JP2005259537A - Manufacturing method for plasma display panel substrate, manufacturing method for the panel and manufacturing method for plasma display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To multi-cut a substrate with a wide area to obtain a plurality of PDP panels at once, to cancel a gap by alignment, and to freely selected the shape of a partition. <P>SOLUTION: The disclosed manufacturing method for the PDP substrate comprises processes of: applying a paste 1 for forming a pattern to an irregular plate 50 which is a transfer mold of a partition pattern; hardening the paste 1 for forming the pattern; and forming an electrode pattern 3 on the hardened paste 1 for forming the pattern. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a substrate of a plasma display panel (hereinafter also referred to as PDP), a method of manufacturing the panel, and a method of manufacturing a plasma display device, and more particularly, a partition wall for separating discharge cells. The present invention relates to a method for manufacturing a substrate of a plasma display panel including the substrate on which the substrate is formed, a method for manufacturing the panel, and a method for manufacturing a plasma display device.

  In general, a plasma display device mainly composed of a PDP is compared with a display device such as a CRT (Cathode Ray Tube) or LCD (Liquid Crystal Device) that has been widely used. Since it has many advantages such as small flickering, large display contrast ratio, thin and large screen, and high response speed, it has recently become a display for information processing equipment such as computers. It is used as a device.

  This plasma display device has an AC type in which an electrode is covered with a dielectric layer and is operated indirectly in an AC discharge state, and an electrode is exposed to a discharge space and is operated in a DC discharge state depending on an operation method. Although it is roughly classified into a DC type, especially an AC type plasma display device (also simply referred to as a plasma display device) is widely used because it can easily realize a large screen as described above. In addition, in the PDP that constitutes the plasma display device, a color that enables multicolor emission by arranging red, green and blue phosphor layers inside the panel. A plasma display device is provided.

FIG. 12 is a perspective view schematically showing a configuration of a PDP which is a main part of the color plasma display device. As shown in the figure, the PDP 100 has a basic configuration in which a front substrate 101 and a rear substrate 102 are arranged to face each other and a discharge gas space 103 is formed between the substrates 101 and 102. doing.
The front substrate 101 is arranged in parallel to each other along the row direction (horizontal direction) H on the inner surface of the first insulating substrate 104 made of a transparent material such as glass and the first insulating substrate 104 to form a row electrode. Scan electrode 105 and sustain electrode (common electrode) 106, transparent dielectric layer 107 made of low melting point lead glass (PbO) or the like covering both electrodes 105, 106, and magnesium oxide for protecting transparent dielectric layer 107 from discharge And a protective layer 108 made of (MgO) or the like. Here, the scan electrode 105 and the sustain electrode 106 are respectively formed on the transparent electrodes 105A and 106A made of ITO (Indium Tin Oxide), tin oxide (SnO ₂ ), and the like, and on the transparent electrodes 105A and 106A in order to reduce resistance. It comprises bus electrodes (trace electrodes) 105B and 106B made of partially formed Al (aluminum), Ag (silver), or the like.

  On the other hand, the back substrate 102 is parallel to each other along a second insulating substrate 109 made of a transparent material such as glass and a column direction (vertical direction) V perpendicular to the row direction H on the inner surface of the second insulating substrate 109. A data electrode (address electrode) 111 made of Al, Ag, or the like that is arranged to form a column electrode, a white dielectric layer 112 made of lead-containing frit glass or the like covering the data electrode 111, and He (helium), Ne ( Neon), Xe (xenon), or other discharge gas is filled alone or mixed to secure the discharge gas space 103 and is composed of lead-containing frit glass formed to separate individual discharge cells. For example, a grid-like partition wall 113, a reflective layer 114 made of white pigment powder or the like formed so as to cover the inner wall surface and bottom surface of the partition wall 113, and the reflective layer 114 are coated. Phosphor layers 115 that are separately applied to a red phosphor layer 115R that converts ultraviolet light generated by the discharge of electric gas into red light, a green phosphor layer 115G that converts green light, and a blue phosphor layer 115B that converts blue light. And.

Of the pair of substrates 101 and 102 constituting the PDP 100 of the color plasma display device as described above, the back substrate 102 in particular requires a number of forming steps including a step of forming the barrier rib 113 that separates the discharge cells as shown below. Therefore, its manufacture becomes complicated.
1. Electrode forming step: A solid film of a photosensitive conductive paste is formed on a transparent insulating substrate 109 such as glass as described above by screen printing, dried, exposed, developed and baked to form a data electrode having a desired pattern. 111 is formed.
2. Dielectric formation step: A solid film of dielectric paste is formed on the insulating substrate 109 including the data electrodes 111 by screen printing, dried and baked to form the white dielectric layer 112.
3. Partition wall paste coating / drying step: A thick film of the partition wall paste is applied on the white dielectric layer 112 and then dried.
4). Exposure / development process: DFR (dry film resist) is laminated on the barrier rib paste, exposed and developed to form a barrier rib pattern on the DFR.
5). Partition formation step: After removing unnecessary partition paste by sandblasting using the DFR pattern as a mask, the DFR is peeled off to form the partition 113.
6). Reflective layer / phosphor layer forming step: The reflective layer 114 and the phosphor layers 115R, 115G, and 115B are formed by sequentially repeating screen printing and drying.
As described above, in order to manufacture the back substrate 102 of the PDP 100, the data electrode 111, the white dielectric layer 112, the partition wall 113, the reflective layer 114, and the phosphor layers 115R, 115G, and 115B are formed on a transparent substrate such as glass. Must be sequentially stacked.

  Here, in manufacturing the back substrate 102, the process of forming the barrier rib 113 for separating the discharge cells is the most complicated. However, as described above, the barrier rib 113 is formed by removing unnecessary barrier rib paste using sandblasting. In this method, the utilization rate of the partition wall paste becomes extremely low (approximately 20%), so that an increase in cost is inevitable. Therefore, for the purpose of reducing the steps 3, 4, and 5 necessary for forming the partition wall 113 and improving the utilization rate of the partition paste, a method of manufacturing a rear substrate that conventionally forms a partition wall using an intaglio plate. Many have been proposed.

