JP4518661B2 - Manufacturing method of image display device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention provides, for example, images of plasma displays, field emission displays, etc.The present invention relates to a method for manufacturing a display device.
[0002]
[Prior art]
In recent years, flat image display devices such as plasma display panels (PDP), plasma address liquid crystal panels (PALC), and field emission displays (hereinafter referred to as FED) have been developed. Has been.
[0003]
Such an image display device irradiates a phosphor with plasma or an electron beam between a front plate and a back plate having phosphors and discharge electrodes formed on the surface, thereby causing the phosphor to emit light. Since the inside of the panel needs to be in a vacuum state or a reduced pressure state, the peripheral portion between the front plate and the back plate is sealed with a frame to constitute the panel. It is known to form a plurality of protrusion members (spacers) for maintaining a predetermined distance between the front plate and the back plate in order to prevent the panel from being bent by this and causing distortion in the image.
[0004]
As a method of forming the protruding member (spacer) on the substrate surface of the front plate or the back plate, a paste layer for the protruding member is formed on the substrate surface and cured, and then unnecessary portions are removed by sandblasting or the like. , A method of repeating a printing method such as a screen printing method on the surface of the substrate, a method of pressing (pressing) a flat plate-shaped or roll-shaped mold in which a protruding member-shaped concave portion is formed in a soft paste layer capable of plastic deformation , A method in which a paste is filled in a concave portion of a mold having a convex member-shaped concave portion, the paste is cured and then transferred to the surface of the substrate, a method of performing an etching process using a mask pattern from the surface of the cured paste layer, etc. Thus, there is known a method of firing a projection member molded body on the surface of a front plate or a back plate and then firing it.
[0005]
[Problems to be solved by the invention]
However, in the conventional method of directly forming a spacer on the surface of the front plate or the back plate, there is a risk of damaging the phosphor or the electrode existing on the surface of the front plate or the back plate forming the spacer, and the electrode is easily damaged. In addition, the spacer cannot be formed on the back plate having phosphors and elements or on the front plate on which the phosphor is formed.
[0006]
In addition, there is a method of sticking spacers cut out from glass plates etc. one by one on the front plate or back plate surface, but care must be taken not to damage the phosphors or electrodes present on the front plate and back plate surfaces. For this reason, the productivity is low, and not only spacers with fine shapes and fine intervals cannot be formed, but errors in the spacer bonding angle are likely to occur, and display unevenness may occur on the panel.
[0007]
Further, the above-described spacer forming method has a problem that if a problem occurs during the formation of the spacer, the expensive front plate or the back plate must be discarded, and the cost is increased.
[0008]
  The present invention has been made to solve the above-mentioned problems, and its purpose is to easily and inexpensively reduce the size of the front plate or the front plate without damaging phosphors or electrodes existing on the front plate or the back plate surface. Protruding members (spacers) can be formed on the back plate surfacePaintingAn object of the present invention is to provide a method for manufacturing an image forming apparatus.
[0009]
[Means for Solving the Problems]
  The present invention relates to a method of manufacturing an image display device in which a plurality of protruding members are disposed between both a front plate and a back plate that are spaced apart and arranged in parallel at a predetermined interval. A plurality of projecting members having the same height fixed to one surface of the support substrate via an adhesive whose adhesive strength is reduced by light, and a top portion of the projecting member. And a thermosetting fixing agent, and a support substrate with a protruding member is prepared, and the fixing agent attached to the supporting substrate with the protruding member is applied to the surface of the front plate or the back plate. After attaching the support substrate with the protruding member in contact, the adhesive is irradiated with light through the support substrate to reduce the adhesive force of the adhesive, and the support substrate is removed from the protruding member. An image display device manufacturing method is provided.
[0010]
In addition, it is preferable that adjacent projecting members are connected by a connecting portion formed on the surface of the support substrate and made of the same component as the projecting member.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
The first embodiment of the support substrate with protruding members of the present invention will be described with reference to FIG. 1 which is a schematic perspective view thereof.
According to FIG. 1, the supporting substrate 1 with the protruding member has an adhesive layer 3 deposited on the surface of the supporting substrate 2, and a plurality of protruding members 4 are formed on the surface of the adhesive layer 3.
