JP2011014630A - Mechanism and method for mounting and demounting substrate cover and drawing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mechanism for mounting and demounting a substrate cover capable of placing the substrate cover at an accurate position on a substrate by making alignment in advance each time the substrate cover is placed on the substrate.SOLUTION: The mechanism 50 for mounting and demounting the substrate cover includes substrate supporting pins 40 supporting the substrate 101 from the rear side, and a lifting-lowering mechanism 30 supporting the substrate cover 10, lifting and lowering the substrate cover 10 in that state, and mounting and demounting the substrate cover 10 to and from the substrate 101 by lifting and lowering. The mechanism 50 for mounting and demounting the substrate cover further includes alignment supporting members 20, 22 and 24 supporting the substrate cover 10 at positions different from those supported by the lifting-lowering mechanism 30 and aligning the substrate cover 10 in the state supporting no substrate cover 10 by the lifting-lowering mechanism 30.

Description

  The present invention relates to a substrate cover attaching / detaching mechanism, a substrate cover attaching / detaching method, and a drawing apparatus. For example, the present invention relates to a cover attaching / detaching mechanism and method for a substrate in a drawing apparatus that draws a pattern on a substrate using an electron beam.

  Lithography technology, which is responsible for the progress of miniaturization of semiconductor devices, is an extremely important process for generating a pattern among semiconductor manufacturing processes. In recent years, with the high integration of LSI, circuit line widths required for semiconductor devices have been reduced year by year. In order to form a desired circuit pattern on these semiconductor devices, a highly accurate original pattern (also referred to as a reticle or a mask) is required. Here, the electron beam (electron beam) drawing technique has an essentially excellent resolution, and is used for producing a high-precision original pattern.

  FIG. 12 is a conceptual diagram for explaining the operation of a conventional variable shaping type electron beam drawing apparatus. The variable shaped electron beam (EB) drawing apparatus operates as follows. In the first aperture 410, a rectangular opening for forming the electron beam 330, for example, a rectangular opening 411 is formed. Further, the second aperture 420 is formed with a variable shaping opening 421 for shaping the electron beam 330 having passed through the opening 411 of the first aperture 410 into a desired rectangular shape. The electron beam 330 irradiated from the charged particle source 430 and passed through the opening 411 of the first aperture 410 is deflected by the deflector, passes through a part of the variable shaping opening 421 of the second aperture 420, and passes through a predetermined range. The sample 340 mounted on a stage that continuously moves in one direction (for example, the X direction) is irradiated. That is, the drawing area of the sample 340 mounted on the stage in which the rectangular shape that can pass through both the opening 411 of the first aperture 410 and the variable shaping opening 421 of the second aperture 420 is continuously moved in the X direction. Drawn on. A method of creating an arbitrary shape by passing both the opening 411 of the first aperture 410 and the variable shaping opening 421 of the second aperture 420 is referred to as a variable shaping method.

  When performing drawing in the drawing apparatus, the outer peripheral portion is covered with a frame-shaped mask cover so that the insulating portion on the end face of the mask (substrate) as a sample is not charged by the reflected electrons of the irradiated electron beam. (For example, refer to Patent Document 1). In such a case, the mask cover is stored in a transport path in a vacuum in the drawing apparatus and placed on the mask during drawing. Here, for example, when the substrate is placed on the mask, the contact portion between the mask and the mask cover does not contact at the same time, so that a slight positional deviation may occur. Further, for example, the positional deviation may occur due to a positioning error of the attaching / detaching mechanism when the mask cover is placed on the mask. Although the positional deviation of the mask cover caused by one transport or drawing is very small, when it is used for drawing a plurality of times without performing alignment, an error may be accumulated and an unacceptable positional deviation may occur. Therefore, in order not to accumulate such errors, it is desirable to perform alignment each time before placing on the mask and place the cover at a highly accurate position with respect to the mask.

JP 2008-058809 A

  As described above, it is desirable to perform alignment every time before placing on the mask and place the mask cover at a highly accurate position with respect to the mask. However, conventionally, a method for solving such a problem has not been established.

