JP2000349511A - Irreversible circuit component and lumped constant isolator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an irreversible circuit component and a lumped constant isolator that the miniaturization of a mobile phone and the extension of the service life of a battery can be realized by integrating an impedance matching circuit with a power amplifier. SOLUTION: The irreversible circuit component is provided with a strip line aggregate 1 provided close to a ferrite board 5, a magnet 6 that applies a magnetic field to the ferrite board 5, capacitors 20, 21 connected to the strip line aggregate 1, and a terminal base 12 connected to the strip line aggregate 1. One end of the strip line aggregate 1 is connected to ground and the other end is connected to the capacitors 20, 21 whose one end is connected to ground and a chip inductor 19 by laser processing in place of a winding is arranged at the other end of the strip line aggregate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lumped-constant type nonreciprocal circuit device such as a circulator and an isolator used for a microwave communication device such as a cellular phone, and more particularly to a load device which performs impedance matching with a power amplifier in a preceding stage. The present invention relates to a non-reciprocal circuit device capable of extending battery life by improving stability and suppressing loss of a mobile phone or the like.

[0002]

2. Description of the Related Art A lumped constant type isolator is used as a non-reciprocal circuit device used in a terminal of a mobile communication device. The isolator is placed between the power amplifier and the antenna in the transmission section of the mobile communication device, and is used for the purpose of preventing backflow of unnecessary signals to the power amplifier, stabilizing the impedance on the load side of the power amplifier, etc. However, impedance matching with the power amplifier is often not always achieved, and it is required to match the input impedance of the non-reciprocal circuit element with the impedance of the power amplifier with emphasis on battery life of mobile phones and the like.

[0003]

However, in the above-described configuration, there is a demand for further downsizing of the mobile phone and extension of the battery life. In order to extend the battery life, impedance matching was performed by adding an inductor or capacitor to the board of the mobile phone to achieve matching, but there was a problem in terms of miniaturization of the mobile phone. . An object of the present invention is to provide a non-reciprocal circuit element and a lumped-constant type isolator that can realize a miniaturization of a mobile phone and an extension of battery life by incorporating an impedance matching circuit with a power amplifier.

[0004]

According to the present invention, there is provided a ferrite substrate, a strip line assembly provided in close proximity to the ferrite substrate, a magnet for applying a magnetic field to the ferrite substrate, and a connection to the strip assembly. And a terminal base connected to the stripline assembly, wherein the terminal base has an enclosing configuration surrounding the ferrite substrate and the magnet, and the stripline assembly has one end grounded, A capacitor whose one end is grounded at one end is connected to the other end of the stripline assembly on at least one of the input side and the output side, and a chip inductor formed by laser processing is connected in series instead of a winding. Second and third parallel plate capacitors each having one end grounded to the input side and the output side of the chip inductor, and a chip By connecting either the capacitor or the multilayer capacitor to both ends, the input impedance of the non-reciprocal circuit element can be matched with the impedance of the power amplifier in the preceding stage to improve the load stability of the power amplifier. Miniaturization and extension of battery life can be realized.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention according to claim 1, wherein a ferrite substrate, a strip line assembly provided adjacent to the ferrite substrate, a magnet for applying a magnetic field to the ferrite substrate, and the strip assembly And a terminal base connected to the stripline assembly, wherein the terminal base has a surrounding configuration surrounding the ferrite substrate and the magnet, and one end of the stripline assembly is grounded. The other end is connected to a capacitor having one end grounded, and the other end of the strip line assembly on the input side is connected to a chip inductor formed by laser processing in series in place of a winding, so that the input impedance is increased. Can be varied, and the impedance matching with the power amplifier is improved. Furthermore, the use of a laser-processed chip inductor instead of a wound or laminated chip impedance makes it possible to easily change the inductance value and achieve the required input impedance, making the chip inductor a non-reciprocal circuit device. By taking in and matching the input impedance with the impedance of the power amplifier, it is possible to realize a compact mobile phone and extend the battery life.

