JP4545625B2 - Substrate positioning table, substrate positioning equipment, and substrate positioning method - Google Patents

Description

  The present invention relates to a substrate positioning table, a substrate positioning device, and a substrate positioning method for accurately positioning a substrate such as a display mother glass and a silicon substrate (wafer).

  In equipment for film deposition of glass substrates (mother glass) used for displays such as PDPs (plasma display panels) and liquid crystal displays, multiple processing chambers (chambers) for processing such as film formation, resist coating, exposure, etching, etc. The substrate is loaded and unloaded with a dedicated robot (transfer device), but in view of the importance of ensuring the positioning accuracy of the glass substrate loaded into the processing chamber, the glass substrate that performs processes such as film deposition is processed. Before loading into the chamber, in the middle of the substrate loading path to the processing chamber (for example, in a chamber (load lock chamber) provided separately from the processing chamber, near the entrance of the vacuum apparatus in which the processing chamber is provided) (In the atmosphere), etc.), the robot is placed on the positioning table and positioned. By loading the scan substrate into the processing chamber, the position of the glass substrate in the processing chamber is to fit within the allowable error range.

Conventionally, as the positioning table, a glass substrate placed on the positioning table is pressed against the positioning gauge for positioning (for example, Patent Document 1), or the end surface of the glass substrate on the positioning table by moving the positioning gauge. There are those that are positioned by pressing against the.
Further, the glass substrate is carried into the positioning table by a dedicated transfer robot that takes out the glass substrate from a loading table (cassette) into which the glass substrate is carried and places it on the positioning table. As this transfer robot, for example, as shown in FIG. 5, a glass substrate 102 is carried on a plurality of movable arms 101 (transfer robot 103), or as shown in FIG. There is a sucker-type suction head 104 connected to the head and a plurality of places on the glass substrate 102 which are sucked and fixed (transfer robot 105). The transfer robot lowers the glass substrate 102 conveyed onto the positioning table 106 and places it on the positioning table 106. In addition, the glass substrate 102 returned to the positioning table 106 from the processing chamber after completing the process such as film deposition is taken out of the positioning table 106 and transported to the unloading position.
The positioning table 106 is pressed by a lateral feed device (not shown) for laterally moving the glass substrate 102 placed by the transfer robot and an end face of the outer peripheral portion of the glass substrate 102 laterally fed by the lateral feed device. A positioning gauge 107 for positioning the glass substrate 102, and the glass substrate 102 carried by the transfer robot is moved by a lateral feed device and brought into contact with the positioning gauge 107, so that the glass substrate 102 is precisely Can be positioned. Further, as the positioning table 106, the glass substrate 102 is supported by a free ball bearing 109 provided on the table main body 108 so as to be movable laterally, and the lateral movement of the glass substrate 102 can be realized with a light force.
Japanese Patent Laid-Open No. 06-183556

  However, in the positioning table as described above, since it takes time to complete the positioning operation by placing the glass substrate against the positioning gauge, there is a dissatisfaction that this causes a decrease in the manufacturing efficiency of the product. there were. In addition, in the configuration in which the glass substrate is moved laterally or the positioning gauge is pressed against the end surface of the glass substrate, the glass substrate is likely to be subjected to distortion such as minute bending, and the dimensional accuracy such as flatness of the glass substrate is improved. There is also a problem of affecting it. Furthermore, since a lateral feed device (or a device for moving the gauge) is required, the cost is high, and there is a problem that such a device becomes a particle generation source and easily contaminates the glass substrate. .

  In view of the above-mentioned problems, the present invention can easily position a substrate such as a glass substrate in a short time, and can hardly cause generation of particles with almost no distortion. An object of the present invention is to provide a substrate positioning table, a substrate positioning facility, and a substrate positioning method.

