JP4546251B2 - スマートカード及びスマートカードの製造方法 - Google Patents
スマートカード及びスマートカードの製造方法 Download PDFInfo
- Publication number
- JP4546251B2 JP4546251B2 JP2004556259A JP2004556259A JP4546251B2 JP 4546251 B2 JP4546251 B2 JP 4546251B2 JP 2004556259 A JP2004556259 A JP 2004556259A JP 2004556259 A JP2004556259 A JP 2004556259A JP 4546251 B2 JP4546251 B2 JP 4546251B2
- Authority
- JP
- Japan
- Prior art keywords
- chip module
- smart card
- adhesive
- connection
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
前記溝が、チップモジュールの端部領域においてモジュール接続部を有するチップモジュール少なくとも1つを受け取るためにカード本体中に配置され、
前記導電性構造体が、カード本体中に埋め込まれ、そして本体接触接続部を有し、そして
前記導電性構造体が、特に、チップモジュールの端部領域の下に配置されているアンテナ接続部をもつアンテナである、
請求項1及び7の前提部に記載のスマートカード及びその製造方法に関する。
3・・・チップモジュール;4・・・ホットメルト接着剤;
5,5a・・・シルバードガラスビーズ;
6・・・接着エリア;7・・・下側溝表面;8・・・孔;
11・・・カード本体;12a,12b・・・溝;13・・・アンテナ接続部;14・・・接着部;14a,14b・・・接着部の高さ;
15・・・カットアウト;15a・・・カットアウトの上側端部領域;
15b・・・カットアウトの側面端部;
16・・・チップモジュール;17・・・モジュール接続部;
18・・・チップモジュールの上側接触エリア。
Claims (5)
- カード本体(11)、少なくとも1つの溝(12a,12b)、及び導電性構造体を有し、
前記溝(12a,12b)が、チップモジュール(16)の端部領域(16a)にモジュール接続部(17)を有するチップモジュール(16)少なくとも1つを受け取るために配置され、
前記導電性構造体が、カード本体(11)中に埋め込まれ、そして本体接触接続部(13)を有し、そして
前記導電性構造体が、特にチップモジュール(16)の端部領域(16a)の下に配置されているアンテナ接続部をもつアンテナである、
スマートカードであって、
据え付けられているチップモジュール(16)によって、一方のモジュール接続部(17)ともう一方の本体接触接続部(13)との間に局所的に付与され、弾性で導電性の材料から形成されており、カード本体の厚さに沿ってレジリエントバッファーとして主に作用する接着部(14)が、接続部(13,17)間に、接触を生じるように圧力を加えて配置されていること、及び
カットアウト(15)が、スマートカードの縦及び幅方向で、圧力の付与前では前記接着部(14)によって充填されないが、圧力の付与下では接着部(14)を完全に受け取るのに十分な容量サイズを有するように、
カード本体(11)中に配置される前記カットアウト(15)中へ、前記接着部(14)を局所的に配置するものとすること
を特徴とする、前記スマートカード。 - 前記接着部(14)が、チップモジュール(16)の端部領域(16a)の下に配置され、そして、底部において、本体接触接続部(13)で終了していることを特徴とする、請求項1に記載のスマートカード。
- カード本体の厚さの方向において、カットアウト(15)が、圧力が加わっていない状態で、局所的に付与されている接着部(14)の高さ(14a,14b)よりも小さい高さ寸法(14b)を有することを特徴とする、請求項1又は2に記載のスマートカード。
- カード本体(11)、少なくとも1つの溝(12a,12b)、及び導電性構造体を有し、
前記溝(12a,12b)が、チップモジュール(16)の端部領域(16a)にモジュール接続部(17)を有するチップモジュール(16)少なくとも1つを受け取るために配置され、
前記導電性構造体が、カード本体(11)中に埋め込まれ、そして本体接触接続部(13)を有し、そして
前記導電性構造体が、特にチップモジュール(16)の端部領域(16a)の下に配置されているアンテナ接続部をもつアンテナである、
スマートカードの製造方法であって、
チップモジュール(16)の据え付けの前に、弾性で導電性の材料から形成されている接着部(14)を、本体接触接続部(13)へ及び/又はモジュール接続部(17)へ付与し、そして硬化し、そして次に、チップモジュール(16)を、弾性材料から形成されている接着部(14)へ圧力を付与して、カード本体(11)へ据え付けること、
カットアウト(15)が、スマートカードの縦及び幅方向で、圧力の付与前では前記接着部(14)によって充填されないが、圧力の付与下では接着部(14)を完全に受け取るのに十分な容量サイズを有するように、
カード本体(11)中に配置される前記カットアウト(15)中へ、前記接着部(14)を局所的に配置するものとすること、及び
レジリエントバッファーとして、チップモジュール(16)の据え付けの後で、チップモジュール接続部(17)と本体接触接続部(13)との間に永続的な接触を生じさせるために、弾性材料から形成されている接着部(14)を、チップモジュール(16)の据え付けの前に硬化すること
を特徴とする、前記方法。 - チップモジュール(16)の据え付けの前に、接着部(14)を受け取るために設計され、そして、カード本体中に配置されているカットアウト(15)の上側端部領域(15a)より、約0.05〜0.15mm高くなるように、接着部(14)を付与することを特徴とする、請求項4に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10257111A DE10257111B4 (de) | 2002-12-05 | 2002-12-05 | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
