JPH11239009A - Band widening structure of irreversible circuit element - Google Patents

Band widening structure of irreversible circuit element

Info

Publication number
JPH11239009A
JPH11239009A JP10039882A JP3988298A JPH11239009A JP H11239009 A JPH11239009 A JP H11239009A JP 10039882 A JP10039882 A JP 10039882A JP 3988298 A JP3988298 A JP 3988298A JP H11239009 A JPH11239009 A JP H11239009A
Authority
JP
Japan
Prior art keywords
circuit
circuit device
reciprocal circuit
reciprocal
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10039882A
Other languages
Japanese (ja)
Inventor
Shinji Yamamoto
伸二 山本
Akinori Misawa
彰規 三澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP10039882A priority Critical patent/JPH11239009A/en
Publication of JPH11239009A publication Critical patent/JPH11239009A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Non-Reversible Transmitting Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To widen the band without making elements large-sized by forming a resonance circuit on a circuit board where the irreversible circuit element and other circuit elements are mounted and grounding the ground terminal of the irreversible element through the resonance circuit. SOLUTION: The irreversible circuit element 40 is used and has two input/ output terminals 5 and two ground terminals 3 from its flank to the bottom surface. On the circuit board 31 where the irreversible circuit element 40 is mounted, a pattern electrode 32 to which the input/output terminals 5 are connected and a pattern electrode 33 to which the ground terminals 3 are connected are formed. To the pattern electrode 33 to which the earth terminals 3, a strip line inductor 34 is connected. A stack chip inductor 36 is connected between the strip line inductor 34 and ground electrodes 35. Consequently, the irreversible circuit equivalent to an equivalent circuit can be obtained and the band of the irreversible circuit element can be widened.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、VHF、UHF、
SHF帯等で使用される集中定数型サーキュレータ、ア
イソレータ等の非可逆回路素子に関し、その非可逆回路
素子の広帯域化を図った構造に関するものである。
[0001] The present invention relates to VHF, UHF,
The present invention relates to a non-reciprocal circuit device such as a lumped-constant circulator and an isolator used in an SHF band or the like, and to a structure for widening the band of the non-reciprocal circuit device.

【0002】[0002]

【従来の技術】一般に、集中定数型アイソレータ、サー
キュレータ等の非可逆回路素子は、信号の伝送方向には
ほとんど減衰がなく、かつ逆方向には減衰が大きくなる
ような機能を有しており、例えば携帯電話、自動車電話
等の移動体通信機器の送受信回路部に用いられている。
2. Description of the Related Art Generally, non-reciprocal circuit devices such as lumped-constant isolators and circulators have a function of hardly attenuating in a signal transmission direction and increasing in a reverse direction. For example, it is used in a transmission / reception circuit of a mobile communication device such as a mobile phone and a car phone.

【0003】図8に、従来例の集中定数型アイソレータ
の分解斜視図を示す。この従来例は、最下部に樹脂ケー
ス1がある。この樹脂ケース1は、3つの導電体板が樹
脂部分と一体に形成されている。この1つの導電体板
は、アース電極板2であり、樹脂ケース1の底部に広く
配置され、それと繋がるアース端子3が樹脂ケース1の
装着面となる裏面に導出されている。また、他の2つの
導電体板は、入出力端子用であり、内側の回路接続端子
4と外側の入出力端子5とが繋がったコ字状の導電体板
である。この内側回路接続端子4は、アース板電極2の
配置されている面に突起部6が形成され、その突起部6
の上に配置されている。このアース端子3、入出力端子
5は、それぞれ2個対向して形成されている。
FIG. 8 is an exploded perspective view of a conventional lumped constant type isolator. In this conventional example, there is a resin case 1 at the bottom. In the resin case 1, three conductor plates are formed integrally with the resin portion. This one conductor plate is a ground electrode plate 2, which is widely disposed on the bottom of the resin case 1, and a ground terminal 3 connected to the ground electrode plate 2 is led out to a back surface serving as a mounting surface of the resin case 1. The other two conductive plates are used for input / output terminals, and are U-shaped conductive plates in which the inner circuit connection terminal 4 and the outer input / output terminal 5 are connected. The inner circuit connection terminal 4 has a projection 6 formed on the surface on which the ground plate electrode 2 is arranged.
Is placed on top. The ground terminal 3 and the input / output terminal 5 are formed to face each other.

