JP2002110072A - Substrate with projection member, method of manufacturing the same, and image forming device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide such a substrate having projection members that the fine projection members with high dimensional precision can be easily formed on the substrate surface, where a conductor layer is formed, without damaging the conductor layer. SOLUTION: In an image forming device (FED) 1 comprising a back plate 2, multiple electron emission elements 3 formed on the surface of the back plate 2, the projection members (spacers) 4 formed on the surface of the back plate 2 where the electron emission elements 3 are formed, and a front plate 5 formed in parallel with the back plate 2 with a predetermined distance kept from the back plate 2 by means of the projection members 4, the projection members 4 are provided on the surface of the back plate 2 and constituted of a joined body of a first projection member 4a higher than that of the conductor layer 6 of the electron emission elements 3 and a second projection member 4b formed integrally on the upper surface of the first projection member 4a, and the joint surface between the first projection member 4a and the second projection member 4b is a curved surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate with a projection member formed by forming a conductor layer and a projection member on the surface of a substrate, and to a method of manufacturing the same. The present invention relates to a substrate with a projection member for an image forming apparatus having a projection member and a method of manufacturing the same.

[0002]

2. Description of the Related Art With the spread of information multimedia in recent years, a demand for a large-screen display as a large-screen and high-definition information terminal is increasing. Conventionally, CRTs, which have been frequently used as image display devices, have disadvantages such as large volume, heavy weight, and large power consumption, so that it is difficult to increase the screen size.

At present, as an image display device satisfying such demands, a light emitting diode (LED), a liquid crystal display element (LCD), a plasma display panel (PDP), and a plasma addressed liquid crystal panel (PAL) have been developed.
C), flat-panel displays, such as field emission displays (FEDs), which have features such as large screens, high image quality, light weight, thinness, and wherever they can be installed, have been developed, and their use ranges are expanding. Among them, a field emission display (FED) having a structure in which an electron beam is emitted from an electron-emitting device formed on the surface of a back plate to irradiate a phosphor layer to emit light is used as a method of emitting light from a pixel. Therefore, the future is attracting attention.

On the other hand, in the above-mentioned flat display, it is necessary to maintain the inside of the display under a reduced pressure or a vacuum of, for example, 10 ^-5 Torr or less. It is necessary to keep the distance between the electron-emitting device and the phosphor at 500 μm or more for the purpose of preventing unevenness of the display. It is pushed by the atmospheric pressure and causes distortion and bending, the distance between the front plate and the back plate fluctuates and the emission luminance of the phosphor layer becomes uneven, and if it is significant, the front plate and the back plate are deformed or destroyed There was a problem of doing.

Therefore, it is known that a spacer is provided between the front plate and the back plate to prevent distortion and bending between the front plate and the back plate. It was produced by bonding to the front plate surface using an adhesive.

On the other hand, Japanese Patent Application Laid-Open No. 9-283017 discloses a method of forming a projection member for a plasma display panel. A method is described in which after drying the paste, a mold having a concave portion in the shape of a projection member formed on the surface of the dried paste is pressed to transfer the projection member molded body to the surface of the substrate, followed by firing.

[0007]

However, in the above-mentioned conventional method of bonding spacers with an adhesive, it takes time and effort to manufacture, and it is not possible to form a spacer having a fine pitch and a high adhesive strength. Since it is difficult to form the spacers perpendicular to the substrate, the spacers are inclined or fall when glued with an adhesive, causing a problem that the distance between the front plate and the back plate varies and display unevenness occurs. .

When the method of forming a projection member for a plasma display panel described in Japanese Patent Application Laid-Open No. 9-283017 is applied to a substrate on which a conductor layer such as an electron-emitting device is formed on the surface of an FED or the like, the molding is performed. There is a possibility that the conductor layer may be damaged by the pressing load of the mold.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a substrate with a projection member which can be easily formed without damaging the element on the surface of the substrate on which the conductor layer is formed. And a method of manufacturing the same, and an image forming apparatus using the same.

