JPH11245497A - Method for forming pattern and patterned substrate - Google Patents

Method for forming pattern and patterned substrate

Info

Publication number
JPH11245497A
JPH11245497A JP10047195A JP4719598A JPH11245497A JP H11245497 A JPH11245497 A JP H11245497A JP 10047195 A JP10047195 A JP 10047195A JP 4719598 A JP4719598 A JP 4719598A JP H11245497 A JPH11245497 A JP H11245497A
Authority
JP
Japan
Prior art keywords
intaglio
ink
pattern
intermediate transfer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10047195A
Other languages
Japanese (ja)
Inventor
Masayoshi Kobayashi
正芳 小林
Eizaburo Watanabe
英三郎 渡邊
Hiroshi Matsuzawa
宏 松澤
Ryuichi Nakamura
隆一 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP10047195A priority Critical patent/JPH11245497A/en
Publication of JPH11245497A publication Critical patent/JPH11245497A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Printing Methods (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To form fine patterns of enameled pottery, fluorescent display devices, gas discharge panels, printed wirings, hybrid integrated circuits, etc., thick and finely to substrates by using an intaglio and filling different kinds of ink in the intaglio by screen printing. SOLUTION: A screen printing plate having patterns of the same shape is used to print an ink 20 to an intaglio 10. Similarly, different kinds of ink 20 are printed, thereby forming a design. A fluorescent ink pattern of red, blue and green is filled in the intaglio 10. The intaglio 10 is united with an intermediate transfer body 30 having a melting adhesive 40 applied on a surface, heated and pressured under a reduced pressure thereby being bonded. After cooled, the intermediate transfer body 30 is separated from the intaglio 10. An ink 50 is further printed and applied to the whole pattern on the ink 20, etc., on the transfer body 30, on which an adhesive 80 of a thermosetting resin is printed and applied. The transfer body is united with a substrate 70 and, an electrode pattern 60 is registered at a predetermined position and heated and bonded. Thereafter, the transfer body 30 is separated from the substrate 70 after heated. so that the ink 20, etc., are transferred to the substrate 70.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、陶器の絵付けや蛍
光表示装置、ガス放電パネル、印刷配線板、混成集積回
路等に於ける抵抗素子など電子工業部品作成の微細パタ
ーンを形成する方法及びパターンの形成された基板に係
わり、特に大面積で同時に高精細も要求されるプラズマ
ディスプレイやプラズマアドレス液晶に於ける電極やバ
リアリブなどの厚膜パターンを形成するための精細なパ
ターンを形成する方法及びパターンの形成された基板に
関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming a fine pattern for producing electronic industrial parts such as a ceramic element, a fluorescent display device, a gas discharge panel, a printed wiring board, and a resistance element in a hybrid integrated circuit. A method of forming a fine pattern for forming a thick film pattern such as an electrode or a barrier rib in a plasma display or a plasma addressed liquid crystal which is required to have a large area and a high definition at the same time, which relates to a substrate on which a pattern is formed, and It relates to a substrate on which a pattern is formed.

【0002】[0002]

【従来の技術】いわゆる注型法や型取り法は多くの産業
分野で広く用いられている、またスクリーン印刷法も同
様でありグラフィク印刷、エレクトロニクス分野に於い
て広く用いられている。
2. Description of the Related Art The so-called casting method and molding method are widely used in many industrial fields, and the screen printing method is the same, and is widely used in the graphic printing and electronics fields.

【0003】たとえばプラズマディスプレイやプラズマ
アドレス液晶ディスプレイに於けるバリアリブなどの厚
膜パターンを形成するためにスクリーン印刷法が用いら
れている、また感光性ペーストの塗布乾燥露光の繰り返
し後に現像しパターンを形成することも行われている。
更に感光性ペーストの代わりに感光性シートつまりグリ
ーンシートを用いる方法もある。また基板上の感光性ド
ライフィルムを予めパターン形成し、パターンの凹部に
ペーストを埋め込み所望のペーストパターンを得る方法
もある。
For example, a screen printing method is used to form a thick film pattern such as a barrier rib in a plasma display or a plasma addressed liquid crystal display, and a pattern is formed by repeating the application of a photosensitive paste, followed by drying and exposure. It has also been done.
Further, there is a method using a photosensitive sheet, that is, a green sheet, instead of the photosensitive paste. There is also a method in which a photosensitive dry film on a substrate is preliminarily formed into a pattern, and a paste is embedded in a concave portion of the pattern to obtain a desired paste pattern.

【0004】これらのパターンに対する要求特性には、
精細でありパターンの厚さがおおよそ100μm以上で
特にパターンの幅は狭くパターンの厚さが厚いなどがあ
り、かつパターンを形成したペーストを高温で焼成する
ことによりガラス基板と融着もしくは粉体としてガラス
基板上に堆積することが望ましいとされている。
The characteristics required for these patterns include:
It is fine and the pattern thickness is about 100 μm or more, especially the pattern width is narrow and the pattern thickness is thick, etc., and the pattern-formed paste is baked at high temperature to fuse with the glass substrate or powder It is desirable to deposit on a glass substrate.

【0005】最近のスクリーン印刷の電子工業への適
用、特にプラズマディスプレイパネルやプラズマアドレ
ス液晶ディスプレイの製造工程では大面積のガラス基板
に対して電極ペーストやバリアリブペーストなどの印刷
に於いて、微細パターンを有する高度な印刷技術を用い
ている。電極パターンやバリアリブパターンの形成に於
いてはこれら多数回の印刷を重ねた後焼成して所望のパ
ターンを得ている。また蛍光体の形成では形成されたリ
ブの間にスクリーン印刷法で蛍光体を含んだペーストを
流し込み、焼成して形成している。
[0005] The recent application of screen printing to the electronics industry, especially in the process of manufacturing plasma display panels and plasma addressed liquid crystal displays, involves printing fine electrode patterns and barrier rib pastes on large-area glass substrates. Advanced printing technology with In forming an electrode pattern and a barrier rib pattern, these multiple times of printing are repeated and then fired to obtain a desired pattern. In the formation of the phosphor, a paste containing the phosphor is poured into the formed ribs by a screen printing method, and the paste is baked.

【0006】しかしながら従来のスクリーン印刷印刷法
には以下のような欠点がある。電極ペーストでは最低2
回の印刷を、バリアリブパターンの印刷では6から数十
回の印刷を重ねるなど多くの工程が必要になり、印刷位
置精度のバラツキやゴミ等による欠陥発生によりパター
ンの歪みや断線などが発生する。つまりスクリーン印刷
法には基本的に欠陥の発生しやすさが存在し、印刷の重
ねを行うことは不確実な加工の繰り返しを行うことにな
り、これらが起因して充分な収率を確保できないでい
る。
However, the conventional screen printing method has the following disadvantages. At least 2 for electrode paste
In the printing of the barrier rib pattern, many steps such as printing six to several tens of times are required, and the pattern is distorted or disconnected due to a variation in the printing position accuracy or a defect due to dust or the like. . In other words, the screen printing method basically has a tendency to generate a defect, and performing the printing overlapping means repeating the uncertain processing, and due to these, a sufficient yield cannot be secured. In.

【0007】蛍光体パターンの形成に於いてはRGB各
色一回のスクリーン印刷を行って、蛍光体ペーストをバ
リアリブパターンの間に流し込み、各印刷毎に乾燥して
いる。しかしバリアリブパターンの形成の際に焼成の製
造工程があり大面積のガラス基板は若干の収縮が発生す
る。一方スクリーン印刷では版と印刷パターンのズレつ
まり印刷パターンの歪みが発生し完全には防止できない
でいる。この歪みと前記収縮はプラズマディスプレイパ
ネルやプラズマアドレス液晶ディスプレイの微細パター
ン製造に於いては製造許容誤差を越える値になってしま
う。つまり色ムラや色ズレの不良となっている。これら
歪みや前記収縮を予め予測しスクリーン印刷版や原版の
スケーリング、つまり寸法を修正した版を製作し用いる
などの方法も用いられているが、やはり完全なパターン
の一致を得ることはできないでいる。
In forming the phosphor pattern, screen printing is performed once for each color of RGB, and a phosphor paste is poured between the barrier rib patterns, and dried for each printing. However, when forming the barrier rib pattern, there is a manufacturing process of baking, and the glass substrate having a large area slightly shrinks. On the other hand, in screen printing, a deviation between the plate and the print pattern, that is, distortion of the print pattern occurs, and cannot be completely prevented. The distortion and the shrinkage result in a value exceeding a manufacturing tolerance in manufacturing a fine pattern of a plasma display panel or a plasma addressed liquid crystal display. That is, color unevenness and color shift are defective. Although such distortion and the shrinkage are predicted in advance, a method of scaling a screen printing plate or an original plate, that is, producing and using a plate whose dimensions are corrected is also used, but it is still impossible to obtain a perfect pattern match. .

【0008】一方感光性ペーストを用い塗布乾燥露光の
繰り返し後に現像しパターンを形成する方法では、多数
回の繰り返しを行うことにより生産設備や加工工程の増
大や低い生産性などが問題となっている。この方法では
繰り返しの削減のため一回で塗布するペーストの厚さを
厚くすることが検討されている。しかし露光時に未露光
部となるべき部分に露光部分から散乱光が回り込み、露
光部分のパターンを太らせることになってしまう基本的
な欠陥がある。従ってこれら露光した積層体を現像した
ところで精細なパターンを容易に得ることはできないで
いる。
On the other hand, in the method of forming a pattern by repeating the application, drying and exposure using a photosensitive paste, a problem arises in that the number of production facilities and processing steps is increased and the productivity is low due to the repetition of a large number of times. . In this method, it has been studied to increase the thickness of the paste applied at one time in order to reduce repetition. However, there is a basic defect that scattered light from the exposed portion wraps around the portion that should be an unexposed portion at the time of exposure, causing the pattern of the exposed portion to become fat. Therefore, a fine pattern cannot be easily obtained when these exposed laminates are developed.

【0009】感光性シートつまりグリーンシートを用い
る方法についても前記と同様である。
A method using a photosensitive sheet, that is, a green sheet, is the same as described above.

【0010】基板上の感光性ドライフィルムを予めパタ
ーン形成し、パターンの凹部にペーストを埋め込み所望
のペーストパターンを得る方法については、比較的高価
なドライフィルムを用いる欠点がある。またパターンの
凹部にペーストを埋め込む際に、ペースト内部に気泡が
混入し易くパターンの欠けの欠陥になることが多く、ド
ライフィルム上に塗布したペーストを除去する工程も必
要で、硬化したペーストを研磨除去することは容易でな
い。またドライフィルムを除去する際にペーストパター
ンを破壊せずに剥離することは容易でない。
The method of forming a pattern on a photosensitive dry film on a substrate in advance and embedding a paste in a concave portion of the pattern to obtain a desired paste pattern has a drawback of using a relatively expensive dry film. In addition, when embedding the paste in the concave portions of the pattern, bubbles are easily mixed into the paste, which often causes defects in the pattern, and a step of removing the paste applied on the dry film is also necessary. It is not easy to remove. Further, it is not easy to remove the dry film without destroying the paste pattern.

