JP4515814B2 - 装着精度測定方法 - Google Patents

装着精度測定方法 Download PDF

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Publication number
JP4515814B2
JP4515814B2 JP2004134587A JP2004134587A JP4515814B2 JP 4515814 B2 JP4515814 B2 JP 4515814B2 JP 2004134587 A JP2004134587 A JP 2004134587A JP 2004134587 A JP2004134587 A JP 2004134587A JP 4515814 B2 JP4515814 B2 JP 4515814B2
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JP
Japan
Prior art keywords
substrate
jig
mounting
workpiece
side mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2004134587A
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English (en)
Japanese (ja)
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JP2005317806A5 (enExample
JP2005317806A (ja
Inventor
洋一 牧野
健 高野
朗 壁下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2004134587A priority Critical patent/JP4515814B2/ja
Publication of JP2005317806A publication Critical patent/JP2005317806A/ja
Publication of JP2005317806A5 publication Critical patent/JP2005317806A5/ja
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Publication of JP4515814B2 publication Critical patent/JP4515814B2/ja
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Expired - Fee Related legal-status Critical Current

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  • Image Processing (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Analysis (AREA)
JP2004134587A 2004-04-28 2004-04-28 装着精度測定方法 Expired - Fee Related JP4515814B2 (ja)

Priority Applications (1)

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JP2004134587A JP4515814B2 (ja) 2004-04-28 2004-04-28 装着精度測定方法

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Application Number Priority Date Filing Date Title
JP2004134587A JP4515814B2 (ja) 2004-04-28 2004-04-28 装着精度測定方法

Publications (3)

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JP2005317806A JP2005317806A (ja) 2005-11-10
JP2005317806A5 JP2005317806A5 (enExample) 2007-05-24
JP4515814B2 true JP4515814B2 (ja) 2010-08-04

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JP2004134587A Expired - Fee Related JP4515814B2 (ja) 2004-04-28 2004-04-28 装着精度測定方法

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JP (1) JP4515814B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4760752B2 (ja) * 2007-03-29 2011-08-31 パナソニック株式会社 部品搭載装置および部品搭載装置における搭載位置精度測定方法
KR20100107019A (ko) 2008-03-31 2010-10-04 후지쯔 가부시끼가이샤 면형체의 얼라이먼트 장치, 제조 장치, 면형체의 얼라이먼트 방법 및 제조 방법
JP5174583B2 (ja) * 2008-08-25 2013-04-03 Ｊｕｋｉ株式会社 電子部品実装装置の制御方法
JP4898753B2 (ja) * 2008-08-26 2012-03-21 ヤマハ発動機株式会社 部品実装システム、部品実装方法、基板貼付状態検出装置、動作条件データ作成装置、基板貼付装置、部品搭載装置および検査装置
JP5024494B1 (ja) * 2012-03-05 2012-09-12 富士ゼロックス株式会社 搭載装置、基板装置の製造方法
US10189654B2 (en) * 2014-06-11 2019-01-29 Universal Instruments Corporation Test device for establishing, verifying, and/or managing accuracy
DE102015112518B3 (de) * 2015-07-30 2016-12-01 Asm Assembly Systems Gmbh & Co. Kg Bestückmaschine und Verfahren zum Bestücken eines Trägers mit ungehäusten Chips
US10290118B2 (en) * 2015-08-06 2019-05-14 Cognex Corporation System and method for tying together machine vision coordinate spaces in a guided assembly environment
JP7607244B2 (ja) * 2021-03-11 2024-12-27 パナソニックＩｐマネジメント株式会社 オフセット値算出システムおよびオフセット値算出方法ならびに部品装着装置
JPWO2023286245A1 (enExample) * 2021-07-15 2023-01-19

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19839999C1 (de) * 1998-09-02 2000-05-04 Siemens Ag Verfahren und Vorrichtung zum Kalibrieren eines Verfahrwegs und/oder einer Winkellage einer Haltevorrichtung in einer Einrichtung zur Herstellung von elektrischen Baugruppen sowie Kalibriersubstrat
JP4326641B2 (ja) * 1999-11-05 2009-09-09 富士機械製造株式会社 装着装置，装着精度検出治具セットおよび装着精度検出方法
JP3738632B2 (ja) * 1999-12-16 2006-01-25 セイコーエプソン株式会社 光学的検出手段の検出データ更正方法及び光学的検出手段を備えた位置検出装置並びに電子部品の実装装置
JP4706107B2 (ja) * 2001-01-24 2011-06-22 ソニー株式会社 実装方法及び実装機能を実行させるためのプログラムを記録したコンピュータ読み取り可能なプログラム格納媒体
JP4033705B2 (ja) * 2002-05-08 2008-01-16 富士機械製造株式会社 プリント配線板位置誤差取得方法，プログラムおよび電子回路部品装着システム

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