  Therefore, the present invention overcomes such a problem and provides a mechanism for attaching / detaching a cover to / from a substrate that can be aligned each time before being placed on the substrate to place the substrate cover at a highly accurate position relative to the substrate. It aims to provide a method.

The substrate cover attaching / detaching mechanism of one embodiment of the present invention includes:
A substrate support part for supporting the substrate from the back side;
A substrate cover that covers the entire outer periphery of the substrate from above, lifts and lowers the substrate cover in a supported state, and a lifting unit that attaches and detaches the substrate cover to and from the substrate,
An alignment unit that supports the substrate cover at a position different from the position supported by the elevating unit, and performs alignment of the substrate cover in a state where the substrate cover is not supported by the elevating unit;
It is provided with.

  With this configuration, the substrate cover can be aligned by an alignment unit having a mechanism different from the lifting unit. Therefore, alignment is not immediately performed when the substrate cover is removed from the substrate, and sliding between the substrate and the substrate cover can be prevented.

Further, the substrate cover has three convex portions formed in a hemispherical surface on the substrate side,
The alignment support portion has a conical groove portion formed in a conical groove, a V groove portion formed in a V-shaped groove, and a flat surface portion formed in a plane, and the conical groove portion and the V-shaped V groove portion It is preferable that the substrate cover is aligned by supporting one of the three convex portions different from the other of the flat portion.

Further, the elevating unit lowers the substrate cover on the alignment unit by uniaxial operation, thereby landing the substrate cover on the alignment unit,
The alignment unit preferably performs alignment of the substrate cover by its own weight.

The substrate cover attaching / detaching method of one embodiment of the present invention includes:
From the alignment unit that aligns the substrate cover that covers the entire outer periphery of the substrate from above, the step of supporting and lifting the aligned substrate cover by the lifting unit;
A step of carrying in the substrate with the substrate cover raised;
A step of lowering the substrate cover after the substrate is loaded, and mounting the substrate cover on the substrate;
Removing the substrate cover from the substrate by raising the substrate cover with the lifting unit from the state where the substrate cover is mounted on the substrate;
After the substrate with the substrate cover removed is unloaded, the step of lowering the substrate cover by the elevating unit and landing the substrate cover on the alignment unit;
It is provided with.

The drawing device of one embodiment of the present invention includes:
A substrate support part for supporting the substrate from the back side;
A substrate cover that covers the entire outer periphery of the substrate from above, lifts and lowers the substrate cover in a supported state, and a lifting unit that attaches and detaches the substrate cover to and from the substrate,
An alignment unit that supports the substrate cover at a position different from the position supported by the elevating unit, and performs alignment of the substrate cover in a state where the substrate cover is not supported by the elevating unit;
A drawing unit that carries a substrate with a substrate cover mounted thereon, and draws a pattern on the loaded substrate using a charged particle beam;
It is provided with.

  According to the present invention, the substrate cover can be placed at a highly accurate position with respect to the substrate by performing alignment every time before placing on the substrate.

1 is a conceptual diagram illustrating a configuration of a drawing apparatus according to Embodiment 1. FIG. FIG. 3 is a top view showing a substrate cover in the first embodiment. FIG. 3 is a top view showing a state in which the substrate cover of FIG. 2 is attached to the substrate. It is sectional drawing of the board | substrate cover of FIG. FIG. 3 is a top conceptual diagram illustrating a conveyance path in the drawing apparatus according to the first embodiment. 6 is a conceptual diagram for explaining a state of conveyance by the conveyance robot according to Embodiment 1. FIG. 3 is a conceptual diagram illustrating a configuration of a substrate cover attaching / detaching mechanism in Embodiment 1. FIG. 3 is a conceptual diagram showing the shape of the upper surface of three alignment support members in Embodiment 1. FIG. FIG. 6 is a diagram showing a part of a process for explaining a substrate cover attaching / detaching method in the first embodiment. It is a figure which shows an example of the board | substrate cover attachment / detachment mechanism which performs both raising / lowering and alignment of a board | substrate cover by an raising / lowering mechanism. It is a figure which shows an example of the sliding trace which generate | occur | produced on the board | substrate. It is a conceptual diagram for demonstrating operation | movement of the conventional variable shaping type | mold electron beam drawing apparatus.

