JP4066333B2 - Non-reciprocal circuit element - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an irreversible circuit element having irreversible transmission characteristics for a high-frequency signal and a resin case used therefor, and more specifically, is used in a mobile communication system such as a mobile phone, and is generally used as an isolator or a circulator. The present invention relates to a non-reciprocal circuit device and a resin case.
[0002]
[Prior art]
Conventionally, there are non-reciprocal circuit elements such as isolators and circulators as one of transmission / reception circuit components such as mobile phones and automobile phones used in the microwave band and UHF band. In general, an isolator or a circulator is used for the purpose of preventing the amplifier from being damaged, and has a function of reducing the insertion loss in the signal transmission direction and increasing the reverse loss in the reverse direction. Hereinafter, the present specification will be described by taking an isolator as an example of the non-reciprocal circuit device.
[0003]
FIG. 12 is an exploded perspective view showing an example of a conventional isolator. This isolator includes a metal case (upper case 1 and lower case 12) functioning as a magnetic yoke, a permanent magnet 2, an assembly 20, plate capacitors 8, 9, and 10, a dummy resistor 11, and a resin case 7.
The assembly 20 prepares a conductor thin plate having a structure in which three central conductors 4, 5, 6 project radially from a disc-shaped shield plate, and a garnet ferrite (ferrimagnetic material) is formed on the disk-like portion of the conductor thin plate. ) 3 is arranged, and the three central conductors 4, 5, 6 are bent and overlapped to be integrated. At this time, the central conductors 4, 5, and 6 are insulated and overlapped.
[0004]
The resin case 7 has a circular recess 13a for the assembly 20 in the center, and has recesses 13b, 13c, and 13d for flat plate capacitors around it. Connection electrodes 14a are formed in the bottoms of the recesses 13b, 13c, and 13d for the plate capacitor and the recesses 13a for the assembly 20. And this connection electrode 14a is comprised with the said conductive thin plate of about 0.1 mm, is extended to the side part of the resin case, and comprises the external terminals 15a-15f. The external terminals 15d to 15f are formed symmetrically on the opposing surfaces of the external terminals 15a to 15c. The resin case is formed with terminal electrode portions 16a and 16d to which the central conductor is connected. The terminal electrode portions 16a and 16d are formed so as to be electrically connected to the external terminals 15a and 15d on the side surfaces. These external terminals and terminal electrode portions and connection electrodes to be connected are formed from the same conductive thin plate.
[0005]
Flat capacitors 8, 9, and 10 are accommodated in the recesses 13b, 13c, and 13d of the resin case 7, respectively. This flat capacitor is configured by forming electrodes on the upper and lower surfaces of a flat dielectric substrate, and the electrodes on the lower surface and the connection electrodes 14a formed on the bottom of the recesses are connected by soldering. A dummy resistor 11 is disposed in the recess 13d together with the flat plate capacitor 10. One electrode of the dummy resistor 11 is solder-connected to the connection electrode 14a, and the other is connected to the center conductor 6.
[0006]
Next, the assembly 20 described above is disposed in the recess 13 a of the resin case 7. At this time, the disk-shaped shield plate of the central conductor portion is soldered to the connection electrode 14a. Thus, one end of the center conductor is grounded. One end of the center conductor 4 is connected to the electrode on the upper surface of the plate capacitor 8 and the terminal electrode portion 16a, and one end of the center conductor 5 is connected to the electrode on the upper surface of the plate capacitor 9 and the terminal electrode portion 16d.
[0007]
Then, the resin case 7 is disposed on the lower case 12. The lower case 12 has a structure that matches the recess 21 at the bottom of the resin case 7. In the recess 21, the connection electrode 14 a is exposed and soldered to the lower case 12, and the resin case 7 and the lower case 12 are integrated. And the permanent magnet 2 which applies a direct-current magnetic field to the garnet ferrite 3 is positioned in the upper case 1, and the upper case 1 and the lower case 12 are fitted, and the surface mountable isolator is comprised. Note that a circulator can be obtained by eliminating the resistance and providing a terminal electrode portion in the same manner as the other central conductors. The capacitor, the terminal electrode portion, and the center conductor end are connected by, for example, soldering or spot welding (for example, Patent Document 1).
[0008]
As another example, there is a case where a capacitor is placed upright and disposed in a resin case so that the electrode surface of the capacitor is substantially parallel to the central axis of the garnet ferrite, and the garnet ferrite is disposed in a space surrounded by the capacitor ( For example, Patent Document 2).