[0010]

In order to solve the above-mentioned problems, the present inventors have studied a method of forming a projecting member. A first protruding member molded body having a high height is provided, and after baking the same, the surface of the first protruding member is transferred to the surface of the first protruding member by a transfer method using a molding die in which a concave portion having a second protruding member shape is engraved. By forming the second protrusion member molded body and firing it, the first protrusion member and the second protrusion member are formed integrally, without damaging the conductor layer,
It has been found that a fine spacer with high formation accuracy can be easily formed.

That is, a substrate with a projection member according to the present invention is a substrate with a projection member having a conductor layer and a projection member formed on the substrate surface, wherein the projection member has a height higher than the height of the conductor layer. And a second protrusion member integrally formed on the upper surface of the first protrusion member, and the second protrusion member of the first protrusion member The peripheral portion on the side is a curved surface.

Here, the height of the first projection member is 1 to
Preferably, the thickness is 200 μm, and the peripheral edge of the first projection member is formed to protrude from the peripheral edge of the second projection member.

[0013] Further, the first projection member and the second projection member may be made of the same material, or the first projection member and the second projection member may be made of materials having different electrical conductivity. Is desirable.

Further, the method of manufacturing a substrate with a projection member according to the present invention includes: (a) forming a conductor layer on the surface of the substrate;
(B) forming a first projection member forming body by a coating method using a first projection member paste at a predetermined position on the substrate; and (c) forming the first projection member forming body. Baking to form a first protruding member, and (d) engraving a plurality of second protruding member-shaped concave or convex portions on the first protruding member forming surface obtained in the step (c). Forming a second projecting member on the upper surface of the first projecting member by using the formed mold; and (e) heating the substrate on which the second projecting member molded body is formed by heating the second projecting member. By firing the protrusion member molded body, the second protrusion integrated with the first protrusion member is formed.
Forming the projection member.

Further, another method of manufacturing a substrate with a projection member according to the present invention includes the steps of (a) forming a conductor layer on the substrate surface;
(B) a step of forming a plurality of first protrusion members on the surface of the resin film; and (c) transferring the first protrusion members obtained in the step (b) to a predetermined position on the substrate, and Forming a first projection member, and (d) forming a plurality of recesses or projections of the second projection member shape on the first projection member formation surface obtained in the step (c). Using the mold,
Forming a second protrusion on the upper surface of the first protrusion; and (e) heating the substrate on which the second protrusion is formed to fire the second protrusion. Thereby forming a second projection member integrated with the first projection member.

Here, the step (d) includes (d ₁ ) a step of forming a plastic resin layer, and (d ₂ ) engraving a plurality of second protrusion member-shaped protrusions on the resin layer. Pressing the formed mold to form a second protrusion-shaped recess in the resin layer on the surface of the first protrusion; and (d ₃ ) forming a second protrusion in the recess of the resin layer. Fill with paste
And (d ₄ ) a step of removing the resin layer.

Further, the firing temperature of the second projection member is
Desirably, the firing temperature is lower than the firing temperature of the first projection member.

Further, the image forming apparatus of the present invention comprises a back plate, a plurality of electron-emitting devices formed on the back plate surface,
An image forming apparatus comprising: a projection member formed on the electron emission element forming surface of the back plate; and a front plate formed in parallel with the back plate at a predetermined distance by the projection member. The back plate, the electron-emitting device, and the projecting member are each made of the above-mentioned substrate with a projecting member.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION A field emission display (Field Emission) having a substrate with a projection member on the surface of a back plate, which is a preferred example of a substrate with a projection member of the present invention, having an electron-emitting device and a spacer (projection member) formed thereon. Display: Below, FED
Abbreviated. 1) and FIG. 2 which is a partially cutaway perspective view showing an example.

As shown in FIG. 1, the FED 1 has a plurality of electron-emitting devices 3 and projection members 4 formed on the surface of a back plate (substrate) 2 and a front plate on the tip surfaces of the plurality of projection members 4, 4. 5 is provided, and the rear plate 2 and the front plate 5 are arranged in parallel by a predetermined distance by the projection member 4.