【0004】この樹脂ケース1の上に、金属ケース下7
が載せられる。この金属ケース下7は、樹脂ケース1の
突起部6に対応する切り欠き部8を有し、この樹脂ケー
ス1のアース電極板2と半田付けされる。
On the resin case 1, a metal case 7
Is placed. The lower metal case 7 has a cutout 8 corresponding to the projection 6 of the resin case 1, and is soldered to the ground electrode plate 2 of the resin case 1.

【0005】この金属ケース下7の上に、誘電体板の上
下面に電極が形成された板状コンデンサ9とチップ抵抗
10と、フェライトコア11上に中心導体12を互いに
絶縁状態で、120度の間隔で回転対称に配置された中
心導体部とを配置する。この3つの中心導体12のう
ち、2つの中心導体12の先端部13a、13bは、そ
れぞれ板状コンデンサ9と樹脂ケース1上の内側回路接
続端子4に接続され、他の一つの中心導体の先端部13
cは、板状コンデンサ9とチップ抵抗10に接続され
る。この中心導体部のフェライトコア11の下部は、3
つの中心導体の共通部であり、この共通部は金属ケース
下7に接続され、アース接続される。又、板状コンデン
サ9も中心導体の先端部が接続される面の対向面側で金
属ケース下7に接続され、アース接続される。そして、
そのチップ抵抗10の端子電極が金属ケース下7と接続
され、アース接続される。
On the lower metal case 7, a plate-like capacitor 9 having electrodes formed on the upper and lower surfaces of a dielectric plate, a chip resistor 10, and a center conductor 12 on a ferrite core 11 are insulated from each other by 120 degrees. And the center conductor portion, which is arranged rotationally symmetrically at an interval of. Of the three center conductors 12, the tip portions 13a and 13b of the two center conductors 12 are connected to the plate-shaped capacitor 9 and the inner circuit connection terminal 4 on the resin case 1, respectively, and the tip ends of the other one of the center conductors Part 13
c is connected to the plate capacitor 9 and the chip resistor 10. The lower part of the ferrite core 11 of the center conductor is 3
Common part of the two center conductors, which is connected to the lower part 7 of the metal case and grounded. The plate capacitor 9 is also connected to the lower metal case 7 on the side opposite to the surface to which the tip of the center conductor is connected, and is also grounded. And
The terminal electrode of the chip resistor 10 is connected to the lower metal case 7 and grounded.

【0006】次に、この中心導体部に樹脂モールド20
を被せる。この樹脂モールド20は、中央にフェライト
コア11の外径とほぼ同じ大きさの貫通孔21を有し、
下部にフェライトコア11の外周部に当接するような爪
部22が3ヶ所形成されている。この爪部22は、フェ
ライトコアの側面の中心導体の部分に位置し、フェライ
トコアの位置決めを行っている。この樹脂モールド20
は、外形が樹脂ケース1及び金属ケース下7の内側に収
納される大きさであり、上面に磁石24を位置決めする
突出部23が形成されている。そして、この突出部23
で位置決めされる位置に磁石24が配置される。そし
て、金属ケース上25を被せ、金属ケース上25と金属
ケース下7とを半田付けして集中定数型アイソレータを
構成している。
Next, a resin mold 20 is formed on the center conductor.
Put on. The resin mold 20 has a through hole 21 having a size substantially equal to the outer diameter of the ferrite core 11 at the center,
At the lower part, three claw portions 22 are formed so as to contact the outer peripheral portion of the ferrite core 11. The claw portion 22 is located at the center conductor on the side surface of the ferrite core, and positions the ferrite core. This resin mold 20
Has a size such that the outer shape is accommodated inside the resin case 1 and the metal case lower part 7, and a protrusion 23 for positioning the magnet 24 is formed on the upper surface. Then, the protrusion 23
The magnet 24 is arranged at a position where the magnet 24 is positioned. Then, the metal case upper part 25 is covered, and the metal case upper part 25 and the metal case lower part 7 are soldered to form a lumped constant type isolator.