For example, Patent Documents 1, 2, and 3 disclose a method of manufacturing a back substrate (first prior art) in which partition walls are formed using an intaglio. FIG. 13 is a process diagram schematically showing the manufacturing method of the back substrate.
First, as shown in FIG. 13A, after preparing a concave plate 100 having a concave portion 101 which is a transfer pattern of a partition pattern to be formed, a photosensitive insulating paste 102 is prepared as shown in FIG. 13B. Is applied to the entire surface of the concave plate 100 including the concave portion 101 by the squeegee 103. Next, as shown in FIG. 13C, the surface of the data electrode 104 is opposed to the concave plate 100 using a transparent insulating substrate 105 such as glass on which the data electrode 104 has been formed in advance, and FIG. As shown, the photosensitive insulating paste 102 is solidified by irradiating ultraviolet rays (Ultra Violet ray: UV) from the back surface of the insulating substrate 105 with the insulating substrate 105 superimposed on the concave plate 100. Next, as shown in FIG. 13E, the concave plate 100 is peeled off and the pattern of the concave portion 101 is transferred to form the partition wall 107 at the same time as the formation of the dielectric layer 106 covering the data electrode 104. The back substrate 108 is manufactured.

  Further, for example, Non-Patent Document 1 discloses a rear substrate manufacturing method (second prior art) in which partition walls are formed using another intaglio. The manufacturing method of the back substrate is called LTCC-M (Low Temperature Co-fired Ceramics on Metal) method, and an insulating dielectric layer is formed by laminating a green sheet on a Ti (titanium) substrate. After forming the data electrode, the dielectric layer, and printing, the green sheet is laminated again, the concave plate is pressed, the partition pattern is transferred, and then fired to manufacture the back substrate.

  Further, a back substrate manufacturing method (third prior art) in which a transfer sheet is used to transfer and form a pattern of any of a base formation layer, a dielectric formation layer, an electrode formation layer, and a partition wall formation layer is disclosed in, for example, a patent. It is disclosed in Document 4. In the manufacturing method of the back substrate, an adhesive layer and a substrate face each other by providing an ink layer after forming a patterned release layer on the base film, and providing an adhesive layer having the same pattern as the release layer on the ink layer. In this way, the back substrate is manufactured by laminating and transferring an ink layer having a desired pattern. Further, for example, Patent Document 5 discloses a method (fourth prior art) for manufacturing a rear substrate by forming a partition pattern using a film in which convex portions made of a partition forming material are formed on a sheet. .

Further, for example, Patent Document 6 discloses a method (fifth prior art) for manufacturing a rear substrate by eliminating the alignment between the partition wall pattern and the electrode pattern. In the manufacturing method of the back substrate, a discharge space forming material that disappears by firing and an electrode are formed by embedding in a mold having convex portions corresponding to ribs, and then transferred to a glass substrate, and then the mold is peeled off Then, after the rib material is embedded in the concave portion of the pattern formed by laminating the discharge space forming material and the electrode material, the back substrate is manufactured by firing.
JP-A-8-273537 JP-A-8-273538 JP 2002-216638 A JP-A-10-214561 JP 11-185604 A JP 2000-348629 A SID 99 DIGEST, 1036-1039

By the way, in the conventional manufacturing method of the back substrate, there are problems as described below.
First, in the manufacturing method of the back substrate according to the first prior art described in Patent Documents 1 to 3, after forming the data electrode 104 on the insulating substrate 105 in advance as shown in FIG. Since the pattern 101 is transferred, it is necessary to align the recess 101 and the data electrode 104 on the insulating substrate 105 with the insulating paste 102 interposed between the concave plate 100 and the insulating substrate 105. In this case, if the alignment is performed in a state where the insulating paste 102 is insufficient between the insulating substrate 105 with the data electrode 104 and the concave plate 100, the resistance between the two 105 and 100 increases, so that it is difficult to adjust the alignment. There is a problem of becoming. In addition, when a large amount of the insulating paste 102 is used to facilitate the alignment between the two 105 and 100, the insulating paste 102 protrudes from the gap between the two 105 and 100 and is formed on the insulating substrate 105. This causes the problem of contaminating the electrode terminals. Furthermore, the first conventional method as described above is used in the multi-chamfering method (manufacturing two or more PDP panels collectively on a large-area glass substrate), which is currently the mainstream method for manufacturing PDP substrates. When applying a manufacturing method based on technology, there is a problem that two or more sheets cannot be aligned at a time.

  Next, in the manufacturing method of the rear substrate according to the second prior art described in Non-Patent Document 1, in order to transfer the partition pattern by pressing the concave plate after forming the data electrode on the Ti substrate by the LTCC-M method, There is a problem that the alignment is easily shifted at the time of pressurization, and the position cannot be adjusted after the pressurization is performed once.

  Next, in the manufacturing method of the back substrate according to the third prior art described in Patent Document 4, any pattern of the base formation layer, the dielectric formation layer, the electrode formation layer, and the partition wall formation layer is transferred alone. However, since the partition pattern sheet is laminated after the electrode pattern is formed, the alignment is liable to be shifted at the time of lamination, and there is a problem that the position cannot be adjusted after being laminated once.

  Next, in the manufacturing method of the back substrate according to the fourth prior art described in Patent Document 5, after aligning the electrode pattern formed on the substrate in advance with the barrier rib pattern of the barrier rib forming film, There is a problem that it is necessary to bond, alignment is liable to shift at the time of bonding, and position adjustment cannot be performed once bonded.

  Next, although the rear substrate manufacturing method according to the fifth prior art described in Patent Document 6 can solve the problem of the alignment between the electrode pattern and the barrier rib pattern in the fourth prior art, Four processes are required: an embedding process, an electrode material embedding process, a transfer process, and a rib material embedding process. For this reason, the number of processes is doubled as compared to the conventional manufacturing method of the back substrate, and the electrode pattern is cut by the horizontal partition perpendicular to the electrode pattern in the current mainstream grid pattern. There is a problem that you can not.