In order to solve the above problems, the present invention provides the following configuration.
In the present invention, the platform on which the substrate is placed, and the outer periphery of the substrate placed on the platform by being lowered from above the platform are arranged at a plurality of locations on the outer periphery of the platform. A free ball bearing that guides the substrate within a substrate positioning region set on the platform, and the free ball bearing is rotatably supported by the ball support and the ball support. And the center of the ball is an extension of the support surface on which the platform supports the substrate, or the range of the plate thickness dimension of the substrate placed on the platform And the substrate that is in contact with the portion of the ball protruding from the ball support is moved by the ball of each free ball bearing by the rotation of the ball. Te inner to induce in the substrate positioning area surrounded, wherein the stand on, free ball bearings a substrate which is placed on the stand as a substrate support means for supporting and permitting displacement in a direction along said support surface A large number of receiving free bearings are mounted and lowered onto the support surface in a bent state while being guided by the balls of the respective side free bearings which are free ball bearings arranged at a plurality of locations on the outer periphery of the platform. substrate to provide a positioning table for board characterized that you have been and can be placed on the support surface while eliminating the deflection rotate the ball of the receiving-free bearing to be.
Configuration In the substrate positioning table, the ball of the side free bearing that at least the surface is formed by a conductive material, the side flibe ground conducting portion in contact with the ball in the ball support bearings are provided Can also be adopted.
In this substrate positioning table, the size of the substrate positioning region is slightly larger than the size of the substrate, and the substrate position deviation allowable range in the direction along the support surface with the target position in the substrate positioning region as a reference Is also possible to adopt a configuration in which is set in a range of ± 0.1 to 0.7 mm.
The present invention also includes a loading table into which a substrate is loaded, a substrate positioning table according to the present invention, and a substrate transfer device that takes out the substrate from the loading table and places the substrate on the loading table. There is provided a positioning apparatus for a substrate.
Further, in the present invention, the side free bearing ball is a free ball bearing in which the substrate placed on the platform of the substrate positioning table according to the present invention is a free ball bearing disposed at a plurality of locations on the outer periphery of the platform. Above the substrate positioning area, it is lowered from above the substrate receiving area, which is an area secured wider than the board positioning area by the protrusion of the ball support of each side free bearing ball. Then, the substrate is lowered while being guided by the balls of the respective side free bearings, and is supported by the receiving free bearings on the mounting table and arranged in the substrate positioning region. To do.

According to the present invention, the substrate is lowered from above the balls of the free ball bearings (hereinafter also referred to as side free bearings) arranged on the outer periphery of the mounting base, and the inner side (balls) surrounded by the side free bearings. The substrate can be positioned with a desired accuracy simply by placing it in the substrate positioning region (inside surrounded by the most protruding portion of the ball support) and placing it on the support surface on the platform. Since the substrate that has entered the substrate positioning area is positioned by the balls of the respective side free bearings, the positioning of the substrate can be completed at the same time that the substrate enters the substrate positioning area. Therefore, positioning in a very short time is possible.
Further, when the substrate is lowered from the substrate receiving region and placed in the substrate positioning region, even if the outer peripheral portion of the substrate contacts the portion of the ball protruding from the ball support, the side free bearing is Since the substrate abutted on the portion protruding from the ball support can be smoothly guided to the substrate positioning region by the rotation of the ball, positioning of the substrate can be completed at the same time that the substrate enters the substrate positioning region.
Moreover, in the present invention, compared to the configuration in which the substrate placed on the positioning table is moved laterally and pressed against the positioning gauge, the substrate is less likely to be subjected to distortion such as partial bending, and the dimensional accuracy of the substrate is increased. An excellent effect that it can be stably maintained is obtained. Furthermore, since it is not necessary to provide a complicated mechanism such as a lateral feed device on the positioning table, the generation source of particles can be greatly reduced, and the cost can be reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 and 2 are views showing a substrate positioning table 1 (hereinafter also referred to as a positioning table) according to the present invention, in which FIG. 1 is a plan view and FIG. 2 is a sectional view taken along line AA in FIG. FIG. 3 is an enlarged view showing a mounting position relationship of free ball bearings (side free bearings and receiving free bearings described later) provided on the positioning table 1, and FIG. 1 is a schematic plan view showing a process equipment 3 equipped with a positioning equipment).
In this embodiment, an example in which a glass substrate for display (mother glass; hereinafter also referred to as a glass substrate) is used as the substrate 4 will be described. However, the substrate 4 applied to the present invention is limited to a glass substrate. For example, various substrates that perform precision processing such as a silicon substrate, a ceramic substrate, and a metal substrate can be employed. Moreover, although the board | substrate 4 is a rectangular plate shape here, it is not limited to this, The shape of this board | substrate 4 may be circular, an ellipse, etc., for example.