[0017]
The support substrate 2 is preferably made of any one of glass, ceramics, plastic, and metal. Among these, as glass, at least 1 sort (s) chosen from the group of quartz glass, soda-lime glass, low soda glass, lead alkali silicate glass, and borosilicate glass can be used. As the plastic, an organic resin such as an acrylic resin, an epoxy resin, a phenol resin, a cellulose resin, polyethylene, polypropylene, or polystyrene can be used, and among these, it is desirable that the plastic is made of an acrylic resin that can be easily removed by baking. In addition, an inorganic filler may be added to the support substrate in order to improve characteristics such as strength improvement. As the metal, Al, Fe, Cu, etc. can be used. Among them, Al or an Al alloy is desirable because it is light and inexpensive. As ceramics, alumina, zirconia, silicon nitride, aluminum nitride, silicon carbide, mullite, cordierite, glass ceramics, etc. can be used, and among them, alumina, mullite, cordier in terms of mechanical reliability and thermal expansion coefficient. It is desirable that at least one selected from the group of lights is a main component, and alumina is most suitable because it is lightweight and inexpensive.
[0018]
As the support substrate, ceramics or plastics are desirable in terms of weight reduction and mechanical reliability, and ceramics having a small thermal expansion accompanying a temperature change is most desirable.
[0019]
Further, in order for the supporting substrate 2 to support the protruding member 4 independently and to increase the formation accuracy of the protruding member 4, it is desirable that the Young's modulus of the supporting substrate 2 is 50 GPa or more, particularly 100 GPa or more. When the rate is low, the Young's modulus of the support substrate 2 is used to increase the formation accuracy of the projection member 4 when the projection member 4 is formed on the surface of the support substrate 2 and when the projection member 4 is brought into contact with the front plate or the back plate. It is desirable to carry out in a state where it is supported by another supporting substrate having a high height.
[0020]
On the other hand, the adhesive layer 3 is made of a material whose adhesive strength is reduced by heat or light, and specifically, thermoplastics such as acrylic resin, butyral resin, polyvinyl alcohol, cellulose resin, epoxy resin, polyolefin resin, silicone resin, and the like. A resin, a resin that has a heat-resistant temperature of 400 ° C. or lower and carbonized and disappears at a higher temperature, a photocurable resin adhesive made of a mixture of a polymer and a photocationic polymerization initiator, and the like can be suitably used. Further, according to FIG. 1, the adhesive layer 3 is formed so as to cover the surface of the support substrate 2, but according to the present invention, the adhesive layer 3 is not limited to this, and the adhesive layer 3 is at least the protruding member 4. As long as it is adhesively fixed to the support substrate 2.
[0021]
According to the present invention, the plurality of projecting members 4 are bonded to the back plate or the front plate with high accuracy by peeling and removing the support substrate 2 from the plurality of projecting members 4 using the adhesive that reduces the adhesive force. Can be formed.
[0022]
On the other hand, the protruding member 4 is formed of ceramics, glass, metal or a composite member thereof, and is made of glass or glass ceramics particularly in terms of insulation and consistency of sintering temperature with the front plate and the back plate. Is desirable. Quartz glass, soda lime glass, low soda glass, lead alkali silicate glass, borosilicate glass, bismuth glass, etc. can be used, if desired, to increase the porcelain strength, to control the coefficient of thermal expansion, to color, dielectric TiO in the glass for rate control and conductivity control₂, ZrO₂ZnO, SnO₂, Si_ThreeN_Four, AlN, Fe₂O_Three, NiO, CuO, MnO₂, SiO₂, BN, Al₂O_ThreeCeramic fillers, inorganic fillers such as glass powders having a glass transition point higher than that of the glass (for example, aluminum silicate glass (glass transition point 650 ° C. or higher)), and Si, Zn, Al, Sn, Cu, Mg, Ag A material in which metal powder such as Au and Pt is dispersed is preferably used. Of the above metals, Si, Zn, Al, Sn, Cu, and Mg are included in the molded body for the projecting member, so that the projecting member 4 is expanded in volume by firing in an oxidizing atmosphere. It prevents shrinkage due to firing and peeling or the like from the support substrate, the front plate or the back plate.
[0023]
According to the present invention, the protruding member 4 may be a sintered body obtained by sintering the glass, or may be a molded body in which the glass exists in an unsintered powder state. When the protruding member 4 is a molded body, it is desirable to sinter the protruding member 4 after bonding the protruding member 4 to the surface of the front plate or the back plate from the viewpoint of mechanical reliability. Considering the heat-resistant temperature of the face plate, the firing temperature of the protrusion 4 molded body is preferably 600 ° C. or less, particularly 550 ° C. or less, and more preferably 500 ° C. or less.
[0024]
In addition, the protruding member 4 may have any of a rib shape (long wall shape), a strip shape, a lattice shape, or a column shape, but particularly accurately maintains a distance between a front plate and a back plate, which will be described later. The rib shape is desirable because it can be easily reduced in vacuum in the display. Further, when the protrusion member 4 is formed in a rib shape, for example, it is formed with a thickness of 200 μm or less, particularly 50 to 200 μm, a pitch of 10 mm or less, particularly 1000 μm or less, further 50 to 750 μm, or even 100 to 300 μm. In addition, the height of the protruding member 4 is 100 μm or more, particularly 150 μm or more, and further 500 μm or more.