【0007】[0007]

【発明が解決しようとする課題】従来の非可逆回路素子
が使用されている用途の一つに携帯電話がある。この携
帯電話の小型化はめざましく、それに使用される非可逆
回路素子も小型化が進んでいる。最近では、7mm角の
大きさの非可逆回路素子が使用されている。一方で、携
帯電話の使用周波数範囲が広帯域化する傾向に有る。
One application in which a conventional non-reciprocal circuit device is used is a cellular phone. The size of the mobile phone has been remarkably reduced, and the size of the non-reciprocal circuit device used for the mobile phone has also been reduced. Recently, a non-reciprocal circuit element having a size of 7 mm square has been used. On the other hand, there is a tendency that the operating frequency range of mobile phones is widened.

【0008】従来の集中定数型非可逆回路素子の等価回
路を図5に示す。中心導体で構成されるL1、L2、L
3と板状コンデンサによるC1、C2、C3を有し、そ
れぞれの一端を接地し、他端を入出力端としている。こ
の例では、アイソレータを示しているので一つの入出力
端はチップ抵抗によるダミー抵抗Rに接続され、接地さ
れている。この従来の集中定数型非可逆回路素子は、単
峰特性であり、広帯域化するためには回路の変更が必要
であった。
FIG. 5 shows an equivalent circuit of a conventional lumped constant type non-reciprocal circuit device. L1, L2, L composed of a center conductor
3 and C1, C2 and C3 formed by plate capacitors, one end of which is grounded and the other end is an input / output terminal. In this example, since an isolator is shown, one input / output terminal is connected to a dummy resistor R formed by a chip resistor and grounded. This conventional lumped-constant type nonreciprocal circuit element has a single-peak characteristic, and the circuit needs to be changed in order to widen the band.

【0009】従来の非可逆回路素子を広帯域化するため
の回路構成として、図6に示す等価回路が知られてい
る。この例では、各入出力端に直列共振回路51、5
2、53を接続している。これにより、双峰特性が得ら
れ、広帯域化することができる。さらに、図6の例で
は、各入出力端に直列共振回路が必要な構造であるのに
対し、図7に示す等価回路も知られている。この図7に
示すものは、従来接地していた各アース接続端とアース
との間に直列共振回路54を接続するものであり、直列
共振回路が一つで済むという利点がある。この従来例と
して、特開平9−270607号公報の図10、11に
記載されているものがある。この従来例は、共振回路を
3つの基板を積層した積層基板により構成し、磁性ヨー
クの下面に配置した構造である。これによれば、部品の
高さが大きくなる分だけ大型化、重量の増大化は避けら
れず、小型化、軽量化に対応出来ないという問題点が指
摘されている。
An equivalent circuit shown in FIG. 6 is known as a circuit configuration for widening the bandwidth of a conventional nonreciprocal circuit device. In this example, the series resonance circuits 51, 5
2, 53 are connected. Thereby, a bimodal characteristic can be obtained, and the band can be widened. Further, in the example shown in FIG. 6, a series resonance circuit is required at each input / output terminal, whereas an equivalent circuit shown in FIG. 7 is also known. In the configuration shown in FIG. 7, the series resonance circuit 54 is connected between each ground connection terminal and the ground, which are conventionally grounded, and there is an advantage that only one series resonance circuit is required. As this conventional example, there is one disclosed in FIGS. 10 and 11 of JP-A-9-270607. This conventional example has a structure in which a resonance circuit is configured by a laminated substrate in which three substrates are laminated, and is arranged on a lower surface of a magnetic yoke. According to this, a problem has been pointed out that the increase in size and weight is inevitable due to the increase in the height of the parts, and it is not possible to cope with downsizing and weight reduction.

【0010】従来では、これらの構造を利用し、集中定
数型非可逆回路素子の広帯域化が図られているが、いず
れも非可逆回路素子として直列共振回路を付加するもの
であり、素子の小型化を阻害する要因となっていた。
Conventionally, the lumped-constant type nonreciprocal circuit element has been broadened by utilizing these structures. However, in each case, a series resonance circuit is added as the nonreciprocal circuit element, and the element is compact. It was a factor that hindered the conversion.