According to a second aspect of the present invention, one of a second and a third parallel plate capacitor, one end of which is grounded at the input and output terminals of the chip inductor, a chip capacitor or a multilayer capacitor is connected to both ends. With such a configuration, the input impedance can be varied, and the impedance matching with the power amplifier can be improved. Further, by using a chip inductor formed by laser processing instead of a winding or multilayer chip impedance, the inductance value can be easily changed, and second and third capacitors are connected to the input and output sides of the chip inductor. This makes it possible to make fine adjustments that could not be made with the chip inductor alone, and achieve the required input impedance. By incorporating the chip inductor and the second and third capacitors into the non-reciprocal circuit device, the input impedance can be reduced. The impedance of the power amplifier can be matched, and the size of the mobile phone can be reduced and the battery life can be extended.

According to a third aspect of the present invention, there is provided a ferrite substrate, a strip line assembly provided in close proximity to the ferrite substrate, a magnet for applying a magnetic field to the ferrite substrate, and connected to the strip assembly. A capacitor, and a terminal base connected to the strip line assembly, wherein the terminal base has a surrounding configuration surrounding the ferrite substrate and the magnet, and the strip line assembly has one end grounded and the other end connected. A capacitor having one end grounded is connected to the input side, and the second and third ends of the non-reciprocal circuit element having the chip inductor connected in series are connected to the input side and the output side of the chip inductor. Non-reciprocal circuit element with either parallel plate capacitor, chip capacitor or multilayer capacitor connected to both ends It is possible to improve the load stability of the power amplifier by taking the impedance matching of a power amplifier in a previous stage of the input impedance,
As a mobile phone, miniaturization and extension of battery life can be realized.

According to a fourth aspect of the present invention, a resistor is connected to at least one strip line of the strip line assembly of the non-reciprocal circuit device according to any one of the first to third aspects. Although the conventional chip inductor and the second and third capacitors could be provided with only the function of the low-pass filter without being provided, it was difficult to have the function of impedance matching. However, the input impedance can be adjusted by loading the chip inductor and the second and third capacitors, and impedance matching with the power amplifier can be achieved, so that the size of the mobile phone can be reduced and the battery life can be extended. Can be realized.

FIG. 1 is an exploded perspective view showing a non-reciprocal circuit device according to an embodiment of the present invention.

In FIG. 1, reference numeral 1 denotes a strip line assembly, and the strip line assembly 1 is composed of a plurality of strip lines 2, 3, and 4. Terminals 2a, 3a, and 4a are provided at ends of the strip lines 2, 3, and 4, respectively.

Reference numeral 5 denotes a ferrite substrate around which the stripline assembly 1 is wound, 6 denotes a magnet for applying a magnetic field to the ferrite substrate 5, 7 denotes a lower case, and an insulator 8 is provided on the lower case 7 and a capacitor 9 is provided. , 10, and 11 are mounted, and the lower case 7 has capacitors 9, 10, 1
At least one of the electrodes is electrically connected.

Terminals 2a, 3a, 4a, 2a are respectively connected to the other electrodes of the capacitors 9, 10, 11, 20. Further, on the opposite side of the terminal 2a connected to the capacitor, 19 is a chip inductor.
Are electrically connected, and the other of the inductors is connected to terminal 1
3, the terminal 13 is electrically connected to one electrode of the capacitor 21, and the other of the capacitor is electrically connected to the lower case 7 to be grounded.

Reference numeral 12 denotes a terminal base. The terminal base 12 is provided with terminals 13 and 14.
Are electrically connected to terminals 2a and 3a, respectively.

Reference numeral 7 denotes a lower case having a U-shaped cross section, and reference numeral 16 denotes a case opened on one side.

In the above configuration, the lower case 7 includes the resistor 1
The lumped-constant isolator can be formed by joining one electrode 7 and connecting the terminal 4a to the other electrode.

In assembling the non-reciprocal circuit device, first, the ferrite substrate 5 is wound so as to cover the strip line assembly 1, and one surface of the ferrite substrate 5 is brought into contact with the lower case 7. Capacitors 9, 10, and 11 having one electrode bonded to lower case 7 are mounted, and terminals 2a, 3a, and 4a are bonded to the other electrodes of capacitors 9, 10, and 11, respectively. Terminals 13 and 14 have terminals 2a and 3a, respectively.
In addition, the mounting terminal base 12 surrounds the ferrite substrate 5 wound around the strip line assembly 1 in the through hole 15 of the terminal base 12 so that the terminal is connected to the other electrodes of the capacitors 9, 10, and 11. 2a, 3
a and 4a are joined and fixed to the lower case 7 so as to press down the joint lower part.