  The present invention has been made in view of the above-described circumstances, and enables multiple chamfering in which a plurality of PDP panels are collectively collected on a large-area substrate, and can eliminate displacement due to alignment. It is an object of the present invention to provide a method of manufacturing a substrate of a plasma display panel, a method of manufacturing the panel, and a method of manufacturing a plasma display device, which can be freely selected.

  In order to solve the above-mentioned problem, the invention described in claim 1 is arranged so that a pair of substrates are opposed to each other so that a discharge space is formed between both substrates, and a discharge cell is divided into one of the pair of substrates. A pattern forming paste applied to a concavo-convex plate, which is a transfer mold of the partition pattern, and the pattern forming paste is cured. And a step of forming the electrode pattern on the cured paste for pattern formation.

  According to a second aspect of the present invention, there is provided a barrier rib pattern and an electrode pattern for arranging a pair of substrates facing each other so that a discharge space is formed between both substrates, and dividing a discharge cell into one of the pair of substrates. A step of forming the electrode pattern on the convex surface of the concavo-convex plate, which is a transfer mold of the partition wall pattern, and the concavo-convex plate on which the electrode pattern is formed. And a step of forming a pattern forming paste.

  According to a third aspect of the present invention, there is provided a plasma display panel substrate manufacturing method according to the first aspect, characterized in that the barrier rib-shaped partition wall pattern is formed.

  According to a fourth aspect of the present invention, there is provided a plasma display panel substrate manufacturing method according to the second aspect, wherein the striped partition wall pattern is formed.

  A fifth aspect of the present invention relates to a method of manufacturing a substrate of a plasma display panel according to any one of the first to fourth aspects, wherein at least one of the pair of substrates is an insulating or conductive substrate. It is characterized by that.

  According to a sixth aspect of the present invention, there is provided a plasma display panel manufacturing method, wherein the substrate according to any one of the first to fifth aspects is a rear substrate of the plasma display panel.

  A seventh aspect of the invention relates to a method of manufacturing a plasma display device, and a first step of manufacturing the plasma display panel by the method of manufacturing a plasma display panel according to claim 6 and driving the plasma display panel. A second step of manufacturing the plasma display panel as a module together with a circuit; and a third step of performing a format conversion of an image signal and electrically connecting an interface to be transmitted to the module to the module. It is characterized by.

  According to the plasma display panel substrate manufacturing method, the panel manufacturing method, and the plasma display device manufacturing method of the present invention, a pattern forming paste is applied to a concavo-convex plate, which is a partition pattern transfer mold, and a pattern forming paste is applied. Since the paste is cured and the electrode pattern is formed on the cured pattern forming paste, it is possible to take multiple PDP panels on a large area substrate in batch and eliminate misalignment due to alignment. Further, the partition wall shape can be freely selected.

  A substrate of a plasma display panel comprising a pair of substrates facing each other so that a discharge space is formed between both substrates, and a partition wall pattern and an electrode pattern for separating discharge cells are formed on one of the pair of substrates. In the manufacturing method, a step of applying a pattern forming paste to an uneven plate that is a transfer pattern of a partition pattern, a step of curing the pattern forming paste, and a step of forming an electrode pattern on the cured pattern forming paste have.

  1A and 1B are diagrams showing a mold for forming an uneven plate used in the method of manufacturing a PDP substrate according to the present invention, wherein FIG. 1A is a front view, FIG. 2B is a side view, and FIG. 2 is a PDP according to the present invention. FIG. 3A is a front view, FIG. 3B is a side view, and FIG. 3 is a process diagram illustrating a method of manufacturing a PDP substrate according to Embodiment 1 of the present invention in the order of steps. 4A is a front view, FIG. 4B is a side view, and FIG. 4 is a cross-sectional view showing an example of an uneven substrate with an electrode pattern used in a modification of the PDP substrate manufacturing method, FIG. FIG. 6 is a cross-sectional view showing another example of the uneven pattern transfer base material with an electrode pattern used in a modification of the PDP substrate manufacturing method, and FIG. 6 shows a back substrate using the uneven pattern transfer base material with the electrode pattern. FIG. 7 is a view for explaining a method of manufacturing the PDP, and FIG. Is a cross-sectional view illustrating.

  First, a mold for forming a concavo-convex plate used in the PDP substrate manufacturing method of this example is prepared. As shown in FIG. 1, the mold 80 is formed by precision processing using, for example, a rectangular copper plate, and has a master partition pattern 11 and convex shapes provided at four corners around the master partition pattern 11. An alignment marker 12 is provided.

  Next, an uneven plate 50 as shown in FIG. 2 is formed using the above-described mold 80. As shown in the figure, the concavo-convex plate 50 includes a partition wall pattern 51 corresponding to the above-described master partition wall pattern 11, a concave alignment marker 52 corresponding to the convex alignment marker 12, and a molding resin body 53. A terminal cover portion 54 and a backing plate 55 are provided. In order to form the concavo-convex plate 50, first, a mold 80 is used, and the periphery is surrounded by a frame (not shown), and as a mold taking resin, silicone rubber, photo-curing resin, thermosetting resin, or the like. Is poured into the mold 80, and then the resin is cured by means of natural drying, ultraviolet irradiation, electron beam irradiation, heating, etc., and the concave / convex shape of the mask partition wall pattern 11 is transferred to form the mold taking resin body 53. To do. Next, a backing plate 55 made of a film, a metal plate, a glass plate, acrylic, polycarbonate, ABS (Acrylonitrile Butadiene Styrene) resin or the like is attached to the back surface of the molding resin body 53 to reinforce the strength. An uneven plate 50 is formed.