According to FIG. 2, the electron-emitting device 3 is
Insulating layer 7 is interposed at the intersection of conductor layer 6a forming a positive electrode and conductor layer 6b forming a negative electrode.

According to the present invention, the spacer (projection member) 4
Are provided on the surface of the substrate, and have a height higher than the height of the electron-emitting device 3.
a and a peripheral edge of a joint surface of the first projection member 4a with the second projection member 4b as shown in FIG. The portion has a curved surface, that is, the first projection member 4a is formed by firing, and then the second projection member 4b is formed. Thus, the spacer 4 having high dimensional accuracy can be formed.

In order to protect the electron-emitting device 3 and to make it easier to manufacture, the height of the first projection member 4a is 1 to 1.
The thickness of the second projection 4b is desirably 200 μm, for example, 150 μm or more, particularly 400 μm or more, and further 1200 μm or more. further,
The shape of the first projection member 4a and the second projection member 4b may be any of a rib shape (a long wall shape), a strip shape, a grid shape, a column shape, etc. A rib-like shape is desirable because the distance between the front panel 2 and the front plate 5 can be maintained with high accuracy, and the pressure in the display can be easily reduced.

According to FIGS. 1 and 2, a plurality of conductor layers 6a for constituting the electron-emitting device 3 are interposed between the rib-shaped first projection member 4a and the back plate 2. According to the present invention, according to the present invention, the conductive layer 6
It is possible to form the electron-emitting device 3 having stable conduction and operating characteristics without damaging a.

Although the first and second projection members 4a and 4b may have different bottom shapes, the first projection member 4a and the second projection member 4a may be different in terms of the strength of the spacer 4. May have the same bottom shape and may be formed without protruding. However, in order to form the second projection member 4b stably and at a high yield, the second projection member 4b is formed between the back plate 2 and the spacer 4. In order to manufacture the spacer 4 with high adhesion and high load resistance, the periphery of the first projection member 4a is
It is desirable that the projection member 4b be formed so as to protrude from the peripheral edge of the projection member 4b.

The first projection member 4a and the second projection member 4b are made of glass such as quartz glass, soda lime glass, low soda glass, lead alkali silicate glass, borosilicate glass, and bismuth glass. T if desired
iO ₂ , ZrO ₂ , ZnO, SnO ₂ , Si ₃ N ₄ , Al
N, Fe ₂ O ₃ , NiO, CuO, MnO ₂ , SiO ₂ , B
N, Al ₂ O _{3 and} other ceramics, inorganic fillers such as glass particles such as aluminum silicate glass (glass transition temperature of 650 ° C. or more), and Ag, Cu, Au, Al, Pt,
It is used by dispersing metals such as Si, Zn and Sn.

According to the present invention, the first projection member 4a and the second projection member 4b are different from each other in terms of the joining property between the first projection member 4a and the second projection member 4b, the thermal expansion behavior, and the strength. Are preferably made of the same material, and in order to enhance the adhesiveness between the back plate 2 and the second protrusion member 4b, the thermal expansion coefficient of the first protrusion member 4a is set to be equal to that of the back plate 2 and the second protrusion member 4b. It is desirable to set it between the thermal expansion coefficients of the member 4b.

Further, the first point is that the charging of the spacer 4 due to the collision of the electron beam emitted from the electron-emitting device 3 is prevented, and the static electricity accumulated in the spacer 4 is quickly removed to the outside of the spacer 4. The protruding member 4a and the second protruding member 4b are made of materials having different electric conductivities. In particular, the electric conductivity of the first protruding member 4a is higher than the electric conductivity of the second protruding member 4b. The conductivity (volume resistivity) of the member 4b is 1.2 × 10 ^{11 to} 1.0 × 10 ¹⁴ Ω · c.
m, in particular, 2.4 × 10 ^{11 to} 5.6 × 10 ¹³ Ω · cm, and the conductivity of the first projection member 4a is 1.0 × 10 ¹³ or less, and particularly, a short circuit between the conductor layers 6a is prevented. To do
3.8 × 10 ^{8 to} 8.9 × 10 ¹⁰ Ω · cm, especially 9.1
It is desirable that the value be from × 10 ^{8 to} 5.2 × 10 ¹⁰ Ω · cm.