The above components and the magnet 6 are attached to the cases 7, 16
And a non-reciprocal circuit device is assembled.

Hereinafter, each component will be described in detail.

First, the strip line assembly 1 will be described.

As shown in FIG. 2, the strip line assembly 1 is preferably formed by forming a metal material such as copper, gold, silver or the like into a sheet having a predetermined shape. It is very advantageous to use those to which the above-mentioned additives are added in terms of electric characteristics, workability and cost. In the present embodiment, the stripline assembly 1 is configured as a sheet, but may be a linear.

Further, in the present embodiment, the strip line assembly 1 is composed of three strip lines 2, 3, and 4. However, it may be composed of four or more strip lines.

Further, in the present embodiment, the strip lines 2, 3, and 4 are formed integrally with each other at a central portion (not shown) to form a substantially Y-shape. You may comprise separately.

In the present embodiment, the strip line assembly 1 is wound around the ferrite substrate 5 and arranged to save space. Configurations are also possible.

Although not shown, an insulating sheet is provided between the strip lines 2, 3, and 4, and is electrically insulated.

More specifically, it is preferable to use a rolled copper foil (25 μm to 60 μm) as the strip line assembly 1, and if the thickness is less than 25 μm, disconnection or the like is likely to occur, resulting in poor productivity and the like. When it is 60 μm or more, it is not suitable for thinness. In addition, it is preferable that the rolled copper foil be plated with a conductive metal material such as silver or gold in a thickness of 1 μm to 5 μm. With such a configuration, the conductivity of the surface of the strip line assembly 1 is improved. And the characteristics can be improved.

Next, the ferrite substrate 5 will be described.

The ferrite substrate 5 has a disk shape, a square plate shape,
It can take a shape such as an elliptical plate shape or a polygonal plate shape, and is preferably a disk shape from the viewpoint of characteristics and the like.

The ferrite substrate 5 is made of Fe, Y, A
It is preferably a magnetic material containing l, Gd, and the like.

When the strip line assembly 1 is wound around the ferrite substrate 5, a predetermined chamfer may be applied to the corners, so that the strip line assembly 1 is disconnected or the characteristic is deteriorated due to friction with the ferrite substrate 5. Etc. can be suppressed.

The size of the ferrite substrate 5 is 0.2 mm to 0.8 mm (preferably 0.3 mm
To 0.6 mm) is preferable from the viewpoint of the characteristic surface strength. For example, when the ferrite substrate 5 is formed in a disc shape,
The diameter is 1.6 mm to 3.5 mm (preferably 2.5 mm
To 2.9 mm) is preferable from the viewpoint of miniaturization and characteristics.

Further, both main surfaces of the ferrite substrate 5 may be polished or the like so that the ferrite substrate 5 has a predetermined thickness.
Variations in characteristics can be suppressed.

Next, the magnet 6 will be described.

The magnet 6 preferably has a magnetic force sufficient to apply a magnetic field to the ferrite substrate 5, and as a particularly preferable material, it is preferable to use Sr-based ferrite.

Further, the size of the magnet 6 is preferably larger than the size of the ferrite substrate 5, and more preferably, the size of the magnet 6 is accommodated within the projected area of the magnet 6. It is particularly preferable that the magnetic field is uniformly applied to the ferrite substrate 5 so that the center of the magnet 6 and the center of the ferrite substrate 5 coincide with each other.

The specific shape of the magnet 6 can be a disk shape, a square plate shape, an elliptical plate shape, a polygonal plate shape, or the like. In particular, the ferrite substrate 5 is a disk shape. In this case, a rectangular plate is preferable because a uniform magnetic field can be applied to the ferrite substrate 5 and positioning can be easily performed.

The thickness of the magnet 6 ranges from 0.3 mm to 1.
5 mm is preferable from the standpoint of thickness reduction and the strength of the magnetic field.