  In the present embodiment, the positioning table 1 according to the present invention is installed in a load lock chamber 32 provided in a vacuum apparatus 31 constituting the process equipment 3 shown in FIG.

  In FIG. 4, the vacuum device 31 includes the load lock chamber 32, a transfer chamber 33, and first to third processing chambers 34a, 34b, and 34c (chambers). Reference numeral 35 a denotes an atmospheric gate provided in the load lock chamber 32, and the substrate 4 from the load lock chamber 32 to the outside of the vacuum device 31 when the substrate 4 is carried into the load lock chamber 32 from the outside of the vacuum device 31. Opened and closed when unloading. Reference numeral 35b denotes a gate that opens and closes between the load lock chamber 32 and the transfer chamber 33, and 35c, 35d, and 35e open and close between the first to third processing chambers 34a, 34b, and 34c and the transfer chamber 33. It is a gate. In the transfer chamber 33, a robot 36 (substrate transfer device; hereinafter also referred to as a vacuum robot) for moving the substrate 4 is installed, and the positioning table 1 in the load lock chamber 32 and the processing chambers 34a, 34b, The substrate 4 is transferred to and from 34c by this vacuum robot 36. When the substrate 4 taken out from the processing chamber is carried into another processing chamber (or carried into the original processing chamber) in accordance with a processing step such as film deposition, the substrate 4 taken out from the processing chamber is temporarily positioned. After positioning on the table 1, it is put in another processing chamber.

  The process equipment 3 includes a cassette 37 and a robot 38 (substrate transfer device; hereinafter also referred to as an atmospheric robot) installed outside the vacuum device 31 and the vacuum device 31 described above. The substrate 4 is carried into the positioning table 1 in the load lock chamber 32 from outside the vacuum device 31 by placing the substrate 4 taken out from the cassette 37 by the atmospheric robot 38 on the positioning table 1 through the atmospheric gate 35a. Is called. The atmospheric robot 38 also performs an operation of carrying the substrate 4 on the positioning table 1 out of the vacuum device 31.

Here, similarly to the transfer robot 103 described with reference to FIG. 5, the atmospheric robot 38 is configured to transfer the substrate 4 while being placed on a movable arm 38 a (see FIG. 2) that can move in the XYZ directions. However, the present invention is not limited to this, and various configurations can be adopted.
The cassette 37 functions as a loading table on which the substrate 4 to be processed is loaded.
The cassette 37, the positioning table 1, and the atmospheric robot 38 constitute a substrate positioning facility according to the present invention.

  As shown in FIG. 1 and FIG. 2, the positioning table 1 is arranged at a plurality of places on the platform 11 on which the substrate 4 is placed and the outer periphery of the platform 11, and is placed on the platform 11. A free ball bearing 12 (hereinafter also referred to as a side free bearing) for positioning the substrate 4 at a desired position on the mounting table 11 by being in contact with the end surface 41 of the substrate 4. Yes.

  The mounting table 11 includes a table body 13 and a plurality of free ball bearings 14 (hereinafter also referred to as receiving free bearings) mounted so as to protrude on the upper surface 13a of the table body 13, The substrate 4 placed on the platform 11 is supported on a horizontal or substantially horizontal support surface F (virtual surface) by the multiple receiving free bearings 14. A mounting base 15 for mounting the side free bearing 12 is provided on the outer periphery of the table main body 13 so as to protrude on the table main body 13, and the receiving free bearing 14 is provided on the mounting base 15. A rotatable ball 14b is attached to the table main body 13 so as to protrude on the upper surface 13a of the table main body located on the inner side surrounded.