On the other hand, the conductor layer 6 forming the electron-emitting device 3 is
Silver (Ag), aluminum (Al), nickel (N
i), platinum (Pt), gold (Au), palladium (Pd)
And the like, or an alloy containing each as a main component, amorphous silicon, polysilicon, graphite, or the like. In addition, as the insulator layer 7 interposed at the intersection of these conductor layers, Si, Ti , Ga, W, A
At least one selected from oxides and nitrides such as l and Pd
Seeds are preferably used.

The back plate 2 and the front plate 5 are made of a glass substrate such as quartz glass, soda lime glass, low soda glass, lead alkali silicate glass, borosilicate glass, bismuth glass, or a ceramic substrate such as alumina or silica. In particular, the front plate 5 is made of a transparent material, and is made of a low soda glass having a high strain point.

Further, if necessary, a diffusion prevention layer 9 made of a ceramic thin film such as silica or silicon nitride is interposed between the back plate 2 and the electron emission element 3 to prevent diffusion of impurities into the electron emission element 3. It is desirable.

A black matrix 11 is provided at a specific position on the surface of the front plate 5 other than the portion where the phosphor layer 10 is formed, in order to prevent color bleeding in the FED 1 and to enhance the contrast of the display screen to obtain a sharp image. It is desirable to be arranged. The black matrix 11 is made of a black or dark material, for example, Fe, Ni, Cu,
A mixture of an oxide powder such as Mn and a low-melting glass, metallic chromium, graphite, or the like can be used.

According to FIG. 1, the phosphor layer 10 of the front panel 5 is used to accelerate the electron beam and reflect the scattered light emitted from the phosphor layer 10 to increase the light emission luminance.
On the surface, for example, 100-300 nm aluminum (A
l) A metal back 13 made of a metal foil such as silver (Ag), nickel (Ni), platinum (Pt) is formed.
The present invention is not limited to this, and instead of the metal back 13, between the front plate 5 and the phosphor layer 10, the electrons emitted from the electron-emitting device 3 toward the phosphor layer 10 are accelerated. For this purpose, a transparent ITO (indium-tin oxide) film (not shown) may be formed.

Further, according to FIG. 1, the FED 1 has a frame 15 disposed between the peripheral portions of the back plate 2 and the front plate 5, and the inside of the FED 1 is formed by the back plate 2, the front plate 5 and the frame 15. Are sealed and fixed. Further, a gas exhaust port 16 is formed in a part of the back plate 2, and the inside of the FED 1 can be evacuated or a reduced pressure state in which a predetermined gas is sealed can be formed in the gas exhaust port 16.

(Manufacturing Method) Next, a method of manufacturing the above-described FED will be described as an example of a method of manufacturing a substrate with a projection member according to the present invention. First, a back plate (substrate) made of the above-described material is prepared, cut into a predetermined shape, and a diffusion prevention layer is formed on one surface of the back plate by a sputtering method, a CVD method, an ion beam method, a vapor deposition method, an MBE method, or the like. After deposition, the surface of the electrode of the electron-emitting device is coated with a mask or the like by photolithography or the like, and electrons are formed by a known thin-film forming method such as sputtering, vapor deposition, ion beam, CVD, or MBE. An electron-emitting device is formed by forming an insulator layer of the electron-emitting device.

On the other hand, to manufacture a spacer, for example,
A glass having an average particle diameter of 6 μm or less, the above-mentioned other metal or inorganic filler, and, if desired, an organic resin such as a binder such as an acrylic binder, a plasticizer, and a dispersant, and an organic solvent are added and kneaded to form a paste. Is prepared.

Then, using the paste at a predetermined position on the back plate, a first projection member molded body is formed by a coating method such as a screen printing method, a gravure printing method, or a dispenser method, and the first projection is formed. The molded body for a member is, for example, 350
The first projection member is formed by firing at 650 ° C, particularly 500-550 ° C.