  Hereinafter, in the embodiment, a configuration using an electron beam will be described as an example of a charged particle beam. However, the charged particle beam is not limited to an electron beam, and a beam using charged particles such as an ion beam may be used.

Embodiment 1 FIG.
FIG. 1 is a conceptual diagram illustrating a configuration of a drawing apparatus according to the first embodiment. In FIG. 1, a drawing apparatus 100 includes a drawing unit 150, a control circuit 160, a control computer 110, a loading / unloading port (I / F) 120, a load lock (L / L) chamber 130, a robot chamber 140, an alignment chamber 146, and a substrate cover. A detachable chamber 148 and a vacuum pump 170 are provided. The drawing apparatus 100 is an example of a charged particle beam drawing apparatus. The drawing apparatus 100 draws a desired pattern on the substrate 101.

  The drawing unit 150 includes an electron column 102 and a drawing chamber 103. In the electron column 102, an electron gun 201, an illumination lens 202, a first aperture 203, a projection lens 204, a deflector 205, a second aperture 206, an objective lens 207, and a deflector 208 are arranged. In the drawing chamber 103, an XY stage 105 is arranged so as to be movable. On the XY stage 105, a substrate 101 on which a substrate cover 10 is mounted is disposed. Although not shown, the substrate 101 is grounded (grounded) to the drawing apparatus 100 via the substrate cover 10. In addition, a transfer robot 122 that transfers the substrate 101 is disposed in the carry-in / out opening 120. A transfer robot 142 that transfers the substrate 101 is disposed in the robot chamber 140.

  The vacuum pump 170 exhausts the gas in the robot chamber 140, the alignment chamber 146, and the substrate cover attaching / detaching chamber 148 via the valve 172. Thereby, the robot chamber 140, the alignment chamber 146, and the substrate cover attaching / detaching chamber 148 are maintained in a vacuum atmosphere. The vacuum pump 170 exhausts the gas in the electron column 102 and the drawing chamber 103 via the valve 174. As a result, the inside of the electron column 102 and the drawing chamber 103 are maintained in a vacuum atmosphere. Further, the vacuum pump 170 exhausts the gas in the load lock chamber 130 via the valve 176. Thereby, the inside of the load lock chamber 130 is controlled to a vacuum atmosphere as necessary. In addition, gate valves 132, 134, and 136 are disposed at boundaries between the loading / unloading port 120, the load lock chamber 130, the robot chamber 140, and the drawing chamber 103. Examples of the substrate 101 include an exposure mask substrate that transfers a pattern onto a wafer. The mask substrate includes, for example, mask blanks on which no pattern is formed yet.

  The control circuit 160 is controlled by the control computer 110, and drives each device in the drawing unit 150, the loading / unloading port 120, the load lock chamber 130, the alignment chamber 146, and the substrate cover attaching / detaching chamber 148 according to the control contents.

  Here, FIG. 1 shows components necessary for explaining the first embodiment. Needless to say, the drawing apparatus 100 may normally include other necessary configurations. The transport robots 122 and 142 may be any mechanical mechanism such as an elevator mechanism or a rotation mechanism.

  An electron beam 200 emitted from an electron gun 201 which is an example of an irradiation unit illuminates the entire first aperture 203 having a rectangular hole, for example, a rectangular hole, by an illumination lens 202. Here, the electron beam 200 is first formed into a rectangle, for example, a rectangle. Then, the electron beam 200 of the first aperture image that has passed through the first aperture 203 is projected onto the second aperture 206 by the projection lens 204. The position of the first aperture image on the second aperture 206 is deflection-controlled by the deflector 205, and the beam shape and size can be changed. As a result, the electron beam 200 is shaped. Then, the electron beam 200 of the second aperture image that has passed through the second aperture 206 is focused by the objective lens 207 and deflected by the deflector 208. As a result, the desired position of the substrate 101 on the continuously moving XY stage 105 is irradiated.