【0011】本発明は、上記のことを鑑みて、素子の大
型化を招くこと無く、広帯域化を達成することができる
非可逆回路素子の広帯域化構造を提供するものである。
In view of the above, the present invention provides a broadband structure of a non-reciprocal circuit device capable of achieving a wide band without increasing the size of the device.

【0012】[0012]

【課題を解決するための手段】本発明の第1の発明は、
非可逆回路素子及びその他の回路素子が実装される回路
基板に共振回路が形成されており、前記非可逆回路素子
のアース端子は、前記共振回路を経由してアースに接続
される構造とすることにより、非可逆回路素子の広帯域
化を達成するものである。
Means for Solving the Problems A first invention of the present invention is:
A resonance circuit is formed on a circuit board on which the non-reciprocal circuit element and other circuit elements are mounted, and a ground terminal of the non-reciprocal circuit element is connected to ground via the resonance circuit. Thus, the non-reciprocal circuit device can achieve a wider band.

【0013】本発明の第2の発明は、前記非可逆回路素
子が単峰特性の集中定数型非可逆回路素子であることを
特徴とするものである。
A second invention of the present invention is characterized in that the non-reciprocal circuit device is a lumped constant non-reciprocal circuit device having a single peak characteristic.

【0014】本発明の第3の発明は、前記共振回路が、
ストリップラインインダクタと積層チップコンデンサか
ら構成されている直列共振回路であることを特徴とする
ものである。
According to a third aspect of the present invention, the resonance circuit includes:
It is a series resonance circuit composed of a stripline inductor and a multilayer chip capacitor.

【0015】本発明の第4の発明は、前記回路基板が多
層配線基板であり、前記共振回路が前記多層配線基板の
多層構造により形成されたLC共振回路であることを特
徴とするものである。
According to a fourth aspect of the present invention, the circuit board is a multilayer wiring board, and the resonance circuit is an LC resonance circuit formed by a multilayer structure of the multilayer wiring board. .

【0016】本発明の第5の発明は、前記非可逆回路素
子が7mm角以下の小型集中定数型非可逆回路素子であ
ることを特徴とするものである。
According to a fifth aspect of the present invention, the non-reciprocal circuit device is a small lumped constant type non-reciprocal circuit device having a size of 7 mm square or less.

【0017】[0017]

【発明の実施の形態】本発明は、非可逆回路素子の広帯
域化を図るものであり、またその広帯域化のために、単
峰特性の非可逆回路素子を双峰特性にするものである。
その広帯域化を図るために、非可逆回路素子のアース端
子に、共振回路を接続してアース接続するものであり、
その共振回路を、非可逆回路素子及びその他の回路素子
が実装される回路基板に形成したものである。つまり、
非可逆回路素子としては、従来のものを特別に改良する
必要はなく、実装基板側で対応するものである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention aims at widening the bandwidth of a non-reciprocal circuit device, and in order to widen the band, a non-reciprocal circuit device having a single peak characteristic has a bimodal characteristic.
In order to widen the band, a resonance circuit is connected to the ground terminal of the non-reciprocal circuit element and grounded,
The resonance circuit is formed on a circuit board on which a non-reciprocal circuit element and other circuit elements are mounted. That is,
As the non-reciprocal circuit device, there is no need to particularly improve the conventional device, and the non-reciprocal circuit device is compatible with the mounting substrate.

【0018】本発明によれば、非可逆回路素子として、
特別な設計変更を必要としなく、広帯域用と狭帯域(通
常の帯域)用とを同一の非可逆回路素子を用いることが
出来、設計、製造メリットは多大なものがある。一方、
回路基板としては、各回路素子を実装し、配線するもの
であり、共振回路を付加することは、さほど大きな負荷
とはならない。よって、本発明によれば、非常に簡便な
構造により、非可逆回路素子の広帯域化を達成出来る。
According to the present invention, as the non-reciprocal circuit device,
The same non-reciprocal circuit element can be used for a wide band and a narrow band (ordinary band) without any special design change, and there are significant design and manufacturing advantages. on the other hand,
As a circuit board, each circuit element is mounted and wired, and adding a resonance circuit does not result in a large load. Therefore, according to the present invention, it is possible to achieve a wide band of the nonreciprocal circuit device with a very simple structure.

