JP4532093B2 - 金属箔製造用不溶性電極 - Google Patents
金属箔製造用不溶性電極 Download PDFInfo
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- JP4532093B2 JP4532093B2 JP2003380129A JP2003380129A JP4532093B2 JP 4532093 B2 JP4532093 B2 JP 4532093B2 JP 2003380129 A JP2003380129 A JP 2003380129A JP 2003380129 A JP2003380129 A JP 2003380129A JP 4532093 B2 JP4532093 B2 JP 4532093B2
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- 229910052751 metal Inorganic materials 0.000 title claims description 47
- 239000002184 metal Substances 0.000 title claims description 47
- 239000011888 foil Substances 0.000 title claims description 40
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000008151 electrolyte solution Substances 0.000 claims description 24
- 230000002093 peripheral effect Effects 0.000 claims description 22
- 238000003860 storage Methods 0.000 claims description 9
- 239000011810 insulating material Substances 0.000 claims description 5
- 229910021645 metal ion Inorganic materials 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims 1
- 239000013500 performance material Substances 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 239000010936 titanium Substances 0.000 description 12
- 230000008439 repair process Effects 0.000 description 10
- 229910052719 titanium Inorganic materials 0.000 description 10
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- 239000010935 stainless steel Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910001200 Ferrotitanium Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- -1 FRP or PVC Chemical compound 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000000414 obstructive effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Description
2 ドラム
3 電極板
6 電極側突片部
7 支持体側突片部
15 支持体
16 支持板部
21 箱形収納容体
25 貫通孔
26 ネジ孔
27 ボルト
28 円弧支持部
Claims (5)
- 上部が開口した箱形収納容体の内部に電極板を支持する支持体を設け、この支持体に前記電極板を支持状態で設けてこの電極板を内面とする電解層を形成し、この電解層に金属イオンを含む電解液を溜め、この電解液に円筒状のドラムを浸漬し、前記電極板から前記電解液を経由して前記ドラムに電流を流すことにより、このドラムの外周面で金属箔を製造する装置であって、前記円筒状のドラムの外周面に対応する断面視円弧状の前記電極板の外面に該電極板を歪みの無い円弧形状に保持する絶縁性の高いものを採用した支持板部を積層状態に設け、若しくは絶縁性の低いものを採用した支持板部を、前記電極板とこの支持板部との間に絶縁層を介在させて積層状態に設け、この支持板部の左右側端部に設けた電極側突片部を前記支持体にボルト固定構造で着脱自在に設けて、又は前記支持板部の左右両端部を前記支持体に設けた支持体側突片部にボルト固定構造で着脱自在に設けて、前記電極板と前記支持体とを着脱自在に固定したことを特徴とする金属箔製造用不溶性電極。
- 前記支持体の上面を、断面視円弧状の前記電極板の形状に対応して外方から支持する円弧支持部とし、又は前記支持体に前記支持体側突片部を内方又は外方に突出状態に設けてこの支持体側突片部の上面を、断面視円弧状の前記電極板の形状に対応して外方から支持する円弧支持部として、この円弧支持部に前記電極板を支承状態に設け、この電極板を前記円弧支持部に着脱自在に設けて前記電極板と前記支持体とを着脱自在に固定したことを特徴とする請求項1記載の金属箔製造用不溶性電極。
- 前記支持板部又は前記電極側突片部に貫通孔若しくはネジ孔を設け、前記支持体又は前記支持体側突片部にネジ孔若しくは貫通孔を設け、この貫通孔に貫通若しくはこのネジ孔にボルトを螺着して前記電極板の外面に積層状態に設けた前記絶縁性の高いものを採用した支持板部と前記支持体とを、若しくは前記電極板の外面との間に絶縁層を介在させて積層状態に設けた前記絶縁性の低いものを採用した支持板部と前記支持体とをボルト止め固定したことを特徴とする請求項1,2のいずれか1項に記載の金属箔製造用不溶性電極。
- 前記支持板部に前記電極側突片部を該支持板部の左右側端部から外方に突出状態に設け、前記電極側突片部に前記貫通孔を設け、前記支持体の上面となる前記円弧支持部に前記ネジ孔を設けて、前記ボルトを前記電極側突片部に設けた前記貫通孔側から挿入し、前記円弧支持部の前記ネジ孔に螺着して前記電極板の外面に積層状態に設けた前記絶縁性の高いものを採用した支持板部と前記支持体とを、若しくは前記電極板の外面との間に絶縁層を介在させて積層状態に設けた前記絶縁性の低いものを採用した支持板部と前記支持体とをボルト止め固定したことを特徴とする請求項2,3のいずれか1項に記載の金属箔製造用不溶性電極。
- 前記支持体に前記支持体側突片部を内方に突出状態に設けて前記円弧支持部を形成し、前記支持体側突片部に前記貫通孔を設け、前記支持板部に前記ネジ孔を設け、前記ボルトを支持体側突片部に設けた前記貫通孔側から挿入し、前記支持板部に設けた前記ネジ孔に螺着して前記電極板の外面に積層状態に設けた前記絶縁性の高いものを採用した支持板部と前記支持体とを、若しくは前記電極板の外面との間に絶縁層を介在させて積層状態に設けた前記絶縁性の低いものを採用した支持板部と前記支持体とをボルト止め固定したことを特徴とする請求項2,3のいずれか1項に記載の金属箔製造用不溶性電極。
Priority Applications (1)
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JP2003380129A JP4532093B2 (ja) | 2003-04-18 | 2003-11-10 | 金属箔製造用不溶性電極 |
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JP2003114489 | 2003-04-18 | ||
JP2003380129A JP4532093B2 (ja) | 2003-04-18 | 2003-11-10 | 金属箔製造用不溶性電極 |
Publications (2)
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JP2004332102A JP2004332102A (ja) | 2004-11-25 |
JP4532093B2 true JP4532093B2 (ja) | 2010-08-25 |
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JP2003380129A Expired - Lifetime JP4532093B2 (ja) | 2003-04-18 | 2003-11-10 | 金属箔製造用不溶性電極 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101320114B1 (ko) | 2011-08-30 | 2013-10-18 | 니시 코교 가부시키가이샤 | 금속박 전해 석출 장치 |
JP7045840B2 (ja) * | 2017-12-08 | 2022-04-01 | 日鉄工材株式会社 | 金属箔製造装置及び電極板取付体 |
JP7005323B2 (ja) * | 2017-12-08 | 2022-01-21 | 日鉄工材株式会社 | 金属箔製造装置 |
JP7005558B2 (ja) | 2019-06-10 | 2022-01-21 | 日鉄工材株式会社 | 金属箔製造装置 |
CN115274288A (zh) * | 2022-08-14 | 2022-11-01 | 西比里电机技术(苏州)有限公司 | 一种陶瓷绝缘铝绕组的制备装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998017845A1 (fr) * | 1996-10-24 | 1998-04-30 | Ishifuku Metal Industry Co., Ltd. | Electrolyseur |
JPH11510218A (ja) * | 1995-08-07 | 1999-09-07 | エルテック・システムズ・コーポレーション | 電気めっき陽極セル |
JP2001164395A (ja) * | 2000-02-04 | 2001-06-19 | Mifune Tekkosho:Kk | 電解銅箔の製造装置 |
JP2002038291A (ja) * | 2001-09-03 | 2002-02-06 | Daiso Co Ltd | 金属箔製造用陽極 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5393396A (en) * | 1990-10-30 | 1995-02-28 | Gould Inc. | Apparatus for electrodepositing metal |
JP2675219B2 (ja) * | 1991-12-26 | 1997-11-12 | ペルメレック電極株式会社 | 金属箔連続製造装置用陽極の再活性化方法 |
JP2963266B2 (ja) * | 1992-01-28 | 1999-10-18 | ペルメレック電極株式会社 | 不溶性電極構造体 |
JP3207977B2 (ja) * | 1993-07-27 | 2001-09-10 | ティーディーケイ株式会社 | 電気めっき方法および電気めっき用分割型不溶性電極 |
JP3606932B2 (ja) * | 1994-12-30 | 2005-01-05 | 石福金属興業株式会社 | 電解用複合電極 |
JPH0987883A (ja) * | 1995-07-14 | 1997-03-31 | Yoshizawa L Ee Kk | 電解用電極の給電方法および給電構造 |
JPH11302900A (ja) * | 1998-04-17 | 1999-11-02 | Ishifuku Metal Ind Co Ltd | 電解装置及びその組立て方法 |
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- 2003-11-10 JP JP2003380129A patent/JP4532093B2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11510218A (ja) * | 1995-08-07 | 1999-09-07 | エルテック・システムズ・コーポレーション | 電気めっき陽極セル |
WO1998017845A1 (fr) * | 1996-10-24 | 1998-04-30 | Ishifuku Metal Industry Co., Ltd. | Electrolyseur |
JP2001164395A (ja) * | 2000-02-04 | 2001-06-19 | Mifune Tekkosho:Kk | 電解銅箔の製造装置 |
JP2002038291A (ja) * | 2001-09-03 | 2002-02-06 | Daiso Co Ltd | 金属箔製造用陽極 |
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