FIG. 2 is a top view showing the substrate cover in the first embodiment.
FIG. 3 is a top view showing a state in which the substrate cover of FIG. 2 is attached to the substrate.
4 is a cross-sectional view of the substrate cover of FIG.
The substrate cover 10 includes three contact support members 12 and a frame 16 (an example of a frame-shaped member). The contact support member 12 is attached from the upper surface side of the frame 16 to a position that supports the substrate cover 10 by three-point instruction. The contact support member 12 is attached so as to protrude from the inner peripheral end of the frame 16 to the inner side and from the outer peripheral end. The contact support member 12 is fixed to the frame 16 by, for example, screwing or welding. On the back surface side of each contact support member 12, a pin 18 serving as a contact portion is disposed at a position inside the inner peripheral end of the frame 16 with the front end facing the back surface side. Further, on the back side of each contact support member 12, a hemispherical convex portion 14 is disposed at a position outside the outer peripheral end of the frame 16 with the spherical surface facing the back side of each contact support member 12.

  The frame 16 is made of a plate material, and has an outer peripheral dimension larger than the outer peripheral end of the substrate 101 and an opening formed in an inner central portion smaller than the outer peripheral end of the substrate 101. That is, as shown in FIG. 3, when the substrate cover 10 is overlaid on the upper portion of the substrate 101 from above, the entire outer periphery of the substrate 101 indicated by the dotted line is formed so as to overlap the frame 16. Thus, the substrate cover 10 covers the entire outer peripheral portion of the substrate 101 from above. The three pins 18 bite into the film formed on the substrate 101 and are electrically connected to the conductive film also formed on the substrate 101.

  The substrate cover 10 is preferably formed entirely of a conductive material, or formed entirely of an insulating material and coated on the surface thereof with a conductive material. As the conductive material, a metal material such as copper (Cu) or titanium (Ti) and an alloy thereof is suitable, and as the insulating material, a ceramic material such as alumina is suitable. For example, the frame 16 is preferably made of a material obtained by coating Ti on alumina. Each contact support member 12 is preferably made of conductive zirconia ceramics. The hemispherical convex portion 14 is preferably made of Ti.

FIG. 5 is a conceptual top view illustrating a conveyance path in the drawing apparatus according to the first embodiment.
FIG. 6 is a conceptual diagram for explaining a state of transfer by the transfer robot in the first embodiment.
After the gate valve 132 is opened, the substrate 101 disposed at the carry-in / out opening 120 is carried onto a support member in the L / L chamber 130 by the carrying robot 122. Then, after closing the gate valve 132, the gate valve 134 is opened, and the transfer robot 142 is transferred to the stage in the alignment chamber 146 via the robot chamber 140. Then, the substrate 101 is aligned in the alignment chamber 146. The aligned substrate 101 is transferred by the transfer robot 142 via the robot chamber 140 onto the substrate cover attaching / detaching mechanism in the substrate cover attaching / detaching chamber 148. Then, the substrate 101 on which the substrate cover 10 is mounted in the substrate cover attaching / detaching chamber 148 is then transferred onto the XY stage 105 in the drawing chamber 103 with the gate valve 136 opened. After the gate valve 136 is closed, a predetermined pattern is drawn on the substrate 101 on the XY stage 105.

