JP4507436B2 - Non-reciprocal circuit element - Google Patents

Description

【００７６】
【表２】

【００７７】
（表１）から判るように、本実施の形態の場合、逆方向の破壊電圧が従来品の１０倍以上となっており、しかも（表２）から判るように特性は従来品とほとんど同じである。
【００７８】
また図３に示すように、標準信号発生器からの信号をアンプで増幅して、順方向にアイソレータに流した場合のアイソレータの温度は、図４に示すように６０℃程度であり、従来品とあまり変わらない。また、図５に示すように、標準信号発生器からの信号をアンプで増幅し、逆方向に流した場合に、２．５Ｗの電流を流した場合でも、アイソレータの温度は１２０℃以下であり、アイソレータの特性が劣化するほどの温度上昇はない。
【００７９】
本実施の形態においては、８８７ＭＨｚ〜９２５ＭＨｚ（中心周波数９０６ＭＨｚ）で動作するアイソレータを作製したが、本発明はこの周波数帯に限定されるものではない。また、本発明はアイソレータに限定されるものではなく、サーキュレータとしても有効である。
【００８０】
また、非可逆回路素子内部の空間に熱伝導率の良い熱伝導体１０を挿入し、抵抗器７にその熱伝導体１０を密着させることによって、従来の非可逆回路素子の特性を損なわず、順方向５Ｗ、逆方向２Ｗが保証できる非可逆回路素子が可能になる。
【００８１】
【発明の効果】
本発明は、磁性を有する基板と、基板の主面上に互いに絶縁されしかも所定の角度を持って交差したストリップラインと、基板に磁界を印可する磁石と、ストリップラインに接続されたコンデンサと、ストリップラインに接続された終端抵抗と、各構成部材を収納するケースと、ケース内に設けられた絶縁性の熱伝導体と、ケース内に少なくとも基板を収納する収納部を有する端子ベースを備え、終端抵抗上に端子ベースの一部が非配置となるように、端子ベースの形状を規定したことで、逆方向に流れる電流が大きくなったとしても内部で発生した熱を効率よく、他の部分へ拡散することができ、放熱効果を向上させることができる。また、従来の非可逆回路素子よりも大きい動作電力を保証でき、従来の電気特性、形状と変わらない非可逆回路素子を得ることができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態における非可逆回路素子の分解斜視図
【図２】本発明の一実施の形態における非可逆回路素子の断面図
【図３】本発明の一実施の形態における非可逆回路素子に順方向に５Ｗ入力したときの測定概念を示す図
【図４】本発明の一実施の形態における非可逆回路素子の時間と表面温度の関係を示すグラフ
【図５】本発明の一実施の形態における非可逆回路素子に順方向に電力を入力したときの測定概念を示す図
【図６】本発明の一実施の形態における非可逆回路素子に逆方向に入力した各電力における時間と表面温度の関係を示すグラフ
【図７】一般的な非可逆回路素子の電流の流れを示す概念図
【図８】一般的な非可逆回路素子の電流の流れを示す概念図
【図９】従来の非可逆回路素子を示す分解斜視図
【符号の説明】
１ 上カバー
２ 磁石
３ 端子ベース
３ａ，３ｂ 入出力端子
４ａ，４ｂ，４ｃ ストリップライン
４ｄ，４ｅ，４ｆ 端子部
５ フェライト板
６ 絶縁シート
７ 抵抗器
８ａ，８ｂ，８ｃ 整合用コンデンサ
９ 下ケース
９ａ 下ケース側面部
９ｂ 下ケース端子部（アース端子）
１０ 熱伝導体
１１ 絶縁物[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-reciprocal circuit device used for mobile communication devices such as a car phone and a cellular phone mainly used in the microwave band, and more particularly to a high power compatible non-reciprocal circuit device.