[0025]
Further, according to FIG. 1, a sticking agent 5 is formed on the top of each protruding member 4. As the fixing agent 5, for example, it is desirable to include a low melting point glass having a glass strain point of 450 ° C. or less, and the front plate or the back plate and the protruding member 4 are bonded by the fixing agent 5.
[0026]
Further, as shown in FIG. 2, the adjacent projecting members 4, 4 are composed of the same components as the projecting member 4, and are integrally formed with the projecting members 4, 4 and are formed on the surface of the support substrate 2. Even if the protruding member 4 is baked by the connecting portion 6, the dimensional accuracy can be increased. The thickness of the connecting portion 6 is preferably 50 μm or less, particularly 1 to 30 μm, and more preferably 5 to 20 μm in order to increase the formation accuracy of the protruding member and easily remove it.
[0027]
Further, the shape may be formed in a stripe shape as shown in FIG. 2A, but it is desirable to form the entire surface as shown in FIG. Further, for example, if the PDP is formed as shown in FIG. 2A so that the connecting portion 6 is on the back plate surface side, the ratio of phosphors deposited on the back plate and spacer surfaces The surface area can be increased and the emission luminance of the phosphor can be improved. The connecting portion 6 can be easily removed by grinding or the like as desired.
[0028]
(Manufacturing method of support substrate)
In order to produce the above-mentioned supporting substrate with a protruding member, first, an adhesive layer is deposited on one surface of a supporting substrate having a predetermined shape by applying or pasting it by a printing method or a spin coater method. (A) A paste layer for a protruding member is deposited on the surface of the adhesive layer and cured, and then an unnecessary portion is removed by a sand blast method or the like. (B) A screen printing method or the like is printed on the substrate surface. A method of producing a molded body for a protruding member by repeating the method, etc., (c) a flat plate-shaped or roll-shaped highly rigid mold in which a protruding member-shaped recess is formed in a soft paste layer capable of plastic deformation A method of producing a molded body for a protruding member by pressing (embossing), (d) filling the paste into a concave portion of a molding die having a concave portion in the shape of a protruding member, and curing the paste if desired, on the surface of the substrate A method of transferring, (e) a method of producing a projection member molded body by performing an etching process using a mask pattern from the surface of the cured paste layer, and (f) a soft resin that can be plastically deformed on the surface of the adhesive layer. And press a flat or roll-shaped high-molding mold with protrusions in the shape of protruding members into the recesses formed in the resin layer to fill the protrusions with the paste for protruding members. After being cured, a projecting member in the form of a predetermined shape can be produced by a method such as removing the resin layer.
[0029]
In addition to the above method, (g) a protruding member processed into a predetermined shape can be bonded to the surface of the support substrate. In this case, the protruding member is formed on the protruding member forming portion in order to form the protruding member with high accuracy. A concave portion may be formed on the surface of the supporting substrate positioned, or it is desirable that the protruding member is bonded together in a state where a guide plate having a predetermined thickness in which the protruding member forming portion is perforated (opened) is placed. Further, when the protruding member 4 is bonded to the front plate or the back plate surface in the form of a molded body, the front plate or the back plate is heated after bonding the protruding member 4 to improve the mechanical reliability. It is desirable to sinter the molded body.
[0030]
Among the above methods, the method (c) is capable of accurately forming fine protrusion members for PDP and PALC, and (d), (f), and (g) are highly accurate in forming high protrusion members for FED. It is desirable to use it. If desired, it is desirable to adhere and form a fixing agent on the top of the protruding member formed on the surface of the support substrate by a printing method or the like. The fixing agent is preferably an organic resin made of a thermosetting resin or the like and a low-melting glass or a solvent added, and if desired, a paste containing a small amount of an additive such as a dispersant, a leveling agent, or an antifoaming agent. Things are desirable. This is deposited on the top (tip) of the protruding member by screen printing, dipping, or the like.
[0031]
Further, it is desirable that the adjacent projection members are made of the same material as the projection members in terms of improving strength and increasing the dimensional accuracy of the projection members, and in particular, connecting portions of about 5 to 200 μm are desirably formed. The connecting portion can be easily removed later by grinding or the like. As shown in FIG. 4, the shape of the connecting portion is as follows: (a) a method of forming a line between the protruding members so as to be orthogonal to the longitudinal direction of the protruding member; and (b) a support substrate or an adhesive layer and the protruding member. And a method of forming a layer (entire surface) between the two.