[0009]
[Patent Document 1]
JP-A-10-135711
[Patent Document 2]
JP-A-10-303607
[0010]
[Problems to be solved by the invention]
In recent years, in the field of mobile communications, not limited to isolators, there has been an increasing demand for smaller size, higher performance, and lower price, and now, downsizing in the order of several hundred μm and higher performance in the number of commas dB. The price reduction that has become the issue. Currently, 5 mm square isolators are widely used, but there is a demand for further miniaturization, and the present inventors have developed with the goal of 4 mm square (reduction of mounting area by less than 40%). .
To further reduce the size of a conventional isolator using a flat plate capacitor as described above, simply reduce the size of the flat plate capacitors 8, 9, 10 or decrease the diameter of the garnet ferrite 3, or both. Must be reduced.
[0011]
For example, the capacitance of the plate capacitor is expressed as C = εr · ε0 · S / d. Here, C is a capacitance value, εr is a dielectric constant of the dielectric, ε0 is a vacuum dielectric constant, S is an area of the electrode, and d is a thickness of the dielectric between the electrodes. In order to obtain the same capacity or more even if the area S of the electrode is reduced by reducing the planar dimension of the plate capacitor, a dielectric having a large relative dielectric constant εr is used, or a dielectric between the electrodes is used. The thickness d must be reduced. However, a dielectric material having a large relative dielectric constant εr generally tends to have a large dielectric loss, and a large dielectric loss is not preferable because an insertion loss of an isolator increases. Further, when the thickness d of the dielectric is reduced, the mechanical strength of the flat plate capacitor is reduced, and when the nonreciprocal circuit element is assembled, cracks and chips are likely to occur, and a desired capacitance value cannot be obtained. Arise.
[0012]
Further, downsizing of garnet ferrite has a problem that a frequency band in which a desired insertion loss characteristic is selected is narrowed. If the diameter of the garnet ferrite is reduced, the inductance composed of the central conductor and garnet ferrite is reduced, so that the capacitance value of the plate capacitor must be increased in order to obtain the required operating frequency, and the size of the plate capacitor is the same. Together, it gets bigger. In conventional non-reciprocal circuit elements, the size of garnet ferrite is limited to φ2.2 (mm), and if smaller garnet ferrite is used, electrical characteristics are deteriorated and a plate capacitor having a large outer dimension must be used. In the configuration in which the plate capacitor is disposed around the conventional assembly, it is difficult to realize a nonreciprocal circuit device having a small and practical characteristic.
[0013]
In the conventional isolator, the plate capacitors 8, 9, 10 are arranged in a U shape so as to surround the assembly 20. The plate capacitor 10 connected in parallel with the dummy resistor 11 is arranged orthogonal to the external terminals 15 a to 15 f formed on the resin case 7. For this reason, when bending force is applied to the nonreciprocal circuit element due to bending of the mounting board on which the nonreciprocal circuit element is mounted, the resin case is deformed with the external terminal as a fulcrum, and as a result, the flat plate connected in parallel with the dummy resistor There was also a problem that the capacitor 10 was destroyed.
[0014]
As another miniaturization method, like the isolator disclosed in Patent Document 2, the capacitor is placed upright in the resin case so that the electrode surface of the capacitor is substantially parallel to the central axis of the garnet ferrite, and the garnet ferrite is arranged. In the method of securing the space to be used, there is a problem that the structure of the resin case is complicated and it is difficult to handle the capacitor during assembly.
[0015]
Therefore, the present invention has several problems with conventional non-reciprocal circuit elements, that is, difficulty in miniaturization of non-reciprocal circuit elements, and destruction of flat capacitor due to external force acting on non-reciprocal circuit elements. Small size to solve It is another object of the present invention to provide a highly reliable nonreciprocal circuit device.
[0016]
[Means for Solving the Problems]
The first invention is An assembly configured as a connection part in which a plurality of center conductors are arranged in an electrically insulated state in a ferrimagnetic body in an electrically insulated state, and one ends of the center conductors are connected to each other; In the assembly composed of a thin conductor plate or magnetic yoke and thermoplastic resin, and having a plurality of center conductors arranged on a ferrimagnetic body, recesses are formed to respectively accommodate a plurality of load capacities to which one end of the center conductor is connected. Resin case for non-reciprocal circuit element With The load capacitor is a flat plate capacitor in which an electrode is formed on a main surface of a long plate-like dielectric substrate, and each bottom surface of the recess is formed in a substantially flat shape with an integral conductor thin plate and accommodated in the recess. On top of the plate capacitor Through insulation So as to arrange the assembly None, when the side where the central conductors are arranged in an intersecting manner is the upper part of the assembly, the connecting part is located at the lower part, the insulating member covers the connecting part, and one of the electrodes of the single-plate capacitor Is arranged so that the part appears, and the connection part of the assembly is not grounded It is a nonreciprocal circuit element.