[0002]
[Prior art]
Since the nonreciprocal circuit device can be configured in a small size, it has been used for a terminal of a mobile communication device from an early stage. As shown in FIGS. 7 and 8, the nonreciprocal circuit element passes the input signal in the forward direction to the output side with a very small loss, and absorbs the reverse direction signal (reflection) by the terminating resistor. It does not pass through the terminal side. The nonreciprocal circuit element is placed between the power amplifier and the antenna in the transmission stage of the mobile communication device, and is used for the purpose of preventing the backflow of unnecessary signals to the power amplifier and stabilizing the impedance on the load side of the power amplifier. It has been.
[0003]
A general configuration of non-reciprocal circuit elements that are currently widely used in terminals such as mobile phones will be briefly described with reference to FIG. Three strip lines 4a, 4b, and 4c that are electrically insulated and intersect and overlap each other at an angle of about 120 degrees are arranged close to the ferrite plate 5, and the magnet 2 for magnetizing the ferrite faces the ferrite. Arranged. Matching capacitors 8a, 8b, and 8c are added in parallel to the strip lines 4a, 4b, and 4c, respectively. The strip lines 4a and 4b are connected to the input / output terminals 3a and 3b, and the strip line 4c is connected to the terminating resistor 7. Is done. The other end of each strip line is connected to a common grounding disk, and the grounding disk is electrically connected to the lower case 9 together with the three matching capacitors 8a, 8b and 8c and the grounding electrode of the resistor 7. Connected to. Further, together with the lower case 9, the upper case 1 including the ferrite plate 5 and the magnet 2 and constituting a part of the magnetic circuit is configured as shown in the figure.
[0004]
[Problems to be solved by the invention]
Recent rapid downsizing of mobile communication devices extends to base stations, and non-reciprocal circuit elements used in base stations may be used near the maximum operating power. Under these circumstances, it is desired to increase the operating power without impairing the current small size and low loss characteristics.
[0005]
The conventional non-reciprocal circuit device has an operating power of 2.5 W in the forward direction and 0.6 W in the reverse direction as an isolator, but there is an increasing demand for using it in about 5 W in the forward direction. However, in the structure of the conventional nonreciprocal circuit element, the problem with high power input is heat generation of the nonreciprocal circuit element, especially when high power is input in the reverse direction, the termination resistor heats up abnormally and is destroyed. End up.
[0006]
In order to solve the above-described conventional problems, an object of the present invention is to provide a non-reciprocal circuit device that realizes high power input without impairing the characteristics of a conventional miniaturized non-reciprocal circuit device.
[0007]
[Means for Solving the Problems]
  The present invention includes a substrate having magnetism,SaidStrip lines that are insulated from each other on the main surface of the substrate and intersect at a predetermined angle;SaidA magnet that applies a magnetic field to the substrate;SaidA capacitor connected to the stripline;SaidA termination resistor connected to the stripline;SaidA case for storing each component,SaidInsulating heat conductor provided in the caseA terminal base having a storage portion for storing at least a substrate in the caseWithAnd defining the shape of the terminal base so that a part of the terminal base is not disposed on the termination resistor.It was.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
  The invention according to claim 1 is a substrate having magnetism, a strip line that is insulated from each other on the main surface of the substrate and intersects with a predetermined angle, a magnet that applies a magnetic field to the substrate, and the strip line A capacitor connected toSaidA termination resistor connected to the strip line, a case for housing each of the components, and an insulating heat conductor provided in the case;A terminal base having a storage portion for storing at least a substrate in the caseWithAnd defining the shape of the terminal base so that a part of the terminal base is not disposed on the termination resistor.By using a nonreciprocal circuit device characterized by this, even if the current flowing in the reverse direction increases, the heat generated inside can be efficiently diffused to other parts, improving the heat dissipation effect. be able to.In addition, it is possible to improve the adhesion between the heat conductor and the termination resistor.
[0009]
  The invention according to claim 2SaidHeat conductorSaidThe non-reciprocal circuit device according to claim 1, wherein the non-reciprocal circuit element according to claim 1 is provided in the vicinity of the termination resistor or in contact with the termination resistor. It is possible to prevent element destruction due to temperature rise.