[0032]
Further, the projecting member formed by firing can be bonded to another support substrate after firing. In this case, the adhesion surface of the projecting member with another support substrate may be the adhesion surface with the previous support substrate, or the opposite surface. The adhesive layer may be applied to the tip surface of the projecting member, but in terms of ease of manufacture, a doctor blade method, a spray method, a spin coat method, a low coater method, etc. are used on another support substrate. It is desirable to form.
[0033]
  (Method of bonding the protruding member to the back plate or the front plate) Further, using the supporting substrate with the protruding member, an imagedisplayA method of forming a protruding member (spacer) on the surface of the front plate or the back plate of the apparatus will be described. First, a front plate and a back plate on which phosphors, electrodes, electron-emitting devices, etc. are formed at predetermined positions on the surface are prepared, and the protruding members of the support substrate with the protruding members are formed at predetermined positions on the front plate or the back plate surface. Abut the top. And the adhesive force of an adhesive bond layer is reduced by heating an adhesive bond layer between a support substrate and a projection member, or irradiating light, such as an ultraviolet-ray, and a support substrate is removed.
[0034]
Next, the protrusion member and the front plate or the back plate are bonded to each other by heating to, for example, 600 ° C. or less, particularly 420 to 500 ° C. to solidify the fixing agent. In addition, when a protrusion member is a molded object by this heating, it is also possible to sinter a protrusion member. As a result, the protruding member can be formed on the surface of the front plate or the back plate.
[0035]
(Second Embodiment)
Further, in FIG. 1, the support substrate 2 and the protruding member 4 are bonded with the adhesive layer 3, but the present invention is not limited to this, and the support substrate 2 and the protruding member 4 are bonded to each other. It may be directly bonded. At this time, it is desirable that the support substrate and the protruding member are joined and integrated by sintering or the like.
[0036]
FIG. 3 is a schematic perspective view of a support substrate with protrusions in which the support substrate 2 and the protrusion member 4 are directly bonded.
3, the support substrate 8 is formed of a free-cutting material having a strength of 100 MPa or less, particularly 60 MPa or less, which can be easily removed by processing or heating. The material constituting the support substrate 8 is made of, for example, a resin such as acrylic resin or Teflon, or a porous ceramic having a porosity of 10 to 70%, particularly 40 to 70%. Further, as the porous ceramic, in order to increase the formation accuracy of the protruding member 4, a high strength, low thermal expansion material such as alumina, mullite, cordierite, or the like can be used. Furthermore, the support substrate 8 may be formed of the same material as the protruding member 4 in terms of ease of manufacture. Further, in order to improve the adhesion between the support substrate 7 (porous ceramic) and the protruding member 4 and improve the formation accuracy of the protruding member, a glass layer is formed between the support substrate (porous ceramic) 7 and the protruding member 4. Can also be formed.
[0037]
On the other hand, the protruding member 4 is formed of the same material as described above. However, according to FIG. 3, the protruding member 4 has a certain degree of strength because it is necessary to remove the support substrate by processing as described later. From this viewpoint, the protruding member 4 may be a molded body, but is preferably a sintered body.
[0038]
(Producing method of protruding member)
In order to produce the support substrate 7 with the projection member, the projection member 4 (molded product) is produced on the surface of the support substrate 8 having a predetermined shape by the method described above, and the molded body is heated together with the support substrate if desired. To sinter the protruding member. Furthermore, if desired, it is desirable to form a sticking agent on the top of the protruding member in the same manner as described above.
[0039]
(Method of sticking protruding member to back plate or front plate)
Further, in order to form the protruding member on the front plate or the back plate surface using the supporting substrate 7 with the protruding member, the supporting substrate with the protruding member is provided at a predetermined position of the front plate or the back plate on which the phosphor or the electrode is formed. 7, the top plate of the projection member 4 is brought into contact with the front plate or the back plate and the projection member 4, and the support substrate is removed by grinding or chemical treatment.
[0040]
  (Structure of FED) Next, the image of the present inventiondisplayAn FED (Field Emission Display) which is a preferred application example of the apparatus will be described with reference to FIG. 4 which is a schematic sectional view thereof. In FIG. 4, the FED 11 is provided with a protruding member (spacer) 14 at a predetermined position between two substrates of a back plate 12 and a front plate 13 which are formed in parallel with a predetermined interval.
[0041]
The substrates of the back plate 12 and the front plate 13 are glass substrates such as quartz glass, soda lime glass, low soda glass, lead alkali silicate glass and borosilicate glass, single crystal substrates such as sapphire, quartz, single crystal zirconia and diamond. Polycrystalline ceramic substrates such as alumina, silica, etc., glass ceramic substrates in which the ceramic is contained and dispersed in the glass, Si substrates, etc. can be used, especially high strain point low soda glass with little sodium and lead components In particular, the front plate 13 is made of a transparent material.
