JP4509072B2 - 基板整列方法 - Google Patents
基板整列方法 Download PDFInfo
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- JP4509072B2 JP4509072B2 JP2006229286A JP2006229286A JP4509072B2 JP 4509072 B2 JP4509072 B2 JP 4509072B2 JP 2006229286 A JP2006229286 A JP 2006229286A JP 2006229286 A JP2006229286 A JP 2006229286A JP 4509072 B2 JP4509072 B2 JP 4509072B2
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- 239000000758 substrate Substances 0.000 title claims description 109
- 238000000034 method Methods 0.000 title claims description 26
- 238000003384 imaging method Methods 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 9
- 239000012636 effector Substances 0.000 description 5
- 238000004904 shortening Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
310 基板受け台
320 基板
321 第1整列マーク
322 第2整列マーク
330 第1映像撮影装置
340 第2映像撮影装置
Claims (2)
- 基板受け台上に第1整列表示及び第2整列表示が形成された基板を定着させる段階と、
前記基板の上部に第1映像撮影装置及び第2映像撮影装置を位置させる段階と、
前記第1映像撮影装置を用いて前記第1整列表示の位置を検出して前記基板受け台上に前記基板を予備整列させる段階と、
前記第2映像撮影装置を用いて前記第2整列表示の位置を検出し、前記基板を再び整列させる段階と、を含む基板整列方法であって、
前記第1整列表示が、前記基板の一側のエッジ部と、前記エッジ部と対角線方向の他側のエッジ部とで形成され、
前記第2整列表示が、前記第1整列表示と対向する前記基板の一側のエッジ部と、前記エッジ部と対角線方向の他側のエッジ部とで形成され、
前記第1映像撮影装置の2台のカメラで得られた画像に、前記基板の一側のエッジ部と、前記エッジ部と対角線方向の他側のエッジ部との前記第1整列表示が位置されるように前記基板受け台上に前記基板を予備整列させ、
前記第2映像撮影装置の2台のカメラで得られた画像の中央領域に、前記第1整列表示と対向する前記基板の一側のエッジ部と、前記エッジ部と対角線方向の他側のエッジ部との前記第2整列表示が位置されるように前記基板を再び整列させることを特徴とする基板整列方法。 - 前記基板を再び整列させる段階において、前記基板を再び整列させるために前記基板受け台を移動させる段階を更に含むことを特徴とする請求項1に記載の基板整列方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060042319A KR20070109406A (ko) | 2006-05-11 | 2006-05-11 | 기판 정렬방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007305952A JP2007305952A (ja) | 2007-11-22 |
JP4509072B2 true JP4509072B2 (ja) | 2010-07-21 |
Family
ID=38839594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006229286A Active JP4509072B2 (ja) | 2006-05-11 | 2006-08-25 | 基板整列方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4509072B2 (ja) |
KR (1) | KR20070109406A (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014011231A (ja) * | 2012-06-28 | 2014-01-20 | Hitachi Ltd | ハンダボール印刷搭載装置 |
KR101506716B1 (ko) * | 2012-12-31 | 2015-03-31 | 엘아이지에이디피 주식회사 | 기판과 베어 글라스의 합착을 위한 정렬방법 |
KR101866139B1 (ko) * | 2017-08-25 | 2018-06-08 | 캐논 톡키 가부시키가이샤 | 얼라인먼트 방법, 얼라인먼트 장치, 이를 포함하는 진공증착방법 및 진공증착장치 |
KR20190124610A (ko) * | 2018-04-26 | 2019-11-05 | 캐논 톡키 가부시키가이샤 | 기판 반송 시스템, 전자 디바이스 제조장치 및 전자 디바이스 제조방법 |
KR102355418B1 (ko) * | 2018-04-26 | 2022-01-24 | 캐논 톡키 가부시키가이샤 | 기판 반송 시스템, 전자 디바이스 제조장치 및 전자 디바이스 제조방법 |
CN110989217B (zh) * | 2019-11-19 | 2021-09-24 | Tcl华星光电技术有限公司 | 一种基板及监控基板上膜层边界位置的方法 |
KR102472252B1 (ko) * | 2020-12-28 | 2022-11-30 | 주식회사 테스 | 기판접합장치의 예비정렬장치 및 예비정렬방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08114811A (ja) * | 1994-10-14 | 1996-05-07 | Toshiba Corp | 基板認識方法およびこの方法を用いた液晶パネル製造装置 |
JPH09283403A (ja) * | 1996-04-10 | 1997-10-31 | Nikon Corp | 露光装置 |
JP2002198278A (ja) * | 2000-12-22 | 2002-07-12 | Nikon Corp | 位置計測装置及びアライメント方法 |
JP2006112933A (ja) * | 2004-10-15 | 2006-04-27 | Hitachi High-Tech Electronics Engineering Co Ltd | アライメントマーク検査方法およびプログラム |
-
2006
- 2006-05-11 KR KR1020060042319A patent/KR20070109406A/ko not_active Application Discontinuation
- 2006-08-25 JP JP2006229286A patent/JP4509072B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08114811A (ja) * | 1994-10-14 | 1996-05-07 | Toshiba Corp | 基板認識方法およびこの方法を用いた液晶パネル製造装置 |
JPH09283403A (ja) * | 1996-04-10 | 1997-10-31 | Nikon Corp | 露光装置 |
JP2002198278A (ja) * | 2000-12-22 | 2002-07-12 | Nikon Corp | 位置計測装置及びアライメント方法 |
JP2006112933A (ja) * | 2004-10-15 | 2006-04-27 | Hitachi High-Tech Electronics Engineering Co Ltd | アライメントマーク検査方法およびプログラム |
Also Published As
Publication number | Publication date |
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KR20070109406A (ko) | 2007-11-15 |
JP2007305952A (ja) | 2007-11-22 |
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