[0010]
  The invention described in claim 3SaidThe non-reciprocal circuit device according to claim 1, wherein the heat conductor is made of a material having plasticity or elasticity, so that the heat conductor can be easily accommodated in the case and the adhesion to each member is improved. In addition to obtaining a heat dissipation effect, it is not necessary to adjust the gap between the members when assembling the element, thereby improving productivity.
[0011]
  The invention according to claim 4SaidThe non-reciprocal circuit device according to claim 3, wherein the heat conductor is made of a resin material, and the heat conductive member can be provided in the case easily and reliably.
[0012]
  The invention according to claim 5SaidProvided on the terminating resistorSaidThermal conductorofThickness can be provided on other partsSaid3. The nonreciprocal circuit device according to claim 2, wherein the non-reciprocal circuit element is made thicker than the thickness of the heat conductor, thereby increasing the heat capacity of the portion where heat is transmitted from the terminal resistor, which generates particularly great heat, to the heat conductor. And the heat can be diffused smoothly.
[0013]
  The invention described in claim 6SaidHeat conductorSaidMagnet orSaid2. The nonreciprocal circuit device according to claim 1, wherein heat from the heat conductor flows into the case having the largest contact area with the outside air, thereby increasing the cooling efficiency. Moreover, since the magnet is also provided in contact with the case, the same effect can be obtained.
[0014]
  The invention described in claim 7SaidThe heat conductor has adhesiveness, and the heat conductor isSaidThe nonreciprocal circuit device according to claim 1, wherein the heat conductor does not move in the device even when an external impact is applied to the device. Does not cause any change.
[0015]
  The invention described in claim 8SaidThe heat conductor is solid orSaidThe non-reciprocal circuit device according to claim 1, wherein the non-reciprocal circuit device is made of a viscous material that does not flow out of the case, so that the heat conducting member does not protrude from the case and affect other members. Deterioration can be prevented.
[0017]
  Claim9The described inventionSaidThe terminal base has an annular shape, and the substrate is accommodated in the central portion of the terminal base. The terminal base is provided with an opening that is partially cut away, and the opening is connected to the central portion. Claims8By having the non-reciprocal circuit element described, it has an effect of creating a space for mounting a plurality of resistors and an effect of creating a space for arranging a heat conductor having good thermal conductivity. .
[0018]
Hereinafter, the non-reciprocal circuit device will be described with reference to FIG.
[0019]
First, the strip line 4a, 4b, 4c is wound so as to cover the ferrite 5, and the ground conductor portion of the strip line is brought into contact with the lower case 9. Each strip line is electrically insulated by an insulating sheet 6.
[0020]
The lower case 9 is mounted so that one electrode of the matching capacitors 8a, 8b, and 8c is bonded, and the termination resistor 7 is mounted so that one electrode is bonded.
[0021]
Terminal portions 4d, 4e, and 4f provided at the ends of the strip lines 4a, 4b, and 4c are joined to the electrodes of the matching capacitors 8a, 8b, and 8c, respectively. Both electrodes of the matching capacitor 8c are joined.
[0022]
Input / output terminals 3a and 3b are joined to the terminal portions 4d and 4e of the strip lines 4a and 4b to which the termination resistor 7 is not connected. The input / output terminals 3a and 3b are integrally formed with the terminal base 3, and the terminal base 3 is disposed so as to press the joint portions between the terminal portions 4d, 4e and 4f and the matching capacitors 8a, 8b and 8c. The
[0023]
A lumped constant isolator is formed by fixing a magnet 2 for applying a DC magnetic field to a ferrite plate 5 to an upper cover 1 and sandwiching a thermal conductor 10 having an insulating property with a lower case 9 joined with a terminal base 3. Assembled. At this time, the shape of the heat conductor 10 sandwiched between the resistors 7 is made to be in close contact with the resistor 7, for example, the amount of the heat conductor 10 in the portion in contact with the resistor 7 is larger than the other portions (for example, on the resistor 7 It is preferable that the value to be provided and the thickness of the conductor 10 be made thicker than other portions).