[0017]
According to a second aspect of the present invention, there is provided an assembly configured as a connecting portion in which a plurality of center conductors are arranged in an electrically insulated state in a cross shape in a ferrimagnetic body, and one ends of the center conductors are connected to each other, and a conductor thin plate or magnetic yoke And an assembly of a plurality of central conductors arranged on a ferrimagnetic material, each of which accommodates three load capacities to which one end of the central conductor is connected Recess A non-reciprocal circuit element resin case, wherein the load capacitance is a flat plate capacitor having electrodes formed on the main surface of a long plate-like dielectric substrate. The recess is formed so as to accommodate the capacitors in parallel in substantially the same direction. Formed When the assembly is arranged via an insulating member on the upper part of the plate capacitor accommodated in the recess, and the side where the central conductors are arranged in an intersecting manner is the upper part of the assembly, the connection part Is a non-reciprocal circuit element that is disposed at the lower portion, the insulating member covers the connecting portion, and is arranged so that a part of the electrode of the single plate capacitor appears, and does not ground the connecting portion of the assembly. .
[0018]
In the present invention, it is preferable that the electrode surfaces of the plate capacitor to which one end of the central conductor is connected have substantially the same height. The non-reciprocal circuit element resin case is composed of a conductive thin plate and a thermoplastic resin, and a partition wall between the recesses formed of this thermoplastic resin is an electrode of a flat capacitor to which one end of the central conductor is connected. It is formed so as not to protrude from the surface, and does not interfere with the assembly disposed above the plate capacitor. Similarly, the outer wall portion of the resin case for the nonreciprocal circuit element is also formed of the thermoplastic resin, and the outer wall portion is formed higher than the electrode surface of the plate capacitor to which one end of the center conductor is connected. Configured to keep. The two opposing side surfaces of the outer wall portion are provided with external terminals made of the thin conductor plate or the magnetic yoke.
The non-reciprocal circuit element resin case has, in addition to the outer wall, a partition wall facing the short side surface of the flat plate capacitor. The partition wall exceeds the height of the partition wall between the recesses, and It is formed below the height of the outer wall. Resistance is accommodated in a recess formed between the outer wall and the partition wall facing the short side surface of the flat plate capacitor.
It is preferable that all the plate capacitors are arranged in each of the concave portions so as to be substantially in the same direction in the longitudinal direction. And if the recessed part which accommodates a flat plate capacitor is formed so that the long side surface of the flat plate capacitor may be substantially parallel to the two side surfaces of the outer wall portion of the non-reciprocal circuit element resin case provided with an external terminal made of a conductive thin plate Even if an external force acts on the resin case, the destruction of the plate capacitor can be extremely reduced.
[0019]
In the present invention, A first resistor may be disposed so as to be connected in parallel with one of the plate capacitors, and can be operated as an isolator. The first resistor is preferably a chip resistor rather than a printed resistor from the viewpoint of power durability. This chip resistor is arranged in a recess formed by the outer wall of the non-reciprocal circuit element resin case and the partition wall facing the short side surface of the plate capacitor. Preferably, three plate capacitors are provided, and the plate capacitor connected in parallel with the resistor is disposed between the other two plate capacitors.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Example 1
The resin case for a nonreciprocal circuit element of the present invention and the nonreciprocal circuit element using the resin case will be described in detail below with reference to FIG.
FIG. 1 is an external view of a resin case for a non-reciprocal circuit device according to an embodiment of the present invention, and FIG. 1 (a) is a plan view of a side where a flat plate capacitor and an assembly are arranged. FIG. 1B is a side view of the outer wall on which the terminals are formed, and FIG. 1C is a plan view of the back side. 2 is a cross-sectional view of the resin case for a non-reciprocal circuit element disclosed in FIG. 1, FIG. 2 (a) is a cross-sectional view along AA ′, FIG. 2 (b) is a cross-sectional view along BB ′, and FIG. c) is a CC ′ section, FIG. 3 (a) is a DD ′ section, and FIG. 3 (b) is an EE ′ section. FIG. 4 is an exploded perspective view showing an example of a non-reciprocal circuit element configured using the resin case for a non-reciprocal circuit element of the present invention. FIG. 5A is a plan view showing a mounted state of the flat plate capacitor and the assembly in the resin case for a non-reciprocal circuit device of the present invention, and FIG. 5B is a sectional view thereof.