[0042]
On the other hand, a plurality of electron-emitting devices 16 are formed on the surface of the back plate 12. The specific structure of the electron-emitting device 16 is, for example, formed such that a plurality of line-shaped positive electrodes and negative electrodes arranged in parallel with a predetermined distance therebetween intersect, and the intersection of the positive electrode and the negative electrode MIM structure with an insulator interposed between them, a surface conduction type in which a positive electrode and a negative electrode are spaced in parallel by a predetermined distance with an insulating layer interposed, and an insulator between a positive electrode and a negative electrode A field emission type or the like in which a part of the electrode and the insulator is cut out at a predetermined position and a cone-shaped protrusion having an acute angle at the notch is provided.
[0043]
The positive electrode and negative electrode conductor layers forming the electron-emitting device 16 are made of silver (Ag), aluminum (Al), nickel (Ni), platinum (Pt), gold (Au), palladium (Pd), or the like. A metal or an alloy containing each of them as a main component, amorphous silicon, polysilicon, graphite, or the like can be used. Further, at the intersection of the positive electrode conductor layer and the negative electrode conductor layer, an insulator made of at least one selected from oxides and nitrides of Si, Ti, Ga, W, Al, Pd and the like is interposed. The
[0044]
If desired, a diffusion prevention layer 18 made of a ceramic thin film such as silica or silicon nitride is preferably interposed between the back plate 12 and the electron emission element 16 in order to prevent impurities from diffusing into the electron emission element 16. .
[0045]
On the other hand, a phosphor 17 is formed on the surface forming the inner surface of the front plate. The phosphors 17 are arranged in a matrix in the row direction and the column direction, with three of the phosphors 17 that develop colors of three colors of R (red), G (green), and B (blue) as one pixel. Do it.
[0046]
Further, a black matrix 19 is arranged at a specific position on the surface of the front plate 13 other than the phosphor 17 forming portion in order to prevent color bleeding in the FED 11 and increase the contrast of the display screen to obtain a sharp image. Is desirable. The black matrix 19 is made of a black or dark material, and for example, a mixture of an oxide powder such as Fe, Ni, Cu, or Mn and low-melting glass, metallic chromium, graphite, or the like can be used.
[0047]
Further, according to FIG. 4, transparent ITO (indium-tin oxide oxide) is interposed between the front plate 13 and the phosphor 17 in order to accelerate electrons emitted from the electron-emitting device 16 toward the phosphor 17. The material) film 20 is formed, but the present invention is not limited to this, and in order to accelerate the electron beam and to reflect the scattered light emitted from the phosphor 17 to increase the light emission brightness, ITO Instead of the film 20, a metal back (not shown) made of a metal foil such as aluminum (Al), silver (Ag), nickel (Ni), platinum (Pt) of 50 to 300 nm is provided on the surface of the phosphor 17 of the front plate 13. May be formed.
[0048]
Further, as shown in FIG. 4, a frame body 21 is disposed between the peripheral portions of the front plate 13 and the back plate 12, and the front plate 13, the back plate 12 and the frame body 21 are bonded to seal the inside. Forming a panel.
[0049]
Although the structure of the FED has been described with reference to FIG. 4, the present invention is not limited to this, and can be applied to other image display devices such as PDP and PALC, printers, and the like.
[0050]
  (FED Manufacturing Method) Next, the image of the present inventiondisplayAn apparatus manufacturing method will be described based on an FED manufacturing method as an example. First, the front plate 13 made of the above-described material is manufactured and cut into a predetermined shape, and then a lattice-like black matrix 19 is formed by a photolithography method, a printing method, or the like, and a predetermined region in a region surrounded by the black matrix 19 is formed. In this position, the phosphor 17 is formed by a known method such as a photolithography method, a printing method, an ink jet method or the like. It should be noted that the phosphor 17 is desirably not formed on the spacer 14 forming portion of the front plate 13 using a mask or the like in terms of improving the bonding strength of the spacer 14 to the front plate 13.
[0051]
Further, in order to release charges accumulated in the phosphor 17, an ITO film 20 is formed between the front plate 13 and the phosphor 17 by a paste coating method, a vapor deposition method, or the like, or aluminum (Al), silver (Ag) ), Nickel (Ni), platinum (Pt), etc., and a metal back (not shown) made of a foil having a thickness of about 50 to 200 nm is preferably formed on the surface of the phosphor 17 by vapor deposition or the like. Further, it is desirable to form a protective layer (not shown) made of a resin on the surface of the phosphor 17 in order to prevent the phosphor 17 from being damaged and to form the metal back with a thin and uniform thickness.