  When drawing is completed, the gate valve 136 is opened, and the substrate 101 on which the substrate cover 10 is mounted is moved into the robot chamber 140 by the transfer robot 142 from the XY stage 105 in the drawing chamber 103. Then, after the gate valve 136 is closed, it is transferred onto a substrate cover attaching / detaching mechanism in the substrate cover attaching / detaching chamber 148. Then, the substrate cover 10 is removed from the substrate 101 by the substrate cover attaching / detaching mechanism in the substrate cover attaching / detaching chamber 148. The substrate cover 10 removed from the substrate 101 is stored on a substrate cover attaching / detaching mechanism in the substrate cover attaching / detaching chamber 148. The substrate 101 from which the substrate cover 10 has been removed in the substrate cover attaching / detaching chamber 148 opens the gate valve 134, and the substrate 101 is transferred to the stage in the load lock chamber 130 by the transfer robot 142. Then, after closing the gate valve 134, the gate valve 132 is opened, and the substrate 101 is unloaded to the loading / unloading port 120 by the transfer robot 122. During these operations, if the degree of vacuum in each chamber decreases, the vacuum pump 170 is activated each time to maintain the degree of vacuum. Alternatively, the valve 172 or the valve 174 is opened and closed, and is evacuated by the operating vacuum pump 170 to maintain a desired degree of vacuum.

  As described above, the loading / unloading port (I / F) 120 that transfers the substrate 101 on the transfer path between the loading / unloading port 120 and the drawing chamber 103, the L / L chamber 130, the robot chamber 140, the alignment chamber 146, and the substrate cover. The detachable chamber 148 and each device disposed inside these are examples of the transport system.

  FIG. 7 is a conceptual diagram showing a configuration of the substrate cover attaching / detaching mechanism in the first embodiment. In FIG. 7, the substrate cover attaching / detaching mechanism 50 includes three rod-shaped alignment support members 20, 22, 24, a base 21, an elevating mechanism 30, and three rod-shaped substrate support pins 40. The three alignment support members 20, 22, and 24 are fixed and arranged on the base 21 without moving. The three alignment support members 20, 22, and 24 are an example of an alignment unit. Three alignment support members 20, 22, and 24 are placed on one of the three convex portions 14 of the substrate cover 10 that is different from the others. Therefore, the three alignment support members 20, 22, and 24 are disposed at positions where the three convex portions 14 of the substrate cover 10 can be placed. The alignment support members 20, 22, and 24 perform alignment of the substrate cover 10 in a state where the substrate cover 10 is not supported by the elevating mechanism 30.

  The elevating mechanism 30 has three support portions, and performs a uniaxial operation in the z direction (up and down direction) in conjunction with each other. The elevating mechanism 30 is an example of an elevating unit. The three support portions of the elevating mechanism 30 are disposed inside the alignment support members 20, 22, and 24 and support the back surface of the frame 16 of the substrate cover 10. As described above, the position at which the substrate cover 10 is supported by the elevating mechanism 30 is different from the position at which the substrate cover 10 is supported by the alignment support members 20, 22, 24. The elevating mechanism 30 supports the substrate cover 10, moves the substrate cover 10 up and down in the supported state, and attaches and detaches the substrate cover 10 to and from the substrate 101. In addition, the lifting mechanism 30 lowers the substrate cover 10 by uniaxial operation on the alignment support members 20, 22, 24 after the substrate 101 is unloaded from the substrate cover attaching / detaching chamber 148, thereby aligning the alignment support members 20, 22. , 24, the substrate cover 10 is landed. Here, illustration of an actuator for raising and lowering the elevating mechanism 30 is omitted.

  The three substrate support pins 40 are arranged inside the three support portions of the lifting mechanism 30 and support the back surface of the substrate 101. The three substrate support pins 40 are an example of a substrate support part. It is preferable that the positions supported by the three substrate support pins 40 overlap with the positions of the three pins 18 of the substrate cover 10. Thereby, when the pin 18 bites into the film of the substrate 101, the substrate support pin 40 supports the substrate 101 at a position corresponding to the pin 18 on the back surface side of the substrate 101. Therefore, even if the pin 18 is pushed in, the pin 18 can bite into the film of the substrate 101 without bending the substrate 101. Therefore, the conductive film can be more reliably conducted.