  In the concavo-convex plate 50 described above, the alignment marker 52 can be used as an exposure marker when the data electrode is formed, or as an assembly marker when the rear substrate and the front substrate are assembled. In addition, since the terminal cover portion 54 is used as a terminal for electrode connection after bonding the substrate to be the back substrate, it adheres so that this paste does not remain on the terminal cover portion 54 when the pattern forming paste is applied. Wipe off the paste with a blade, squeegee or roll bar. By adjusting the thickness of the terminal cover portion 54, the thickness of the dielectric layer can be adjusted. As an example, the thickness of the terminal cover portion 54 is selected to be 0 to 50 μm.

Next, with reference to FIG. 3, the manufacturing method of the substrate of the PDP in this example will be described in the order of steps. In this example, a description will be given of an example in which a grid-like partition is formed.
First, as shown in FIG. 3 (a), an uneven plate 50, which is a transfer mold for a partition pattern to be formed, is prepared. The concavo-convex plate 50 has a structure as shown in FIG.

  Next, as shown in FIG. 3B, the pattern forming paste 1 is applied to the entire surface of the concavo-convex plate 50 including the partition wall pattern 51 by the blade 2, and then the surface of the pattern forming paste 1 is flattened. At this time, the pressure of the blade 2 is adjusted so that no paste residue remains on the terminal cover portion 54. Instead of the blade 2, a squeegee, a roll bar or the like used in a printing machine may be used. Here, as the pattern forming paste 1, a mixed powder of lead glass and ceramic (alumina, titania, silicon oxide, etc.) and an ultraviolet curable resin having a low adhesive strength (a good plate separation is obtained) in a mass ratio of 4 are used. A mixture with a ratio of 1 was used. The UV curable resin used here preferably has an adhesive strength after UV curing of 1.0 N (Newton) / 25 mm or less. By using such an ultraviolet curable resin, the release property of the cured paste from the concavo-convex plate 50 is improved, and no residue remains on the concavo-convex plate 50, so that the concavo-convex plate 50 can be used repeatedly. .

  Next, as shown in FIG. 3C, the pattern forming paste 1 on the concavo-convex plate 50 is directly irradiated with ultraviolet rays to cure the paste 1, thereby forming the partition pattern 51.

  Next, as shown in FIG. 3D, an electrode pattern is formed. First, a photosensitive conductive paste (UVAg) is solid-printed on the cured paste 1 using a printing machine, and then dried. Next, after adjusting the position of the exposure mask using alignment markers 52 formed at the four corners of the concavo-convex plate 50 in the exposure apparatus, the electrode pattern is exposed, developed, and dried to form the electrode pattern 3. Form. As will be described later, the electrode pattern 3 becomes a data electrode disposed on the substrate.

Next, as shown in FIG.3 (e), the board | substrate used as the back substrate of PDP is affixed. First, an adhesive paste 4 is applied on the cured paste 1 on which the electrode pattern 3 is formed, and then a substrate 5 is attached via the adhesive paste 4. Next, the adhesive paste 4 is cured by irradiating ultraviolet rays from the substrate 5 side or from the uneven plate 50 side. Here, as the adhesive paste 4, an adhesive that burns out at 400 ° C. or lower, such as an ultraviolet curable resin, an electron beam curable adhesive, an anaerobic adhesive, or a thermosetting adhesive, is used. Here, when an ultraviolet curable resin is used as the adhesive paste 4, the adhesive strength after ultraviolet curing is desirably 2.0 N (Newton) / 25 mm or more. By using such an ultraviolet curable resin, by improving the adhesion between the paste for pattern formation and the substrate, the releasability of the paste from the concavo-convex plate 50 is improved, and no residue remains on the concavo-convex plate 50. The uneven plate 50 can be used repeatedly. As the substrate 5, a soda glass plate, PD200, Ti plate, 426 alloy, 50Ni alloy thin film plate or the like is used. Here, as the substrate 5, by using a material having a thermal expansion coefficient of 60 × 10 ^{−7 to} 100 × 10 ⁻⁷ / ° C., it is possible to prevent disconnection or chipping of the partition wall due to temperature change during firing and lighting. it can.

  Next, as shown in FIG. 3 (f), the concavo-convex plate 50 is peeled from the substrate 5. Next, the paste 1 on which the barrier rib pattern 51 has been formed and the substrate 5 onto which the electrode pattern 3 has been transferred are baked together. Next, the reflective layer and the phosphor layer (both not shown) are printed and dried by a conventional method to manufacture a PDP rear substrate having a cross-shaped barrier rib.

  In addition, as a modification of the manufacturing method of the back substrate of the above PDP, after applying the adhesive paste in the middle of the above manufacturing process, covering with a cover film and curing, then peeling the cover film and then bonding paste You may make it stick on a board | substrate in the state exposed. 4 and 5 are cross-sectional views showing a substrate for transferring irregularities with electrode patterns used in such a method of manufacturing a back substrate.

  As shown in FIG. 4, the first uneven substrate 6 with electrode pattern is an example having no adhesive layer, and is formed on a base substrate 19 having an uneven shape 18 corresponding to the partition pattern. A cover film 8 is attached so as to cover the forming paste 7 and the electrode pattern 3. Here, the pattern-forming paste 7 has a softening point of 90 to 150 ° C., and contains a resin that adheres to the substrate during thermocompression bonding of the substrate.

  As shown in FIG. 5, the second uneven substrate 9 with electrode pattern for transfer is provided with an adhesive layer 13 immediately below the cover film 8. Here, the adhesive layer 13 has a softening point of 90 to 150 ° C., and is composed of a resin that adheres to the substrate during thermocompression bonding of the substrate, or is attached to a conductive substrate with lead glass and After firing using a mixture of a mixed powder of ceramic (alumina, titania, silicon oxide, etc.) and a UV curable resin having a low adhesive strength (to improve plate separation) in a mass ratio of 4: 1. It plays the role of an insulating layer between the electrode pattern 3 and the conductive substrate. Other than this, the configuration is substantially the same as that of the first electrode pattern-provided uneven transfer substrate 6, and therefore, corresponding parts are denoted by the same reference numerals and description thereof is omitted.