Next, the lower case 7 will be described.

The lower case 7 is generally made of a metal material having good conductivity, and particularly preferably, a conductive metal substrate containing copper, silver, iron, or the like is suitably used. It is preferable to form a metal material having good conductivity, such as silver or gold, having a thickness of 1 μm to 5 μm by plating or the like, from the viewpoint of electrical characteristics and bonding with other components.

The insulator 8 provided in the lower case 7 is connected to the hot terminal side of the resistor 17 and the capacitors 9 and 10.
Are formed on the lower case 7 on the side surface close to the lower case 7.
It is preferable that the insulating material is constituted by an adhesive sheet, a non-adhesive sheet, or at least one method of printing.

Next, the capacitors 9, 10, and 11 (hereinafter abbreviated as a capacitor group) will be described.

The dielectric constant of the dielectric substrate of the capacitor constituting the capacitor group is desirably 80 or more.
0 and 11 can be formed thin, and the element can be miniaturized.

The electrodes formed on both surfaces of the dielectric substrate are made of an electrode material selected from at least one of copper, silver and nickel.

The external shape of the capacitor group is preferably square, which is advantageous in terms of mounting surface and positioning. The external shape of the capacitor group may be circular or elliptical.

Next, the terminal base 12 will be described.

The feature of the terminal base 12 is that it is provided so as to surround the ferrite substrate 5 so that the magnet 6 can be fixed as shown in FIG. 1, and the strip line assembly 3 and the capacitors 9, 10, By holding down the joint of the resistor 11 and the joint of the resistor 17, it is possible to reduce the size of the apparatus without requiring a new holding member for holding each part. Furthermore, by inserting the input / output terminals 13 and 14 into the terminal base 12, the size can be further reduced, and the production becomes easy.

The terminal base 12 has a structure in which terminals 13 and 14 are provided on a non-conductive material such as a resin (epoxy resin, liquid crystal polymer, etc.), ceramics or the like by using insert molding or the like. The terminals 13 and 14 are made of a conductive material such as brass, and it is preferable that the conductive material be plated with both conductors such as silver.

The terminal base 12 is preferably made of a material having heat resistance, since it is highly likely that heat will be applied when the terminal base 12 is mounted on another circuit board with a bonding material or the like. Specifically, at least 250 ° C. (preferably 2 ° C.)
(At least 90 ° C.).

As shown in FIGS. 3, 4, and 5, the terminal base 12 is provided so as to sandwich the terminals 2a and 3a between the capacitors 9 and 10 and the terminals 13 and 14, and is bonded to at least the lower case 7. Joined by materials and fittings. In addition, as shown in FIGS.
A concave portion 7a is provided so that positioning of the terminal base 12 can be easily performed. A protrusion 12a that fits into the concave portion 7a is provided on the terminal base 12. The relationship between the protrusion 12a and the recess 7a may be reversed. That is, the concave portion 7a may be provided in the terminal base 12 and the protrusion may be provided in the lower case 7.

Preferably, the terminal base 12 is not provided with terminals and electrode patterns other than the terminals 13 and 14, so that the terminal base 12 can be further reduced in size and weight.

In the present embodiment, the terminals 13, 13 are inserted into the terminal base 12 made of resin or the like by insert molding or the like.
Although the terminal 14 is provided, the terminals 13 and 14 may be bonded to the terminal base 12 with an adhesive or the like.
A method of fixing the terminals 13 and 14 by mechanically fixing the terminals 13 and 14 by providing a locking portion or the like on the 2 and deforming the negligible portion may be used. In this case, the terminals 13 and 14 may be further securely fixed using an adhesive or the like. Furthermore,
In the present embodiment, the terminals 13 and 14 are formed by bending a plate-like body made of a conductive material such as metal. However, the terminals 13 and 14 are formed on the terminal base 12 by a thin film forming technique such as plating or sputtering. In this case, the terminals 13 and 14 may be formed on the surface of the terminal base 12, or the terminals 13 and 14 may be formed inside the terminal base 12 and a part thereof may be formed. It may be configured to be exposed on the surface of the terminal base 12.

Next, the lower case 7 and the case 16 will be described.