[0021]
The resin case 7 is formed with recesses 13b, 13c, 13d in which the plate capacitors 8, 9, 10 are accommodated and a recess 23 in which the dummy resistor 11 connected in parallel with the plate capacitor 10 is disposed. The resin case 7 is formed by integrating a thin Cu conductor plate of about 0.1 mm and a high heat-resistant thermoplastic engineering plastic such as a liquid crystal polymer or polyphenylene sulfide. The Cu conductor thin plate is a metal or alloy containing at least one of silver, copper, gold, and aluminum on its surface, and has an electrical resistivity of 5.5 μΩcm or less, preferably 3.0 μΩcm, more preferably 1.8 μΩcm or less. A certain highly conductive metal film is formed, thereby improving the transmission efficiency of the microwave signal and suppressing the mutual interference with the outside to reduce the loss. The film thickness at this time is 0.5 to 25 μm, preferably 0.5 to 10 μm, and more preferably 1 to 8 μm. The conductor thin plate is formed into a hoop shape, which is placed in a mold and injection molded using the thermoplastic engineering plastic. The bottoms of the three recesses 13b, 13c, and 13d for accommodating the plate capacitors are exposed to the flat conductive thin plate to form a common connection electrode 14a, and the plate capacitors 8, 9, and 10 are arranged in a single plane. Then, it is soldered to the electrode on the lower surface of the plate capacitor and the connection electrode 14a formed on the bottom of the recess.
The dummy resistor 11 is disposed in the recess 23, and one electrode is solder-connected to the connection electrode 14a.
The assembly 20 is prepared, for example, by a conductor thin plate having a structure in which three central conductors 4, 5, 6 project radially from a disk-shaped shield plate (not shown), as in the prior art. The garnet ferrite 3 is arranged on the disk-shaped portion of the above, and the three central conductors 4, 5, 6 are bent and overlapped to be integrated. On the upper side of the flat capacitor, an assembly 20 is disposed via an insulating member 22 such as an insulating sheet made of polyimide resin. One end of the center conductor 4 is connected to the electrode on the upper surface of the plate capacitor 8 and the terminal electrode portion 16 a, and one end of the center conductor 5 is connected to the electrode on the upper surface of the plate capacitor 9, the terminal electrode portion 16 d and the dummy resistor 11. The
[0022]
In the resin case of the present invention, the electrode surfaces of the plate capacitors 8, 9, and 10 are substantially equal in height, and the partition wall 50 between the recesses in which the plate capacitors are accommodated projects beyond the electrode surface of the plate capacitor. Therefore, the assembly 20 is stably arranged without tilting during assembly. In the resin case disclosed herein, since the connection electrodes 14a on which the three plate capacitors are arranged are on the same plane, the thicknesses of the plate capacitors are formed to be equal to each other, and the electrode surfaces of the plate capacitors are substantially formed. The height is equal.
Further, even if the plate capacitors 8 and 9 arranged so as to sandwich the plate capacitor 10 are made to have substantially the same thickness, and the plate capacitor 10 is thinner than the other plate capacitors 8 and 9, the assembly 20 can be stably provided. Can be arranged.
[0023]
The outer wall 51 of the non-reciprocal circuit element resin case 7 is formed of the thermoplastic resin, and the outer wall 51 is formed higher than the electrode surface of the plate capacitor to which one end of the center conductor is connected. And it comprises so that the external terminals 15a-15f which consist of the said conductor thin plate may be provided in two side surfaces which the outer wall part opposes.
This external terminal is formed of the Cu conductor thin plate, and after the injection molding of the conductor thin plate and the thermoplastic resin, the lead portion (not shown) of the conductor thin plate formed into a hoop shape is cut and bent with a die. It processed and formed as the said external terminal. Out of the external terminals, the external terminals 15b, 15c, 15e, and 15f are connected to the connection electrode 14a.
In addition to the outer wall 51 and the partition wall 50 between the flat plate capacitors, the non-reciprocal circuit element resin case also has a partition wall 52 on the side facing the short side surface of the flat plate capacitor. It is formed to exceed the height of the wall and below the height of the outer wall. The dummy resistor 11 connected in parallel with the plate capacitor 10 is accommodated in the recess 23 formed by the outer wall 51 and the partition wall 52 on the external terminal 15f side. Further, a part of the outer wall facing the partition wall 52 through the plate capacitors 8 and 9 is made convex toward the assembly side, and the convex portion 53 and the partition wall 53 make the assembly 20 in the resin case 7 Positioning is performed.