PCT/EP2003/013552 WO2004051559A1 (de) | 2002-12-05 | 2003-12-02 | Chipkarte und verfahren zur herstellung einer chipkarte |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006509280A JP2006509280A (ja) | 2006-03-16 |
JP4546251B2 true JP4546251B2 (ja) | 2010-09-15 |
Family
ID=32403720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004556259A Expired - Fee Related JP4546251B2 (ja) | 2002-12-05 | 2003-12-02 | スマートカード及びスマートカードの製造方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7331528B2 (ja) |
EP (1) | EP1567979B1 (ja) |
JP (1) | JP4546251B2 (ja) |
KR (1) | KR100743956B1 (ja) |
CN (1) | CN100353375C (ja) |
AU (1) | AU2003288211A1 (ja) |
DE (2) | DE10257111B4 (ja) |
WO (1) | WO2004051559A1 (ja) |
Families Citing this family (21)
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US6940408B2 (en) | 2002-12-31 | 2005-09-06 | Avery Dennison Corporation | RFID device and method of forming |
US7224280B2 (en) | 2002-12-31 | 2007-05-29 | Avery Dennison Corporation | RFID device and method of forming |
KR100689016B1 (ko) * | 2004-09-15 | 2007-03-02 | 주식회사 와이비엘 | 아이씨 카드 |
US9245283B2 (en) | 2006-10-17 | 2016-01-26 | Karen Nixon Lane | Incentive imaging methods and devices |
EP2045763B1 (de) | 2007-10-03 | 2012-04-11 | Trüb AG | Verfahren zum Herstellen von Datenträgern, Vorrichtung zum Durchführen des Verfahrens sowie Vorprodukt zum Herstellen von Datenträgern |
JP5428339B2 (ja) * | 2007-10-26 | 2014-02-26 | 東レ株式会社 | 平面アンテナおよびその製造方法 |
EP2079107B1 (de) | 2008-01-10 | 2017-10-18 | Gemalto AG | Verfahren zum Herstellen eines kartenförmigen Datenträgers und nach diesem Verfahren hergestellter Datenträger |
DE102009017290A1 (de) | 2009-04-11 | 2010-10-21 | Cardag Deutschland Gmbh | Chipkarte und Verfahren zu deren Herstellung |
DE102009037627A1 (de) | 2009-08-14 | 2011-02-17 | Giesecke & Devrient Gmbh | Portabler Datenträger |
NO20093601A1 (no) | 2009-12-29 | 2011-06-30 | Idex Asa | Overflatesensor |
BR112013019548A2 (pt) * | 2011-01-31 | 2017-07-04 | American Bank Note Co | cartão inteligente de interface dupla |
US20120248201A1 (en) * | 2011-01-31 | 2012-10-04 | American Bank Note Company | Dual-interface smart card |
DE102011116259A1 (de) * | 2011-10-18 | 2013-04-18 | Giesecke & Devrient Gmbh | Kontaktierung einer Antenne |
CN102426659B (zh) * | 2011-11-03 | 2014-12-10 | 北京德鑫泉物联网科技股份有限公司 | 同时具有两种读写模式基体的智能卡及其生产方法 |
EP2631849A1 (fr) | 2012-02-27 | 2013-08-28 | Gemalto SA | Procédé de fabrication d'un dispositif comprenant un module doté d'un circuit électrique et/ou électronique |
US10906287B2 (en) * | 2013-03-15 | 2021-02-02 | X-Card Holdings, Llc | Methods of making a core layer for an information carrying card, and resulting products |