[0024]
Each configuration will be described below.
[0025]
First, the thermal conductor 10 that fills the space of the nonreciprocal circuit element will be described.
[0026]
As a constituent material of the thermal conductor 10, it is necessary to include an insulating material having high thermal conductivity. For example, silicone rubber sheet, oil compound (grease-like with alumina powder), condensation type silicone RTV rubber (one that cures and adheres to moisture in the air), addition type liquid silicone rubber / gel (heat curing) The mold may be one-component or two-component). In this way, the heat conductor 10 is generally made of a soft material, so that it can be easily deformed and stored easily by pressing force between other members in the element, and the adhesion between the members is also improved. It becomes easier and spreads easily in the space inside the non-reciprocal circuit device. In addition, a grease-like heat conductor 10 is also preferably used, but preferably has a viscosity (at 150 ° C. or less) such that the heat conductor 10 does not flow outside when housed in the element. . That is, as described above, a sheet-like material or a highly viscous grease-like material is preferably used. On the other hand, a material that applies a large stress to the internal components of the element when cured is also not preferred. That is, when the resin is cured, a large stress is applied to the component, and the characteristics may be deteriorated or the joint may be disconnected.
[0027]
In particular, it is most preferable to use a resin material such as silicone rubber having a thermal conductivity of 1 W / m · ° C. or more for the thermal conductor 10 because of its electrical characteristics and flame retardancy.
[0028]
The heat conductor 10 is preferably in contact with the resistor 7 or provided in the vicinity thereof. That is, the resistor 7 generates the largest amount of heat, and by increasing the heat dissipating locations via the heat conductor 10, it is possible to prevent the temperature from exceeding a predetermined temperature (130 ° C.). Further, as described above, by increasing the thickness and amount of the heat conductor 10 provided on the resistor 7, the heat generated in the resistor 7 can be efficiently guided to the heat conductor 10, and the temperature of the element is increased. The rise can be further suppressed.
[0029]
Further, the heat conductor 10 is particularly preferable because it can easily dissipate heat outward by contacting the magnet 2 or the lower case 9 or the upper cover 1.
[0030]
The heat conductor 10 can be easily sandwiched and handled by each member inside the nonreciprocal circuit element, and a plurality of heat conductors can be used at the same time regardless of the shape of the heat conductor. It is also possible to use a plurality of layers. Furthermore, if this thermal conductor has adhesiveness or has an adhesive layer, positioning and fixing of components inside the nonreciprocal circuit element are facilitated, and even if an impact is applied to the element, the inside of the element Therefore, it is preferable that the heat conductor 10 can be prevented from moving and the characteristic can be prevented from changing. A similar effect can be obtained by using an adhesive instead of the adhesive layer.
[0031]
The heat conductor 10 is preferably provided between the magnet 2 and the substrate 6 and is preferably provided so that a part thereof is in contact with the resistor 7. As shown in FIG. 1, a configuration in which a sheet-like heat conductor 10 is provided between the magnet 2 and the substrate 6 is most preferable as a process.
[0032]
As described above, by providing the insulating heat conductor 10 in the element, for example, the antenna of the communication device is damaged, and high-power input is applied to the nonreciprocal circuit element in the reverse direction due to total reflection. In this case, even if the resistor 7 causes abnormal heat generation due to high power, the heat conductor 10 can efficiently conduct the heat dissipated from the resistor 7 to other parts. Accordingly, it is possible to prevent a high-power current from flowing into an amplifier such as an operational amplifier connected to the non-reciprocal circuit element in the reverse direction, thereby preventing damage to the amplifier.
[0033]
Next, the strip lines 4a, 4b, 4c will be described.
[0034]
The strip lines 4a, 4b, 4c are preferably formed of a metal material such as copper, gold, silver or the like in a sheet-like body having a predetermined shape, and in particular, copper, a copper alloy, or a copper added with a predetermined amount of additive. Use is very advantageous in terms of electrical characteristics, processability, and cost.