[0052]
This protective layer can be formed by a photolithographic method, a printing method, an ink jet method, or the like, which can be lost by a heat treatment, which will be described later, in addition to a binder, a solvent, which will be described later, and a resin paste to which an antifoaming material or a leveling material is added desirable.
[0053]
On the other hand, the conductor layer made of the above-described material is formed on the surface of the back plate 12 made of the above-mentioned material so that the positive electrode conductor layer and the negative electrode conductor layer intersect at a predetermined position by a photolithography method or the like. At the intersection, the electron-emitting device 16 is formed by interposing an insulator made of the above-described material by sputtering, vapor deposition, ion beam sputtering, CVD, MBE, or the like.
[0054]
Next, the spacer (projection member) 14 is formed on the surface of either the front plate 13 or the back plate 12 by the method described above.
[0055]
  Then, the frame body 21 is arranged at the peripheral edge between the back plate 12 and the front plate 13, and a part for fixing the projection of the front plate and the frame body 21 by an adhesive such as frit glass by a printing method, and / or a spacer and The frame body is applied by applying heat treatment at 400 to 500 ° C. by applying the protrusion and the tip surface of the frame body 21, aligning the tip surface of the protrusion formed on the surface of the back plate 12 with a predetermined position of the front plate 13. After the 21 and the protrusion are bonded together, a vacuum pump is disposed at one end of the panel to move the inside of the panel to 10^-3FED (image) is achieved by sealing with a vacuum reduced to about Pa.displayDevice) 11 can be manufactured.
[0056]
【Example】
Example 1
PbO—SiO with an average particle size of 0.5 μm₂-ZnO-B₂O_ThreeFor glass powder, ZnO powder, TiO₂Powder, Si powder, Cu powder, acrylic UV curable resin, solvent and dispersant were added and kneaded to prepare a paste. Moreover, after preparing a mold made of urethane rubber having a groove for forming a protrusion member molded body, filling the protrusion for forming the protrusion member in the groove and defoaming, 100 mm × 80 mm × 1 mm, A glass substrate coated with a polyolefin resin on the surface was pressed against the groove as a support substrate, the paste was cured by irradiating ultraviolet rays through the glass substrate, and the projection member molded body was transferred to the surface by releasing the mold. A support substrate was obtained. The grooves of the mold were formed in a vertical shape, a rib shape having a depth of 190 μm and a width of 100 μm, and the pitch was 360 μm.
[0057]
On the other hand, a silver paste was applied onto a 250 mm × 200 mm × 2 mm soda lime glass substrate by screen printing and baked to form an electrode. An insulating layer made of low-melting glass was applied thereon using a slit coater method, and baked at 590 ° C. to obtain a back plate. In addition, a bus electrode made of aluminum and a transparent electrode made of ITO film are formed on a 250 mm × 200 mm × 2 mm soda lime glass substrate by a photolithography method, and a dielectric layer made of low-melting glass having high transparency is laminated by a lamination method. A protective layer made of MgO was sequentially formed by a sputtering method to obtain a front plate.
[0058]
Next, after placing a paste composed of a low-melting glass and a thermosetting acrylic resin on the upper end surface of the protruding member molded body using a printing method, on the back plate between the protruding member molded bodies The alignment was performed so that the formed electrodes were arranged, and the four support substrates with protruding members were placed at predetermined positions on the back plate. Furthermore, after heating this at 130 degreeC and fixing a protrusion member molded object and a backplate, after irradiating an ultraviolet-ray to the said adhesive agent and removing a supporting member, it heats to 550 degreeC, and a protrusion member and a backplate are attached. Integrated. When the formation state of the protruding member was confirmed visually and with a microscope, it was satisfactorily formed without cracking or peeling.
[0059]
On the other hand, a phosphor is applied to the surface of the front plate that forms the inner surface of the discharge display cell via a mask pattern, and after the phosphor is baked at 550 ° C., the spacer and frame of the back plate and the front plate are sealed. The inside of the panel was sealed with an agent, and a discharge gas mainly composed of Ne—Xe was hermetically sealed at 400 to 550 hPa in the panel to produce a PDP.
[0060]
Using the PDP, a voltage of 250 V was applied between the discharge electrodes on the front plate to cause the discharge display cell to emit light. Furthermore, when a voltage pulse having image information was applied to the address electrode on the back plate and the discharge electrode on the front plate, a good image could be displayed.
[0061]
(Example 2)
PbO—SiO with an average particle size of 1.0 μm₂-B₂O_ThreeA paste was prepared by adding and kneading Zn metal powder, Al metal powder, SnO powder, ZnO powder, acrylic resin, solvent, dispersant, and plasticizer to the glass powder.