DE102013018518A1 (de) | 2013-11-04 | 2015-05-07 | Giesecke & Devrient Gmbh | IC-Modul für unterschiedliche Verbindungstechniken |
US10318852B2 (en) * | 2014-11-10 | 2019-06-11 | Golden Spring Internet Of Things Inc. | Smart card simultaneously having two read/write modes and method for producing same |
KR102251694B1 (ko) * | 2015-06-23 | 2021-05-13 | 랑셍 홀딩 | 정보의 무접촉 전송을 위한 적어도 하나의 인터페이스를 가진 스마트 카드 블랭크 |
FR3047101B1 (fr) | 2016-01-26 | 2022-04-01 | Linxens Holding | Procede de fabrication d’un module de carte a puce et d’une carte a puce |
US9953258B1 (en) * | 2016-12-09 | 2018-04-24 | Capital One Services, Llc | Transaction card having structural reinforcement |
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DE19500925C2 (de) * | 1995-01-16 | 1999-04-08 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer kontaktlosen Chipkarte |
US6036099A (en) * | 1995-10-17 | 2000-03-14 | Leighton; Keith | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
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DE19747388C1 (de) * | 1997-10-27 | 1999-05-12 | Meinen Ziegel & Co Gmbh | Verfahren und Vorrichtung zur Herstellung von Chipkarten |
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FR2790849B1 (fr) * | 1999-03-12 | 2001-04-27 | Gemplus Card Int | Procede de fabrication pour dispositif electronique du type carte sans contact |
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-
2002
- 2002-12-05 DE DE10257111A patent/DE10257111B4/de not_active Expired - Fee Related
-
2003
- 2003-12-02 WO PCT/EP2003/013552 patent/WO2004051559A1/de active Application Filing
- 2003-12-02 US US10/537,386 patent/US7331528B2/en not_active Expired - Lifetime
- 2003-12-02 AU AU2003288211A patent/AU2003288211A1/en not_active Abandoned
- 2003-12-02 KR KR1020057010216A patent/KR100743956B1/ko active IP Right Grant
- 2003-12-02 CN CNB2003801047823A patent/CN100353375C/zh not_active Expired - Fee Related
- 2003-12-02 DE DE50311290T patent/DE50311290D1/de not_active Expired - Lifetime
- 2003-12-02 EP EP03780100A patent/EP1567979B1/de not_active Expired - Lifetime
- 2003-12-02 JP JP2004556259A patent/JP4546251B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006509280A (ja) | 2006-03-16 |
EP1567979B1 (de) | 2009-03-11 |
KR20050089811A (ko) | 2005-09-08 |
AU2003288211A1 (en) | 2004-06-23 |
CN1720541A (zh) | 2006-01-11 |
DE50311290D1 (de) | 2009-04-23 |
DE10257111B4 (de) | 2005-12-22 |
KR100743956B1 (ko) | 2007-07-30 |
DE10257111A1 (de) | 2004-07-01 |
EP1567979A1 (de) | 2005-08-31 |
US7331528B2 (en) | 2008-02-19 |
CN100353375C (zh) | 2007-12-05 |
US20060038022A1 (en) | 2006-02-23 |
WO2004051559A1 (de) | 2004-06-17 |
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