ、原料の1,4−ビス(ジメチルシリル)ベンゼンに由来するピークは消失していた。反応液を120℃/10hPaの条件で5時間減圧濃縮して白色固体143g(収率95%)を得た。この白色固体を1H―NMRで分析した結果、下記構造で示される化合物であることがわかった。
1H―NMRチャートを表1および図1に示す。
撹拌機、温度計及び窒素置換装置を備えたフラスコ内に、2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン 102.5g(0.25モル)およびシクロヘキサノン500gを仕込んだ。ついで、4,4’−ヘキサフルオロプロピリデンビスフタル酸二無水物55.5g(0.125モル)、実施例1で得られたシルフェニレン化合物59.3g(0.125モル)を反応系の温度が50℃を超えないように調節しながら、上記フラスコ内に添加した。さらに室温で8時間攪拌した。つぎに、該フラスコに水分受容器付き還流冷却器を取り付けた後、キシレン 100gを加え、150℃に昇温させてその温度を6時間保持したところ、黄褐色の溶液が得られた。こうして得られた溶液を室温(25℃)まで冷却した後、メタノール中に投じて再沈澱させた。得られた沈降物を乾燥し、NMRによって分析したところ、下記式を繰り返し単位とするシルフェニレン含有ポリイミド樹脂を得た。1H―NMRチャートを図2に示す。
N,N―ジメチルホルムアミドを溶媒とするゲル浸透クロマトグラフィー(GPC)により、この樹脂の重量平均分子量(ポリスチレン換算)を測定したところ、25000であった。
Claims (3)
- 請求項1に記載のシルフェニレン化合物をモノマーとして製造したことを特徴とする、ポリイミド樹脂。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007323032A JP4549382B2 (ja) | 2007-12-14 | 2007-12-14 | 新規シルフェニレン化合物およびその製造方法 |
US12/332,924 US8048978B2 (en) | 2007-12-14 | 2008-12-11 | Silphenylene compound and process for producing the same |
US13/167,942 US8252882B2 (en) | 2007-12-14 | 2011-06-24 | Polyimide resin produced by using silphenylene compound |
Applications Claiming Priority (1)
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JP2007323032A JP4549382B2 (ja) | 2007-12-14 | 2007-12-14 | 新規シルフェニレン化合物およびその製造方法 |
Publications (2)
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JP2009143848A JP2009143848A (ja) | 2009-07-02 |
JP4549382B2 true JP4549382B2 (ja) | 2010-09-22 |
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JP2007323032A Active JP4549382B2 (ja) | 2007-12-14 | 2007-12-14 | 新規シルフェニレン化合物およびその製造方法 |
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US (2) | US8048978B2 (ja) |
JP (1) | JP4549382B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6866802B2 (ja) | 2017-08-09 | 2021-04-28 | 信越化学工業株式会社 | シリコーン骨格含有高分子化合物、感光性樹脂組成物、感光性樹脂皮膜、感光性ドライフィルム、積層体、及びパターン形成方法 |
JP6874584B2 (ja) | 2017-08-09 | 2021-05-19 | 信越化学工業株式会社 | 感光性樹脂組成物、感光性樹脂皮膜、感光性ドライフィルム、積層体、及びパターン形成方法 |
JP6810677B2 (ja) * | 2017-12-05 | 2021-01-06 | 信越化学工業株式会社 | 新規テトラカルボン酸二無水物、ポリイミド樹脂及びその製造方法、感光性樹脂組成物、パターン形成方法及び硬化被膜形成方法、層間絶縁膜、表面保護膜、電子部品 |
JP6870657B2 (ja) | 2018-05-17 | 2021-05-12 | 信越化学工業株式会社 | 感光性樹脂組成物、感光性ドライフィルム、及びパターン形成方法 |
JP6919626B2 (ja) * | 2018-05-17 | 2021-08-18 | 信越化学工業株式会社 | シルフェニレン骨格及びポリエーテル骨格を含むポリマー |
US11548985B2 (en) | 2018-11-28 | 2023-01-10 | Shin-Etsu Chemical Co., Ltd. | Siloxane polymer containing isocyanuric acid and polyether skeletons, photosensitive resin composition, pattern forming process, and fabrication of opto-semiconductor device |
JP7056541B2 (ja) | 2018-12-19 | 2022-04-19 | 信越化学工業株式会社 | 感光性樹脂組成物、感光性ドライフィルム及びパターン形成方法 |
JP7388296B2 (ja) | 2020-06-11 | 2023-11-29 | 信越化学工業株式会社 | ケイ素含有テトラカルボン酸二無水物、その製造方法およびポリイミド樹脂 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001002780A (ja) * | 1999-06-23 | 2001-01-09 | Nissan Chem Ind Ltd | シルフェニレン残基を有するジアミン化合物及びそれを用いたポリアミド、ポリアミド酸、ポリイミド、液晶配向処理剤並びに液晶表示素子 |
JP2001512759A (ja) * | 1997-08-07 | 2001-08-28 | ワツカー−ケミー ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Si−H基を有するシリコンイミド |
CN1702097A (zh) * | 2005-07-01 | 2005-11-30 | 清华大学 | 含有异山梨醇单元的旋光性聚酰亚胺及其制备方法 |
Family Cites Families (4)
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DE3447457A1 (de) | 1984-12-27 | 1986-07-03 | Wacker-Chemie GmbH, 8000 München | Vernetzbare organopolysiloxane, verfahren zu ihrer herstellung und verwendung dieser organopolysiloxane |
JPH05331291A (ja) | 1992-06-03 | 1993-12-14 | Shin Etsu Chem Co Ltd | 酸無水物基含有オルガノポリシロキサンおよびその製造方法 |
ES2127365T5 (es) * | 1993-08-26 | 2002-08-16 | Vantico Ag | Composicion liquida reticulable por radiacion, destinada en especial a la estereolitografia. |
JP2850726B2 (ja) * | 1993-10-29 | 1999-01-27 | 信越化学工業株式会社 | 有機ケイ素化合物及びその製造方法 |
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2007
- 2007-12-14 JP JP2007323032A patent/JP4549382B2/ja active Active
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2008
- 2008-12-11 US US12/332,924 patent/US8048978B2/en not_active Expired - Fee Related
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- 2011-06-24 US US13/167,942 patent/US8252882B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001512759A (ja) * | 1997-08-07 | 2001-08-28 | ワツカー−ケミー ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Si−H基を有するシリコンイミド |
JP2001002780A (ja) * | 1999-06-23 | 2001-01-09 | Nissan Chem Ind Ltd | シルフェニレン残基を有するジアミン化合物及びそれを用いたポリアミド、ポリアミド酸、ポリイミド、液晶配向処理剤並びに液晶表示素子 |
CN1702097A (zh) * | 2005-07-01 | 2005-11-30 | 清华大学 | 含有异山梨醇单元的旋光性聚酰亚胺及其制备方法 |
Also Published As
Publication number | Publication date |
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US8048978B2 (en) | 2011-11-01 |
US20110251371A1 (en) | 2011-10-13 |
US20090156753A1 (en) | 2009-06-18 |
JP2009143848A (ja) | 2009-07-02 |
US8252882B2 (en) | 2012-08-28 |
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