Next, the upper surface of the first projection member is formed by using a mold in which a plurality of recesses or projections of a second projection member shape are formed on the first projection member formation surface obtained by the above method. Then, a second projection member is formed.

As a method of forming the second protrusion member,
(1) A molding tool made of rubber, metal, ceramics, or the like is filled with a second projection member paste having the same or a different composition as the above-described paste, and the molding tool is positioned on the first projection member on the substrate surface. After being brought into contact with each other, the mold is pulled out, whereby the first substrate (back plate) is removed.
And (2) applying the paste for the second projection member to the surface of the substrate, drying the paste to a predetermined softness, and then forming the paste layer. The first protruding member of the substrate is pressed by pressing a high-rigidity mold having a groove (recess) having the shape of a second protruding member formed from a surface thereof in alignment with the first protruding member. A method of forming the second projection member on the upper surface is applicable.

In addition to the above method, (3) forming a plastic resin layer on the back plate surface by a coating method such as a screen printing method, a gravure printing method, a dispenser method, and a roll coater method; Forming a concave portion of the second protruding member shape on the resin layer on the surface of the first protruding member by pressing a molding die engraved with the convex portion of the second protruding member shape; A second projection member paste is filled therein to form a second projection member molded body, and the resin layer is removed by heating, melting, chemical treatment or the like. The high second protrusion member can be formed with high dimensional accuracy.

Then, the substrate (back plate) on which the first and second projection members are formed is made to have a structure in which the electron-emitting device is not deteriorated or deteriorated.
By firing at 00 to 490 ° C., a joined body of the first protrusion member on the surface of the substrate (back plate) and the second protrusion member integrally formed on the upper surface of the first protrusion member is formed. Can be formed. In addition, in order to increase the formation angle of the second protrusion member and the dimensional accuracy of the spacer, it is preferable that the firing temperature of the second protrusion member is lower than the firing temperature of the first protrusion member.

(Transfer Method) According to the present invention, the following method can be suitably used in place of the above-described method of forming the first projection member. That is, the first protrusion member paste is formed on the surface of the resin film by the above-described coating method using the paste for the first protrusion member on the surface of a resin film such as a PET film. Then, the resin film on which the first projection member molded body is formed is transferred to a predetermined position on the surface of the substrate (back plate) to form the first projection member molded body on the substrate surface, and then fired as described above. The method of forming the first protrusion member by using the method can also be suitably used. According to this method, the paste residue and the like are not inadvertently adhered to the upper surface of the electron-emitting device and the conductor layer that forms the electron-emitting device, and the electron-emitting device and the conductor layer can be damaged as compared with the above-described direct application method. Properties can be further reduced.

On the other hand, a glass substrate for a front plate made of the above-mentioned material is prepared and processed into a predetermined shape. Then, if necessary, an ITO film is formed on one surface of the front plate by a printing method such as a known printing method such as a screen printing method, a gravure printing method, an offset printing method, a paste coating method such as a roll coater method, or a vapor deposition method. Is formed, and a black matrix having a predetermined shape is formed at a predetermined position by a known printing method such as a photolithography method, a screen printing method, a gravure printing method, and an offset printing method.

Next, a phosphor paste is applied to a predetermined position of the area surrounded by the black matrix on the front plate by a photolithography method, a printing method such as a screen printing method, a gravure printing method, an offset printing method, or an ink jet method. Is formed. When the above-mentioned ITO film was not formed, a resin layer was formed by a printing method such as a photolithography method, a screen printing method, a gravure printing method, an offset printing method using a resin paste on the front plate surface, if desired. Thereafter, a metal back is deposited and formed at a predetermined position by a vapor deposition method or the like, and a resin layer is formed on the surface of the metal back.

Further, the phosphor paste or the paste and the resin layer are heated at 400 to 600 ° C., particularly at 450 to 50 ° C.
A front plate is formed by heat-treating at 0 ° C. to volatilize and remove the organic components and the resin layer in the phosphor.