Next, with reference to FIG. 6, a method for manufacturing a back substrate using the above-described first or second uneven pattern transfer bases 6 and 9 with an electrode pattern will be described.
First, as shown in FIG. 6A, the substrate 5 is attached between the pair of laminating rolls 14 and 15 by moving the substrate 5 in the direction of the arrow using, for example, the second uneven substrate 9 with an electrode pattern ( In the case of laminating), the cover film 8 is wound up from the surface of the substrate 9 by the cover film winding roll 16 provided in front of the laminating rolls 14 and 15 to expose the adhesive layer 13. And the base material 9 is fixed on the board | substrate 5 through the contact bonding layer 13 with a pair of laminate rolls 14 and 15 currently heated at 90-150 degreeC. Finally, as shown in FIG. 6 (b), the base substrate 19 is wound up by the base substrate winding roll 17 provided behind the pair of laminate rolls 14 and 15, and the partition wall pattern 51 has been formed. The paste 1 and the substrate 5 to which the electrode pattern 3 is transferred are baked together. Next, the back layer substrate of the PDP is manufactured by repeating the printing and drying steps of the reflective layer and the phosphor layer (both not shown) by a normal method.
Also by such a manufacturing method of a back substrate, a back substrate provided with a partition pattern can be manufactured like the above-mentioned manufacturing method.

Next, a specific example of a method for manufacturing the rear substrate of the PDP in this example will be described.
Cutting with a copper plate to form a mold 80 having a partition wall pattern 51 with a terminal cover portion 54 having a thickness of 50 μm, covering the mold 80 with a frame, and then pouring silicon rubber for molding, The plate 55 was cured in a state of being pasted to form a transfer type concavo-convex plate 50. Next, as a paste for pattern formation using the concavo-convex plate 50, an ultraviolet curable resin (N-3415) manufactured by Nippon Synthetic Chemical Industry Co., Ltd., a curing agent Coronate L-55E, and a photoinitiator Irgacure-184 (I-184) Were mixed at a ratio of 100: 0.6: 1.4, and a mixed powder of lead glass and ceramic (alumina and titania) was used at a mass ratio of 4: 1. As an adhesive, an adhesive (N-3816) manufactured by Nippon Synthetic Chemical Industry Co., Ltd. was used. As the substrate 5, a soda lime glass substrate having a thickness of 2.8 mm was used.

After the pattern forming paste is applied to the concavo-convex plate 50, which is a partition pattern transfer mold, with a flade, the paste on the terminal cover portion 54 is removed with a squeegee, and the upper surface of the concavo-convex plate 50 is flattened. Irradiate to cure. Next, a DuPont photosensitive silver paste (DC204) was solid printed on the cured pattern forming paste using a printing machine, dried, and exposed to an electrode pattern with an exposure power of 300 mJ / cm ² by an exposure device. Then, an electrode pattern was formed through development and drying processes. Next, an adhesive is applied with a blade, and the adhesive is cured by sandwiching the adhesive between the electrode pattern formed on the pattern forming paste and the substrate. Subsequently, the concavo-convex plate 50 is peeled from the glass substrate so that the cured pattern forming paste and the electrode pattern remain on the glass substrate surface, and then the paste and the electrode pattern patterned on the surface are transferred to the glass substrate. A batch baking was performed at 550 ° C., and finally, the reflective layer and the phosphor layer were printed and dried by a usual method to produce a PDP back substrate 56 as shown in FIG. Reference numeral 57 is a glass substrate, 58 is an electrode pattern, 59 is a dielectric layer, 61 is a reflective layer, 62 is a phosphor layer, and 65 is a partition.

Thus, according to the method of manufacturing the PDP substrate of this example, the following effects can be obtained.
1. It can be formed on the barrier rib pattern and electrode pattern that have been aligned in advance by one-time bonding, and the electrode pattern and barrier rib are fired together, eliminating the shrinkage caused by firing shrinkage and alignment between the barrier rib position and the electrode position. It is possible to chamfer a plurality of PDP panels collectively on a substrate having an area.
2. It is possible to prevent the barrier rib paste from protruding onto the electrode terminal.
3. If a laminate film having a partition pattern and an electrode pattern is used, the manufacturing time and the number of manufacturing steps of the back substrate of the PDP can be shortened, so that the capital investment can be suppressed to less than half of the conventional one.
4). Since the adhesive layer serves as an insulating layer, the metal and alloy of the substrate material can be used, the heat dissipation is improved, and there is no need to attach the heat dissipation sheet, so the PDP can be manufactured thinly, lightly and inexpensively, Handling becomes easy.
5). Since the material glass, metal, and alloy of the substrate have a thermal expansion coefficient of 60 × 10 ^{−7 to} 100 × 10 ⁻⁷ / ° C., the difference from the thermal expansion coefficient with the partition wall material becomes small, so that firing and discharge It is possible to prevent the disconnection or peeling of the partition wall due to the heat inside, and to provide a PDP panel with good weather resistance.
6). By separating the paste for pattern formation and the paste for adhesion, the peelability from the concavo-convex plate is improved, and since it is firmly adhered to the substrate, it can be easily peeled from the concavo-convex plate without breaking the partition, The uneven plate can be reused.

  Therefore, according to this example, it is possible to take a plurality of CDPs to collect a plurality of PDP panels on a large-area substrate at the same time, eliminate displacement due to alignment, and freely select a partition shape. it can.