[0035]
Further, in the present embodiment, the three strip lines 4a, 4b, and 4c are used. However, four or more strip lines may be used.
[0036]
Further, in the present embodiment, the strip lines 4a, 4b, 4c are integrally formed with each other at the center (not shown) and are substantially Y-shaped. However, the strip lines 4a, 4b, 4c are separate from each other. It may be configured.
[0037]
In the present embodiment, when the ferrite plate 5 is wound around the strip lines 4a, 4b, 4c, the strip lines 4a, 4b, 4c extended from the ground conductor portion are bent along the ferrite side surface, and further, the same ferrite It is preferable that the magnetic filling rate can be increased as much as possible by bending along the side surface facing the side surface, and an increase in insertion loss of the nonreciprocal circuit element due to downsizing can be prevented.
[0038]
An insulating sheet 6 is provided between the strip lines 4a, 4b, and 4c, and is electrically insulated.
[0039]
Specifically, it is preferable to use rolled copper foil (25 μm to 60 μm) as the strip lines 4 a, 4 b, and 4 c, and when the thickness is 25 μm or less, disconnection or the like is likely to occur, resulting in poor productivity. If it is 60 μm or more, it is unsuitable for thinness. The rolled copper foil is preferably plated with a conductive metal material such as silver or gold at a thickness of 1 μm to 5 μm. With this configuration, the surface conductivity of the stripline can be improved. , The characteristics can be improved.
[0040]
Next, the ferrite plate 5 will be described.
[0041]
The ferrite plate 5 can take a disk shape, a square plate shape, an elliptical plate shape, a polygonal plate shape, or the like, and is preferably a disk shape when judged from a characteristic aspect or the like.
[0042]
The ferrite plate 5 is preferably a magnetic material containing Fe, Y, Al, Gd and the like.
[0043]
When the strip line is wound around the ferrite plate 5, predetermined chamfering is performed on the corner portion to suppress the deterioration of the characteristics due to the disconnection of the strip line or the friction with the ferrite plate 5.
[0044]
The size of the ferrite plate 5 is preferably 0.2 mm to 0.8 mm (preferably 0.3 mm to 0.6 mm) as a thickness from the viewpoint of the characteristic surface strength, and is thicker than the thickness of the matching capacitor. It is characterized by that. For example, when the ferrite plate 5 is a disc shape, the diameter is preferably 1.6 mm to 3.5 mm (preferably 2.5 mm to 2.9 mm) in view of miniaturization and characteristics.
[0045]
Further, both the main surfaces of the ferrite plate 5 can be formed to have a predetermined thickness by polishing or the like, and variations in characteristics can be suppressed.
[0046]
Next, the magnet 2 will be described.
[0047]
The magnet 2 is preferably black because image recognition at the time of assembly is easy. Further, it is preferable to have a magnetic force enough to apply a magnetic field to the ferrite plate 5, and it is preferable to use Sr-based ferrite as a particularly preferable material.
[0048]
Furthermore, the size of the magnet 2 is preferably larger than the ferrite plate 5, and the ferrite plate 5 is preferably accommodated within the projected area of the magnet 2. It is particularly preferable to arrange the magnet 2 and the ferrite plate 5 so that the centers of the magnets 2 and 5 coincide with each other because the magnetic field can be uniformly applied to the ferrite plate 5.
[0049]
The specific shape of the magnet 2 can be a disc shape, a square plate shape, an elliptical plate shape, a polygonal plate shape or the like, and in particular, when the ferrite plate 5 is a disc shape. The rectangular plate shape is preferable because a uniform magnetic field can be applied to the ferrite plate 5 and positioning and the like can be easily performed.
[0050]
The thickness of the magnet 2 is preferably 0.3 mm to 1.5 mm in view of thinning and the strength of the magnetic field.
[0051]
Next, the lower case 9 and the upper cover 1 will be described.
