JP4536601B2 - 半導体装置の作製方法 - Google Patents

半導体装置の作製方法 Download PDF

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Publication number
JP4536601B2
JP4536601B2 JP2005168056A JP2005168056A JP4536601B2 JP 4536601 B2 JP4536601 B2 JP 4536601B2 JP 2005168056 A JP2005168056 A JP 2005168056A JP 2005168056 A JP2005168056 A JP 2005168056A JP 4536601 B2 JP4536601 B2 JP 4536601B2
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Japan
Prior art keywords
layer
film
light
semiconductor
conductive layer
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Expired - Fee Related
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JP2005168056A
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English (en)
Japanese (ja)
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JP2006032916A5 (enExample
JP2006032916A (ja
Inventor
裕子 山本
理 中村
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2005168056A priority Critical patent/JP4536601B2/ja
Publication of JP2006032916A publication Critical patent/JP2006032916A/ja
Publication of JP2006032916A5 publication Critical patent/JP2006032916A5/ja
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Publication of JP4536601B2 publication Critical patent/JP4536601B2/ja
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  • Electroluminescent Light Sources (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
JP2005168056A 2004-06-14 2005-06-08 半導体装置の作製方法 Expired - Fee Related JP4536601B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005168056A JP4536601B2 (ja) 2004-06-14 2005-06-08 半導体装置の作製方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004175833 2004-06-14
JP2005168056A JP4536601B2 (ja) 2004-06-14 2005-06-08 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2006032916A JP2006032916A (ja) 2006-02-02
JP2006032916A5 JP2006032916A5 (enExample) 2008-05-29
JP4536601B2 true JP4536601B2 (ja) 2010-09-01

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Family Applications (1)

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JP2005168056A Expired - Fee Related JP4536601B2 (ja) 2004-06-14 2005-06-08 半導体装置の作製方法

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JP (1) JP4536601B2 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7528448B2 (en) * 2006-07-17 2009-05-05 E.I. Du Pont De Nemours And Company Thin film transistor comprising novel conductor and dielectric compositions
JP2008041960A (ja) * 2006-08-07 2008-02-21 Nissan Chem Ind Ltd 電子回路部品の製造方法
KR101398325B1 (ko) * 2006-12-19 2014-05-26 엘지디스플레이 주식회사 박막 트랜지스터 어레이 기판 및 그 제조방법
US8110450B2 (en) * 2007-12-19 2012-02-07 Palo Alto Research Center Incorporated Printed TFT and TFT array with self-aligned gate
TWI569454B (zh) * 2008-09-01 2017-02-01 半導體能源研究所股份有限公司 半導體裝置的製造方法
JP5509629B2 (ja) * 2009-03-09 2014-06-04 コニカミノルタ株式会社 薄膜トランジスタアレイの製造方法、及び薄膜トランジスタアレイ
KR101195569B1 (ko) 2010-11-08 2012-10-29 유버 주식회사 발광소자 탑재용 기판 및 이의 제조방법
US20140097002A1 (en) 2012-10-05 2014-04-10 Tyco Electronics Amp Gmbh Electrical components and methods and systems of manufacturing electrical components
KR101409287B1 (ko) 2014-02-18 2014-06-24 엘지디스플레이 주식회사 박막 트랜지스터 어레이 기판
JP2015195329A (ja) * 2014-03-28 2015-11-05 株式会社秀峰 導電配線の製造方法および導電配線
JP2016039171A (ja) * 2014-08-05 2016-03-22 株式会社秀峰 導電配線の製造方法および導電配線
JP6431361B2 (ja) * 2014-12-22 2018-11-28 エルジー ディスプレイ カンパニー リミテッド 電子部品の実装方法
JP6473361B2 (ja) * 2015-03-25 2019-02-20 スタンレー電気株式会社 電子デバイスの製造方法、および、電子デバイス
JP6630053B2 (ja) * 2015-03-25 2020-01-15 スタンレー電気株式会社 電子デバイスの製造方法
JP2016207904A (ja) * 2015-04-24 2016-12-08 スタンレー電気株式会社 回路基板の製造方法、電子デバイスの製造方法、および、電子デバイス
JP6491032B2 (ja) 2015-04-24 2019-03-27 スタンレー電気株式会社 抵抗器の製造方法、および、抵抗器
GB2541412B (en) * 2015-08-18 2018-08-01 M Solv Ltd Method and Apparatus for Forming a Conductive Track
CN109075079B (zh) * 2016-04-22 2022-04-15 株式会社半导体能源研究所 剥离方法及柔性装置的制造方法
JP7254444B2 (ja) * 2018-02-13 2023-04-10 旭化成株式会社 金属配線の製造方法及び金属配線製造装置
JP2020039002A (ja) * 2019-12-03 2020-03-12 スタンレー電気株式会社 電子デバイス
JP2022025960A (ja) * 2020-07-30 2022-02-10 株式会社ブイ・テクノロジー 焼成メタルインク配線製造方法および焼成メタルインク配線製造方法で製造された製品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57201096A (en) * 1981-06-04 1982-12-09 Nippon Electric Co Method of forming wiring conductor
JP3397481B2 (ja) * 1994-12-28 2003-04-14 株式会社日立製作所 配線の断線修正方法
JP3761615B2 (ja) * 1995-11-10 2006-03-29 株式会社日立製作所 電子回路基板の配線修正方法およびその装置
JP4593969B2 (ja) * 2003-05-16 2010-12-08 株式会社半導体エネルギー研究所 配線の作製方法及び表示装置の作製方法
JP2005072205A (ja) * 2003-08-22 2005-03-17 Seiko Epson Corp 熱処理方法、配線パターンの形成方法、電気光学装置の製造方法、電気光学装置及び電子機器

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