The method for manufacturing the PDP substrate according to the second embodiment was performed in the following specific example.
Cutting with a copper plate to form a mold 80 having a partition pattern 51 with a terminal cover 24 having a thickness of 0 μm, covering the mold 80 with a frame, and then pouring silicon rubber for molding, and backing plate A transfer type concavo-convex plate 50 was formed by curing in a state where 55 was applied. Next, as a paste for pattern formation using the concavo-convex plate 50, an ultraviolet curable resin (N-3415) manufactured by Nippon Synthetic Chemical Industry Co., Ltd., a curing agent Coronate L-55E, and a photoinitiator Irgacure-184 (I-184) Were mixed at a ratio of 100: 0.6: 1.4, and a mixed powder of lead glass and ceramic (alumina and titania) was used at a mass ratio of 4: 1. As the adhesive paste, a mixed powder of lead glass and ceramic (titania) and an adhesive (N-3816) manufactured by Nippon Synthetic Chemical Industry Co., Ltd. were mixed at a mass ratio of 4: 1. As the substrate 5, a 50Ni alloy thin plate having a thickness of 0.3 mm was used.

After the pattern forming paste is applied to the concavo-convex plate 50, which is a partition pattern transfer mold, with a flade, the paste on the terminal cover portion 54 is removed with a squeegee, and the upper surface of the concavo-convex plate 50 is flattened. Is exposed at an exposure power of 600 mJ / cm ² and irradiated to cure. Next, a DuPont photosensitive silver paste (DC204) was solid printed on the cured pattern forming paste using a printing machine, dried, and exposed to an electrode pattern with an exposure power of 300 mJ / cm ² by an exposure device. Then, an electrode pattern was formed through development and drying processes. Next, an adhesive is applied with a blade, and the adhesive is cured by sandwiching the adhesive between the electrode pattern formed on the pattern forming paste and the substrate. Subsequently, the 50Ni alloy thin plate to which the cured pattern forming paste and the electrode pattern are transferred is collectively fired at 550 ° C. Finally, the reflective layer and the phosphor layer were printed and dried in the usual manner to produce a PDP back substrate 63 as shown in FIG. Reference numeral 64 is a metal substrate, 66 is an electrode pattern, 67 is a partition, 68 is a reflective layer, 69 is a phosphor layer, and 72 is an adhesive layer.

  Also in Example 2 as described above, substantially the same effect as Example 1 was obtained except that some conditions of the process were different.

The manufacturing method of the PDP substrate according to the third embodiment was performed in the following specific example.
By cutting using a copper plate, a mold 80 having a partition wall pattern 51 with a terminal cover portion 54 having a thickness of 50 μm is formed, and an ultraviolet curable resin for molding (manufactured by Nippon Synthetic Chemical Industry Co., Ltd. (N-3415) )), Curing agent Coronate L-55E and photoinitiator Irgacure-184 (I-184) were mixed at a ratio of 100: 0.6: 1.4, then poured into a mold, and the thickness for backing was 50 μm. The polyethylene terephthalate (PET) film was cured in a state where it was affixed to form a transfer-type relief plate film. The paste for pattern formation is 100: 0.6: 1 of UV curable resin (N-3415), curing agent coronate L-55E and photoinitiator Irgacure-184 (I-184) manufactured by Nippon Synthetic Chemical Industry Co., Ltd. .4, and mixed with lead glass and ceramic (alumina and titania) mixed powder at a mass ratio of 4: 1. As the substrate 5, a soda lime glass substrate having a thickness of 2.8 mm was used.

After the pattern forming paste is applied to the concavo-convex plate 50, which is a partition pattern transfer mold, with a flade, the paste on the terminal cover portion 54 is removed with a squeegee, and the upper surface of the concavo-convex plate 50 is flattened. Is exposed at an exposure power of 600 mJ / cm ² and irradiated to cure. Next, using a laminating apparatus on the cured pattern forming paste, a DuPont adhesive sheet composed of a base film (PET), an adhesive polymer layer, and a cover film is applied while peeling the base film, and an exposure apparatus. Then, the electrode pattern was patterned, and a toner film composed of a base film and a toner (mixed powder of Ag and low-melting glass) was laminated again to form a laminate film having a partition wall pattern and an electrode pattern. Next, a laminate film having a partition pattern and an electrode pattern is attached on a glass substrate using a laminating apparatus, and attached while peeling off the base film with toner in the non-electrode pattern portion, and then the concavo-convex film is peeled off, A cured pattern forming paste and a glass substrate with an electrode pattern were formed. Next, batch baking was performed at 550 ° C. on the glass substrate onto which the paste and electrode paste patterned on the substrate surface were transferred. Finally, the reflective layer and the phosphor layer were printed and dried in the usual manner to produce a PDP back substrate 79 as shown in FIG. Reference numeral 71 is a metal film, 73 is an electrode pattern, 74 is a dielectric layer, 75 is a partition, 76 is a reflective layer, 77 is a phosphor layer, and 78 is an adhesive layer.

  Even in Example 3 as described above, substantially the same effect as Example 1 was obtained except that some conditions of the process were different.

FIGS. 10A and 10B are process diagrams showing a PDP substrate manufacturing method according to Embodiment 4 of the present invention in the order of steps, wherein FIG. 10A is a front view and FIG. 10B is a side view. In this example, an example in which stripe-shaped partition walls are formed will be described.
First, as shown in FIG. 10 (a), a concavo-convex plate 50 which is a transfer mold for a partition wall pattern to be formed is prepared.

  Next, as shown in FIG. 10B, an electrode pattern is formed. First, the photosensitive conductive paste (UVAg) is printed solid using a printing machine and then dried. Next, after adjusting the position of the exposure mask using alignment markers 52 formed at the four corners of the concavo-convex plate 50 in the exposure apparatus, the electrode pattern is exposed, developed, and dried to form the electrode pattern 3. Form.

  Next, as shown in FIG. 10 (c), the pattern forming paste 1 is applied to the entire surface by the blade 2 on the concavo-convex plate 50, which is a transfer pattern of the partition wall pattern on which the electrode pattern 3 is formed, and then the pattern is formed. The surface of the paste 1 is flattened. At this time, the pressure of the blade 2 is adjusted so that no paste residue remains on the terminal cover portion 54. Instead of the blade 2, a squeegee, a roll bar or the like used in a printing machine may be used.