  In addition, although the table main body 13 of the mounting base 11 in the illustrated example has a rectangular shape in plan view (see FIG. 1), the present invention is not limited to this, and for example, a circular shape in plan view and an elliptical shape can also be adopted. It is.

  The side free bearing 12 includes a ball support 12a (holder) and a ball 12b rotatably supported by the ball support 12a, and the ball support 12a is mounted on an outer peripheral portion of the mounting base 11. 15 is fixedly attached. The side free bearing 12 is mounted on the inner surface 15a side of the mounting base 15 of the table body 13 (the side facing the inner space S surrounded by the mounting base 15), and protrudes from the ball support 12a of the ball 12b. The portion is located closer to the inner space S than the mounting base inner surface 15a. Further, as shown in FIG. 3, the side free bearing 12 is arranged such that the center of the ball 12 b is on an extension of the support surface F on which the platform 11 supports the substrate 4. For this reason, the ball 12b of the side free bearing 12 is positioned so that the portion with the largest protrusion amount of the ball 12b from the ball support 12a coincides with the support surface F.

  In this positioning table 1, the inner region surrounded by the balls 12 b of each side free bearing 12 (specifically, the portion with the largest protrusion amount of the balls 12 b from the ball support 12 a) is a platform for the positioning table 1. 11 is a substrate positioning region M in which the substrate 4 placed on the substrate 11 is disposed, and the substrate 4 placed on the platform 11 is disposed in the substrate positioning region M, so that the balls 12b of each side free bearing 12 of the positioning table 1 are disposed. Is positioned with respect to the positioning table 1 with a desired accuracy.

As shown in FIGS. 2 and 3, the dimension L of the substrate positioning region M (specifically, the XY dimension. The dimension L of FIG. 2 indicates the dimension in the Y direction) is the dimension t of the substrate 4 (specifically, the vertical and horizontal dimensions). 2 is slightly larger than the dimension t in the longitudinal direction (short side) of the rectangular plate-like substrate 4), and the difference between the dimension L of the substrate positioning region M and the dimension t of the substrate 4. (Lt) determines the positioning accuracy of the substrate 4 placed in the substrate positioning region M with respect to the positioning table 1. This positioning accuracy is the position of the substrate 4 in the direction along the support surface F with respect to a target position (hereinafter referred to as a reference position, error 0) in the substrate positioning region M for the substrate 4 arranged in the substrate positioning region M. It is set based on the allowable deviation range (dimensions c1 and c2 shown in FIG. 2). Note that the dimensions c1 and c2 shown in FIG. 2 are both the end face 41 of the substrate 4 arranged at the reference position and the ball 12b of the side free bearing 12 arranged at the position facing the end face 41 (ball This is the distance between the portion 12b protruding from the ball support 12a (described later) and the largest portion (point).
The positioning accuracy of the substrate 4 with respect to the positioning table 1 can be set to about ± 0.1 to 0.7 mm, for example, but can also be set to a finer level than this.

  The side free bearing 12 functions to guide the substrate 4 abutted on the portion of the ball 12b protruding from the ball support 12a to the substrate positioning region M by the rotation of the ball 12b. Accordingly, when the substrate 4 is lowered so as to enter the substrate positioning region M from above the platform 11, even if the end portion of the substrate 4 comes into contact with the ball 12b of the side free bearing 12 in the middle of the descent, the substrate 4 remains in the ball 12b. Is smoothly guided to the substrate positioning region M and is arranged in the substrate positioning region M.

  The operation of carrying the substrate 4 into the positioning table 1 by the atmospheric robot 38 (see FIG. 4) (positioning method of the substrate) is to take out the substrate 4 from the cassette 37 and move the movable arm 38a on which the substrate 4 is placed. Then, as shown in FIG. 2, the substrate 4 is placed above the substrate positioning region M of the positioning table 1, and then the movable arm 38 a is lowered so that the substrate 4 is placed in the substrate positioning region M.