[0024]
In the resin case, all the plate capacitors 8, 9, and 10 are aligned in the longitudinal direction so as to be substantially in the same direction, and are arranged in the concave portion. And this recessed part is formed so that the long side surface of all the flat capacitors may become substantially parallel with two side surfaces of the outer wall part of the resin case for nonreciprocal circuit elements provided with the external terminal which consists of conductor thin plates. The bottom surface portion of the resin case 7 is concaver than the external terminals on the bottom surface portion, like the one used in the conventional non-reciprocal circuit element, and the connection electrode 14a is exposed. The lower case 12 of the nonreciprocal circuit element is disposed in the recess 21 and is soldered and integrated with the connection electrode 14a. In such a resin case structure, as described above, an external force acts on the resin case from the thickness direction, and even if bending occurs with the external terminal as a fulcrum, the bending to the flat capacitor 10 connected in parallel with the dummy resistor 11 occurs. Even when the influence is extremely reduced and an unnecessary external force is applied, the plate capacitor 10 is not destroyed.
[0025]
Using such a resin case, a 4 mm square isolator compatible with 800 MHz (D-AMPS frequency: 824 MHz to 849 MHz) was manufactured. This isolator is composed of a metal case (upper case 1 and lower case 12), a permanent magnet 2, an assembly 20, plate capacitors 8, 9, and 10, a dummy resistor 11 and a resin case 7 that function as a magnetic yoke, as in the conventional isolator. It is configured. FIG. 6 shows an equivalent circuit according to an embodiment of the present invention. Inductors L1, L2, and L3 are formed by the garnet ferrite portion around which the central conductors 4, 5, and 6 are wound, and capacitors C1, C2, and C3 are formed by the plate capacitors 8, 9, and 10. A dummy resistor 11 (Rt) connected in parallel to the capacitor C3 is disposed, and an isolator that operates at a desired frequency f0 (center frequency) is configured by adjusting the inductances L1, L2, and L3 and the capacitors C1, C2, and C3. .
The most characteristic part of this isolator is that the assembly 20 is disposed on the upper surface side of the plate capacitors 8, 9, 10 via the insulating member 22, in other words, the assembly 20 and the plate capacitors 8, 9, 10. By disposing them on different surfaces, each can be configured on one surface, and when it is a non-reciprocal circuit element, it is easy to obtain desired garnet dimensions and capacitor dimensions (capacitance).
FIG. 7 shows the electrical characteristics of the isolator according to one embodiment of the present invention. FIG. 7A shows the insertion between the input port P1 (corresponding to the external terminal 15a) and the output port P2 (corresponding to the external terminal 15d). FIG. 7B is a frequency characteristic diagram of the loss characteristic and the return characteristic. FIG. 7B shows the frequency of the isolation characteristic and the return characteristic between the output port P2 (corresponding to the external terminal 15d) and the input port P1 (corresponding to the external terminal 15a). A characteristic diagram is shown.
In the isolator of the present invention, the insertion loss has a peak value of 0.5 dB or less, and also in the passband is 0.55 dB or less. Also, isolation characteristics of 20 dB or more were obtained, and excellent electrical characteristics could be obtained despite being small.
[0026]
(Example 2)
Hereinafter, a resin case for a nonreciprocal circuit device according to another embodiment of the present invention and a nonreciprocal circuit device using the same will be described in detail.
8 is an external view of a resin case for a non-reciprocal circuit device according to one embodiment of the present invention, and FIG. 8 (a) is a plan view on the side where a plate capacitor and an assembly are arranged. FIG. 8B is a side view of the outer wall on which the terminals are formed, and FIG. 8C is a plan view on the back side. 9 is a cross-sectional view of the resin case for a non-reciprocal circuit device disclosed in FIG. 8, FIG. 9A is a cross-sectional view along AA ′, FIG. 9B is a cross-sectional view along BB ′, and FIG. c) is a CC ′ section, FIG. 10A is a DD ′ section, and FIG. 10B is an EE ′ section. FIG. 11 is an exploded perspective view showing an example of a non-reciprocal circuit device configured using the resin case for a non-reciprocal circuit device of the present invention.
This embodiment has many parts in common with the above-described embodiment, and in the above figure, the same reference numerals are given to the same functional parts as those in the drawing shown in the first embodiment. The following description will be focused on the differences from the first embodiment.
As shown in FIG. 8, the non-reciprocal circuit device according to the present invention does not have the conductor thin plate as in the first embodiment, and the assembly 20, capacitors 8, 9, 10 and resistor 11 are provided in a predetermined part on the lower case 12. And a permanent magnet is arranged. The structure and manufacturing method will be described in detail below.
[0027]
The magnetic yoke constituting the lower case 12 is formed by punching a long sheet material made of a metal material into a predetermined shape with a press machine, forming a magnetic yoke portion connected from the hoop portion of the lead frame, and bending a predetermined portion. Supplied in a processed lead frame.