  The three alignment support members 20, 22, and 24 are provided with three protrusions of the substrate cover 10 when the substrate cover 10 is attached to the substrate 101 with the substrate 101 supported by the three substrate support pins 40. 14 is formed so as not to touch the upper surfaces of the three alignment support members 20, 22, 24. Further, when the substrate 101 is unloaded from the substrate cover attaching / detaching chamber 148 and the alignment support members 20, 22, 24 support the substrate cover 10 without the substrate 101, the substrate cover 10 is placed on the upper surface of the substrate support pins 40. It is formed so as not to touch. In other words, when the alignment support members 20, 22, and 24 support the substrate cover 10 without the substrate 101, the height direction between the back surface of the frame 16 of the substrate cover 10 and the upper surface of the substrate support pins 40 is increased. It is preferable that the gap is configured to be thinner than the thickness of the substrate 101.

  FIG. 8 is a conceptual diagram showing the shapes of the upper surfaces of the three alignment support members in the first embodiment. FIG. 8A shows a top view of the alignment support member 20, and FIG. 8B shows a front cross-sectional view of the alignment support member 20. A conical groove formed in a conical groove is formed on the upper surface of the alignment support member 20. FIG. 8C shows a top view of the alignment support member 22, and FIG. 8D shows a front sectional view of the alignment support member 22. On the upper surface of the alignment support member 22, a V-groove portion formed in a V-shaped groove is formed. 8E shows a top view of the alignment support member 24, and FIG. 8F shows a front sectional view of the alignment support member 24. As shown in FIG. On the upper surface of the alignment support member 24, a flat portion formed in a flat surface is formed. Each alignment support member 20, 22, 24 mounts the hemispherical convex portion 14 of the substrate cover 10. The alignment support members 20, 22, and 24 align the substrate cover 10 by the weight of the substrate cover 10 that has landed. That is, one convex portion 14 is positioned at a certain point by moving along the inclination of the conical groove portion. Further, another convex portion 14 is positioned by moving in one direction of the plane direction by the inclination of the V-groove portion. And the remaining one convex part 14 becomes free with respect to a plane direction on a plane part. Therefore, the position can be determined based on the point positioned by the conical groove. Further, as shown in FIG. 8, the height of the upper surface of the alignment support member 24 is formed to coincide with the height when the convex portion 14 is placed on the other two alignment support members 20 and 22. . Here, using the maximum static friction coefficient μ between the alignment support members 20, 22, 24 and the convex portion 14, the inclination angle θ with respect to the z-axis of the conical groove portion and the V groove portion is set so as to satisfy sin θ × cos θ> 2μ. Is preferred.

  FIG. 9 is a diagram illustrating a part of a process for explaining the substrate cover attaching / detaching method according to the first embodiment. A description will be given from a state in which the substrate cover 10 is stored on the alignment support members 20, 22, and 24. In the stored state, the substrate cover 10 is aligned. In such a situation, the support portion of the lifting mechanism 30 is located below the upper surfaces of the alignment support members 20, 22, and 24.

  1) First, the servo of a motor (not shown) of the elevating mechanism 30 is turned on, and the origin of the servo motor is searched at a position where it does not contact the substrate cover 10 on the alignment support members 20, 22, 24.

  2) Next, the aligned substrate cover 10 is supported by the elevating mechanism 30 from the alignment support members 20, 22, and 24 to a height at which the substrate 101 can be loaded.

  3) With the substrate cover 10 raised, the substrate 101 aligned from the robot chamber 140 is carried onto the substrate support pins 40 in the substrate cover attaching / detaching chamber 148 by the transfer robot 142, and the state shown in FIG. As shown, it is placed on the substrate support pins 40.

  4) Next, after the substrate 101 is carried in, the substrate cover 10 is lowered by the elevating mechanism 30 to mount the substrate cover 10 on the substrate 101 as shown in FIG.

  5) Conductivity check is performed using the electrode spring 32 connected between the elevating mechanism 30 and the convex portion 14 with the substrate cover 10 mounted on the substrate 101.

  6) The support portion of the lifting mechanism 30 is further lowered to a position where the support portion of the lifting mechanism 30 is separated from the substrate cover 10. As a result, the substrate 101 with the substrate cover 10 mounted thereon is placed on the substrate support pins 40.