【0019】本発明に係る一実施例の分解斜視図を図1
に示す。この実施例は、従来の技術で説明した非可逆回
路素子40を用い、その側面から底面かけて、2つの入
出力端子5と2つのアース端子3を有している。そし
て、その非可逆回路素子40が実装される回路基板31
には、その入出力端子5が接続されるパターン電極32
と、アース端子3が接続されるパターン電極33が形成
されている。そして、アース端子3が接続されるパター
ン電極33は、ストリップラインインダクタ34が接続
されている。このストリップラインインダクタ34とア
ース電極35との間に積層チップインダクタ36が接続
されている。これにより、図7に示す等価回路と同等の
非可逆回路を得ることが出来、非可逆回路素子の広帯域
化を達成出来る。この実施例と従来例との挿入損失特性
を図2に示す。明らかに本発明のものは広帯域化されて
いることがわかる。
FIG. 1 is an exploded perspective view of an embodiment according to the present invention.
Shown in This embodiment uses the non-reciprocal circuit device 40 described in the related art, and has two input / output terminals 5 and two ground terminals 3 from the side surface to the bottom surface. Then, the circuit board 31 on which the non-reciprocal circuit element 40 is mounted
Has a pattern electrode 32 to which the input / output terminal 5 is connected.
And a pattern electrode 33 to which the ground terminal 3 is connected is formed. The strip electrode 34 is connected to the pattern electrode 33 to which the ground terminal 3 is connected. A multilayer chip inductor 36 is connected between the stripline inductor 34 and the ground electrode 35. As a result, a non-reciprocal circuit equivalent to the equivalent circuit shown in FIG. 7 can be obtained, and a wider band of the non-reciprocal circuit device can be achieved. FIG. 2 shows the insertion loss characteristics of this embodiment and the conventional example. It is apparent that the band of the present invention is broadened.

【0020】本発明に係る別の実施例の分解斜視図を図
3に示す。この実施例も、従来の技術で説明した非可逆
回路素子40を用いた。そして、その非可逆回路素子4
0が実装される回路基板31には、その入出力端子5が
接続されるパターン電極32と、アース端子3が接続さ
れるパターン電極37が形成されている。この回路基板
は、多層配線基板であり、その内部の構造を示す斜視図
を図4に示す。この内部は、まずパターン電極37と対
向しコンデンサを構成するパターン電極38が所定間隔
を開けて構成されている。そのパターン電極38にはス
ルーホール39が形成されており、さらに下側に構成さ
れているインダクタライン42に接続されている。この
インダクタライン42にはスルーホール39に接続され
るランド部41を有し、他端はアースライン43に接続
されている。これにより、図7に示す等価回路と同等の
非可逆回路を得ることが出来、非可逆回路素子の広帯域
化を達成出来る。
FIG. 3 is an exploded perspective view of another embodiment according to the present invention. This embodiment also uses the non-reciprocal circuit device 40 described in the related art. And the non-reciprocal circuit element 4
The pattern electrode 32 to which the input / output terminal 5 is connected and the pattern electrode 37 to which the ground terminal 3 is connected are formed on the circuit board 31 on which 0 is mounted. This circuit board is a multilayer wiring board, and a perspective view showing an internal structure thereof is shown in FIG. In the inside, first, a pattern electrode 38 facing the pattern electrode 37 and constituting a capacitor is formed at a predetermined interval. A through hole 39 is formed in the pattern electrode 38, and is connected to an inductor line 42 formed further below. The inductor line 42 has a land 41 connected to the through hole 39, and the other end is connected to the ground line 43. As a result, a non-reciprocal circuit equivalent to the equivalent circuit shown in FIG. 7 can be obtained, and a wider band of the non-reciprocal circuit device can be achieved.

【0021】このような回路基板においては、多層配線
基板は広く利用されており、その多層配線基板の内部に
上記した共振回路を構成することは容易である。また、
上記した2つの実施例において、パターン電極の形状は
適宜設計できるものであり、共振回路の構成も適宜変更
可能である。非可逆回路素子のアース端子(従来構造で
アースに接続されていた端子)に接続される共振回路を
構成し、その共振回路をアース接続する構成とした回路
基板であれば、本発明を実施出来る。もちろん、この回
路基板には、他の回路素子も実装され、例えば、携帯電
話の回路基板として使用されるものである。
In such a circuit board, a multilayer wiring board is widely used, and it is easy to configure the above-described resonance circuit inside the multilayer wiring board. Also,
In the above two embodiments, the shape of the pattern electrode can be appropriately designed, and the configuration of the resonance circuit can be appropriately changed. The present invention can be implemented as long as the circuit board is configured to form a resonance circuit connected to the ground terminal of the non-reciprocal circuit element (terminal connected to the ground in the conventional structure) and to connect the resonance circuit to the ground. . Of course, other circuit elements are also mounted on this circuit board, and are used, for example, as circuit boards for mobile phones.

【0022】本発明に係る非可逆回路素子は、上記実施
例に記載されたものに限られないことは明らかである。
本発明に係る非可逆回路素子は、特に広帯域化を考慮し
たものでなくても良く、通常品を使用出来る。また、本
発明に係る非可逆回路素子は、単峰特性のものが利用出
来る。また、上記実施例は、アイソレータで説明した
が、サーキュレータでも同様の効果を得ることができ
る。サーキュレータとするには、抵抗に接続されている
端子を、他の入出力端と同様にすれば良い。
It is clear that the non-reciprocal circuit device according to the present invention is not limited to those described in the above embodiments.
The non-reciprocal circuit device according to the present invention does not need to particularly consider a wide band, and a normal product can be used. The nonreciprocal circuit device according to the present invention may have a single-peak characteristic. In the above embodiment, the isolator has been described. However, a similar effect can be obtained with a circulator. To make it a circulator, the terminal connected to the resistor may be made the same as the other input / output terminals.

【0023】本発明に係る非可逆回路素子は、磁性体
と、その磁性体に密接して配置された3つの中心導体
と、各中心導体に接続されるコンデンサ成分と、磁性体
に直流磁界を印加する永久磁石とを有する構成であるこ
とが好ましい。
The non-reciprocal circuit device according to the present invention comprises a magnetic material, three central conductors arranged closely to the magnetic material, a capacitor component connected to each central conductor, and a DC magnetic field applied to the magnetic material. It is preferable to have a configuration having a permanent magnet to be applied.

【0024】本発明によれば、非可逆回路素子の広帯域
化を達成することができる。しかも、非可逆回路素子は
従来構造と同様で良く、大型化することはなく、重量の
増大もない。このため、非可逆回路素子の小型化を阻害
することがない。本発明は、小型の非可逆回路素子にお
いて特に有効であり、7mm角以下の大きさの非可逆回
路素子において、特に有効である。また、薄型化も阻害
するものではなく、薄型の非可逆回路素子において特に
有効であり、2.5mm以下の高さの非可逆回路素子に
おいて、特に有効である。さらに、2.0mm以下の高
さの非可逆回路素子において、特に有効である。
According to the present invention, it is possible to achieve a wide band of the nonreciprocal circuit device. In addition, the non-reciprocal circuit element may have the same structure as the conventional structure, and does not increase in size or increase in weight. Therefore, the miniaturization of the non-reciprocal circuit device is not hindered. The present invention is particularly effective in a small non-reciprocal circuit device, and particularly effective in a non-reciprocal circuit device having a size of 7 mm square or less. Further, it does not hinder the reduction in thickness, and is particularly effective in a thin non-reciprocal circuit device, and is particularly effective in a non-reciprocal circuit device having a height of 2.5 mm or less. Further, it is particularly effective for a non-reciprocal circuit device having a height of 2.0 mm or less.

【0025】本発明の配線基板は、プリント基板、フレ
キシブル基板、多層配線基板など種々の基板が利用出来
る。近年は、多層基板が多く使用されており、多層基板
であれば、スペース的にも従来と全く同じスペースで構
成出来る。また、多層基板の厚さは特に厚くする必要も
ない。
As the wiring board of the present invention, various substrates such as a printed board, a flexible board, and a multilayer wiring board can be used. In recent years, a multi-layer substrate has been widely used, and a multi-layer substrate can be configured in exactly the same space as in the related art. Further, the thickness of the multilayer substrate does not need to be particularly large.