The metal material composing the lead frame is excellent in magnetic properties such as SPCC, 42Ni · Fe alloy, 45Ni · Fe alloy, Fe-Co alloy, etc., and these metal materials are cold to about 100 to 300 μm. Rolled or hot rolled. Since the magnetic yoke is used as a part of the magnetic circuit, it is preferable to select a magnetic material having excellent magnetic characteristics. As for the magnetic characteristics, the maximum permeability is preferably 5000 or more and the saturation magnetic flux density is preferably 1.4 Tesla or more.
Furthermore, the surface has a conductivity of 5.5 μΩcm or less, preferably 3.0 μΩcm or less, more preferably 1.8 μΩcm or less with a metal or alloy containing at least one of silver, copper, gold and aluminum. A high metal film is formed. The film thickness at this time is 0.5 to 25 μm, preferably 0.5 to 10 μm, and more preferably 1 to 8 μm. With this configuration, when the non-reciprocal circuit element is formed, the metal film can increase the transmission efficiency of high-frequency signals, suppress mutual interference with the outside, and reduce loss.
Although details will be described later, when the non-reciprocal circuit element is used, a metal material constituting the lower case may be exposed from the metal film. In such a case, as the metal material, 42Ni · Fe alloy or 45Ni is used. -It is preferable to use a metal material excellent in oxidation resistance, such as an Fe alloy.
[0028]
The Fe—Co alloy has a maximum magnetic permeability of 15000 and a saturation magnetic flux density of 2.25 Tesla. An ultra-thin plate having a thickness of about 100 μm can be produced as a plate material, and is suitable as a magnetic yoke. Specifically, the composition is, respectively, by mass%, Co: 49, V: 2, C: ≤ 0.015, Si: ≤ 0.10, Mn: ≤ 0.15, the balance Fe and an alloy of inevitable impurities It is preferable to do this. Here, Co is selected from 40 to 60% based on the correlation between the frequency band in which the nonreciprocal circuit element is used and the magnetic characteristics, but is preferably around 50%, and V is added to improve cold workability. However, since it affects the magnetic characteristics, it should be 5% or less, and 2% is desirable for ensuring workability. If this Fe—Co alloy is used for the yoke, the leakage of magnetic flux in the magnetic circuit is sufficiently and sufficiently suppressed even if the yoke is thinned, so that the isolator can be further reduced in thickness and size.
[0029]
Sprocket holes are provided at predetermined intervals in the hoop portions of the long lead frame. A lower case 12 of the non-reciprocal circuit element is integrally provided at the tips of a plurality of support portions extending from the hoop portion. Further, the tip of the support portion is separated from the lower case 12, and input / output terminals described later are integrally provided. In the middle of reaching the lower case 12 of the support portions 53 and 54, a portion having a narrow width (narrow portion) is formed. In a subsequent process, the lead frame 50 and the lower case 12 are separated at the narrow portion. By thus separating the narrow portion, the area of the magnetic yoke where the surface of the metal material is exposed is minimized, and oxidation of the exposed portion is reduced.
In addition, a substantially V-shaped separation groove is formed in the width direction of the support portions 53 and 54 so that the lead frame and the lower case can be easily separated on the back surface side (the mounting surface side with the circuit board) of the narrow portion. It is installed. By providing the separation groove in this way, there is no burr due to cutting on the back surface side of the narrow part, and soldering when mounting the nonreciprocal circuit element on the circuit board can be ensured, so open defects Does not occur, and the fixing strength to the circuit board does not decrease.
[0030]
The concave portion 14a in which the flat plate capacitor 10 at the substantially central portion of the lower case 12 is disposed may be formed at a different depth from the concave portion in which the other flat plate capacitors 8 and 9 are disposed. In that case, the lower case 12 may be drawn by a mold. Further, the depth in that case is approximately equal to or less than the thickness of the metal material constituting the lower case. Further, although the back side of the lower case corresponding to the recess 14a is convex, the depth at the time of formation is appropriately adjusted so as not to interfere with the mounting surface. If a ground electrode is provided and soldered to the portion of the circuit board corresponding to the convex portion on the back side of the lower case corresponding to the recess 14a, a stable ground potential can be obtained and the adhesion strength between the circuit board and the nonreciprocal circuit element can be obtained. Can be improved.
[0031]
Then, the input / output terminals 15a and 15d, the ground terminals 15b, 15c, 15e and 15f, and the lower case side wall are bent and shaped. Then, the lead frame was placed on an injection molding machine, and a resin such as liquid crystal polymer or polyphenylene sulfide and other heat resistant thermoplastic engineering plastics was insert molded to form the lower case 12.