  7) Then, the substrate 101 on which the substrate cover 10 is mounted in the substrate cover attaching / detaching chamber 148 is unloaded from the substrate cover attaching / detaching chamber 148 by the transfer robot 142, and then the gate valve 136 is opened to set the XY stage in the drawing chamber 103. 105 is conveyed.

  When the drawing is completed, the substrate cover 10 is then removed. Below, the removal operation | movement of the board | substrate cover 10 is demonstrated.

  8) When the servo of the motor (not shown) of the elevating mechanism 30 is turned off, turn it on and turn the servo motor on at a height position below the support height of the substrate cover 10 by the alignment support members 20, 22, and 24. Search the origin. If the motor servo remains ON, it is only necessary to stand by at a height position equal to or lower than the support height of the substrate cover 10 by the alignment support members 20, 22, and 24.

  9) The substrate 101 on which the substrate cover 10 is mounted is transferred from the robot chamber 140 onto the substrate support pins 40 in the substrate cover attaching / detaching chamber 148 by the transfer robot 142.

  10) The substrate cover 10 is removed from the substrate 101 as shown in FIG. 9A by raising the substrate cover 10 with the lifting mechanism 30 from the state in which the substrate cover 10 is mounted on the substrate 101.

  11) The substrate 101 from which the substrate cover 10 has been removed is carried out of the substrate cover attaching / detaching chamber 148 by the transfer robot 142.

  12) After the substrate 101 with the substrate cover 10 removed is carried out, the substrate cover 10 is lowered by the elevating mechanism 30 and the substrate cover 10 is landed on the alignment support members 20, 22, 24. Then, the support portion of the lifting mechanism 30 is further lowered and detached from the substrate cover 10. Thereby, as described above, the substrate cover 10 is aligned by the weight of the substrate cover 10. Then, the substrate cover 10 is stored on the alignment support members 20, 22, and 24 in an aligned state.

  13) The servo of a motor (not shown) of the lifting mechanism 30 is turned off.

  By operating as described above, the removal operation of the substrate cover 10 is completed.

  Further, as described above, in the first embodiment, the lifting mechanism 30 that lifts and lowers the substrate cover 10 and the alignment mechanism that aligns the substrate cover 10 have different configurations. Here, it is also possible to perform both raising and lowering of the substrate cover 10 and alignment by the raising and lowering mechanism.

  FIG. 10 is a diagram illustrating an example of a substrate cover attaching / detaching mechanism that performs both raising and lowering of the substrate cover and alignment by the lifting mechanism. FIG. 10 shows an example in which the support portion of the elevating mechanism 33 is configured such that a conical groove portion, a V groove portion, and a flat portion are formed on the upper surface in the same manner as the alignment support members 20, 22, and 24. However, in the configuration shown in FIG. 10, the alignment operation is started simultaneously with the removal of the substrate cover 10 from the substrate 101. Therefore, sliding occurs between the substrate 101 and the pins 18 of the substrate cover 10.

  FIG. 11 is a diagram illustrating an example of sliding traces generated on the substrate. When both raising and lowering of the substrate cover and alignment as shown in FIG. 10 are performed by the raising and lowering mechanism 33, sliding as shown in FIG. 11 occurs and particles are generated. As a result, the particles adhere to the drawing surface of the substrate 101. Therefore, it is necessary to prevent the occurrence of sliding. On the other hand, in the first embodiment, the lifting mechanism 30 that lifts and lowers the substrate cover 10 and the alignment mechanism that aligns the substrate cover 10 have different configurations. For this reason, the alignment operation is not started simultaneously with the removal of the substrate cover 10 from the substrate 101. Therefore, the occurrence of sliding can be prevented.

  As described above, in the first embodiment, the substrate cover 10 can be placed at a highly accurate position with respect to the substrate 101 by performing alignment every time before placing on the substrate 101. Further, since the alignment operation only needs to be placed on the alignment support members 20, 22, and 24, the alignment operation can be performed simultaneously with the storage of the substrate cover 10.

  The embodiments have been described above with reference to specific examples. However, the present invention is not limited to these specific examples.