The lower case 7 is preferably made of a conductive metal material or the like. In the present embodiment, a rolled steel plate is used. In order to further improve the electrical characteristics, a plated film composed of a metal material such as silver or copper
It is preferable that the thickness be 5 μm. The lower case 7 has projections 7b, 7c, 7 on the other end in addition to the projection 7a described above.
d and 7e are provided, and the projections 7b to 7e may be used as ground terminals.

The central part (not shown) of the strip line assembly 1 is joined to the lower case 7 by at least a conductive joining material or the like.

The lower case 7 has a substantially U-shaped cross section, and has no adjustment window or the like.

The case 16 is also made of the same material, and is not provided with an adjustment window or the like.

The case 16 has at least the magnet 6 adhered thereto by a bonding material or housed together with the terminal base 12.

Next, the chip inductor 19 will be described.

As shown in FIG. 5, the chip inductor 19 forms the required inductance value by processing the metal part 22 on the spiral part 23 by using a laser, and the insulator 2 is formed on the outer periphery.
4 and the electrode portions 25 are provided at both ends.

[0059]

According to the present invention, the size of the mobile phone can be reduced and the battery life can be extended by forming a matching circuit for input impedance by surrounding the ferrite substrate with the terminal base joined to the strip assembly.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a non-reciprocal circuit device according to an embodiment of the present invention.

FIG. 2 is a plan view showing internal components of the non-reciprocal circuit device according to one embodiment of the present invention.

FIG. 3 is an exploded perspective view showing a non-reciprocal circuit device according to one embodiment of the present invention.

FIG. 4 is a sectional view showing a non-reciprocal circuit device according to one embodiment of the present invention.

FIG. 5 is an exploded perspective view showing the inside of a chip inductance according to one embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Strip line assembly 2, 3, 4 Strip line 5 Ferrite board 6 Magnet 7 Lower case 8 Insulator 9, 10, 11 Capacitor 12 Terminal base 13, 14 Terminal 16 Case 17 Resistance 18 Insulator 19 Chip inductor 20 Capacitor 21 Capacitor 22 Metal part 23 Spiral part 24 Insulator 25 Electrode part

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Hitoshi Uchi 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Takayuki Takeuchi 1006 Kadoma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial F Terms (reference) 5E070 AA05 AB01 AB03 BA11 BB05 CC03 5J013 EA01

Claims (4)

[Claims] A ferrite substrate, a strip line assembly provided adjacent to the ferrite substrate, a magnet for applying a magnetic field to the ferrite substrate, a capacitor connected to the strip assembly, and the strip line. A terminal base connected to the aggregate, wherein the terminal base has an enclosing configuration surrounding the ferrite substrate and the magnet, and the strip line aggregate has one end grounded and the other end grounded at one end. Is connected to the other end of the stripline assembly on the input side, and a chip inductor formed by laser processing is connected in series instead of a winding in a non-reciprocal circuit device. 2. The semiconductor device according to claim 1, wherein one of a second parallel plate capacitor, a third parallel plate capacitor, a chip capacitor and a multilayer capacitor, one end of which is grounded on the input and output terminal sides of the chip inductor, is connected to both ends. The non-reciprocal circuit device according to claim 1. 3. A ferrite substrate, a strip line assembly provided close to the ferrite substrate, a magnet for applying a magnetic field to the ferrite substrate, a capacitor connected to the strip assembly, and the strip line. A terminal base connected to the aggregate, wherein the terminal base has an enclosing configuration surrounding the ferrite substrate and the magnet, and the strip line aggregate has one end grounded and the other end grounded at one end. Is connected, further, on the input side, in the non-reciprocal circuit element in which the chip inductor is connected in series, the input side and the output side of the chip inductor are grounded at the second and third parallel plate capacitors, The input impedance of the non-reciprocal circuit element is increased by connecting either the chip capacitor or the multilayer capacitor at both ends. Non-reciprocal circuit element, characterized in that to improve the load stability of the power amplifier by the taking impedance matching of a power amplifier in a previous stage. 4. A lumped constant type isolator, wherein a resistor is connected to at least one strip line of the strip line assembly of the non-reciprocal circuit device according to claim 1.