  As the movable arm 38 a is lowered from above the positioning table 1, the substrate 4 placed on the movable arm 38 a is also lowered, but the substrate 4 is placed on the ball 14 b of the receiving free bearing 14 of the platform 11. The descent stops at the point of contact (indicating that the support surface F has been reached). When the substrate 4 is accommodated in the substrate positioning region M, the side free bearings 12 (specifically, the balls 12b) around the substrate positioning region M are positioned with a desired accuracy (positioning in the direction along the support surface F). ) On the other hand, the movable arm 38a continues to descend even after the lowering of the substrate 4 stops, and stops descending when it enters the arm storage groove 13b formed on the table main body 13. This prevents the movable arm 38a from touching the substrate 4 supported on the receiving free bearing 14, and the movable arm 38a does not affect the positioning of the substrate 4 on the receiving free bearing 14.

  Further, as described above, even if the end of the substrate 4 comes off the substrate positioning region M and comes into contact with the ball 12b of the side free bearing 12 during the lowering, the substrate 4 is guided to the substrate positioning region M by the rotation of the ball 12b. Therefore, the substrate 4 can be smoothly arranged in the substrate positioning region M.

  Note that the atmospheric robot 38 does not restrain the movement of the substrate 4 in the lateral direction on the movable arm 38a when performing the operation of putting the substrate 4 into the substrate positioning region M from above the platform 11, and does not restrain the side free bearing. The one that does not adversely affect the positioning of the substrate 4 due to contact with the 12 balls 12b is employed. As the atmospheric robot 38, it is possible to adopt a configuration in which the substrate 4 is transferred by a transfer member other than the movable arm 38a, but it does not adversely affect the positioning of the substrate 4 due to the contact of the side free bearing 12 with the ball 12b. Is adopted.

  According to this positioning table 1, the substrate 4 lowered from above the positioning table 1 is accommodated in the substrate positioning region M, and at the same time, by the side free bearings 12 (specifically, balls 12b) around the substrate positioning region M. Since the positioning of the substrate 4 is completed, the time required for positioning the substrate 4 can be greatly shortened, and the positioning efficiency can be greatly improved. In addition, since a device such as a lateral feed device for laterally moving the substrate, which has been conventionally used, is unnecessary, and the positioning of the substrate 4 can be realized with a very simple configuration. The generation of particles can be greatly reduced, and there is an advantage that the high cleanliness in the chamber (load lock chamber 32) in which the positioning table 1 is installed can be kept stable.

  Further, in the present invention, the ball 12a formed of a conductive resin material is employed, and the side free bearing 12 having a ground current-carrying portion in contact with the ball 12a is employed as the ball support 12a. It is also possible to prevent the occurrence of sparks due to static electricity charged on the substrate 4 when 4 contacts the ball 12a.

As shown in FIG. 3, the side free bearing 12 accommodates about half of the ball 12b in a ball support 12a composed of a cylindrical case 12d and a lid 12e, and further inside the ball support 12a. A large number of rollable small spheres 12f in contact with the balls 12b are accommodated. As the component parts of the side free bearing 12, for example, a ball 12b formed of a conductive resin material and a small ball 12f formed of a conductive metal such as stainless steel are adopted. Further, as the cylindrical case 12d, stainless steel or the like is used. When one made of a conductive metal or one having a configuration in which an energizing circuit (including a contact portion that is in contact with the small sphere 12f to ensure electrical continuity) made of an electric wire or the like is employed is adopted, the small sphere 12f and the cylindrical case It has a configuration having a ground energization section consisting of 12d. By connecting the ground energization section to a ground circuit outside the side free bearing 12, it is possible to prevent the occurrence of a spark when the substrate 4 contacts the ball 12b.
Since the occurrence of sparks causes damage to the substrate 4, the use of the side free bearing 12 having the above-described configuration can prevent the substrate 4 from being damaged due to sparks, and can improve the product yield.
As the conductive resin material for forming the ball 12b, a base resin in which a conductive metal filler is dispersed and mixed, or a base resin to which an antistatic polymer is added can be used. The surface resistivity should be ³ to × 10 ¹⁰ Ω / □. As base resins, PAI (polyamideimide), PBI (polybenzimidazole), PCTFE (polychlorotrifluoroethylene), polyetheretherketone, PEI (polyetherimide), PI (polyimide), PPS (polyphenylene sulfide), Melamine resin, aromatic polyamide resin (aramid resin), etc. can be employed. Further, LCP (liquid crystal polymer), PBT (polybutylene terephthalate), PES (polyether sulfone), and other resins can also be used. Vespel (registered trademark of DuPont, which is an aromatic polyamide resin) and PBI are preferable from the viewpoint of stability of characteristics with respect to the environment in the vacuum apparatus.