  In addition, although descriptions are omitted for parts and the like that are not directly required for the description of the present invention, such as a device configuration and a control method, a required device configuration and a control method can be appropriately selected and used. For example, although the description of the control unit configuration for controlling the drawing apparatus 100 is omitted, it goes without saying that the required control unit configuration is appropriately selected and used.

  In addition, a cover attaching / detaching mechanism, a method for attaching / detaching a cover to a substrate, a drawing apparatus, and a drawing method that include elements of the present invention and that can be appropriately modified by those skilled in the art are included in the scope of the present invention. .

DESCRIPTION OF SYMBOLS 10 Substrate cover 12 Contact support member 14 Convex part 16 Frame 18 Pin 20, 22, 24 Alignment support member 21 Base 30, 33 Lifting mechanism 32 Electrode spring 40 Substrate support pin 50 Substrate cover attaching / detaching mechanism 100 Drawing apparatus 101 Substrate 102 Electronic mirror Cylinder 103 Drawing chamber 105 XY stage 110 Control computer 120 Carrying in / out port 122, 142 Transport robot 130 Load lock chamber 132, 134, 136 Gate valve 140 Robot chamber 146 Alignment chamber 148 Substrate cover attaching / detaching chamber 150 Drawing unit 160 Control circuit 170 Vacuum pump 172 , 174, 176 Valve 200 Electron beam 201 Electron gun 202 Illumination lens 203, 410 First aperture 204 Projection lens 205, 208 Deflector 206, 420 Second aperture 207 objective lens 330 electron beam 340 sample 411 opening 421 variable-shaped opening 430 a charged particle source

Claims (5)

A substrate support part for supporting the substrate from the back side;
A substrate cover that covers the entire outer peripheral portion of the substrate from above, lifts and lowers the substrate cover in a supported state, and a lifting unit that attaches and detaches the substrate cover to and from the substrate,
An alignment unit that supports the substrate cover at a position different from the position supported by the lifting unit, and performs alignment of the substrate cover in a state where the substrate cover is not supported by the lifting unit;
A board cover attaching / detaching mechanism comprising: The substrate cover has three convex portions formed in a hemispherical surface on the substrate side,
The alignment support portion includes a conical groove portion formed in a conical groove, a V groove portion formed in a V-shaped groove, and a flat surface portion formed in a flat surface, and the conical groove portion and the V-shaped V-shape. 2. The substrate cover attaching / detaching mechanism according to claim 1, wherein the groove portion and the flat portion align the substrate cover by supporting one of the three convex portions different from the other. The elevating unit lowers the substrate cover in a single axis operation on the alignment unit, thereby landing the substrate cover on the alignment unit,
The substrate cover attaching / detaching mechanism according to claim 1, wherein the alignment unit performs alignment of the substrate cover by the weight of the landed substrate cover. From the alignment unit that aligns the substrate cover that covers the entire outer periphery of the substrate from above, the aligned substrate cover is supported by the lifting unit and raised,
Carrying the substrate with the substrate cover raised;
Mounting the substrate cover on the substrate by lowering the substrate cover after the substrate is loaded; and
Removing the substrate cover from the substrate by raising the substrate cover with the elevating unit from a state in which the substrate cover is mounted on the substrate;
A step of lowering the substrate cover by the elevating unit and landing the substrate cover on the alignment unit after the substrate from which the substrate cover has been removed is carried out;
A substrate cover attaching / detaching method comprising: A substrate support part for supporting the substrate from the back side;
A substrate cover that covers the entire outer peripheral portion of the substrate from above, lifts and lowers the substrate cover in a supported state, and a lifting unit that attaches and detaches the substrate cover to and from the substrate,
An alignment unit that supports the substrate cover at a position different from the position supported by the lifting unit, and performs alignment of the substrate cover in a state where the substrate cover is not supported by the lifting unit;
A drawing unit that carries a substrate on which the substrate cover is mounted, and draws a pattern on the loaded substrate using a charged particle beam;
A drawing apparatus comprising: