JP4524378B2 - リフロー装置 - Google Patents
リフロー装置 Download PDFInfo
- Publication number
- JP4524378B2 JP4524378B2 JP2004108026A JP2004108026A JP4524378B2 JP 4524378 B2 JP4524378 B2 JP 4524378B2 JP 2004108026 A JP2004108026 A JP 2004108026A JP 2004108026 A JP2004108026 A JP 2004108026A JP 4524378 B2 JP4524378 B2 JP 4524378B2
- Authority
- JP
- Japan
- Prior art keywords
- heat capacity
- reflow
- heating chamber
- furnace body
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 claims description 67
- 238000009835 boiling Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 11
- 239000007789 gas Substances 0.000 description 25
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 17
- 238000001816 cooling Methods 0.000 description 10
- 229910001873 dinitrogen Inorganic materials 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 150000002829 nitrogen Chemical class 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
10 炉体
11〜17 加熱室
15 プリヒート用の加熱室
16 リフロー用の加熱室
26 熱容量増加媒体供給手段
Claims (2)
- ワークをリフロー加熱する炉体と、
炉体の内部に炉体内雰囲気ガスの熱容量を増加させる熱容量増加媒体を供給する熱容量増加媒体供給手段とを具備し、
炉体は、
ワークを予加熱するプリヒート用の加熱室と、
ワークをリフロー加熱するリフロー用の加熱室と、
ワークがプリヒート用の加熱室からリフロー用の加熱室に移動するタイミングを検知するセンサとを備え、
熱容量増加媒体供給手段は、
ワークがプリヒート用の加熱室からリフロー用の加熱室に移動するタイミングでリフロー用の加熱室のみへ熱容量増加媒体を供給する機能を備えた
ことを特徴とするリフロー装置。 - 熱容量増加媒体は、炉体内の設定温度より低い沸点を有する液体である
ことを特徴とする請求項1記載のリフロー装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004108026A JP4524378B2 (ja) | 2004-03-31 | 2004-03-31 | リフロー装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004108026A JP4524378B2 (ja) | 2004-03-31 | 2004-03-31 | リフロー装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005294561A JP2005294561A (ja) | 2005-10-20 |
JP4524378B2 true JP4524378B2 (ja) | 2010-08-18 |
Family
ID=35327149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004108026A Expired - Fee Related JP4524378B2 (ja) | 2004-03-31 | 2004-03-31 | リフロー装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4524378B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4685992B2 (ja) * | 2007-01-23 | 2011-05-18 | 株式会社タムラ製作所 | はんだ付け装置及びはんだ付け方法並びにはんだ付け用プログラム |
JPWO2012070264A1 (ja) * | 2010-11-23 | 2014-05-19 | 三菱電機株式会社 | リフローはんだ付け装置およびリフローはんだ付け方法 |
JP2015002325A (ja) * | 2013-06-18 | 2015-01-05 | 株式会社Ssテクノ | 水蒸気リフロー装置及び水蒸気リフロー方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003152327A (ja) * | 2001-11-19 | 2003-05-23 | Fuji Electric Co Ltd | ハンダ付け方法および装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3182209B2 (ja) * | 1992-06-05 | 2001-07-03 | 株式会社タムラ製作所 | はんだ付け用チャンバの雰囲気形成方法 |
-
2004
- 2004-03-31 JP JP2004108026A patent/JP4524378B2/ja not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003152327A (ja) * | 2001-11-19 | 2003-05-23 | Fuji Electric Co Ltd | ハンダ付け方法および装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2005294561A (ja) | 2005-10-20 |
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