[0052]
The lower case 9 is generally made of a metal material having good conductivity, and particularly preferably, a conductive metal substrate containing copper, silver, iron or the like is suitably used. Further, on the conductive metal substrate, It is preferable to form a metal material having good conductivity such as silver or gold by plating or the like from the viewpoint of electrical characteristics and bondability with other parts. Further, the lower case 9 is provided with a projection 9b in addition to the wall portion 9a, and this projection 9b may be used as a ground terminal.
[0053]
Further, the insulator 11 provided in the lower case 9 is formed on the hot terminal side of the resistor 7 and the side surface portion of the lower case where the matching capacitors 8 a, 8 b and 8 c are close to the lower case 9. This insulator is preferably constituted by at least one method of adhesive sheet, non-adhesive sheet or printing.
[0054]
The lower case 9 has at least the ground conductor portions of the strip lines 4a, 4b, 4c joined together by a conductive joining material or the like.
[0055]
The lower case 9 has a substantially U-shaped cross section, and no adjustment window or the like is formed.
[0056]
Further, the upper cover 1 is also made of the same material, and is not provided with an adjustment window or the like, and at least a magnet 2 is bonded to the upper cover 1 with a bonding material.
[0057]
Next, the termination resistor 7 will be described.
[0058]
A chip-fixed resistor is preferably used as the termination resistor 7 from the viewpoint of small size and mountability. Further, when a plurality of resistors are used in parallel, it is preferable to use a multiple chip resistor because the number of mounted parts can be reduced.
[0059]
Next, the matching capacitors 8a, 8b, and 8c will be described.
[0060]
As the matching capacitors 8a, 8b, and 8c, it is preferable to use a parallel plate type capacitor in view of capacitance variation and miniaturization of the nonreciprocal circuit element, in particular, thinning.
[0061]
The electrode at this time is made of an electrode material selected from at least one of copper, silver, and nickel.
[0062]
In addition, it is advantageous in terms of mounting surface and positioning that the external shape of the matching capacitors 8a, 8b, and 8c is preferably rectangular. The outer shape may be a circle or an ellipse.
[0063]
Next, the terminal base 3 will be described.
[0064]
A feature of the terminal base 3 is that it is provided so as to surround the ferrite plate 5, the mounting position can be defined, and the input / output terminals 3a and 3b are inserted into the terminal base, so that the ferrite plate 5 and the strip lines 4a and 4b are inserted. , 4c and the input / output terminals 3a, 3b can be stabilized, and variations in characteristics can be reduced to facilitate manufacture. Preferably, there is a missing portion that does not completely surround the ferrite plate 5, and there is preferably a missing portion of 10% or more from the point of disposing the thermal conductor 10 around the resistor 7, and positioning of the ferrite plate 5, and In order to keep the positional relationship with the input / output terminals 3a and 3b stable and to form the input / output terminals 3a and 3b on the terminal base 3, it is preferable that the missing portion is 50% or less. More preferably, if it is set to 10 to 25%, the structure for pressing the joint portion between the terminal portions 4d, 4e, and 4f provided at the tips of the strip lines 4a, 4b, and 4c and the matching capacitors 8a, 8b, and 8c is not impaired, and the assembly is performed. The bonding failure at the time is reduced.
[0065]
The terminal base 3 has a configuration in which input / output terminals 3a and 3b are provided using insert molding or the like in a non-conductive material such as resin (epoxy resin, liquid crystal polymer, etc.) or ceramic. When configuring the terminal base 3 with a resin having poor thermal conductivity, it is preferable from the viewpoint of improving heat dissipation to create a space where a heat conductor having good thermal conductivity can be placed instead by providing a plurality of the missing portions. The terminal base 3 may be divided into a plurality of parts.
[0066]
The input / output terminals 3a and 3b are made of a conductive material such as brass, and it is preferable that the conductive material is plated with a good conductor such as silver.
[0067]
Further, since the terminal base 3 is likely to be heated when mounted on another circuit board with a bonding material or the like, the terminal base 3 is preferably made of a material having heat resistance. Specifically, it is preferable to have heat resistance of 250 ° C. or higher (preferably 290 ° C. or higher).