Further, the present invention has an advantage that the positioning accuracy required for the atmospheric robot 38 (accuracy of transporting the substrate 4 by the atmospheric robot 38) can be relaxed.
That is, in the positioning table 1 having the above-described configuration, when the substrate 4 is lowered from above the balls 12b of the side free bearings 12 by the movement of the movable arm 38a of the atmospheric robot 38, the outer peripheral portion of the substrate 4 is Since the substrate 4 can be guided to the substrate positioning region M by the rotation of the ball 12b if it is placed on the portion of the ball 12b of the side free bearing 12 that protrudes from the ball support 12a, the ball 12b of the side free bearing 12 There is no need for the position of the substrate 4 lowered to the vicinity to be within the range of the substrate positioning region M. The atmospheric robot 38 causes the substrate 4 that is lowered from above the balls 12b of the side free bearings 12 to protrude from the ball support 12a of the balls 12b of the side free bearings 12 (above the substrate positioning region M). The positioning accuracy of the substrate 4 can be adjusted so as to be within the range of the substrate positioning region M since it can be lowered to the substrate positioning region M while being positioned so as to be within a wide range (substrate receiving region U) by the protruding dimension P). Compared with the case where the substrate 4 is moved while maintaining the above, the transfer accuracy can be relaxed.

In FIG. 2, the substrate receiving area U is a ball support 12a of each side free bearing 12 on the mounting base 11 (specifically, an end face 12c on the side facing the substrate positioning area M of each ball support 12a. Is an inner region surrounded by the end surface of the lid 12e of the ball support 12a, and is located above the ball 12b of each side free bearing 12. In other words, the substrate receiving area U is, in other words, the uppermost portion (point) of the portion protruding from the ball support 12a (accommodating about half of the ball 12b) of the ball 12b of each side free bearing 12. It is an inner area surrounded by.
When the substrate 4 is lowered from above the balls 12b of the side free bearings 12 by the atmospheric robot 38, positioning accuracy (conveyance accuracy) is ensured so that the substrate 4 is surely within the range of the substrate receiving area U. Then, the substrate 4 can be lowered to the substrate positioning region M without contacting the ball support 12a of the side free bearing 12, and the substrate 4 can be positioned with a desired positioning accuracy with respect to the positioning table 1. Arranged in region M.

(Concrete example)
If the horizontal positioning accuracy of the substrate 4 in the substrate positioning region M is ± 0.5 mm (c1 and c2 in FIG. 2 are 0.5 mm) and the protruding dimension P of the ball 12b of the side free bearing 12 is 2.5 mm, The allowable error range of the horizontal position of the substrate 4 when it is carried into the substrate receiving area U by the atmospheric robot 38 is ± 3.0 mm. In other words, after the substrate 4 is carried into the substrate receiving region U by the atmospheric robot 38 so that the horizontal position of the substrate 4 is within ± 3.0 mm, the substrate 4 is lowered with respect to the positioning table 1. The substrate 4 can be positioned with an accuracy of ± 0.5 mm.

By the way, in recent years, an increase in the size of a glass substrate 4 such as a mother glass for a display has progressed. In recent years, the size of mother glass, which is frequently used, is for liquid crystal displays and is about 1500 mm × 1800 mm and a thickness of about 0.3 to 0.7 mm.
As described above, when the thin and large glass substrate 4 is transported by the robot and positioned by the positioning table, it is necessary to take measures against the bending of the glass substrate 4. For example, as illustrated in FIG. 2, the atmospheric robot 38 of the present embodiment has a configuration in which the glass substrate 4 is placed on the movable arm 38 a inserted under the glass substrate 4 and transferred, but the robot itself has high transfer accuracy. Even if it is sufficiently secured, it is difficult to eliminate the occurrence of positioning errors due to the bending of the glass substrate 4. Further, as illustrated in FIG. 5, in the positioning table configured to position the glass substrate by pressing against the positioning gauge, the glass substrate is partially bent by the pressing force against the positioning gauge, There is a possibility of affecting the flatness of the glass substrate.

  On the other hand, in the present invention, the substrate 4 lowered from above the balls 12b of the side free bearings 12 around the platform 11 is guided by the balls 12b of the side free bearings 12 from the substrate receiving region U. However, since the substrate 4 can be positioned with respect to the mounting table 11 (that is, the positioning table 1) with a desired accuracy simply by entering the substrate positioning region M and placing it on the support surface F on the mounting table 11, the glass 4 High accuracy positioning can be easily realized by absorbing the accuracy error caused by the bending of the substrate. If the substrate 4 to be lowered to the substrate positioning region M is positioned within the range of the substrate receiving region U described above, it is a configuration in which high-accuracy positioning can be easily realized by lowering, and there is an accuracy error due to bending of the glass substrate. Even so, high-accuracy positioning can be realized easily and reliably. Further, since the positioning can be completed simply by dropping the substrate 4 into the substrate positioning region M while being guided by the balls 12b of the side free bearings 12, the glass substrate is partially applied by the pressing force against the positioning gauge. Inconveniences such as generating a large amount of bending can be eliminated, and the flatness of the glass substrate can be stably maintained.

In the positioning table 1 according to the present invention, the glass substrate 4 placed on the support surface F of the platform 11 is supported by the receiving free bearings 14, so that the glass substrate 4 on the movable arm 38a is supported in a bent state. Even when the glass substrate 4 is lowered onto the surface F, the glass substrate 4 is finally placed on the support surface F while eliminating the bending while rotating the balls 14b of the receiving free bearings 14, so that eventually Then, it is placed on the support surface F with almost no deflection. Thereby, when the positioning in the positioning region M is completed, high flatness is ensured in the glass substrate 4. In addition, since the external force or the like for lateral feeding is not applied to the glass substrate 4 placed on the support surface F, the flatness of the glass substrate can be stably maintained.
Here, the receiving free bearing 14 functions as a substrate support unit that supports the substrate 4 placed on the platform 11 while allowing displacement in the direction along the support surface F. However, the substrate support means is not limited to the receiving free bearing ring 14. For example, a part of the load of the substrate 4 placed on a plurality of stays (including receiving free bearings) protruding on the mounting base, It is supported on the stay by being supported by an air layer (slightly higher than atmospheric pressure) formed between the substrate 4 and the top surface of the platform by air blown from an air outlet opening on the top surface of the platform. A substrate that does not restrain lateral movement of the substrate 4 (movement in a direction along a support surface F (virtual surface) that is a surface that supports the substrate 4 by a plurality of stays) or the like is employed.

  After the substrate 4 taken out from the processing chamber in a process such as film deposition in the vacuum apparatus 31 is placed on the positioning table installed in the load lock chamber 31 (see FIG. 4) and repositioned, the next process is performed. Even when the substrate is carried into the processing chamber, high positioning accuracy can be obtained easily and in a short time by the positioning table 1 according to the present invention, and the flatness of the substrate 4 can be maintained.

In addition, as a board | substrate applied to this invention, it is not limited to the glass substrate (mother glass) for liquid crystal displays, For example, the glass substrate for PDP, a silicon substrate, a ceramic substrate, and a metal substrate may be sufficient.
The installation position of the positioning table according to the present invention is not limited within the load lock chamber, and may be set as appropriate according to the necessity of positioning the substrate, and is not particularly limited. For example, in the middle of a substrate carrying-in route or a carrying-out route to the processing chamber (for example, outside the vacuum device 31 (in the atmosphere), near the substrate inlet (atmospheric gate) to the vacuum device 31), or in the processing chamber It is also possible to install it in The positioning table according to the present invention can also be used for, for example, positioning of a substrate to be carried into a processing apparatus in the atmosphere, positioning before storing the substrate in a transfer cassette, and the like.

It is a top view which shows the positioning table 1 for substrates which concerns on this invention (henceforth a positioning table). It is a figure which shows the positioning table of FIG. 1, Comprising: It is the AA sectional view taken on the line in FIG. It is an enlarged view which shows the attachment positional relationship of the side free bearing provided in the positioning table of FIG. 1, and a receiving free bearing. 1 is a schematic plan view showing process equipment provided with a substrate positioning equipment according to the present invention. It is a figure which shows the transfer robot of a prior art example. It is a figure which shows the other example of the transfer robot of a prior art example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Substrate positioning table, 2 ... Substrate positioning equipment, 4 ... Substrate, 11 ... Mount, 12 ... Free ball bearing (side free bearing), 12a ... Ball support (ground energization part), 12b ... Ball, 12f: small sphere (ground energizing part), 14: free ball bearing (receiving free bearing), 14a ... ball support (ground energizing part), 14b ... ball, M ... substrate positioning area, U ... substrate receiving area.

Claims (5)

By placing the substrate on which the substrate is placed and guiding the outer periphery of the substrate placed on the platform by descending from above the platform, which is arranged at a plurality of locations on the outer periphery of the platform. A free ball bearing for positioning the substrate in a substrate positioning region set on the platform;
The free ball bearing includes a ball support and a ball rotatably supported by the ball support, and the center of the ball is a support surface on which the platform supports the substrate. It is arranged on the extension or at a position above the support surface within the range of the thickness of the substrate placed on the platform, and abuts on the portion of the ball protruding from the ball support The rotated substrate can be guided to the inner substrate positioning region surrounded by the ball of each free ball bearing by rotation of the ball ,
On the platform, a large number of receiving free bearings, which are free ball bearings, are attached as substrate support means for supporting the substrate placed on the platform while allowing displacement in the direction along the support surface,
A substrate that is lowered on the support surface in a state of being bent while being guided by the balls of the respective side free bearings, which are free ball bearings arranged at a plurality of locations on the outer peripheral portion of the mounting platform, has the balls of the receiving free bearings. A substrate positioning table characterized in that it can be placed on the support surface while rotating to eliminate bending . Ball of the side free bearing is formed at least the surface of a conductive material, according to claim 1 which is in the ball support of the side flibe bearings, characterized in that the ground conducting portion in contact with the ball is provided The substrate positioning table as described. The size of the substrate positioning region is slightly larger than the size of the substrate, and the allowable range of substrate position deviation in the direction along the support surface with respect to the target position in the substrate positioning region is ± 0.1 to 0.7 mm. The substrate positioning table according to claim 1, wherein the substrate positioning table is set within a range of the above. A loading table on which the substrate is carried, claims 1 and substrate positioning table according to any one of 3, the carry-base substrate transfer device placed on the stand of the substrate positioning table the substrate is taken out from And a substrate positioning facility. The board | substrate mounted on the said mounting base of the positioning table for substrates of any one of Claims 1-3 ,
Projection of the ball of each side free bearing from the ball support above the substrate positioning area above the ball of the side free bearing which is a free ball bearing arranged at a plurality of locations on the outer periphery of the platform After being lowered from above the substrate receiving area, which is an area secured widely, and entering the substrate receiving area,
A substrate positioning method, wherein the substrate is lowered while being guided by a ball of each side free bearing, and is supported by the receiving free bearing on the mounting table and disposed in the substrate positioning region.

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