On the other hand, a front plate is placed on the distal end face of the spacer by using a sealing frit obtained by mixing and kneading an organic vehicle with the above-mentioned glass, a specific metal and an inorganic filler, particularly a glass frit or the like. A frame is arranged between the peripheral portions of the front plate and the back plate, and the conductive frit for sealing is injected into a contact portion of the frames by a dispenser or the like,
In an oxidizing atmosphere such as air, for example, at 400 to 550 ° C,
In particular, by heating the phosphor layer at a temperature of 450 to 480 ° C so that the phosphor layer is not deteriorated, and sintering and fixing the conductive frit for sealing, the back plate and the frame are bonded and sealed.

Further, a gas exhaust port for exchanging gas with the inside of the display is formed at an end of the back plate in advance, and is connected to an external gas exhaust pipe. Then, a vacuum pump is connected to a gas exhaust pipe provided in the frame, and the inside of the panel is evacuated to a pressure of about 10 ⁻⁴ Pa to 400 to 5 Pa.
The image forming apparatus of the present invention can be manufactured by heating to 00 ° C. and fixing the conductive frit for sealing between the front plate, the back plate, the spacer and the frame, and sealing the gas exhaust port. .

In the method of manufacturing the FED,
Although the spacer is integrally formed on the back plate side, the present invention is not limited to this, and the spacer may be integrally formed on the front plate side. A joined body of a first projection member formed by a coating method and baking, and a second projection member integrally formed on the upper surface of the first projection member by the embossing method using the above-described molding die. Thus, a conductive layer such as a metal back formed on the surface of the front plate is not damaged, and a fine spacer having high dimensional accuracy can be formed without causing unevenness in an image.

[0049]

EXAMPLES Example 1 Two 150 mm × 150 mm × 2 mm substrates made of soda lime glass (strain point 500 ° C., average thermal expansion coefficient 10 × 10 ⁻⁶ / ° C.) were prepared.
After forming a diffusion preventing layer made of silicon nitride on the surface of one substrate (back plate) by a sputtering method, a gold (Au) thin film is formed on the surface by a sputtering method,
Etching using photolithography method, width 10
A plurality of lower electrode layers (conductor layers) of 0 μm × length 10 cm × thickness 0.1 μm were formed in parallel at a line pitch of 800 μm. Further, an insulating layer made of SiO _{2 having} a thickness of 400 ° is formed at a predetermined position on the surface of the lower electrode layer by a sputtering method, and further has the same shape as the lower electrode layer and is orthogonal to the lower electrode layer. A plurality of upper electrode layers were formed by sputtering using a mask pattern so that the layers formed intersections, and electron-emitting devices were formed at the intersections.

On the other hand, PbO—B ₂ O ₃ — having an average particle size of 2 μm
30 parts by weight of metal Si, 30 parts by weight of TiO ₂ , and 10 parts by weight of ZnO are weighed with respect to 100 parts by weight of glass of an SiO ₂ system (strain point: 410 ° C.), and a reaction curable binder is added thereto. , A polymerization initiator and a dispersant were added and mixed to prepare Paste A.

Next, using the paste A, a screen having a width 300
A plurality of rib-shaped first projection member patterns each having a size of μm × length 10 cm × thickness (height) 20 μm were formed at a pitch of 800 μm between the first projection members, and baked at 450 ° C. for 15 minutes in the air.

Next, the wax-based resin and the plasticizer were kneaded while being heated to a temperature higher than the melting point of the wax, and an alcohol-based volatile solvent was added to obtain a resin paste. Then, a plastic layer having a thickness of 1200 μm was formed on the surface of the back plate on which the electron-emitting devices and the first projection members were formed by doctor blade printing using the resin paste.

Then, a height of 1200 μm × a width of 200 μm
Using a roll-shaped forming die in which a plurality of convex portions are engraved in parallel at a pitch of 800 μm between the convex portions, aligning this with the first protrusion member pattern, and rotating the roll die from the surface of the resin layer. The resin layer was pressed, and a plurality of grooves each having a length of 8 cm and having a second protruding member shape were formed in parallel in the resin layer.