[0068]
The terminal base 3 is provided so that the terminal portions 4d and 4e provided at the tips of the strip lines 4a and 4b are sandwiched between the matching capacitors 8a and 8b and the input / output terminals 3a and 3b, and at least the adhesive is attached to the lower case 7 Or joined by fitting.
[0069]
Preferably, the terminal base 3 can be further reduced in size and weight if the terminal base 3 is not provided with terminals and electrode patterns other than the input / output terminals 3a and 3b.
[0070]
In this embodiment, the input / output terminals 3a and 3b are provided on the terminal base 3 made of resin or the like by insert molding or the like. However, the input / output terminals 3a and 3b are bonded to the terminal base 3 with an adhesive or the like. Alternatively, the terminal base 3 may be provided with a locking portion or the like, and the locking portion may be deformed to mechanically fix the input / output terminals 3a and 3b. It may be used and fixed securely. Further, in the present embodiment, the input / output terminals 3a and 3b are bent on a plate-like body made of a conductive material such as metal, but a thin film forming technique such as plating or sputtering on the terminal base 3 is used. In this case, the input / output terminals 3a and 3b may be formed of a thin film. In this case, the input / output terminals 3a and 3b are formed on the surface of the terminal base 3, or the input / output terminals 3a and 3b are formed inside the terminal base 3. It is good also as a structure which forms 3b and exposes a part on the surface of the terminal base 3. FIG.
[0071]
Further, as shown in FIG. 1, the terminal base 3 is formed in a substantially C-shape, and the resistor 7 is exposed in the opening 3c, that is, the terminal base 3 exists in a resistance shape. By configuring so that the thermal conductor 10 is not provided between the magnet 2 and the terminal base 3, the resistor 7 and the thermal conductor 10 can be reliably brought into contact with each other.
[0072]
The heat dissipation of the nonreciprocal circuit device according to the embodiment of the present invention will be described below.
[0073]
A thermal conductor 10 having good thermal conductivity was inserted into the space between the magnet 2 attached to the upper cover 1 or the upper cover 1 and the terminal base 3 and the space between the ferrite plate 5. In the present embodiment, the silicon rubber sheet TC-50TXS manufactured by Shin-Etsu Silicone Co., Ltd. was used as the heat conductor 10 having good thermal conductivity. However, it may be not only a sheet shape but also an oil compound or a curable rubber shape. Further, in the present embodiment, two resistors 7 are configured in parallel as shown in FIG. 1, but one or three or more resistors may be terminated, or multiple chip resistors may be used. .
[0074]
As the evaluation of the isolator in this embodiment, the breakdown power (Table 1) and the electrical characteristics (Table 2) of the nonreciprocal circuit element by reverse direction input are shown in (Table 1) and (Table 2).
[0075]
[Table 1]

[0076]
[Table 2]

[0077]
As can be seen from (Table 1), in the case of the present embodiment, the breakdown voltage in the reverse direction is 10 times or more that of the conventional product, and the characteristics are almost the same as those of the conventional product as can be seen from (Table 2). is there.
[0078]
As shown in FIG. 3, the temperature of the isolator when the signal from the standard signal generator is amplified by an amplifier and passed through the isolator in the forward direction is about 60 ° C. as shown in FIG. And not much different. Also, as shown in FIG. 5, when the signal from the standard signal generator is amplified by an amplifier and flows in the reverse direction, the isolator temperature is 120 ° C. or less even when a current of 2.5 W is passed. There is no temperature rise to the extent that the characteristics of the isolator deteriorate.
[0079]
In this embodiment, an isolator that operates at 887 MHz to 925 MHz (center frequency 906 MHz) is manufactured, but the present invention is not limited to this frequency band. Further, the present invention is not limited to an isolator, but is effective as a circulator.
[0080]
In addition, by inserting the thermal conductor 10 having good thermal conductivity into the space inside the non-reciprocal circuit element and bringing the thermal conductor 10 into close contact with the resistor 7, the characteristics of the conventional non-reciprocal circuit element are not impaired, A nonreciprocal circuit device capable of guaranteeing the forward direction 5W and the reverse direction 2W becomes possible.
