JP4524659B2 - 表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール - Google Patents

表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール Download PDF

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Publication number
JP4524659B2
JP4524659B2 JP2005278929A JP2005278929A JP4524659B2 JP 4524659 B2 JP4524659 B2 JP 4524659B2 JP 2005278929 A JP2005278929 A JP 2005278929A JP 2005278929 A JP2005278929 A JP 2005278929A JP 4524659 B2 JP4524659 B2 JP 4524659B2
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Prior art keywords
mounting
pad
insulating container
outer bottom
component
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Japanese (ja)
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JP2007096371A5 (enExample
JP2007096371A (ja
Inventor
桂嗣 小野
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Miyazaki Epson Corp
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Epson Toyocom Corp
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JP2005278929A 2005-09-26 2005-09-26 表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール Expired - Fee Related JP4524659B2 (ja)

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JP2005278929A JP4524659B2 (ja) 2005-09-26 2005-09-26 表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール

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JP2005278929A JP4524659B2 (ja) 2005-09-26 2005-09-26 表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール

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JP2007096371A JP2007096371A (ja) 2007-04-12
JP2007096371A5 JP2007096371A5 (enExample) 2008-04-17
JP4524659B2 true JP4524659B2 (ja) 2010-08-18

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JP2005278929A Expired - Fee Related JP4524659B2 (ja) 2005-09-26 2005-09-26 表面実装型圧電モジュール用パッケージ、及び表面実装型圧電モジュール

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4525597B2 (ja) * 2006-01-12 2010-08-18 エプソントヨコム株式会社 表面実装型圧電デバイス、及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03162676A (ja) * 1989-08-28 1991-07-12 Mitsubishi Electric Corp 液体封止半導体装置
JP2002329839A (ja) * 2001-02-27 2002-11-15 Toyo Commun Equip Co Ltd 表面実装用電子部品、その製造方法、及びシート状母材
JP2003046251A (ja) * 2001-07-27 2003-02-14 Kyocera Corp 電子部品
JP4091868B2 (ja) * 2003-03-27 2008-05-28 京セラ株式会社 表面実装型温度補償水晶発振器
JP2004357019A (ja) * 2003-05-29 2004-12-16 Seiko Epson Corp 圧電発振器

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