【0026】[0026]

【発明の効果】本発明によれば、非可逆回路素子を新た
に設計し、構成する必要はなく、従来と同様の構成の非
可逆回路素子を用い、配線基板に共振回路を構成するこ
とにより、非可逆回路素子の広帯域化を可能とするもの
である。極めて簡便な構成により、広帯域化を可能とす
るものであり、携帯電話などの非可逆回路素子を使用し
た通信機器などにおいて、極めて有益なものである。
According to the present invention, it is not necessary to newly design and construct a non-reciprocal circuit device, and it is possible to use a non-reciprocal circuit device having the same configuration as that of the related art and construct a resonance circuit on the wiring board. This enables the nonreciprocal circuit device to have a wider band. An extremely simple configuration enables a wide band, and is extremely useful in communication equipment using a non-reciprocal circuit device such as a mobile phone.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る一実施例の分解斜視図である。FIG. 1 is an exploded perspective view of an embodiment according to the present invention.

【図2】本発明に係る一実施例と従来例の挿入損失特性
である。
FIG. 2 shows insertion loss characteristics of one embodiment according to the present invention and a conventional example.

【図3】本発明に係る別の実施例の分解斜視図である。FIG. 3 is an exploded perspective view of another embodiment according to the present invention.

【図4】本発明に係る別の実施例の回路基板の内部構造
図である。
FIG. 4 is an internal structural view of a circuit board according to another embodiment of the present invention.

【図5】従来の非可逆回路素子の等価回路図である。FIG. 5 is an equivalent circuit diagram of a conventional non-reciprocal circuit device.

【図6】非可逆回路素子の広帯域化回路の一例の等価回
路図である。
FIG. 6 is an equivalent circuit diagram of an example of a broadband circuit of a non-reciprocal circuit device.

【図7】非可逆回路素子の広帯域化回路の別の例の等価
回路図である。
FIG. 7 is an equivalent circuit diagram of another example of the broadband circuit of the non-reciprocal circuit device.

【図8】従来の非可逆回路素子の分解斜視図である。FIG. 8 is an exploded perspective view of a conventional non-reciprocal circuit device.

【符号の説明】[Explanation of symbols]

31 回路基板 32、33、37、38 パターン電極 34 ストリップラインインダクタ 35、43 アースパターン 36 積層チップコンデンサ 39 スルーホール 42 インダクタライン DESCRIPTION OF SYMBOLS 31 Circuit board 32, 33, 37, 38 Pattern electrode 34 Stripline inductor 35, 43 Ground pattern 36 Multilayer chip capacitor 39 Through hole 42 Inductor line

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 非可逆回路素子及びその他の回路素子が
実装される回路基板に共振回路が形成されており、前記
非可逆回路素子のアース端子は、前記共振回路を経由し
てアースに接続されることを特徴とする非可逆回路素子
の広帯域化構造。
1. A resonance circuit is formed on a circuit board on which a non-reciprocal circuit element and other circuit elements are mounted, and a ground terminal of the non-reciprocal circuit element is connected to ground via the resonance circuit. A broadband structure of a non-reciprocal circuit device.
【請求項2】 前記非可逆回路素子は、単峰特性の集中
定数型非可逆回路素子であることを特徴とする請求項1
記載の非可逆回路素子の広帯域化構造。
2. The non-reciprocal circuit device according to claim 1, wherein the non-reciprocal circuit device is a lumped constant type non-reciprocal circuit device having a single peak characteristic.
A broadband structure of the non-reciprocal circuit device according to the above.
【請求項3】 前記共振回路は、ストリップラインイン
ダクタと積層チップコンデンサから構成されている直列
共振回路であることを特徴とする請求項1記載の非可逆
回路素子の広帯域化構造。
3. The non-reciprocal circuit device according to claim 1, wherein the resonance circuit is a series resonance circuit including a strip line inductor and a multilayer chip capacitor.
【請求項4】 前記回路基板は多層配線基板であり、前
記共振回路は、前記多層配線基板の多層構造により形成
されたLC共振回路であることを特徴とする請求項1記
載の非可逆回路素子の広帯域化構造。
4. The non-reciprocal circuit device according to claim 1, wherein the circuit board is a multilayer wiring board, and the resonance circuit is an LC resonance circuit formed by a multilayer structure of the multilayer wiring board. Broadband structure.
【請求項5】 前記非可逆回路素子は、7mm角以下の
小型集中定数型非可逆回路素子であることを特徴とする
請求項1記載の非可逆回路素子の広帯域化構造。
5. The broadband structure of a non-reciprocal circuit device according to claim 1, wherein the non-reciprocal circuit device is a small lumped constant type non-reciprocal circuit device of 7 mm square or less.
JP10039882A 1998-02-23 1998-02-23 Band widening structure of irreversible circuit element Pending JPH11239009A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10039882A JPH11239009A (en) 1998-02-23 1998-02-23 Band widening structure of irreversible circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10039882A JPH11239009A (en) 1998-02-23 1998-02-23 Band widening structure of irreversible circuit element