In the lower case 12, the input / output terminals 15a and 15d and the ground terminals 15b, 15c, 15e, and 15f are exposed on the inner bottom surface of the lower case 12, and the arrangement of the plate capacitor and the assembly is easy as in the first embodiment. Thus, a partition wall made of the resin is formed. As shown in FIG. 8C, the bottom surface of the lower case 12 exposes the input / output terminals 15a and 15, ground terminals 15b, 15c, 15e and 15f, and a part (shaded portion) of the lower case 12. With this configuration, when the nonreciprocal circuit element is mounted on the circuit board of the electronic device, the resin is interposed between a part (shaded portion) of the lower case 12 and the input terminal and the ground terminal. In addition, the solder does not flow from the input terminal or the ground terminal to the bottom surface of the lower case, and the input / output terminal and the ground terminal can be securely soldered to the circuit board without any short circuit.
[0032]
The lower case 12 formed in this way is sequentially transported through the assembling steps while being connected to the lead frame using a sprocket hole. Then, flat capacitors 8, 9, 10 and a resistor 11 are appropriately disposed on a portion surrounded by a partition wall formed of resin on the upper surface of the lower case 12, and an insulating sheet made of polyimide resin is disposed above the flat capacitor. The assembly 20 is disposed via the insulating member 22. One end of the center conductor 4 is connected to the electrode on the upper surface of the plate capacitor 8 and the terminal electrode portion 16 a, and one end of the center conductor 5 is connected to the electrode on the upper surface of the plate capacitor 9, the terminal electrode portion 16 d and the dummy resistor 11. Then, the permanent magnet 2 is arranged in the thickness direction so as to apply a DC magnetic field to the assembly 20, and the upper case 1 as a magnetic yoke is fitted with the lower case 12 to form a magnetic circuit. At that time, the upper case 1 and the lower case 12 are mechanically fixed, and since high frequency current flows in the upper and lower cases, they are fixed by soldering each other so as to ensure electrical connection. preferable.
[0033]
In this way, a non-reciprocal circuit element connected to the hoop portion of the lead frame was configured. And the said soldering was performed through the reflow process. Thereafter, the nonreciprocal circuit element was cut off from the long lead frame by a cut groove formed in the support portion.
[0034]
In the present embodiment, the nonreciprocal circuit device could be reduced in height by eliminating the thin conductor plate in the first embodiment. And by arranging the plate capacitor directly in the lower case, even if an external force acts on the non-reciprocal circuit element, the external force acting directly on the plate capacitor can be reduced by the rigidity of the metal material constituting the lower case. As a result, the destruction of the plate capacitor could be reduced.
[0035]
【The invention's effect】
According to the present invention, there are some problems of conventional non-reciprocal circuit elements, that is, difficulty in miniaturization of non-reciprocal circuit elements, and destruction of flat capacitor due to external force acting on non-reciprocal circuit elements. Small size to solve In addition, a highly reliable nonreciprocal circuit device can be obtained.
[Brief description of the drawings]
FIG. 1 is a non-reciprocal circuit according to an embodiment of the present invention. Used for (A) It is a top view of the side by which a flat plate capacitor and an assembly are arrange | positioned of a resin case, (b) is a side view of the outer wall in which the terminal was formed, (c) is a top view on the back side.
2A is a cross-sectional view taken along the line AA ′, FIG. 2B is a cross-sectional view taken along the line BB ′, and FIG. 2C is a cross-sectional view taken along the line CC ′. It is a cross section.
3A is a cross-sectional view taken along the line DD ′, and FIG. 3B is a cross-sectional view taken along the line EE ′ of the resin case for a non-reciprocal circuit disclosed in FIG. 1;
FIG. 4 of the present invention Non-reciprocal circuit element It is a disassembled perspective view which shows an example.
FIG. 5 is a non-reciprocal circuit device according to an embodiment of the present invention. Used for (A) of the resin case is a plan view on the mounting surface side such as a flat plate capacitor, and (b) is a cross-sectional view along the line aa ′.
[Fig. 6] An example of the nonreciprocal circuit device of the present invention is shown. It is an equivalent circuit.
[Fig. 7] of the present invention. Non-reciprocal circuit device according to one embodiment FIG.
FIG. 8 relates to another embodiment of the present invention. Non-reciprocal circuit element (A) It is a top view of the side by which a flat capacitor and an assembly are arrange | positioned, (b) It is a side view of the outer wall in which the terminal was formed, (c) is a top view on the back side.
FIG. 9 is disclosed in FIG. Non-reciprocal circuit element (A) is AA 'sectional drawing, (b) is BB' sectional drawing, (c) is CC 'sectional.