[0062]
On the other hand, a roll-shaped mold made of a metal having a groove for forming a protruding member molded body was prepared, and an applied 250 mm × 200 mm × 0.5 mm acrylic substrate coated with the protruding member forming paste was applied. The support substrate on which the protruding member molded body was formed was prepared by rotating the mold while pressing the paste layer with the mold. The grooves were arranged in a stripe shape having a vertical shape with a depth of 300 μm and a width of 100 μm and a pitch of 840 μm. A connecting portion having a thickness of 20 μm was formed between the protruding members. Further, an adhesive composed of a low melting point glass and a polyolefin resin was deposited on the upper end surface of the protruding member molded body by using a printing method.
[0063]
On the other hand, on the same soda lime glass substrate as in Example 1, a nickel paste is applied by screen printing and baked to form a discharge electrode to form a back plate, and on the other hand, two electrodes enter between the protruding members. The support substrate with the protruding member and the back plate were bonded together, heated to 100 ° C. and bonded, then heated to 560 ° C., the protruding member and the back plate were integrated, and the support substrate was incinerated. Further, the connecting portion formed on the top of the protruding member was removed and the top unevenness was set to 5 μm or less.
[0064]
A dielectric substrate made of 250 mm × 200 mm glass having a thickness of 50 μm was bonded to the top of the spacer of the obtained substrate (back plate) with a protruding member (spacer). Moreover, the peripheral part of the back plate and the front plate was sealed with a frit sealant made of low-melting glass to form a panel. And the discharge gas which has Ne-Xe as a main component was airtightly sealed in this panel, and the front board which has an electrode substantially orthogonal to the electrode of a backplate on the dielectric substrate through the liquid crystal layer was bonded together. In addition, it was confirmed that the dielectric substrate was not cracked or cracked in the panel sealing and gas sealing process.
[0065]
The liquid crystal could be driven by applying a discharge voltage of 350 V and a data voltage to the obtained PALC panel.
[0066]
(Example 3)
SiO with an average particle size of 0.8 μm₂-B₂O_ThreeA paste was prepared by adding and kneading Si metal, SnO powder, epoxy resin, solvent, and dispersant to the ZnO glass powder. In addition, a mold made of silicone rubber having a protruding member molded body and a groove for forming a connecting portion is prepared, and after filling the protruding portion forming paste into the groove and defoaming, 120 mm × A 100 mm × 0.5 mm acrylic substrate was pressed against the groove and heated to 130 ° C. to obtain an acrylic substrate having a projection member molded body formed on the surface. The grooves of the projecting members were arranged in a stripe shape having a vertical shape with a depth of 1500 μm and a width of 150 μm and a pitch of 6000 μm. The groove of the connecting portion was provided in a direction substantially perpendicular to the stripe, and had a depth of 50 μm, a width of 300 μm, and a pitch of 600 μm, and a connecting portion having a thickness of 50 μm was formed between the protruding members.
[0067]
Next, the acrylic substrate was eliminated at 500 ° C. to obtain a member composed of a protruding member and a connecting portion. In addition, in order to obtain the strength that can withstand the subsequent process, a butyral resin was applied to the surface opposite to the protruding member forming surface of the connecting portion of this member to adhere the aluminum substrate.
[0068]
On the other hand, an electrode and an insulating layer were formed on the same glass substrate as in Example 1 to form a field emission device, which was used as a back plate. Further, a black matrix and a phosphor were sequentially formed on the surface of a glass substrate having the same shape. Furthermore, after forming the filming layer which consists of acrylic resins, aluminum was vapor-deposited by thickness 100nm using the vapor deposition method. This was heat-treated at 400 ° C. to obtain a front plate.
[0069]
Next, after placing a paste made of low melting point glass and epoxy resin on the upper end surface of the support substrate with projection members using a printing method, the front plate is aligned so that the projections are in contact with the black matrix. Four supporting substrates with projecting members were placed thereon. Further, this was heated to 120 ° C., the mold was released after fixing the projection member molded body and the front plate, and further heated to 420 ° C. to integrate the projection member and the front plate, and the support substrate was separated from the projection member. . Further, after arranging the frame body around the protrusion, the back plate and the front plate are sealed, and the inside of the panel is 10%.^-3After exhausting to a vacuum of Pa or less, sealing was performed to obtain an FED panel.
[0070]
By applying a voltage of 50 V to the electron-emitting device and a voltage of 7 kV between the front plate and the back plate, it was confirmed that electrons were emitted, the phosphor emitted light, and an image could be displayed satisfactorily.
[0071]
Example 4
Na with an average particle size of 1.0 μm₂OB₂O_Three-SiO₂A paste was prepared by adding and kneading Mg metal, Si metal, butyral resin, solvent, and dispersant to the glass powder.