Publications (1)

Publication Number Publication Date
JPH11239009A true JPH11239009A (en) 1999-08-31

Family

ID=12565360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10039882A Pending JPH11239009A (en) 1998-02-23 1998-02-23 Band widening structure of irreversible circuit element

Country Status (1)

Country Link
JP (1) JPH11239009A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2358291A (en) * 1999-12-09 2001-07-18 Murata Manufacturing Co Nonreciprocal circuit device and communication device
GB2369501A (en) * 2000-06-30 2002-05-29 Murata Manufacturing Co Nonreciprocal circuit device and mounting structure
US6657511B2 (en) * 2000-05-17 2003-12-02 Murata Manufacturing Co., Ltd. Nonreciprocal circuit device and communication apparatus including the same
US6861922B2 (en) 2000-03-02 2005-03-01 Murata Manufacturing Co., Ltd. Nonreciprocal circuit device including two series resonant circuits having differing resonant frequencies
US7057471B2 (en) 2003-11-28 2006-06-06 Tdk Corporation Non-reciprocal device
JP2008085981A (en) * 2006-08-31 2008-04-10 Ntt Docomo Inc Irreversible circuit element
CN114865256A (en) * 2022-07-11 2022-08-05 西南应用磁学研究所(中国电子科技集团公司第九研究所) Ultra-wideband lumped parameter circulator/isolator with multi-layer dielectric strip line structure

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2358291A (en) * 1999-12-09 2001-07-18 Murata Manufacturing Co Nonreciprocal circuit device and communication device
GB2358291B (en) * 1999-12-09 2002-02-27 Murata Manufacturing Co Nonreciprocal circuit device and communication device using same
US6639485B2 (en) 1999-12-09 2003-10-28 Murata Manufacturing Co., Ltd. Nonreciprocal circuit device and communication device using same
US6861922B2 (en) 2000-03-02 2005-03-01 Murata Manufacturing Co., Ltd. Nonreciprocal circuit device including two series resonant circuits having differing resonant frequencies
US6657511B2 (en) * 2000-05-17 2003-12-02 Murata Manufacturing Co., Ltd. Nonreciprocal circuit device and communication apparatus including the same
GB2369501A (en) * 2000-06-30 2002-05-29 Murata Manufacturing Co Nonreciprocal circuit device and mounting structure
GB2369501B (en) * 2000-06-30 2002-11-20 Murata Manufacturing Co Nonreciprocal circuit device and mounting structure of the same
US6677537B2 (en) 2000-06-30 2004-01-13 Murata Manufacturing Co., Ltd. Nonreciprocal circuit device and mounting structure of the same
US7057471B2 (en) 2003-11-28 2006-06-06 Tdk Corporation Non-reciprocal device
JP2008085981A (en) * 2006-08-31 2008-04-10 Ntt Docomo Inc Irreversible circuit element
CN114865256A (en) * 2022-07-11 2022-08-05 西南应用磁学研究所(中国电子科技集团公司第九研究所) Ultra-wideband lumped parameter circulator/isolator with multi-layer dielectric strip line structure

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