FIG. 10 is disclosed in FIG. Non-reciprocal circuit element (A) is a DD ′ section, and (b) is an EE ′ section.
FIG. 11 is an exploded perspective view showing an example of a non-reciprocal circuit device according to another embodiment of the present invention.
FIG. 12 is an exploded perspective view of a conventional non-reciprocal circuit device.

Claims (11)

An assembly configured as a connection portion in which a plurality of central conductors are arranged in an electrically insulated state in a ferrimagnetic body in an electrically insulated state, and one end of the central conductor is connected to each other, and is composed of a conductor thin plate or a magnetic yoke and a thermoplastic resin A non-reciprocal circuit element resin case formed with recesses for accommodating a plurality of load capacities, each of which is connected to one end of the center conductor, of an assembly in which a plurality of center conductors are arranged in a ferrimagnetic body,
The load capacitor is a flat plate capacitor in which an electrode is formed on a main surface of a long plate-like dielectric substrate, and each bottom surface of the recess is formed in a substantially flat shape with an integral conductor thin plate and accommodated in the recess. The assembly is arranged on the upper part of the plate capacitor via an insulating member,
When the side where the central conductors are arranged in an intersecting manner is the upper part of the assembly, the connecting part is located at the lower part, the insulating member covers the connecting part, and a part of the electrode of the single plate capacitor is A non-reciprocal circuit device which is arranged so as to appear and does not ground a connection portion of the assembly. An assembly configured as a connection portion in which a plurality of central conductors are arranged in an electrically insulated state in a ferrimagnetic body in an electrically insulated state, and one end of the central conductor is connected to each other, and is composed of a conductor thin plate or a magnetic yoke and a thermoplastic resin And a resin case for a non-reciprocal circuit element in which recesses for accommodating three load capacities, each of which is connected to one end of the center conductor, of an assembly in which a plurality of center conductors are arranged on a ferrimagnetic body,
The load capacitor is a flat plate capacitor in which electrodes are formed on the main surface of a long plate-like dielectric substrate, and the recess is formed in the resin case for a non-reciprocal circuit element so that the flat plate capacitors are accommodated in parallel in substantially the same direction. Is formed, and the assembly is arranged via an insulating member on the upper part of the plate capacitor accommodated in the recess,
When the side where the central conductors are arranged in an intersecting manner is the upper part of the assembly, the connecting part is located at the lower part, the insulating member covers the connecting part, and a part of the electrode of the single plate capacitor is A non-reciprocal circuit device which is arranged so as to appear and does not ground a connection portion of the assembly.   3. The nonreciprocal circuit device according to claim 1, wherein electrode surfaces of the plate capacitor to which one end of the central conductor is connected have substantially the same height.   The non-reciprocal circuit element resin case includes a partition wall formed of a thermoplastic resin between the recesses, and the partition wall does not protrude from an electrode surface of a plate capacitor to which one end of the center conductor is connected. The nonreciprocal circuit device according to any one of claims 1 to 3.   The outer wall standing upright on the outer periphery of the non-reciprocal circuit element resin case is formed of the thermoplastic resin, and the outer wall is formed higher than the electrode surface of the plate capacitor to which one end of a central conductor is connected. The nonreciprocal circuit device according to claim 4, further comprising an external terminal made of the thin conductor plate on two opposing side surfaces of the substrate.   The resin case for a nonreciprocal circuit element has a partition wall between a short side surface of a flat plate capacitor and the outer wall, and the partition wall exceeds the height of the partition wall between the recesses, and the height of the outer wall. The nonreciprocal circuit device according to claim 5, wherein the nonreciprocal circuit device is formed as follows.   7. The nonreciprocal circuit device according to claim 1, wherein all the plate capacitors are aligned in the longitudinal direction so as to be substantially in the same direction and are arranged in the concave portion.   The concave portion is formed such that the longitudinal side surfaces of all the plate capacitors are substantially parallel to the two side surfaces of the outer wall of the resin case for a non-reciprocal circuit element having an external terminal made of a thin conductor plate or a magnetic yoke. The nonreciprocal circuit device according to any one of claims 1 to 7.   11. The nonreciprocal circuit device according to claim 1, further comprising a first resistor connected in parallel with one of the plate capacitors, and operating as an isolator.   10. The nonreciprocal circuit device according to claim 9, wherein the first resistor is disposed in a recess formed by a partition wall facing the outer wall of the resin case for the nonreciprocal circuit device and the short side surface of the flat plate capacitor. .   11. The nonreciprocal according to claim 9, wherein three plate capacitors are provided, and one of the plate capacitors connected in parallel with the first resistor is disposed between the other two plate capacitors. Circuit element.

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