[0072]
On the other hand, a roll-shaped molding die made of a metal having a groove part for forming a protruding member molded body is prepared, and the above-mentioned protruding member forming paste is filled in the groove part and dried, followed by silicone-based adhesion to the surface. Supporting a projecting member molded body formed on the surface by pressing a 250 mm × 200 mm × 0.5 mm porous substrate having an adhesive layer made of an agent and low melting point glass as a supporting substrate against the groove and rotating the mold A substrate was obtained. The grooves were arranged in a stripe shape having a vertical shape with a depth of 1200 μm and a width of 120 μm and a pitch of 2000 μm. The porous substrate was an alumina substrate having a porosity of 40% and a three-point bending strength of 50 MPa based on JIS R1601. And this support substrate with a protrusion member was baked at 650 degreeC, and the support substrate with a protrusion member which consists of glass ceramics was obtained. Further, a paste made of a mixture of low-melting glass and epoxy resin was deposited on the top of the protruding member using a printing method.
[0073]
On the other hand, a back plate and a front plate are formed in the same manner as in Example 3, and are aligned so that the projection member is placed at the black matrix formation position of the front plate, and the support substrate with the projection member is placed on the front plate surface Placed. And this was heated to 130 degreeC, and after fixing the protrusion member molded object and the backplate, it heated to 420 degreeC and integrated the protrusion member and the backplate. Thereafter, the support substrate was removed by grinding.
[0074]
Then, a frame was placed on the peripheral portion of the front plate and the back plate and bonded and sealed, and the back plate and the top of the spacer of the front plate were bonded to form a panel. Furthermore, the inside of the panel is 10^-3After exhausting to a vacuum of Pa or less, sealing was performed to obtain an FED panel.
[0075]
By applying a voltage of 50 V to the electron-emitting device and 3 kV between the front plate and the back plate to the obtained FED panel, electrons are emitted, the phosphor emits light, and a good image is displayed. confirmed.
[0076]
(Comparative example)
A support substrate with a projection member was prepared in the same manner as in Example 4 except that the support substrate was replaced with alumina ceramics having a porosity of 3% or less and a strength of 250 MPa with respect to the support substrate with a projection member of Example 4. When the support member was ground after the top portion of the projecting member was bonded to a predetermined position of the front plate in the same manner as in No. 4, the spacers were chipped or cracked when the support member was ground.
[0077]
【The invention's effect】
As described above in detail, according to the present invention, a projection member can be easily and cost-effectively provided on the surface of the front plate or the back plate without damaging phosphors or electrodes existing on the surface of the front plate or the back plate. A support substrate with a protruding member capable of forming a (spacer) can be manufactured.
[Brief description of the drawings]
FIG. 1 is a schematic oblique view showing a support substrate with a protruding member of the present invention.
FIG. 2 is a schematic perspective view showing the shape of a connecting member of a supporting substrate with a protruding member of the present invention.
FIG. 3 is a schematic perspective view showing another supporting substrate with a protruding member of the present invention.
FIG. 4 is an image showing a preferred application example of the support substrate with a protruding member of the present invention.displayIt is a schematic sectional drawing which shows FED which is an example of an apparatus.
[Explanation of symbols]
1, 7 .. Support member with protruding member
2,8 ... Support substrate
3. Adhesive layer
4 ... Projection member
5... Adhesive
6 ... Connection part
11 ... ImagedisplayEquipment (FED)
12 ... Back plate
13 ... Front plate
14 ... Projection member (spacer)
16 ... Electron emitting device
17 ... phosphor
18 ... Diffusion prevention layer
19 ... Black matrix
20 ... ITO film
21 ... Frame

Claims (2)

  A method of manufacturing an image display device in which a plurality of projecting members are disposed between both a front plate and a back plate that are spaced apart at a predetermined interval and disposed in parallel.
  A translucent support substrate, a plurality of projecting members of the same height fixed to one surface of the support substrate via an adhesive whose adhesive strength is reduced by light, and a top of the projecting member A thermosetting fixing agent formed on the substrate, and preparing a support substrate with a protruding member,
  After adhering the fixing agent attached to the supporting substrate with the protruding member to the surface of the front plate or the back plate and attaching the supporting substrate with the protruding member, the adhesive is passed through the supporting substrate. A method of manufacturing an image display device, wherein the support substrate is removed from the projecting member by irradiating light on the adhesive member to reduce the adhesive force of the adhesive. 2. The method of manufacturing an image display device according to claim 1, wherein the adjacent projecting members are connected to each other by a connecting portion formed on the surface of the support substrate and made of the same component as the projecting member.

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