The paste A is filled in the obtained spacer resin mold, sufficiently defoamed, heat-treated at 110 ° C. for 30 minutes to cure the binder, and then the resin layer is dissolved and removed with a solvent. A second molded body for a projection member was formed.

The obtained molded body for a spacer is baked in air at 450 ° C. for 15 minutes, and a spacer comprising a joined body of the first projection member and the second projection member is provided on the surface of the back plate. Formed.

Observation of the appearance of the spacer of the obtained substrate with a projection member confirmed that the substrate was formed well without cracking or peeling and without inclination or the like of the projection member. . Note that the peripheral portion of the first projection member was formed to protrude from the second projection member by the same width. In addition, as a result of measuring the conduction of the electron-emitting device, it was confirmed that no defect such as disconnection was observed and that the device was formed well.

(Example 2) 30 parts by weight of metal Si, 30 parts by weight of TiO ₂ ,
A paste B is prepared by mixing 30 parts by weight of nO ₂ and an organic component of the paste A.
On the ET film surface, a 300 μm-wide grid-like shaped first protrusion member forming body surrounding the electron-emitting device was formed by screen printing.

Next, the first projection member molded body of the film was brought into contact with a predetermined position on the surface of the back plate on which the diffusion preventing layer and the electron-emitting device of Example 1 were formed, and the film was peeled off. A first projection member was transferred and formed on the surface of the back plate, and baked in the same manner as in Example 1 to form a first projection member on the surface of the back plate. Further, the first projection member forming surface is formed by the screen printing method using the above-mentioned resin paste.
A resin layer having the same height as that of the protrusion member was formed.

On the other hand, a depth of 1200 μm × a width of 200 μm ×
After filling the paste A into a silicone rubber mold in which a plurality of recesses each having a length of 10 mm were formed in parallel at intervals of 800 μm and sufficiently defoaming, the silicone rubber was aligned with the surface of the resin layer on the back plate and brought into contact therewith. Heat treatment was performed at 30 ° C. for 30 minutes, and a silicone rubber mold was extracted to transfer and form a second projection member molded body on the upper surface of the first projection member on the back plate.

Then, after removing the resin layer in the same manner as in Example 1, baking was performed to form a spacer composed of a joined body of the first projection member and the second projection member on the surface of the back plate.

Observation of the appearance of the spacer with respect to the obtained substrate with a protruding member confirmed that the substrate was well formed without cracking or peeling and without tilting or the like. Note that the peripheral portion of the first projection member was formed to protrude from the second projection member by the same width. In addition, as a result of measuring the conduction of the electron-emitting device, it was confirmed that no defect such as disconnection was observed and that the device was formed well.

Using paste A and paste B, a plate-shaped sintered body was prepared, and the conductivity was measured. As a result, 2.5 × 10 ¹¹ Ω · cm and 3.8 × 10
^{It was 10} Ω · cm, suggesting that the charge of the spacer can be effectively prevented because of the good conductivity of the first projection member.

(Comparative Example) A resin layer was directly formed at a predetermined position on the surface of the back plate on which the diffusion preventing layer and the electron-emitting device of Example 1 were formed, without forming the first projection member of Example 1. Using the mold of Example 1, a spacer groove having a height of 1400 μm × 200 μm in width × 10 mm in length was formed.
In the same manner as in Example 1, the spacer paste was filled to form a spacer molded body, and then the resin layer was removed and baked to form a spacer made of one member on the surface of the back plate.

As a result of the evaluation in the same manner as in Example 1, although the appearance was excellent, the disconnection was observed in a part of the electron-emitting device.

[0065]

As described above in detail, according to the substrate with a projection member of the present invention, the first surface having a height higher than the conductor layer is previously applied to the surface of the substrate on which the conductor layer is formed by a coating method, a transfer method or the like. After the projection member is provided, the second projection member is integrally formed on the surface of the first projection member by a transfer method using a molding die in which a recess having the shape of the second projection member is engraved. In addition, it is possible to easily form a fine spacer having high formation accuracy without damaging the element.