[0081]
【The invention's effect】
  The present invention includes a magnetic substrate, striplines that are insulated from each other on the principal surface of the substrate and intersecting each other at a predetermined angle, a magnet that applies a magnetic field to the substrate, a capacitor connected to the stripline, A terminating resistor connected to the stripline, a case for housing each component, and an insulating heat conductor provided in the case;A terminal base having a storage portion for storing at least a substrate in the caseWithDefine the shape of the terminal base so that a part of the terminal base is not placed on the termination resistor.As a result, even if the current flowing in the reverse direction increases, the heat generated inside can be efficiently diffused to other parts, and the heat dissipation effect can be improved. In addition, a larger operating power than that of the conventional non-reciprocal circuit element can be ensured, and a non-reciprocal circuit element that does not differ from the conventional electrical characteristics and shape can be obtained.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a non-reciprocal circuit device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of a non-reciprocal circuit device according to one embodiment of the present invention.
FIG. 3 is a diagram showing a measurement concept when 5 W is input in the forward direction to the nonreciprocal circuit device according to one embodiment of the present invention.
FIG. 4 is a graph showing the relationship between time and surface temperature of a nonreciprocal circuit device according to one embodiment of the present invention.
FIG. 5 is a diagram showing a measurement concept when power is input in the forward direction to the nonreciprocal circuit device according to one embodiment of the present invention.
FIG. 6 is a graph showing the relationship between time and surface temperature at each power input in the reverse direction to the nonreciprocal circuit device according to one embodiment of the present invention.
FIG. 7 is a conceptual diagram showing a current flow of a general non-reciprocal circuit device.
FIG. 8 is a conceptual diagram showing a current flow of a general non-reciprocal circuit device.
FIG. 9 is an exploded perspective view showing a conventional non-reciprocal circuit device.
[Explanation of symbols]
1 Top cover
2 Magnet
3 terminal base
3a, 3b I / O terminal
4a, 4b, 4c Strip line
4d, 4e, 4f terminal
5 Ferrite plate
6 Insulation sheet
7 resistors
8a, 8b, 8c Matching capacitors
9 Lower case
9a Side surface of lower case
9b Lower case terminal (grounding terminal)
10 Thermal conductor
11 Insulator

Claims (9)

A substrate having a magnetic, a strip line intersecting with insulated Moreover predetermined angles on the main surface of the substrate, and a magnet for applying a magnetic field to the substrate, a capacitor connected to said strip line, wherein A terminal base having a termination resistor connected to a stripline, a case for housing each of the constituent members, an insulating heat conductor provided in the case, and a storage portion for storing at least a substrate in the case And a shape of the terminal base is defined such that a part of the terminal base is not disposed on the termination resistor . Nonreciprocal circuit device according to claim 1, characterized in that provided in contact with the heat conductor in the vicinity to or the terminating resistor of the terminating resistor. 2. The nonreciprocal circuit device according to claim 1, wherein the heat conductor is made of a material having plasticity or elasticity. 4. The nonreciprocal circuit device according to claim 3, wherein the heat conductor is made of a resin material. Nonreciprocal circuit device according to claim 2, characterized in that thicker than a thickness of the heat conducting member provided the thickness of the heat conducting member provided on said terminating resistor on the other part. Nonreciprocal circuit device according to claim 1, characterized in that the heat conductor is brought into contact with at least one of the magnets to or the case. Non-reciprocal circuit element according to claim 1, wherein the heat conductor has an adhesive property, the heat conductor is characterized in that it is fixed within the case. Non-reciprocal circuit device of the heat conductor according to claim 1, wherein configured at a level of viscosity which does not flow from the solid to or the case material. The terminal base has an annular shape, and a substrate is accommodated in the central portion of the terminal base. The terminal base is provided with an opening that is partially cut away, and the opening is connected to the central portion. 9. The nonreciprocal circuit device according to claim 8, wherein:

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