  Next, as shown in FIG. 10D, the pattern forming paste 1 on the concavo-convex plate 50 is directly irradiated with ultraviolet rays to cure the paste 1, thereby forming the partition pattern 51.

  Next, as shown in FIG. 10E, a substrate to be the back substrate of the PDP is attached. First, an adhesive paste 4 is applied on the cured paste 1 on which the electrode pattern 3 is formed, and then a substrate 5 is attached via the adhesive paste 4. Next, the adhesive paste 4 is cured by irradiating ultraviolet rays from the substrate 5 side or from the uneven plate 50 side.

  Next, as shown in FIG. 10 (f), the concavo-convex plate 50 is peeled from the substrate 5. Next, the paste 1 on which the barrier rib pattern 51 has been formed and the substrate 5 onto which the electrode pattern 3 has been transferred are baked together. Next, the reflective layer and the phosphor layer (both not shown) are printed and dried by a conventional method to produce a PDP back substrate having stripe-shaped barrier ribs.

  Thus, also in this example, since only the shapes of the partition walls are different from those of the first to third embodiments, substantially the same effects as those of the first to third embodiments can be obtained.

FIG. 11 is a block diagram showing the structure of a plasma display device manufactured by the plasma display device manufacturing method according to Embodiment 5 of the present invention. The manufacturing method of the plasma display device of this example is characterized in that it is configured by using the PDP substrate manufactured according to Examples 1 to 4.
As shown in FIG. 11, the plasma display device 60 of this example is designed to have a module structure, and specifically includes an analog interface (hereinafter referred to as IF) 20 and a PDP module 30. .

  As shown in FIG. 11, the analog IF 20 includes a Y / C separation circuit 21 including a chroma decoder, an A / D conversion circuit 22, a synchronization signal control circuit 23 including a PLL circuit, an image format conversion circuit 24, The circuit includes an inverse γ (gamma) conversion circuit 25, a system control circuit 26, and a PLE control circuit 27.

  Schematically, the analog IF 20 converts the received analog video signal into a digital video signal, and then supplies the digital video signal to the PDP module 30. For example, an analog video signal transmitted from a TV tuner is decomposed into RGB luminance signals in the Y / C separation circuit 21 and then converted into digital signals in the A / D conversion circuit 22. Thereafter, when the pixel configuration of the PDP module 30 is different from the pixel configuration of the video signal, the image format conversion circuit 24 performs necessary image format conversion. The display luminance characteristic with respect to the input signal of the PDP is linearly proportional, but a normal video signal is corrected (γ conversion) in advance in accordance with the characteristic of the CRT. For this reason, after the A / D conversion of the video signal is performed in the A / D conversion circuit 22, the inverse γ conversion circuit 25 performs the inverse γ conversion on the video signal, and the digital video signal restored to the linear characteristic is obtained. Generate. This digital video signal is output to the PDP module 30 as an RGB video signal.

  Since the analog video signal does not include the sampling clock and data clock signal for A / D conversion, the PLL circuit built in the synchronization signal control circuit 23 is supplied with the horizontal synchronization signal simultaneously with the analog video signal. Is used as a reference to generate a sampling clock and a data clock signal and output them to the PDP module 30. The PLE control circuit 27 of the analog IF 20 performs brightness control. Specifically, the display luminance is increased when the average luminance level is equal to or lower than a predetermined value, and the display luminance is decreased when the average luminance level exceeds a predetermined value.

  The system control circuit 26 outputs various control signals to the PDP module 30. The PDP module 30 further includes a digital signal processing / control circuit 31, a panel unit 32, and an in-module power supply circuit 33 incorporating a DC / DC converter. The digital signal processing / control circuit 31 includes an input IF signal processing circuit 34, a frame memory 35, a memory control circuit 36, and a driver control circuit 37.

  For example, the average luminance level of the video signal input to the input IF signal processing circuit 34 is calculated by an input signal average luminance level calculation circuit (not shown) in the input IF signal processing circuit 34 and output as, for example, 5-bit data. Is done. Further, the PLE control circuit 27 sets PLE control data according to the average luminance level and inputs it to a luminance level control circuit (not shown) in the input IF signal processing circuit 34.

  The digital signal processing / control circuit 31 processes these various signals in the input IF signal processing circuit 34 and then transmits the control circuit to the panel unit 32. At the same time, the memory control circuit 36 and the driver control circuit 37 transmit the memory control circuit and driver control signal to the panel unit 32.

  The panel unit 32 includes a PDP 70 using the rear substrate manufactured according to the first to fourth embodiments, a scan driver 38 that drives the scan electrodes, a data driver 39 that drives the data electrodes, and the PDP 70 and the scan driver 38. The high voltage pulse circuit 40 that supplies a pulse voltage and the power recovery circuit 41 that recovers surplus power from the high voltage pulse circuit 40 are configured.

The PDP 70 is configured to have pixels arranged, for example, 1365 × 768. In the PDP 70, the scanning driver 38 controls the scanning electrodes, and the data driver 39 controls the data electrodes, so that lighting or non-lighting of predetermined pixels among these pixels is controlled and desired display is performed. .
The logic power supply supplies logic power to the digital signal processing / control circuit 31 and the panel unit 32. Further, the in-module power supply circuit 33 is supplied with DC power from the display power supply, converts the voltage of the DC power into a predetermined voltage, and then supplies the voltage to the panel unit 32.

Hereinafter, a method for manufacturing the plasma display device 60 of this example will be schematically described.
First, the PDP 70 using the back substrate manufactured according to the first to fourth embodiments, the scan driver 38, the data driver 39, the high voltage pulse circuit 40, and the power recovery circuit 41 are arranged on one substrate, and the panel unit. 32 is formed. Further, a digital signal processing / digital circuit 31 is formed separately from the panel section 32.

The panel unit 32, the digital signal processing / control circuit 31, and the in-module power supply circuit 33 thus formed are assembled as one module to form the PDP module 30. Further, the analog IF 20 is formed separately from the PDP module 30.
In this manner, after the PDP module 30 and the analog IF 20 are separately formed, both are electrically connected to complete the plasma display device 60 shown in FIG.