【0011】これら電子工業部品以外にも陶磁器の絵付
け等に於いていくつかの方法が用いられている。発色顔
料を含んだ釉薬を筆で直接塗布する方法や柔軟な紙等に
予めスクリーン印刷法やオフセット法で水溶性の転写紙
などに絵付けし、仮焼きした陶磁器などに転写紙を張り
付け、その後高温で焼成し形成する方法がある。しかし
筆で直接塗布する方法では微細な絵付けをすることは部
分的には可能でも、大型の絵付けを規定の位置に完全に
行うことは不可能であり、大量生産も不可能である。ま
た転写法に於いてはかなりの精度で絵付けを行うことが
でき、また大量生産も可能である。しかし転写紙を形成
する方法、つまりスクリーン印刷法の限界として線幅が
100μm程度を形成することが限界であり、絵付けの
厚さは焼成前で20μm程度が限界で、更に厚く絵付け
することは不可能である。またオフセット印刷法を用い
て転写紙を形成する方法に於いては、印刷膜厚が薄く顔
料濃度を高めるなどの工夫で、微細な絵付けが可能であ
る。しかし、絵付けの厚さはスクリーン印刷法で形成し
た転写紙を用いる方法より薄く、深みのある絵付けは不
可能である。
In addition to these electronic industrial parts, several methods are used for painting ceramics and the like. A method of directly applying a glaze containing a coloring pigment with a brush, painting a water-soluble transfer paper or the like in advance on a flexible paper by screen printing or offset method, pasting the transfer paper on a calcined ceramic, etc. There is a method of firing and forming at a high temperature. However, with the method of direct application with a brush, fine painting can be partially performed, but it is impossible to completely apply a large painting to a predetermined position, and mass production is also impossible. In addition, in the transfer method, painting can be performed with considerable accuracy, and mass production is also possible. However, the method of forming transfer paper, that is, the screen printing method has a limit of forming a line width of about 100 μm, and the thickness of the painting is about 20 μm before baking, and the painting must be thicker. Is impossible. In addition, in the method of forming the transfer paper by using the offset printing method, fine painting can be performed by devising, for example, increasing the pigment concentration with a thin print film thickness. However, the thickness of the painting is thinner than the method using transfer paper formed by the screen printing method, so that a deep painting is impossible.

【0012】[0012]

【発明が解決しようとする課題】本発明は、以上のよう
な問題点に着目してなされたものであり、陶器の絵付け
や蛍光表示装置、ガス放電パネル、印刷配線板、混成集
積回路等に於ける抵抗素子など電子工業部品作成の微細
パターンを形成する方法に於いて、基板等に厚くかつ精
細なパターンを形成する方法を提供することを課題とす
る。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and includes painting of ceramics, fluorescent display devices, gas discharge panels, printed wiring boards, hybrid integrated circuits, and the like. It is an object of the present invention to provide a method for forming a fine and fine pattern on a substrate or the like in a method for forming a fine pattern for producing an electronic industrial component such as a resistance element.

【0013】[0013]

【課題を解決するための手段】本発明は上記課題を解決
するために、請求項1の発明に於いては、陶器の絵付
け、蛍光表示装置、ガス放電パネル、印刷配線板、混成
集積回路等に於ける微細パターンを形成する方法に於い
て、凹版を用い、その凹版に異なった種類のインキをス
クリーン印刷法で充填することを特徴とするパターン形
成方法、としたものである。
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention is directed to the invention of claim 1, wherein a ceramic painting, a fluorescent display device, a gas discharge panel, a printed wiring board, a hybrid integrated circuit are provided. And the like. In the method of forming a fine pattern in the above method, an intaglio plate is used, and the intaglio plate is filled with a different type of ink by a screen printing method.

【0014】また、請求項2の発明に於いては、凹版を
用い、その凹版にインキをスクリーン印刷法で充填する
工程、凹版のインキが硬化した後、中間転写体に転写す
る工程、中間転写体または基板に接着剤を塗布する工
程、被形成体たる基板に前記接着剤を介して中間転写体
を接着する工程、中間転写体を引き剥がす工程、を具備
することを特徴とするパターン形成方法、としたもので
ある。
According to the second aspect of the present invention, a step of using an intaglio, filling the intaglio with ink by a screen printing method, a step of transferring the intaglio ink to an intermediate transfer member after the ink is cured, A step of applying an adhesive to a body or a substrate, a step of bonding an intermediate transfer body to the substrate as a formation target via the adhesive, and a step of peeling off the intermediate transfer body. ,

【0015】また、請求項3の発明に於いては、凹版を
用い、その凹版にインキをスクリーン印刷法で充填する
工程に於いて、異なった種類のインキをその凹版に充填
することを特徴とする請求項2記載のパターン形成方
法、としたものである。
According to a third aspect of the present invention, in the step of using an intaglio and filling the intaglio with ink by screen printing, different types of ink are filled in the intaglio. A pattern forming method according to claim 2.

【0016】また、請求項4の発明に於いては、インキ
として、シリコーン樹脂や汎用樹脂と、パターン形成の
体質顔料を混練したインキを用いることを特徴とする請
求項2記載のパターン形成方法、としたものである。
According to a fourth aspect of the present invention, there is provided the pattern forming method according to the second aspect, wherein an ink obtained by kneading a silicone resin or a general-purpose resin with an extender for pattern formation is used as the ink. It is what it was.

【0017】また、請求項5の発明に於いては、凹版の
インキが硬化した後、中間転写体に転写する工程に於い
て、凹版又は中間転写体に熱溶融接着剤を塗布し、この
熱溶融接着剤により中間転写体に転写することを特徴と
する請求項2記載のパターン形成方法、としたものであ
る。
According to a fifth aspect of the present invention, in the step of transferring the ink to the intermediate transfer member after the ink of the intaglio has been cured, a hot-melt adhesive is applied to the intaglio or the intermediate transfer member. 3. The pattern forming method according to claim 2, wherein the pattern is transferred to an intermediate transfer member by a molten adhesive.

【0018】また、請求項6の発明に於いては、中間転
写体または基板に接着剤を塗布する工程に於いて、接着
剤に体質顔料を混練した熱硬化樹脂を用いる請求項2記
載のパターン形成方法、としたものである。
Further, in the invention according to claim 6, in the step of applying an adhesive to the intermediate transfer member or the substrate, a thermosetting resin obtained by kneading an extender with the adhesive is used. Forming method.

【0019】また、請求項7の発明に於いては、凹版を
用い、その凹版に、シリコーン樹脂や汎用樹脂と、パタ
ーン形成の体質顔料を混練したインキをスクリーン印刷
法で充填する工程、凹版のインキが硬化した後、その凹
版または中間転写体に熱溶融接着剤を塗布し、この熱溶
融接着剤により、中間転写体に転写する工程、中間転写
体または基板に体質顔料を混練した熱硬化樹脂を用いた
接着剤を塗布する工程、被形成体たる基板に前記接着剤
を介して中間転写体を接着する工程、中間転写体と基板
等を加熱し、中間転写体を引き剥がす工程、を具備する
ことを特徴とするパターン形成方法、としたものであ
る。
According to a seventh aspect of the present invention, an intaglio is used, and the intaglio is filled with an ink obtained by kneading a silicone resin or a general-purpose resin and a pattern-forming extender by a screen printing method. After the ink has been cured, a hot-melt adhesive is applied to the intaglio or intermediate transfer body, and the hot-melt adhesive is used to transfer to the intermediate transfer body. A step of applying an adhesive using a method, a step of bonding an intermediate transfer body to the substrate as a formation target via the adhesive, a step of heating the intermediate transfer body and the substrate, and peeling off the intermediate transfer body. A pattern forming method.

【0020】更にまた、請求項8の発明に於いては、微
細なパターンの形成された基板であって、この基板上に
体質顔料を混練した熱硬化樹脂を用いた接着剤を介して
パターンが形成されており、このパターンはシリコーン
樹脂や汎用樹脂とパターン形成の体質顔料を混練したイ
ンキよりなるものであることを特徴とするパターンの形
成された基板、としたものである。
Further, according to the invention of claim 8, there is provided a substrate on which a fine pattern is formed, and the pattern is formed on the substrate via an adhesive using a thermosetting resin kneaded with an extender pigment. This pattern is a substrate on which a pattern is formed, which is made of an ink obtained by kneading a silicone resin or a general-purpose resin and an extender for forming a pattern.

【0021】[0021]

【発明の実施の形態】以下、本発明の実施の形態を詳細
に説明する。本発明のパターン形成方法は凹版にスクリ
ーン印刷法でインキ等を充填し硬化させることを特徴と
するものであり、スクリーン印刷版やインキ等を多数用
いることにより、多色のインキパターンを凹版上に形成
できる。つまり凹版上の一部の凹部にスクリーン印刷法
で色インキを充填し、このインキと異なる色インキを凹
版上の他の部分に充填することを繰り返すと、凹版上に
色分けしたパターンが形成できる。該インキ等はシリコ
ーン樹脂やポリスチレン、エポキシ等汎用樹脂を単独も
しくは混合して用い、必要であれば適当な溶剤で希釈し
たメジウムに蛍光体や着色顔料、低融点ガラス等を混練
して用いることができ、印刷後硬化が速やかで、割れな
どしないものが好ましい。
Embodiments of the present invention will be described below in detail. The pattern forming method of the present invention is characterized in that the intaglio is filled with ink or the like by a screen printing method and cured, and by using a large number of screen printing plates or inks, a multicolor ink pattern is formed on the intaglio. Can be formed. That is, by repeatedly filling a color ink in a part of the intaglio with the screen ink by a screen printing method and filling another part of the intaglio with a color ink different from this ink, a color-coded pattern can be formed on the intaglio. The inks and the like may be used alone or in combination with a general-purpose resin such as a silicone resin, polystyrene, or epoxy.If necessary, a medium diluted with an appropriate solvent may be mixed with a phosphor, a coloring pigment, a low-melting glass, or the like. It is preferable that the resin can be cured quickly after printing and does not crack.

【0022】本発明のパターン形成方法は凹版に充填し
たインキ等を硬化した後転写することを特徴とするもの
である。まず中間転写体に熱溶融樹脂、いわゆるホット
メルト接着剤を塗布し、塗布面を凹版に押し当てながら
熱ロールでラミネートする。この場合中間転写体はステ
ンレス板やインバー板を用いることができ、熱溶融樹脂
を塗布しながらラミネートすることもできる。また熱ロ
ールでなく平プレスを用いることも可能である。これら
の方法で接着した中間転写体を凹版から引き剥がすとイ
ンキは熱溶融樹脂に接着し凹版から剥がれて中間転写体
に転移する。この際インキは通称通常の印刷と異なり、
凹版内のインキ全てを転移させることができる。
The pattern forming method of the present invention is characterized in that the ink or the like filled in the intaglio is cured and then transferred. First, a hot-melt resin, a so-called hot melt adhesive, is applied to the intermediate transfer body, and the intermediate transfer body is laminated with a hot roll while pressing the applied surface against the intaglio. In this case, a stainless plate or an invar plate can be used as the intermediate transfer member, and the intermediate transfer member can be laminated while applying a hot-melt resin. It is also possible to use a flat press instead of a hot roll. When the intermediate transfer member adhered by these methods is peeled off from the intaglio, the ink adheres to the hot-melt resin, peels off from the intaglio, and transfers to the intermediate transfer member. In this case, the ink is different from common printing,
All of the ink in the intaglio can be transferred.

【0023】本発明のパターン形成方法は前記中間転写
体に体質顔料を混練した接着剤を塗布し転写することを
特徴とするものである。接着剤としてエポキシ、シリコ
ーン等加熱もしくは常温で硬化する樹脂に着色顔料、低
融点ガラス等を混練して用いることができる。中間転写
体と被パターン形成体たるガラス等の基板を合わせ平プ
レス機やロール式ラミネートプレス機で接着し接着剤を
硬化させる。更にホットメルト接着剤の溶融温度以上に
加熱すると容易に中間転写体をガラス等の基板等から剥
離する事ができる。これらの結果得られた基板等を高温
で焼成することによって陶器の絵付けや電子工業部品等
の微細パターンを形成することができる。
The pattern forming method of the present invention is characterized in that an adhesive obtained by kneading an extender is applied to the intermediate transfer member and transferred. A coloring pigment, a low-melting glass, or the like can be kneaded with a resin such as epoxy or silicone that cures at heating or at room temperature as an adhesive. The intermediate transfer body and a substrate such as glass as a pattern forming body are bonded together by a flat press machine or a roll laminating press machine to cure the adhesive. Further, when the intermediate transfer member is heated to a temperature higher than the melting temperature of the hot melt adhesive, the intermediate transfer member can be easily peeled off from a substrate such as glass. By firing the resulting substrate or the like at a high temperature, fine patterns such as pottery painting and electronic industrial parts can be formed.

【0024】本発明の方法によれば微細なパターンつま
り幅が50μm程度でパターンの高さつまりインキ等の
厚さが150μm程度の厚い絵柄を形成することができ
る。また絵柄は任意に色分けでき、一般のカラー印刷物
程度の微細なパターンをガラス基板等に形成できる。
According to the method of the present invention, a thick pattern having a fine pattern, that is, a width of about 50 μm, and a pattern height, that is, a thickness of ink or the like of about 150 μm, can be formed. In addition, the pattern can be arbitrarily color-coded, and a fine pattern comparable to a general color print can be formed on a glass substrate or the like.

【0025】本発明による方法によれば、パターン形成
に凹版とスクリーン印刷法を用いるため微細なパターン
が形成でき、被転写体と同じ熱膨張計数のインバー等を
中間転写体に用いることによって、加工途中の温度によ
る寸法の変化を防止でき正確な絵付けができる。またこ
れら絵付けした基板を高温で焼成することによって陶器
の絵付けや蛍光表示装置、ガス放電パネルの基板を正確
に形成することが可能となる。
According to the method of the present invention, a fine pattern can be formed because the intaglio printing and the screen printing method are used for pattern formation. Dimensional changes due to intermediate temperatures can be prevented, and accurate painting can be performed. Further, by firing these painted substrates at a high temperature, it becomes possible to accurately form ceramic painting, a fluorescent display device, and a substrate for a gas discharge panel.

【0026】[0026]

【実施例】<実施例1>本発明のパターン形成方法を工
程図1に示す。図1(a)は凹版の断面図を示し、深さ
200μmで頂部の幅50μmの広さ800×600m
mのストライプパターンを配置したサイズ900×75
0×4.5mmの凹版である。版の材料としてポリカー
ボネート、アクリル等の樹脂、好ましくはガラス基板と
同じ熱膨張計数を持つ42アロイがよい。または42ア
ロイの表面にこれら樹脂を皮膜状に形成しその樹脂表面
に上記ストライプパターンを配置した凹版を用いること
もできる。
<Embodiment 1> A process for forming a pattern according to the present invention is shown in FIG. FIG. 1 (a) is a cross-sectional view of an intaglio plate, having a depth of 200 μm, a top width of 50 μm, and a width of 800 × 600 m.
900 × 75 size with m stripe pattern
It is an intaglio of 0 × 4.5 mm. As a material for the plate, a resin such as polycarbonate or acrylic, preferably a 42 alloy having the same coefficient of thermal expansion as that of the glass substrate is used. Alternatively, an intaglio in which these resins are formed into a film on the surface of a 42 alloy and the above-mentioned stripe pattern is disposed on the surface of the resin may be used.

【0027】図1(a)に示す凹版10に凹版のパター
ンの一部分と一致する同じ形状のパターンを有するスク
リーン印刷版を用いてインキ20をスクリーン印刷す
る。スクリーン印刷前に凹版10の表面に剥離剤;ダイ
キン工業製ダイフリーGA6310を塗布することは好
ましい。更に異なる種類のインキ21等を同様の手法を
用いて凹版に印刷し絵柄を形成する。ここで用いるイン
キは紫外線によって発光する蛍光体をシリコーン樹脂等
に混連し作成できる。また蛍光体の種類を選ぶことによ
り赤青緑の各色の蛍光体パターンを形成するためのイン
キを製造できる。またシリコーン樹脂の替わりにアクリ
ル、ウレタン、ポリスチレン、エポキシ等の樹脂または
これらに適当な溶剤を加えて用いることができるが、好
ましくは付加重合型のシリコーン樹脂がよい。例えば東
芝シリコーン(株)製TSE3450を50部、蛍光体
粉末50部を混連したものが好適である。
The ink 20 is screen-printed on the intaglio 10 shown in FIG. 1A by using a screen printing plate having a pattern of the same shape corresponding to a part of the pattern of the intaglio. It is preferable to apply a release agent; Daifree GA6310 manufactured by Daikin Industries, Ltd. to the surface of the intaglio 10 before screen printing. Further, a different type of ink 21 or the like is printed on the intaglio using the same method to form a picture. The ink used here can be prepared by mixing a phosphor emitting light by ultraviolet rays with a silicone resin or the like. In addition, by selecting the type of phosphor, an ink for forming a phosphor pattern of each color of red, blue and green can be manufactured. Further, instead of the silicone resin, a resin such as acryl, urethane, polystyrene, epoxy or the like or an appropriate solvent can be added thereto, and an addition polymerization type silicone resin is preferable. For example, a mixture of 50 parts of TSE3450 manufactured by Toshiba Silicone Co., Ltd. and 50 parts of phosphor powder is preferable.

【0028】図1(b)にこれら3色の蛍光体インキパ
ターンを凹版10に充填した状態を示す。更に凹版のパ
ターンの頂部11の上に重なるように、スクリーン印刷
法でパターンを印刷しても良い。このインキは焼成後ガ
ラス溶融体となり黒色になるものが好ましい。このイン
キの成分として銅鉄クロム等を含む金属酸化物顔料と、
低融点ガラスの粉末と上記樹脂等を用いて混連し製造で
きる。
FIG. 1B shows a state in which the intaglio 10 is filled with these three color phosphor ink patterns. Further, the pattern may be printed by a screen printing method so as to overlap the top 11 of the intaglio pattern. It is preferable that this ink becomes a glass melt after firing and turns black. A metal oxide pigment containing copper iron chromium or the like as a component of the ink,
It can be manufactured by mixing the powder of the low melting point glass and the above-mentioned resin.

【0029】図1(c)に示す中間転写体30に対峙し
て凹版10を合わせ減圧下で両者を加圧加熱し接着した
後冷却するに。中間転写体30の表面には接着層の熱溶
融接着剤40が塗布形成してあり、加圧加熱されること
によりインキ20等と中間転写体30は熱溶融接着剤4
0を介して接着する。中間転写体30は42アロイやイ
ンバーを用いることができ、被転写体に青板ガラス基板
を用いる場合には42アロイを用いることが好適であ
り、板厚は0.1から0.5mmの弾性変形の範囲で曲
げられる程度の厚さが好ましい。
The intaglio plate 10 is brought into contact with the intermediate transfer body 30 shown in FIG. 1C, and the two are pressurized and heated under reduced pressure. A hot-melt adhesive 40 of an adhesive layer is applied and formed on the surface of the intermediate transfer member 30, and the ink 20 and the like and the intermediate transfer member 30 are heated and heated under pressure.
Glue through 0. The intermediate transfer member 30 can be made of 42 alloy or Invar. When a soda glass substrate is used for the transfer object, it is preferable to use 42 alloy, and the plate thickness is 0.1 to 0.5 mm. The thickness which can be bent in the range of is preferable.

【0030】上記接着した中間転写体30を凹版10か
ら引き剥がす。つまり中間転写体30を接着した面の隅
の部分から曲げながら引き剥がす。すると図1(d)に
示す中間転写体30上にインキのパターンが形成でき
る。
The bonded intermediate transfer member 30 is peeled off from the intaglio 10. That is, the intermediate transfer body 30 is peeled off while being bent from the corner of the surface to which the intermediate transfer body 30 is bonded. Then, an ink pattern can be formed on the intermediate transfer body 30 shown in FIG.

【0031】更に中間転写体30上のインキ20等のパ
ターン全体にスクリーン印刷法でインキ50を印刷塗布
する。このインキ50は酸化チタン等の白色金属酸化物
顔料5部から10部と、低融点ガラスの粉末40から8
0部、シリコーン、エポキシアクリレート、ウレタンア
クリレート等の硬化性樹脂のメジウム部20から40部
からなり、凹版10の凸部に対応する凹部に充分に充填
する。このインキ50の皮膜を加熱硬化させた後更に同
じインキをスクリーン印刷法で塗布し皮膜を形成しても
よい。更にこのインキ50の皮膜上に、クリーン印刷法
で熱硬化樹脂の接着剤80を印刷塗布すると、図1
(e)となる。この接着剤80は、低融点ガラス粉末4
0から80部、アルミナ等の金属酸化物顔料を2から2
0部、エポキシ樹脂20から60部からなる。このエポ
キシ樹脂は油化シェルエポキシ(株)製ビスフェノール
A型のエピコート828もしくはビスフェノールF型の
エピコート807等を用いることができ粘度の低いもの
が好ましい。また反応性希釈剤を加えた樹脂も使用可能
である。更にこの接着剤にはスクリーン印刷で使用する
直前に硬化剤を添加する。硬化剤はスクリーン印刷で必
要な作業時間を確保できるものを用いることができ、油
化シェルエポキシ(株)製のアミン系硬化剤のエポメー
トB−002の場合は、エポキシ樹脂100部に対して
硬化剤40から60部を用いる。
Further, an ink 50 is printed and applied to the entire pattern such as the ink 20 on the intermediate transfer member 30 by a screen printing method. This ink 50 is composed of 5 to 10 parts of a white metal oxide pigment such as titanium oxide, and 8 to 8 of a low melting glass powder.
0 to 40 parts of a medium portion of a curable resin such as silicone, epoxy acrylate, urethane acrylate, etc., which are sufficiently filled in the concave portions corresponding to the convex portions of the intaglio plate 10. After heating and curing the film of the ink 50, the same ink may be further applied by a screen printing method to form a film. Further, when an adhesive 80 of a thermosetting resin is printed and applied on the film of the ink 50 by a clean printing method, FIG.
(E). The adhesive 80 is made of low melting glass powder 4
0 to 80 parts, 2 to 2 parts of metal oxide pigment such as alumina
0 parts, 20 to 60 parts of epoxy resin. As this epoxy resin, Bisphenol A type Epicoat 828 or Bisphenol F type Epicoat 807 manufactured by Yuka Shell Epoxy Co., Ltd. can be used, and those having a low viscosity are preferable. Also, a resin to which a reactive diluent has been added can be used. Further, a curing agent is added to the adhesive immediately before use in screen printing. As the curing agent, a curing agent capable of securing the required working time by screen printing can be used. In the case of Epomate B-002, an amine-based curing agent manufactured by Yuka Shell Epoxy, 100 parts of epoxy resin is cured. 40 to 60 parts of agent are used.

【0032】インキ50及び接着剤80を形成した中間
転写体上30とガラス基板70を対峙し、中間転写体3
0上のインキ20のパターンとガラス基板70上に予め
形成した電極パターン60を所定の位置に合わせて加熱
圧着する。インキ50の皮膜はガラス基板70と接着剤
80により接着したまま硬化し、中間転写体30とガラ
ス基板70は接着し図1(f)となる。この加熱圧着に
ついてはアライメント装置付きの真空平プレス機が好適
であるが、アライメント時に中間転写体30とガラス基
板70を仮固定しロールプレス機で圧着した後加熱する
こともできる。
The intermediate transfer body 30 on which the ink 50 and the adhesive 80 are formed and the glass substrate 70 face each other.
The pattern of the ink 20 on the substrate 0 and the electrode pattern 60 formed in advance on the glass substrate 70 are heat-pressed in accordance with a predetermined position. The film of the ink 50 is cured while being adhered to the glass substrate 70 by the adhesive 80, and the intermediate transfer body 30 and the glass substrate 70 are adhered to each other, as shown in FIG. For this heat compression bonding, a vacuum flat press machine with an alignment device is suitable, but it is also possible to temporarily fix the intermediate transfer body 30 and the glass substrate 70 at the time of alignment, press them with a roll press machine, and then heat them.

【0033】図1(g)に中間転写体30をガラス基板
70から引き剥がした図を示す。中間転写体30上の熱
溶融接着剤40は加熱することによって接着力は極度に
弱くなりインキ20等と42アロイの中間転写体30両
者に付着したまま熱溶融接着剤40の皮膜は分裂し、中
間転写体30はガラス基板70から引き剥がすことがで
き、結果としてインキ20等はガラス基板70に転写さ
れることになる。
FIG. 1 (g) shows a diagram in which the intermediate transfer member 30 is peeled off from the glass substrate 70. By heating the hot-melt adhesive 40 on the intermediate transfer member 30, the adhesive force is extremely weakened, and the film of the hot-melt adhesive 40 splits while being attached to both the ink 20 and the like and the 42-alloy intermediate transfer member 30, The intermediate transfer body 30 can be peeled off from the glass substrate 70, and as a result, the ink 20 and the like are transferred to the glass substrate 70.

【0034】図2にガラス基板70を500から600
℃で焼成した結果を示す。予めガラス基板70の上の形
成した電極パターン60と誘電体62はそのままで、電
極パターン60に対して所定の場所に溶融固化したガラ
スがバリアリブ64として形成され、その間に赤青緑そ
れぞれに発光する蛍光体層塗り分けて形成できている。
バリアリブの形状として深さ170μmで頂部の幅45
μmの広さ800×600mmのストライプパターンで
ある。これらによりバリアリブと蛍光体が形成でき、そ
れぞれのパターンは精細であり相互の位置ズレもなくプ
ラズマディスプレイに於ける背面基板として好適なもの
ができた。
FIG. 2 shows that the glass substrate 70 is
The result of baking at ℃ is shown. While the electrode pattern 60 and the dielectric 62 previously formed on the glass substrate 70 remain as they are, a glass melted and solidified at a predetermined position with respect to the electrode pattern 60 is formed as a barrier rib 64, during which red, green and blue light is emitted. The phosphor layers are formed separately.
The shape of the barrier rib is 170 μm in depth and 45 mm in width at the top.
It is a stripe pattern having a width of 800 μm and a width of 800 × 600 mm. With these, a barrier rib and a phosphor could be formed, and the respective patterns were fine and there was no misalignment between them, and a pattern suitable for a back substrate in a plasma display was obtained.

【0035】[0035]

【発明の効果】本発明のパターン形成方法によれば、ガ
ラス基板等に厚くかつ精細なパターンを形成する方法を
提供することができ、得られるパターンの幅と厚さの比
率が極めて大きく、多くの繰り返しの工程も必要なく、
基板の焼成も蛍光体層とバリアリブ層を同時に形成する
ことで1度で済むなど生産性の向上に貢献し得る。
According to the pattern forming method of the present invention, it is possible to provide a method of forming a thick and fine pattern on a glass substrate or the like, and the ratio of the width and thickness of the obtained pattern is extremely large. No need to repeat the process of
By simultaneously forming the phosphor layer and the barrier rib layer, the substrate can be fired only once, which can contribute to an improvement in productivity.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(a) 〜(g) は、本発明のパターン形成方法の工
程を示す断面で表した説明図である。
FIGS. 1A to 1G are explanatory views showing cross sections showing steps of a pattern forming method of the present invention.

【図2】本発明の実施例の方法により製作したガス放電
パネルの背面基板の断面図である。
FIG. 2 is a cross-sectional view of a back substrate of a gas discharge panel manufactured by a method according to an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

10‥‥凹版 11‥‥パターンの頂部 20‥‥インキ 21‥‥インキ 22‥‥インキ 30‥‥中間転写体 40‥‥(熱溶融)接着剤 50‥‥インキ 60‥‥電極パターン 62‥‥誘電体 64‥‥バリアリブ 70‥‥(電極付きガラス)基板 80‥‥(熱硬化)接着剤 10 Intaglio 11 Top of pattern 20 Ink 21 Ink 22 Ink 30 Intermediate transfer 40 Adhesive (hot melt) 50 Ink 60 Electrode pattern 62 Dielectric Body 64 ‥‥ Barrier rib 70 ‥‥ (Glass with electrodes) Substrate 80 ‥‥ (Thermosetting) Adhesive

───────────────────────────────────────────────────── フロントページの続き (72)発明者 中村 隆一 東京都台東区台東1丁目5番1号 凸版印 刷株式会社内 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Ryuichi Nakamura 1-5-1, Taito, Taito-ku, Tokyo Letterpress Printing Co., Ltd.