Further, by setting the electric conductivity of the first projection member higher than that of the second projection member, it is possible to effectively prevent the spacer from being charged.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing an example of a field emission display (FED) as a preferred example using a substrate with a projection member of the present invention.

FIG. 2 is a partially cut-away schematic cross-sectional view of the field emission display (FED) of FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Field emission display (FED, image forming apparatus) 2 Back plate 3 Electron emission element 4 Spacer (projection member) 4a First projection member 4b Second projection member 5 Front plate 6 Conductor layer 7 Insulator layer 9 Diffusion prevention Layer 10 Phosphor layer 11 Black matrix 13 Metal back 15 Frame 16 Gas exhaust port

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5C012 AA05 BB07 5C032 CC10 CD04 5C036 EE14 EF01 EF06 EF09 EG01 EH06 EH26

Claims (10)

[Claims] 1. A substrate with a projection member having a conductor layer and a projection member formed on a surface of the substrate, wherein the projection member comprises:
A first protrusion member having a height higher than the height of the conductor layer;
The first projection has a joint with a second projection formed integrally with the upper surface of the first projection, and the peripheral edge of the first projection on the side of the second projection is curved. A substrate provided with a projection member. 2. The height of the first projection member is 1 to 200 μm.
2. The substrate with projection members according to claim 1, wherein m is m. 3. The substrate with a projection member according to claim 1, wherein the periphery of the first projection member is formed so as to protrude from the periphery of the second projection member. 4. The apparatus according to claim 1, wherein said first projection member and said second projection member are made of the same material.
A substrate with a projection member according to any one of the above. 5. The substrate with a projection member according to claim 1, wherein the first projection member and the second projection member are made of materials having different electrical conductivity. 6. A process for forming a conductive layer on the surface of a substrate, and (b) a first molded product for a projection member using a first projection member paste at a predetermined position on the substrate by a coating method. (C) firing the molded body for the first projection member to form a first projection member; and (d) the first projection member obtained in the step (c). Forming a second projecting member on the upper surface of the first projecting member by using a molding die having a plurality of recesses or projecting portions of a second projecting member shape formed on the forming surface; By heating the substrate on which the second projection member molded body is formed and firing the second projection member molded body, the second projection member integrated with the first projection member is heated.
Forming a substrate with a projection member. 7. A method comprising: (a) forming a conductor layer on a substrate surface; (b) forming a plurality of first projection members on a resin film surface; and (c) obtaining the (b) process. First
Transferring the projection member to a predetermined position on the substrate to form a first projection member on the surface of the substrate; and (d) forming a plurality of projection members on the first projection member formation surface obtained in the step (c). Forming a second protruding member on the upper surface of the first protruding member by using a forming die engraved with a concave portion or a protruding portion of the second protruding member shape; and (e) forming the second protruding member. The second substrate integrated with the first projection member is heated by heating the substrate on which the body is formed and firing the second projection member molded body.
Forming a substrate with a projection member. 8. The step (d) includes: (d ₁ ) forming a resin layer having plasticity; and (d ₂ ) forming a plurality of second protrusion member-shaped protrusions on the resin layer. Pressing a molding die to form a recess having a second projection member shape on the resin layer on the surface of the first projection member; and (d ₃ ) providing a paste for the second projection member in the recess of the resin layer. 8. A method of manufacturing a substrate with a projection member according to claim 6, further comprising the steps of: forming a second projection member molded body by filling the resin layer; and (d ₄ ) removing the resin layer. Method. 9. The method according to claim 6, wherein a firing temperature of the second projection member is lower than a firing temperature of the first projection member. . 10. A back plate, a plurality of electron-emitting devices formed on the surface of the back plate, a projecting member formed on the surface of the back plate on which the electron-emitting devices are formed, and the back plate by the projecting members. A front plate formed in parallel at a predetermined interval,
An image forming apparatus, comprising: a back plate, an electron-emitting device, and a projecting member comprising the substrate with a projecting member according to claim 1.