JP2002170507A - Supporting base plate having projections as spacer and picture display device using the supporting base plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a supporting base plate having projections as spacer on a front surface or on a back surface of the supporting base plate whose projections can be formed in precise dimensions, easily and at low cost, without damaging fluorescent material or electrodes existing on the front surface or on the back surface of the supporting base plate, and the picture display device using the supporting base plate. SOLUTION: This picture display device is manufactured using the supporting base plate 1 having same height plural projections 4 which are fixed on a surface of the base plate 2 at prescribed intervals via adhesive 3 whose strength of bonding decreases by heating or by lighting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support substrate having a projection member suitably used for an image forming apparatus such as a plasma display and a field emission display, and an image forming apparatus using the support substrate having the projection member. It relates to a manufacturing method.

[0002]

2. Description of the Related Art In recent years, plasma display panels (Plas
ma Display Panel, PDP), Plasma Address Liquid Crystal Panel (PALC),
2. Description of the Related Art Flat-panel display devices such as a field emission display (hereinafter referred to as FED) have been developed.

[0003] In such an image display device, the phosphor is irradiated with plasma or an electron beam between the front plate and the back plate having a phosphor or a discharge electrode formed on the surface to cause the phosphor to emit light. An image is formed by this, and since the inside of the panel needs to be in a vacuum state or a reduced pressure state, a peripheral portion between the front plate and the back plate is sealed with a frame to constitute a panel. It is known to form a plurality of projecting members (spacers) for maintaining a predetermined interval between the front plate and the back plate in order to prevent the panel from bending due to the atmospheric pressure and causing the image to be distorted.

As a method of forming the above-mentioned protrusion members (spacers) on the surface of the front plate or the back plate, a paste layer for the protrusion members is formed on the surface of the substrate and cured, and then unnecessary portions are formed by sandblasting or the like. A method of removing, a method of repeating a printing method such as a screen printing method on a substrate surface,
A method of pressing (embossing) a plate-shaped or roll-shaped molding die having a projection-shaped concave portion formed on a plastically deformable soft paste layer, and applying a paste into a concave portion of a molding die having a projection-shaped concave portion. Filling, curing the paste and transferring it to the substrate surface, etching the surface of the cured paste layer using a mask pattern, etc., to form a protrusion member molded body on the front plate or back plate surface There is known a method of baking after production.

[0005]

However, in the above-mentioned conventional method of forming a spacer directly on the surface of the front plate or the back plate, the phosphors, electrodes and the like existing on the surface of the front plate or the back plate on which the spacer is formed are damaged. Therefore, spacers cannot be formed on the rear plate having electrodes or elements that are easily damaged or the front plate on which the phosphor is formed.

There is also a method in which spacers cut from a glass plate or the like are bonded one by one to the surface of the front plate or the back plate, but care must be taken not to damage the phosphors, electrodes, etc. present on the surface of the front plate and the back plate. Because you need to
In addition to the low productivity, it is not possible to form a spacer having a fine shape and a fine interval, and an error is likely to occur in a bonding angle of the spacer, which may cause display unevenness on a panel.

Furthermore, the above-described method of forming a spacer has a problem that if a problem occurs during the formation of the spacer, the expensive front plate or back plate must be discarded, resulting in an increase in cost.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has as its object the purpose of improving the dimensional accuracy, easily and at low cost without damaging the phosphors, electrodes, etc. existing on the front and rear plate surfaces. It is an object of the present invention to provide a support substrate with a protrusion member capable of forming a protrusion member (spacer) on the surface of a front plate or a rear plate, and a method of manufacturing an image forming apparatus using the same.

[0009]

In order to solve the above-mentioned problems, the present inventors have studied a method of forming a projecting member. As a result, instead of forming the projecting member directly on the front plate or the back plate surface, a dummy support substrate is used. After the projection member is formed thereon, the top of the projection member of the support substrate with the projection member is brought into contact with and adhered to a predetermined position on the front plate or the back plate, and the support substrate is removed, whereby the surface of the front plate or the back plate is removed. It has been found that a projection member (spacer) can be formed on the front plate or the back plate surface easily and at low cost with good dimensional accuracy without damaging the phosphors, electrodes, etc. existing in the device.

In other words, the support substrate with a protrusion member of the present invention comprises a plurality of protrusion members having the same height on one surface of the support substrate via an adhesive whose adhesive force is reduced by heat or light. It is characterized by being fixed.

[0011] Further, another supporting substrate with a protruding member of the present invention may be provided on one surface of a supporting substrate having a strength of 100 MPa or less.
It is characterized in that a plurality of protrusion members having the same height are fixed with a predetermined distance therebetween, and it is particularly preferable that the support substrate is made of porous ceramics having a porosity of 10 to 70%.

Further, the porous ceramic is made of at least one selected from the group consisting of mullite, alumina, and cordierite.
It is preferable that the connecting member is formed on the surface of the supporting substrate and is connected by a connecting portion made of the same component as the protruding member.

Further, the projecting member is made of a molded body containing glass powder and / or ceramic powder, and the projecting member is made of Si, Zn, Al, Sn, Cu and Mg.
It is preferable that at least one kind of metal selected from the group be contained, and that the protruding member be fired at 600 ° C. or lower.

It is preferable that a fixing agent is formed on the top of the projecting member, and that the fixing agent includes a low-melting glass having a strain point of 450 ° C. or less.

Further, according to the method of manufacturing an image forming apparatus of the present invention, there is provided an image forming apparatus comprising a plurality of projecting members disposed between a front plate and a rear plate which are disposed in parallel at a predetermined interval. A method of manufacturing a forming apparatus, comprising: abutting a top portion of a projection member of a support substrate with a projection member described above on a surface of the front plate or the back plate and bonding the same, and then removing the support substrate. Is what you do.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a support substrate with a projection member according to the present invention will be described with reference to FIG. 1 which is a schematic perspective view thereof. According to FIG. 1, a support substrate 1 with a projection member
The adhesive layer 3 is formed on the surface of the support substrate 2 by adhesion, and a plurality of protrusion members 4 are formed on the surface of the adhesive layer 3.

The support substrate 2 is preferably made of any one of glass, ceramics, plastic, and metal. Among them, as the glass, at least one selected from the group consisting of quartz glass, soda lime glass, low soda glass, lead alkali silicate glass, and borosilicate glass can be used. As the plastic, an organic resin such as an acrylic resin, an epoxy resin, a phenol resin, a cellulose resin, polyethylene, polypropylene, and polystyrene can be used. In addition, an inorganic filler may be added to the support substrate to improve properties such as strength. Al, Fe, C as metal
It is preferable to use Al or an Al alloy from the viewpoint that u or the like can be used. As ceramics, alumina, zirconia, silicon nitride,
Aluminum nitride, silicon carbide, mullite, cordierite, glass ceramics, and the like can be used. Among them, alumina, mullite,
It is desirable that at least one member selected from the group of cordierite be the main component, and alumina is optimal because it is lightweight and inexpensive.

As the support substrate, ceramics or plastics are desirable in terms of weight reduction and mechanical reliability, and ceramics having a small thermal expansion due to a temperature change are most desirable.

In order for the supporting substrate 2 to independently support the projecting member 4 and to increase the accuracy of forming the projecting member 4, the Young's modulus of the supporting substrate 2 is desirably 50 GPa or more, particularly 100 GPa or more. When the Young's modulus of the protrusion 2 is low, the support substrate 2 is formed in order to increase the accuracy of forming the protrusion 4 when the protrusion 4 is formed on the surface of the support 2 and when the protrusion 4 contacts the front plate or the back plate. It is desirable to carry out the process in a state of being supported by another supporting base having a high Young's modulus.

On the other hand, the adhesive layer 3 is made of a material whose adhesive strength is reduced by heat or light, and specifically includes acrylic resin, butyral resin, polyvinyl alcohol, cellulose resin, epoxy resin, polyolefin resin, silicone resin and the like. Thermoplastic resins, resins whose heat-resistant temperature is 400 ° C. or lower and carbonization disappears at a temperature higher than that, photocurable resin adhesives composed of a mixture of a polymer and a cationic photopolymerization initiator, and the like can be suitably used. . Also, according to FIG.
Although the adhesive layer 3 is formed so as to cover the surface of the support substrate 2, according to the present invention, the present invention is not limited to this.
The adhesive layer 3 may be any as long as at least the protrusion member 4 is bonded and fixed to the support substrate 2.

According to the present invention, the support substrate 2 is peeled off and removed from the plurality of projection members 4 using the above-mentioned adhesive whose adhesive force is reduced, so that the plurality of projection members 4 are accurately formed on the back plate or the front plate. It can be formed by bonding.

On the other hand, the projection member 4 is made of ceramic, glass,
Formed by metal, metal or their composite members
However, the insulation temperature and the sintering temperature of the front and back
Glass or glass ceramic in terms of compatibility
Is desirable. Quartz glass, soda lime glass, low saw
Douglas, lead alkali silicate glass, borosilicate glass, bis
Mass-based glass can be used, and if desired, the porcelain strength can be increased.
To control the coefficient of thermal expansion,
For controlling the conductivity and controlling the conductivity,
TiO_Two, ZrO_Two, ZnO, SnO_Two, Si
_ThreeN_Four, AlN, Fe_TwoO _Three, NiO, CuO, MnO_Two,
SiO_Two, BN, Al_TwoO_ThreeSuch as ceramic powder, above
Glass having a higher glass transition point than glass (for example, silica
Aluminum-based glass (glass transition point 650 ° C or higher)
Inorganic filler such as powder and Si, Zn, Al, S
Metal powders such as n, Cu, Mg, Ag, Au and Pt
Those dispersed are preferably used. The above metal
Among them, Si, Zn, Al, Sn, Cu and Mg
By including it in the molded body for the starting member,
The protrusion 4 is fired in an oxidizing atmosphere to expand the volume,
Shrinks due to firing, from support substrate, front plate or back plate
The occurrence of peeling or the like is prevented.

According to the present invention, the protruding member 4 may be a sintered body obtained by sintering the glass, or a molded body in which the glass is present in an unsintered powder state. . When the projecting member 4 is a molded body, it is desirable to bond the projecting member 4 to the surface of the front plate or the rear plate and then sinter the projecting member 4 in terms of mechanical reliability. In consideration of the heat resistance temperature of the face plate, the firing temperature of the protruding member 4 molded body is desirably 600 ° C. or less, particularly 550 ° C. or less, and more desirably 500 ° C. or less.

The projecting member 4 may have a rib shape (a long wall shape), a strip shape, a lattice shape, or a column shape. It is desirable that the shape be a rib because it can be held accurately and vacuum decompression in the display is easy. Further, when the protrusion member 4 is formed in a rib shape, the protrusion member 4 has a thickness of, for example, 200 μm or less, particularly 50 to 200 μm, and a pitch of 10 m.
m or less, especially 1000 μm or less, furthermore 50 to 750 μm
m, and further formed at 100 to 300 μm,
The height of the protruding member 4 is 100 μm or more, particularly 150 μm or more, and more preferably 500 μm or more.

Further, according to FIG. 1, a fixing agent 5 is formed on the top of each projection member 4. The fixing agent 5 preferably contains, for example, a low-melting glass having a glass distortion point of 450 ° C. or less, and the front plate or the rear plate and the projection member 4 are bonded by the fixing agent 5.

As shown in FIG. 2, the space between the adjacent projection members 4, 4 is made of the same components as the projection members 4, and is formed integrally with the projection members 4, 4 and on the surface of the support substrate 2. It may be connected by the connecting portion 6.
Accordingly, the dimensional accuracy can be improved even when the protrusion member 4 is fired. Note that the thickness of the connecting portion 6 is 50 μm or less, particularly 1
It is preferably 30 μm, more preferably 5 to 20 μm.

The shape may be formed in a stripe shape as shown in FIG. 2A, but from the viewpoint of easiness of manufacture, it should be formed over the entire surface as shown in FIG. 2B. Is desirable. Further, for example, when manufacturing a PDP, FIG.
When the connecting portion 6 is formed on the back plate surface side as shown in (a), the specific surface area of the phosphor adhered and formed on the back plate and the spacer surface is increased, and the emission luminance of the phosphor is improved. be able to. The connecting portion 6 can be easily removed by grinding or the like, if desired.

(Manufacturing Method of Supporting Substrate) In order to manufacture the supporting substrate with the protruding member, first, an adhesive layer is applied or attached to one surface of the supporting substrate having a predetermined shape by a printing method or a spin coater method. To form an adherend.
Then, (a) a paste layer for a projecting member is formed on the surface of the adhesive layer and cured, and then unnecessary portions are removed by sandblasting or the like. (B) Printing such as screen printing on the substrate surface. A method of producing a molded body for a protruding member by repeating a method or the like; (c) a flat or roll-shaped highly rigid mold having a protruding member-shaped recess formed in a soft paste layer capable of plastic deformation. Pressing (embossing)
(D) filling a paste into a recess of a mold having a recess in the shape of a protrusion member, curing the paste if desired, and transferring the paste to the substrate surface; e) a method of producing a molded body for a projection member by performing an etching process using a mask pattern from the surface of the cured paste layer, and (f) forming a soft resin layer capable of being plastically deformed on the surface of the adhesive layer to form a projection. After pressing (pressing) a plate-shaped or roll-shaped highly rigid molding die having a member-shaped projection formed therein, filling the concave portion formed in the resin layer with the paste for the projection member and curing the same, A molded member-shaped projection member having a predetermined shape can be manufactured by a method of removing the resin layer or the like.

In addition to the above method, (g) it is also possible to attach a projection member processed into a predetermined shape to the surface of the support substrate. In this case, in order to form the projection member accurately, the projection member is required. A concave portion may be formed on the surface of the support substrate located at the formation portion, or the projection member may be attached to the projection member formation portion with a guide plate having a predetermined thickness perforated (opened) placed thereon. Is desirable. Further, when the projection member 4 is bonded to the front plate or the rear plate surface in a state of a molded body, the whole front plate or the rear plate is heated after bonding the projection member 4 in terms of improving mechanical reliability. It is desirable to sinter the molded body.

Among the above methods, the method (c) is characterized in that a fine projection member for PDP and PALC can be formed with high accuracy.
It is desirable to use (d), (f), and (g) from the viewpoint that a high protrusion member for FED can be formed with high accuracy. Also, if desired, it is desirable to form a fixing agent on the top of the projection member formed on the surface of the support substrate by a printing method or the like. The fixing agent is desirably obtained by adding a low-melting glass and a solvent to an organic resin made of a thermosetting resin or the like, or made of a paste containing additives such as a small amount of a dispersing agent, a leveling agent, and an antifoaming agent if desired. Things are desirable. This is formed on the top (tip) of the projection member by screen printing, dipping, or the like.

Further, it is desirable to form a connecting portion of approximately 5 to 200 μm between adjacent projecting members, which is made of the same material as the projecting members in terms of improving strength and improving dimensional accuracy of the projecting members. The connecting portion can be easily removed later by grinding or the like. As shown in FIG. 4, (a) a method of forming the connecting portion in a line shape between the projecting members so as to be orthogonal to the longitudinal direction of the projecting members,
(B) A method of forming a layer (over the entire surface) between the supporting substrate or the adhesive layer and the projection member.

Further, the protrusion member formed by firing is
After firing, it can be bonded to another supporting substrate. In addition,
In this case, the bonding surface of the projection member with another support substrate may be the bonding surface with the previous support substrate or the opposite surface. The adhesive layer may be coated with an adhesive on the tip end surface of the protruding member.However, in terms of ease of production, another supporting substrate is doctor blade method, spray method, spin coating method, low coater method or the like. It is desirable to form.

(Method of bonding projection member to back plate or front plate) Further, a method of forming a projection member (spacer) on the surface of the front plate or back plate of the image forming apparatus by using the support substrate with the projection member. Will be described. First, a front plate and a back plate on which a phosphor, an electrode, an electron-emitting device and the like are formed at predetermined positions on the surface are prepared, and the protrusions of the support member with the protrusion members are formed at predetermined positions on the front plate or the back plate surface. Contact the top. Then, heating the adhesive layer between the support substrate and the projection member, or reducing the adhesive force of the adhesive layer by irradiating light such as ultraviolet light,
Remove the support substrate.

Next, the protrusion member and the front plate or the back plate are bonded by heating to, for example, 600 ° C. or lower, particularly 420 to 500 ° C. to solidify the fixing agent. In addition, when the protrusion member is a molded body, the protrusion member can be sintered by this heating. Thus, the projection member can be formed on the front plate or the rear plate surface.

(Second Embodiment) In FIG. 1, the support substrate 2 and the protruding member 4 are bonded by the adhesive layer 3, but the present invention is not limited to this. Alternatively, the support substrate 2 and the protruding member 4 may be directly bonded. At this time, it is desirable that the support substrate and the projection member are joined and integrated by sintering or the like.

FIG. 3 is a schematic perspective view of a supporting substrate with projections in which the supporting substrate 2 and the projecting member 4 are directly bonded to each other. According to the supporting substrate 7 with the protrusion member of FIG. 3, the supporting substrate 8 has a strength 100 that can be easily removed by processing, heating, or the like.
It is formed of a free-cutting material of MPa or less, particularly 60 MPa or less. The material forming the support substrate 8 is, for example, a resin such as an acrylic resin or Teflon (registered trademark), or a porous ceramic having a porosity of 10 to 70%, particularly 40 to 70%. Further, as the porous ceramic, a high-strength, low-thermal-expansion material such as alumina, mullite, cordierite, or the like can be used in order to increase the accuracy of forming the projection member 4. Furthermore, the support substrate 8 may be formed of the same material as the protruding member 4 in terms of ease of manufacture. Further, in order to enhance the adhesiveness between the support substrate 7 (porous ceramic) and the projection member 4 and improve the accuracy of forming the projection member, a glass layer is provided between the support substrate 7 (porous ceramic) 7 and the projection member 4. Can also be formed.

On the other hand, the projecting member 4 is formed of the same material as described above, but according to FIG.
Since the support substrate needs to be removed by processing, it is desirable that the projection member 4 has a certain strength. From such a viewpoint, the projection member 4 may be a molded body, but is particularly preferably a sintered body. .

(Production Method of Protrusion Member) In order to produce such a support substrate 7 with a projection member, a projection member 4 (molded product) is produced on the surface of a support substrate 8 having a predetermined shape by the above-described method, and if desired. Then, the molded body is heated together with the supporting substrate to sinter the projection members. Further, if desired, it is desirable to form a bonding agent on the top of the protruding member as described above.

(Method of bonding projection member to back plate or front plate) In order to form a projection member on the surface of the front plate or back plate using the support substrate 7 with the projection member, the above-described phosphor, electrode, etc. After the top of the projection member 4 of the support substrate 7 with the projection member is brought into contact with a predetermined position of the front plate or the rear plate on which the projection plate 4 is formed, and the front plate or the rear plate and the projection member 4 are bonded with a bonding agent, the support substrate is removed. It can be formed by removing by grinding or chemical treatment.

(Structure of FED) Next, an FED (Field Emission Discharge) which is a preferable application example of the image forming apparatus of the present invention.
play) will be described with reference to FIG. 4 which is a schematic sectional view thereof. In FIG. 4, the FED 11 has a projection member (spacer) 14 disposed at a predetermined position between two substrates, a back plate 12 and a front plate 13, which are formed in parallel at a predetermined interval.

The substrates of the back plate 12 and the front plate 13 are made of glass substrates such as quartz glass, soda lime glass, low soda glass, lead alkali silicate glass and borosilicate glass, sapphire, quartz, single crystal zirconia, diamond and the like. Single crystal substrate, alumina, polycrystalline ceramic substrate such as silica, containing the ceramic in the glass,
A dispersed glass ceramic substrate, a Si substrate, or the like can be used. In particular, a low soda glass having a high strain point and low in sodium and lead components is desirable. In particular, the front plate 13 is formed of a transparent material.

On the other hand, a plurality of electron-emitting devices 16 are formed on the surface of the back plate 12. A specific structure of the electron-emitting device 16 is, for example, such that a plurality of linear positive electrodes and negative electrodes arranged in parallel at predetermined intervals intersect with each other, and an intersection of the positive electrode and the negative electrode is formed. A MIM structure in which an insulator is interposed between the electrodes, a surface conduction type in which a positive electrode and a negative electrode are spaced in parallel at a predetermined interval with an insulating layer interposed, and a positive electrode in which an insulator is interposed between the positive and negative electrodes A field emission type or the like in which the electrode and the insulator are partially cut out at predetermined positions and a cone-shaped projection having a sharp end at the cutout portion is provided.

The conductor layers for the positive and negative electrodes forming the electron-emitting device 16 are made of silver (Ag), aluminum (Al), nickel (Ni), platinum (Pt), gold (A
u), a metal such as palladium (Pd) or an alloy mainly containing each of them, amorphous silicon, polysilicon, graphite, or the like can be used. Also,
At the intersection of the conductor layer for the positive electrode and the conductor layer for the negative electrode, Si,
An insulator made of at least one selected from oxides and nitrides of Ti, Ga, W, Al, Pd and the like is interposed.

If necessary, the back plate 12 and the electron-emitting device 16 are provided to prevent diffusion of impurities into the electron-emitting device 16.
It is desirable that a diffusion prevention layer 18 made of a ceramic thin film such as silica or silicon nitride is interposed between the first and second layers.

On the other hand, a phosphor 17 is formed on the surface of the front plate which forms the inner surface of the panel. Phosphor 17 is R
(Red), G (green), B (blue) phosphor 3
7 are one pixel, which are regularly arranged in a matrix in the row and column directions.

Further, a black matrix 19 is arranged at a specific position on the surface of the front plate 13 other than the portion where the phosphor 17 is formed, in order to prevent color bleeding in the FED 11 and to enhance the contrast of the display screen to obtain a sharp image. It is desirable to be done. The black matrix 19 is made of a material that becomes black or dark, and includes, for example, Fe, Ni, C
A mixture of an oxide powder such as u or Mn and a low melting point glass, metallic chromium, graphite, or the like can be used.

According to FIG. 4, a transparent ITO is provided between the front plate 13 and the phosphor 17 in order to accelerate electrons emitted from the electron-emitting device 16 toward the phosphor 17.
(Indium-tin oxide) film 20 is formed,
The present invention is not limited to this, and the phosphor of the front plate 13 may be used in place of the ITO film 20 to accelerate the electron beam and reflect the scattered light of the phosphor 17 to increase the light emission luminance. 17 surface, for example, 50-300n
m of aluminum (Al), silver (Ag), nickel (N
i), a metal back (not shown) made of a metal foil such as platinum (Pt) may be formed.

Further, as shown in FIG. 4, a frame 21 is provided between the peripheral portions of the front plate 13 and the rear plate 12, and
3. The back plate 12 and the frame body 21 are bonded to form a sealed panel.

Although the structure of the FED has been described with reference to FIG. 4, the present invention is not limited to this. For example, the present invention is applicable to other image display devices such as PDP and PALC, printers, and the like.

(Method of Manufacturing FED) Next, a method of manufacturing an image forming apparatus according to the present invention will be described based on an example of a method of manufacturing an FED. First, the front plate 13 made of the above-described material is prepared, cut into a predetermined shape, and then a lattice-shaped black matrix 19 is subjected to a photolithography method.
The phosphor 17 is formed by a known method such as a photolithography method, a printing method, and an ink-jet method at a predetermined position in a region surrounded by the black matrix 19 by a printing method or the like. The front plate 1 of the spacer 14
From the viewpoint of improving the bonding strength to 3, the phosphor 17 is desirably not formed at the portion of the front plate 13 where the spacer 14 is formed by using a mask or the like.

In order to release the electric charge accumulated in the phosphor 17, an ITO film 20 is formed between the front plate 13 and the phosphor 17 by a paste coating method, a vapor deposition method, or the like, or an aluminum (Al), Silver (Ag), nickel (N
i), a metal back (not shown) made of a foil made of platinum (Pt) or the like and having a thickness of about 50 to 200 nm.
Is desirably formed on the surface of the phosphor 17 by a vapor deposition method or the like. Further, in order to prevent damage to the phosphor 17 and to form the metal back into a thin and uniform thickness, a protective layer (not shown) made of resin is used. Is preferably formed on the surface of the phosphor 17.

This protective layer can be formed by a photolithography method, a printing method, an ink-jet method, or the like by using a resin paste to which a defoaming material, a leveling material, and the like are added in addition to a binder and a solvent to be described later. It is desirable to do.

On the other hand, a conductor layer made of the above-mentioned material is formed on the surface of the back plate 12 made of the above-mentioned material by a photolithography method or the like so that the conductor layer for the positive electrode and the conductor layer for the negative electrode intersect at a predetermined position. The electron-emitting device 16 is formed by depositing and interposing an insulator made of the above-mentioned material by a sputtering method, an evaporation method, an ion beam sputtering method, a CVD method, an MBE method, or the like at the intersection.

Next, the front plate 13 is formed by the method described above.
Alternatively, a spacer (projection member) 14 is formed on any surface of the back plate 12.

Then, the frame 21 is disposed on the peripheral portion between the rear plate 12 and the front plate 13 and a portion for fixing the projection of the front plate and the frame 21 by printing an adhesive such as frit glass by a printing method, and / or Or spacer and projection and frame 21
The heat treatment is performed at 400 to 500 ° C. by applying the protrusions formed on the surface of the back plate 12 to the predetermined positions of the front plate 13 and applying a heat treatment at 400 to 500 ° C.
1 and the projections, a vacuum pump is arranged at one end of the panel, and the inside of the panel is vacuum-depressurized to about 10 ⁻³ Pa and sealed, thereby forming an FED (image forming apparatus) 11.
Can be produced.

[0056]

EXAMPLES (Example 1) PbO- having an average particle size of 0.5 μm
For SiO ₂ —ZnO—B ₂ O ₃ glass powder, ZnO
Powder, TiO ₂ powder, Si powder, Cu powder, acrylic UV curable resin, solvent and dispersant were added and kneaded to prepare a paste. Further, a mold made of urethane rubber having a groove for forming a protrusion member molded body is prepared, and the groove is filled with the paste for forming the protrusion member, and after defoaming, 100 mm × 80 mm × 1 mm, A glass substrate coated with a polyolefin resin on the surface was pressed against the groove as a support substrate, the paste was cured by irradiating ultraviolet rays through the glass substrate, and the protrusion member was transferred to the surface by releasing the mold. A supporting substrate was obtained. In addition,
The groove of the mold is vertical with a depth of 190 μm and a width of 100 μm
And the pitch was 360 μm.

On the other hand, an electrode was formed by applying a silver paste on a soda lime glass substrate of 250 mm × 200 mm × 2 mm by screen printing and baking it.
On this, an insulating layer made of low melting point glass was applied using a slit coater method, and baked at 590 ° C. to obtain a back plate. Further, a bus electrode made of aluminum and a transparent electrode made of an ITO film are formed on a 250 mm × 200 mm × 2 mm soda lime glass substrate by a photolithography method, and a dielectric layer made of a low-melting glass having high transparency is laminated by a lamination method. And a protective layer made of MgO were sequentially formed by a sputtering method to obtain a front plate.

Next, after a paste made of a low-melting glass and a thermosetting acrylic resin is placed on the upper end surface of the projection member molded body by a printing method, a back is formed between the projection member molded bodies. The four supporting substrates with the protruding members were placed at predetermined positions on the back plate while being positioned so that the electrodes formed on the face plate were arranged. Further, this is heated at 130 ° C. to fix the protruding member molded body and the back plate, and then irradiate the adhesive with ultraviolet rays to remove the supporting member, and then heat to 550 ° C. to remove the protruding member and the back plate. Integrated. The state of formation of the protruding member was visually and microscopically confirmed, and it was found that the protruding member was formed well without cracking or peeling.

On the other hand, a phosphor is applied to the surface of the front plate forming the inner surface of the discharge display cell through a mask pattern, and the phosphor is baked at 550 ° C. Was sealed with a sealing agent to seal the inside of the panel, and a discharge gas containing Ne-Xe as a main component was hermetically sealed at 400 to 550 hPa into the panel to produce a PDP.

A voltage of 250 V was applied between the discharge electrodes on the front panel using the PDP, and the discharge display cells emitted light. When voltage pulses with image information were applied to the address electrodes on the back plate and the discharge electrodes on the front plate,
A good image could be displayed.

Example 2 PbO having an average particle size of 1.0 μm
A paste was prepared by adding Zn metal powder, Al metal powder, SnO powder, ZnO powder, acrylic resin, solvent, dispersant, and plasticizer to —SiO ₂ —B ₂ O ₃ glass powder and kneading them.

On the other hand, a roll-shaped forming die made of metal having a groove for forming a protruding member formed body is prepared.
The above-mentioned paste 2 for forming the projection member was applied.
An acrylic substrate having a size of 50 mm × 200 mm × 0.5 mm was prepared, and the mold was rotated while pressing the paste layer with the mold to obtain a support substrate having a projection member molded body formed on the surface. The groove has a vertical shape and a depth of 3
The pitch was 840 μm in a striped arrangement of 00 μm and width of 100 μm. It should be noted that a thickness of 2
A connecting portion of 0 μm was formed. Further, an adhesive composed of a low-melting glass and a polyolefin resin was formed on the upper end surface of the protrusion member molded body by using a printing method.

On the other hand, a nickel paste was applied on the same soda lime glass substrate as in Example 1 by a screen printing method and baked to form a discharge electrode to form a back plate, and, on the other hand, two electrodes between the projecting members. The support substrate with the protruding member and the back plate are bonded together so that
After heating to 0 ° C. for bonding, the substrate was heated to 560 ° C., the protruding member and the back plate were integrated, and the supporting substrate was incinerated. Further, the connecting portion formed on the top of the projecting member was removed, and the unevenness of the top was reduced to 5 μm or less.

On the obtained substrate (back plate) with the protrusion members (spacers), 250 μm of 50 μm thickness
A dielectric substrate made of mx 200 mm glass was bonded. Further, a peripheral portion of the back plate and the front plate was sealed with a frit sealant made of low melting point glass to form a panel. Then, a discharge gas containing Ne-Xe as a main component was hermetically sealed in the panel, and a front plate having electrodes substantially orthogonal to electrodes of a back plate was bonded on a dielectric substrate via a liquid crystal layer. It was also confirmed that no cracks, cracks, or the like occurred in the dielectric substrate in the panel sealing and gas sealing steps.

A discharge voltage of 35 was applied to the obtained PALC panel.
The liquid crystal could be driven by applying 0V and the data voltage.

Example 3 SiO having an average particle size of 0.8 μm
Against ₂ -B ₂ O ₃ -ZnO glass powder, Si metal, S
An nO powder, an epoxy resin, a solvent, and a dispersant were added and kneaded to prepare a paste. Also, a mold made of silicone rubber having a protrusion member molded body and a groove for forming a connecting portion is prepared, and the paste for forming the protrusion member is filled in the groove and defoamed. 100mm
A 0.5 mm acrylic substrate is pressed into the groove,
By heating to 30 ° C., an acrylic substrate having a protruding member formed body formed on the surface was obtained. The grooves of the projecting members were vertically arranged in a striped arrangement having a depth of 1500 μm and a width of 150 μm, and the pitch was 6000 μm. The groove of the connecting portion is provided in a direction substantially orthogonal to the stripe and has a depth of 50.
μm, a width of 300 μm, and a pitch of 600 μm, and a connecting portion having a thickness of 50 μm was formed between the projecting members.

Next, the acrylic substrate was erased at 500 ° C. to obtain a member comprising a projecting member and a connecting portion. In addition,
In order to obtain a strength that can withstand a subsequent process, a butyral resin was applied to the surface of the connecting portion of the member opposite to the surface on which the protrusion member was formed, and an aluminum substrate was bonded.

On the other hand, an electrode and an insulating layer were formed on the same glass substrate as in Example 1 to form a field emission device, which was used as a back plate. Further, a black matrix and a phosphor were sequentially formed on the surface of a glass substrate having the same shape. Further, after forming a filming layer made of an acrylic resin, aluminum was evaporated to a thickness of 100 nm by an evaporation method. This was heat-treated at 400 ° C. to obtain a front plate.

Next, after a paste made of low-melting glass and epoxy resin is placed on the upper end surface of the support substrate with the projection members by using a printing method, the black matrix and the projections are aligned so as to be in contact with each other. Then, four support substrates with the protrusion members were placed on the front plate. Furthermore, this is 120 ° C
After fixing the protrusion member molded body and the front plate, the mold was released, and further heated to 420 ° C. to integrate the protrusion member and the front plate, and the support substrate was separated from the protrusion member. Further, the frame body was arranged around the protrusions, and then the back plate and the front plate were sealed. The inside of the panel was evacuated to a vacuum of 10 ⁻³ Pa or less, and then sealed to obtain an FED panel.

When a voltage of 50 V was applied to the electron-emitting device and a voltage of 7 kV was applied between the front plate and the back plate, electrons were emitted, the phosphor emitted light, and it was confirmed that an image could be displayed well.

Example 4 Na _{2 having an} average particle size of 1.0 μm
For OB ₂ O ₃ —SiO ₂ glass powder, Mg metal,
A paste was prepared by adding and kneading Si metal, butyral resin, a solvent, and a dispersant.

On the other hand, a roll-shaped forming die made of a metal having a groove for forming a projecting member formed body is prepared.
After filling and drying the paste for forming the protrusion member in the groove, the surface is provided with an adhesive layer made of a silicone-based adhesive and a low-melting glass, and has a size of 250 mm × 200 mm × 0.5 m.
m porous substrate as a support substrate and pressed against the groove,
By rotating the molding die, a support substrate having a projection member molded body formed on the surface was obtained. The grooves were arranged in a vertical shape in a stripe pattern having a depth of 1200 μm and a width of 120 μm, and the pitch was set to 2000 μm. Porous substrate has porosity of 4
0%, 3-point bending strength based on JISR1601 is 50M
An alumina substrate of Pa was used. Then, the support substrate with the protrusion member was fired at 650 ° C. to obtain a support substrate with the protrusion member made of glass ceramic. Further, a paste made of a mixture of a low melting point glass and an epoxy resin was formed on the top of the projection member by using a printing method.

On the other hand, the rear plate and the front plate were formed in the same manner as in Example 3, and the front plate was positioned so that the projection member was placed at the black matrix forming position. The supporting substrate was placed. Then, this was heated to 130 ° C., and after fixing the protruding member molded body and the back plate, it was heated to 420 ° C. to integrate the protruding member and the back plate. Thereafter, the supporting substrate was removed by grinding.

Then, a frame was placed on the periphery of the front plate and the back plate and bonded and sealed, and the back plate and the top of the spacer of the front plate were bonded to form a panel. Further, the inside of the panel was evacuated to a vacuum of 10 ⁻³ Pa or less, and then sealed to obtain an FED panel.

When a voltage of 50 V is applied to the electron-emitting device and a voltage of 3 kV is applied between the front panel and the rear panel to the obtained FED panel, electrons are emitted, the phosphor emits light, and a good image is displayed. I was sure that.

(Comparative Example) The support substrate with the porosity of 3% or less and a strength of 250 M was used for the support substrate with the protrusion member of Example 4.
Except for replacing with the alumina ceramic of Pa, a supporting substrate with a protruding member was prepared in the same manner as in Example 4, and the supporting member was stuck at a predetermined position on the front plate after the top of the protruding member as in Example 4. As a result of the grinding, the spacer was chipped or cracked when the support member was ground.

[0077]

As described above in detail, according to the present invention, the front plate or the back plate can be easily and inexpensively manufactured with good dimensional accuracy without damaging the phosphors and electrodes existing on the front plate and the back plate surface. A support substrate with a protrusion member that can form a protrusion member (spacer) on the surface of the face plate can be manufactured.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a support substrate with a projection member of the present invention.

FIG. 2 is a schematic perspective view showing a shape of a connecting member of the supporting substrate with a protrusion member of the present invention.

FIG. 3 is a schematic perspective view showing another supporting substrate with a protrusion member of the present invention.

FIG. 4 is a schematic sectional view showing an FED which is an example of an image forming apparatus which is a preferable application example of the support substrate with a projection member of the present invention.

[Explanation of symbols]

 1, 7, a support member with a projection member 2, 8, a support substrate 3, an adhesive layer 4, a projection member 5, an adhesive 6, a connecting portion 11, Image forming apparatus (FED) 12 ・ ・ ・ Back plate 13 ・ ・ ・ Front plate 14 ・ ・ ・ Protrusion member (spacer) 16 ・ ・ ・ Emission device 17 ・ ・ ・ Phosphor 18 ・ ・ ・ Diffusion prevention layer 19 ・ ・・ Black matrix 20 ・ ・ ・ ITO film 21 ・ ・ ・ Frame

Continuation of the front page F term (reference) 5C012 AA09 BB07 BC03 5C032 AA07 CD06 5C036 EF01 EF06 EG02 EG50 5C040 GF02 GF18 GF19 HA01 HA02

Claims (11)

[Claims] 1. A plurality of projecting members having the same height are fixed to one surface of a supporting substrate via an adhesive whose adhesive force is reduced by heat or light, with a predetermined interval therebetween. Support substrate with a projection member. 2. A supporting substrate with a projecting member, wherein a plurality of projecting members having the same height are fixed on one surface of a supporting substrate having a strength of 100 MPa or less with a predetermined interval therebetween. 3. The supporting substrate with projection members according to claim 2, wherein said supporting substrate is made of a porous ceramic having a porosity of 10 to 70%. 4. The supporting substrate according to claim 3, wherein the porous ceramic is made of at least one selected from the group consisting of mullite, alumina, and cordierite. 5. The projection member according to claim 1, wherein the adjacent projection members are formed on the surface of the support substrate and are connected by a connection part made of the same component as the projection member. A support substrate with the protrusion member according to the above. 6. The supporting substrate with a protruding member according to claim 1, wherein the protruding member is formed of a molded body containing glass powder and / or ceramic powder. 7. The semiconductor device according to claim 7, wherein said projecting member is made of Si, Zn, Al, Sn,
The support substrate with a projection member according to claim 6, wherein the support substrate includes at least one metal selected from the group consisting of Cu and Mg. 8. The supporting substrate with a protruding member according to claim 6, wherein the protruding member can be fired at a temperature of 600 ° C. or less. 9. A supporting substrate with a projecting member according to claim 1, wherein a fixing agent is applied to the top of said projecting member. 10. The support substrate with a projection member according to claim 9, wherein the fixing agent contains a low-melting glass having a strain point of 450 ° C. or less. 11. A method for manufacturing an image forming apparatus, comprising a plurality of projecting members disposed between a front plate and a rear plate, which are disposed in parallel at a predetermined interval. 11. The image forming method according to claim 1, wherein the top surface of the projecting member of the supporting substrate with the projecting member according to claim 1 is affixed to the surface of the face plate or the back plate, and the supporting substrate is removed. Device manufacturing method.