  As described above, by modularizing the plasma display device 60, it becomes possible to manufacture the plasma display device 60 independently of other components constituting the plasma display device. When a failure occurs, the repair can be simplified and shortened by replacing the PDP module 30 with each other.

  As described above, according to the method for manufacturing the plasma display device of this example, the plasma display device 60 is modularized so that the PDP module 30 can be replaced in the event of a failure. The time can be shortened.

  The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and the present invention can be changed even if there is a design change or the like without departing from the gist of the present invention. include. For example, in the embodiment, the example in which the partition walls are formed on the back substrate is shown, but the partition walls can also be formed on the front substrate. Therefore, it is not necessary to provide the partition wall only on the rear substrate, and it may be provided on the front substrate. The PDP of the present invention is not limited to an example used for a color plasma display device, but can also be applied to a PDP used for a monochrome display device.

It is a figure which shows the metal mold | die for forming the uneven | corrugated plate used for the manufacturing method of the board | substrate of PDP of this invention, (A) is a front view, (B) is a side view. It is a figure which shows the uneven | corrugated plate used for the manufacturing method of the board | substrate of PDP of this invention, (A) is a front view, (B) is a side view. BRIEF DESCRIPTION OF THE DRAWINGS It is process drawing which shows the manufacturing method of the board | substrate of PDP which is Example 1 of this invention in order of a process, (A) is a front view, (B) is a side view. It is sectional drawing which shows an example of the uneven | corrugated shape transfer base material with an electrode pattern used for the modification of the manufacturing method of the board | substrate of the same PDP. It is sectional drawing which shows the other example of the uneven | corrugated shape transfer base material with an electrode pattern used for the modification of the manufacturing method of the board | substrate of the same PDP. It is a figure explaining the method to manufacture a back substrate using the uneven | corrugated shaped transfer base material with the electrode pattern. It is sectional drawing which shows the back substrate of PDP manufactured by Example 1 of this invention. It is sectional drawing which shows the back substrate of PDP manufactured by Example 2 of this invention. It is sectional drawing which shows the back substrate of PDP manufactured by Example 3 of this invention. FIG. 6 is a process diagram illustrating a method of manufacturing a substrate of a PDP that is Embodiment 4 of the present invention in the order of processes, where (A) is a front view and (B) is a side view. It is a block diagram which shows the structure of the plasma display apparatus manufactured by the manufacturing method of the plasma display apparatus which is Example 5 of this invention. It is a perspective view which shows roughly the structure of PDP which is the principal part of the conventional color plasma display apparatus. It is process drawing which shows schematically the manufacturing method of the back substrate of the conventional PDP.

Explanation of symbols

1 Pattern forming paste 2 Blade 3 Electrode pattern (data electrode)
DESCRIPTION OF SYMBOLS 4 Adhesive paste 5 Board | substrate 6 Base material for uneven | corrugated shape transfer with 1st electrode pattern 7 Paste for pattern formation 8 Cover film 9 Base material for uneven | corrugated shape transfer with 2nd electrode pattern 11 Master partition pattern 12 Convex alignment marker 13 Adhesive layer 14, 15 Laminate roll 16 Cover film take-up roll 17 Base substrate take-up roll 18 Uneven shape 19 Base substrate 20 Analog interface (IF)
DESCRIPTION OF SYMBOLS 30 Plasma display panel (PDP) module 31 Digital signal processing and control circuit 32 Panel part 50 Concavity and convexity plate 51 Bulkhead pattern 52 Concave alignment marker 53 Molding resin body 54 Terminal cover part 55 Backing board 56, 63, 79 Back surface board 57 Glass substrate 58, 66, 73 Electrode pattern 59, 74 Dielectric layer 60 Plasma display device 65, 67, 75 Partition 61, 68, 76 Reflective layer 62, 69, 77 Phosphor layer 64 Metal substrate 72, 78 Adhesive layer 70 PDP (Plasma display panel)
71 Metal film 80 Mold

Claims (7)

A substrate of a plasma display panel in which a pair of substrates are arranged opposite to each other so that a discharge space is formed between both substrates, and a partition wall pattern and an electrode pattern for separating discharge cells are formed on one of the pair of substrates. A manufacturing method of
Applying a pattern forming paste to the concavo-convex plate which is a transfer mold of the partition wall pattern;
Curing the pattern forming paste; and
Forming the electrode pattern on the cured paste for pattern formation;
A method for manufacturing a substrate of a plasma display panel, comprising: A substrate of a plasma display panel in which a pair of substrates are arranged opposite to each other so that a discharge space is formed between both substrates, and a partition wall pattern and an electrode pattern for separating discharge cells are formed on one of the pair of substrates. A manufacturing method of
Forming the electrode pattern on the convex surface of the concavo-convex plate which is a transfer mold of the partition wall pattern;
Forming a pattern forming paste on the concavo-convex plate on which the electrode pattern is formed;
A method for manufacturing a substrate of a plasma display panel, comprising:   2. The method of manufacturing a substrate of a plasma display panel according to claim 1, wherein the barrier rib pattern is formed in a grid pattern.   3. The method of manufacturing a substrate of a plasma display panel according to claim 2, wherein the barrier rib pattern in a stripe shape is formed.   5. The method for manufacturing a substrate of a plasma display panel according to claim 1, wherein at least one of the pair of substrates is an insulating or conductive substrate.   6. The method of manufacturing a plasma display panel, wherein the substrate according to claim 1 is a rear substrate of the plasma display panel. A first step of manufacturing a plasma display panel by the method of manufacturing a plasma display panel according to claim 6;
A second step of manufacturing the plasma display panel as a module together with a circuit for driving the plasma display panel;
A third step of performing an image signal format conversion and electrically connecting an interface for transmission to the module to the module;
A method of manufacturing a plasma display device, comprising:

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