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】陶器の絵付け、蛍光表示装置、ガス放電パ
ネル、印刷配線板、混成集積回路等に於ける微細パター
ンを形成する方法に於いて、凹版を用い、その凹版に異
なった種類のインキをスクリーン印刷法で充填すること
を特徴とするパターン形成方法。
1. A method for forming a fine pattern in ceramic painting, a fluorescent display device, a gas discharge panel, a printed wiring board, a hybrid integrated circuit, etc., wherein an intaglio is used, and different types of intaglio are used. A pattern forming method characterized by filling the ink by a screen printing method.
【請求項2】凹版を用い、その凹版にインキをスクリー
ン印刷法で充填する工程、 凹版のインキが硬化した後、中間転写体に転写する工
程、 中間転写体または基板に接着剤を塗布する工程、 被形成体たる基板に前記接着剤を介して中間転写体を接
着する工程、 中間転写体を引き剥がす工程、 を具備することを特徴とするパターン形成方法。
2. A step of using an intaglio plate and filling the intaglio plate with ink by a screen printing method, a step of curing the intaglio ink and transferring it to an intermediate transfer member, and a step of applying an adhesive to the intermediate transfer member or substrate. A pattern forming method, comprising: a step of bonding an intermediate transfer member to a substrate as a formation target via the adhesive; and a step of peeling off the intermediate transfer member.
【請求項3】凹版を用い、その凹版にインキをスクリー
ン印刷法で充填する工程に於いて、異なった種類のイン
キをその凹版に充填することを特徴とする請求項2記載
のパターン形成方法。
3. The pattern forming method according to claim 2, wherein in the step of using the intaglio and filling the ink with the intaglio by a screen printing method, different types of ink are filled in the intaglio.
【請求項4】インキとして、シリコーン樹脂や汎用樹脂
と、パターン形成の体質顔料を混練したインキを用いる
ことを特徴とする請求項2記載のパターン形成方法。
4. The pattern forming method according to claim 2, wherein an ink obtained by kneading a silicone resin or a general-purpose resin with an extender for pattern formation is used as the ink.
【請求項5】凹版のインキが硬化した後、中間転写体に
転写する工程に於いて、凹版または中間転写体に熱溶融
接着剤を塗布し、この熱溶融接着剤により中間転写体に
転写することを特徴とする請求項2記載のパターン形成
方法。
5. In the step of transferring to the intermediate transfer member after the ink of the intaglio has been cured, a hot-melt adhesive is applied to the intaglio or the intermediate transfer member, and transferred to the intermediate transfer member by the hot-melt adhesive. 3. The pattern forming method according to claim 2, wherein:
【請求項6】中間転写体または基板に接着剤を塗布する
工程に於いて、接着剤に体質顔料を混練した熱硬化樹脂
を用いる請求項2記載のパターン形成方法。
6. The pattern forming method according to claim 2, wherein in the step of applying an adhesive to the intermediate transfer member or the substrate, a thermosetting resin obtained by kneading an extender with the adhesive is used.
【請求項7】凹版を用い、その凹版に、シリコーン樹脂
や汎用樹脂と、パターン形成の体質顔料を混練したイン
キをスクリーン印刷法で充填する工程、 凹版のインキが硬化した後、その凹版または中間転写体
に熱溶融接着剤を塗布し、この熱溶融接着剤により、中
間転写体に転写する工程、 中間転写体または基板に体質顔料を混練した熱硬化樹脂
を用いた接着剤を塗布する工程、 被形成体たる基板に前記接着剤を介して中間転写体を接
着する工程、 中間転写体と基板等を加熱し、中間転写体を引き剥がす
工程、 を具備することを特徴とするパターン形成方法。
7. A step of using an intaglio, filling the intaglio with an ink obtained by kneading a silicone resin or a general-purpose resin and an extender for forming a pattern by a screen printing method. After the intaglio ink is cured, the intaglio or intermediate A step of applying a hot-melt adhesive to the transfer body and transferring the hot-melt adhesive to an intermediate transfer body, a step of applying an adhesive using a thermosetting resin obtained by kneading an extender to the intermediate transfer body or the substrate, A method for forming a pattern, comprising: a step of bonding an intermediate transfer member to a substrate, which is an object, via the adhesive, a step of heating the intermediate transfer member and the substrate and the like, and peeling off the intermediate transfer member.
【請求項8】微細なパターンの形成された基板であっ
て、この基板上に体質顔料を混練した熱硬化樹脂を用い
た接着剤を介してパターンが形成されており、このパタ
ーンはシリコーン樹脂や汎用樹脂とパターン形成の体質
顔料を混練したインキよりなるものであることを特徴と
するパターンの形成された基板。
8. A substrate on which a fine pattern is formed, wherein a pattern is formed on the substrate via an adhesive using a thermosetting resin kneaded with an extender pigment, and the pattern is formed of a silicone resin or A pattern-formed substrate comprising an ink obtained by kneading a general-purpose resin and an extender for forming a pattern.
JP10047195A 1998-02-27 1998-02-27 Method for forming pattern and patterned substrate Pending JPH11245497A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10047195A JPH11245497A (en) 1998-02-27 1998-02-27 Method for forming pattern and patterned substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10047195A JPH11245497A (en) 1998-02-27 1998-02-27 Method for forming pattern and patterned substrate

Publications (1)

Publication Number Publication Date
JPH11245497A true JPH11245497A (en) 1999-09-14

Family

ID=12768354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10047195A Pending JPH11245497A (en) 1998-02-27 1998-02-27 Method for forming pattern and patterned substrate

Country Status (1)

Country Link
JP (1) JPH11245497A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001264962A (en) * 2000-03-17 2001-09-28 Dainippon Printing Co Ltd Offset printing plate
JP2002170507A (en) * 2000-11-29 2002-06-14 Kyocera Corp Supporting base plate having projections as spacer and picture display device using the supporting base plate
KR100818513B1 (en) 2006-09-04 2008-03-31 삼성전기주식회사 Manufacturing method of dielectric sheet product and laminated ceramic board having engraved electrode pattern
JP2017152668A (en) * 2016-02-25 2017-08-31 財團法人工業技術研究院Industrial Technology Research Institute Circuit printing device, circuit printing method and circuit structure manufactured by printing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001264962A (en) * 2000-03-17 2001-09-28 Dainippon Printing Co Ltd Offset printing plate
JP2002170507A (en) * 2000-11-29 2002-06-14 Kyocera Corp Supporting base plate having projections as spacer and picture display device using the supporting base plate
JP4518661B2 (en) * 2000-11-29 2010-08-04 京セラ株式会社 Manufacturing method of image display device
KR100818513B1 (en) 2006-09-04 2008-03-31 삼성전기주식회사 Manufacturing method of dielectric sheet product and laminated ceramic board having engraved electrode pattern
JP2017152668A (en) * 2016-02-25 2017-08-31 財團法人工業技術研究院Industrial Technology Research Institute Circuit printing device, circuit printing method and circuit structure manufactured by printing method

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