JP2003017902A - Irreversible circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a irreversible circuit device that can warrant greater operating power without losing the characteristic of a conventional small-sized nonreciprocal circuit device. SOLUTION: A thermal conductor 10 with excellent thermal conductivity is inserted to a space in the inside of the irreversible circuit device of this invention.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-reciprocal circuit device used in mobile communication equipment such as a car phone and a mobile phone, which is mainly used in a microwave band, and more particularly to a high power non-reciprocal circuit device. is there.

[0002]

2. Description of the Related Art Non-reciprocal circuit devices have been used in mobile communication equipment terminals since they are small in size. As shown in FIGS. 9 and 10, the non-reciprocal circuit element passes the input signal in the forward direction to the output side with an extremely small loss, and absorbs the signal (reflection) in the reverse direction by the terminating resistor to input the signal. It has the property of not passing through the terminal side. The non-reciprocal circuit element is placed between the power amplifier and the antenna at the transmission stage of mobile communication equipment, and is used for the purpose of preventing backflow of unnecessary signals to the power amplifier, stabilizing the load side impedance of the power amplifier, etc. Has been.

A general configuration of a non-reciprocal circuit device which is widely used in terminals such as mobile phones at present is briefly described with reference to FIG. Three sets of strip lines 4 that are electrically insulated and intersect and overlap at an angle of approximately 120 degrees
a, 4b, and 4c are arranged close to the ferrite plate 5, and a magnet 2 for magnetizing the ferrite is arranged so as to face the ferrite. The strip lines 4a, 4
b and 4c have matching capacitors 8a, 8b and 8 respectively.
c is added in parallel, and the strip lines 4a and 4b are connected to the input / output terminals 3a and 3b, respectively.
Is connected to the terminating resistor 7. Also, the other end of each stripline is connected to a common ground disk,
The ground disk is the three matching capacitors 8a, 8
b, 8c and the ground side electrode of the resistor 7 are electrically connected to the lower case 9. Furthermore, together with the lower case 9,
The upper case 1 including the ferrite plate 5 and the magnet 2 and forming a part of a magnetic circuit is configured as shown in the figure.

[0004]

The recent rapid miniaturization of mobile communication equipment extends to base stations, and non-reciprocal circuit elements used in base stations are sometimes used near the maximum operating power. Under these circumstances, it is desired to increase the operating power without impairing the current small size and low loss characteristics.

In the conventional non-reciprocal circuit device, the operating power is 2.5 W in the forward direction and 0.6 W in the backward direction as an isolator, but there is an increasing demand for use in the forward direction of about 5 W. However, in the structure of the conventional non-reciprocal circuit device, there is heat generation of the non-reciprocal circuit device as a problem with high power input,
In particular, when high power is input in the opposite direction, the terminating resistor abnormally heats up and is destroyed.

In order to solve the above-mentioned conventional problems, it is an object of the present invention to provide a non-reciprocal circuit device which realizes high power input without impairing the characteristics of the conventional miniaturized non-reciprocal circuit device. To do.

[0007]

According to the present invention, there is provided a magnetic substrate, strip lines which are insulated from each other on a main surface of the substrate and intersect each other at a predetermined angle, and a magnet which applies a magnetic field to the substrate. A capacitor connected to the strip line, a terminating resistor connected to the strip line, a case accommodating each component, and an insulating heat conductor provided in the case were provided.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first aspect of the invention is a substrate having magnetism, striplines which are insulated from each other on a main surface of the substrate and intersect each other at a predetermined angle, and a magnetic field is applied to the substrate. A magnet, a capacitor connected to the strip line, a terminating resistor connected to the strip line, a case accommodating each of the constituent members, and 2% or more and 75% or less of the volume of the nonreciprocal circuit device in the case. By using a non-reciprocal circuit element characterized by having an insulating heat conductor so as to occupy the inside, even if the current flowing in the opposite direction becomes large, the heat generated internally can be efficiently It can be diffused to a part, and the heat dissipation effect can be improved.

According to a second aspect of the present invention, the heat conductor is provided in the vicinity of the terminating resistor or in contact with the terminating resistor. It is possible to efficiently dissipate the heat generated from the terminating resistor, which generates a great amount of heat, and prevent the element from being destroyed due to the temperature rise.

According to a third aspect of the present invention, the heat conductor is made of a material having plasticity or elasticity, and the nonreciprocal circuit device according to the first aspect can be easily housed in a case. Moreover, the adhesion with each member is improved,
It is possible to obtain a heat dissipation effect, and it is not necessary to adjust a gap between members when assembling the element, which improves productivity.

According to a fourth aspect of the present invention, the heat conductor is made of a resin material, and the non-reciprocal circuit element according to the third aspect is used. Can be provided.

The invention according to claim 5 is characterized in that the thickness of the heat conductor provided on the terminating resistor is made thicker than the thickness of the heat conductor provided on the other portion. By using a circuit element, it is possible to increase the heat capacity of a portion where heat is transferred from the terminal resistor, which generates a particularly large amount of heat, to the heat conductor, and heat can be diffused smoothly.

According to a sixth aspect of the present invention, there is provided the nonreciprocal circuit device according to the first aspect, wherein the heat conductor is brought into contact with at least one of the magnet and the case.
Since the heat from the heat conductor flows into the case having the largest contact area with the outside air, the cooling efficiency can be improved, and the same effect can be obtained as the magnet is provided in contact with the case.

The invention according to claim 7 is the nonreciprocal circuit device according to claim 1, characterized in that the heat conductor has adhesiveness, and the heat conductor is fixed in the case. Therefore, even if an external impact is applied to the element, the heat conductor does not move inside the element, and the characteristics are not changed.

According to an eighth aspect of the present invention, the heat conductor is made of a solid material or a viscous material that does not flow out of the case. It is possible to prevent characteristic deterioration without protruding from the case and affecting other members.

According to a ninth aspect of the present invention, a terminal base having a housing portion for housing at least a substrate is further provided in the case, and the terminal base is partially disposed on the terminating resistor. With the nonreciprocal circuit device according to the first aspect of the invention, it is possible to reliably improve the adhesion between the heat conductor and the terminating resistor.

According to a tenth aspect of the present invention, the terminal base has an annular shape, a board is accommodated in the central portion of the terminal base, and an opening is formed in the terminal base as if a part thereof is cut off. 10. The nonreciprocal circuit device according to claim 9, wherein the opening is connected to the central part, thereby providing a function of creating a space for mounting a plurality of resistors and a thermal conductivity. It has the function of creating a space for arranging a good heat conductor.

The nonreciprocal circuit device will be described below with reference to FIG.

First, the strip lines 4a, 4b, 4c
Is wound so as to cover the ferrite 5, and the ground conductor portion of the strip line is brought into contact with the lower case 9. Each strip line is electrically insulated by the insulating sheet 6.

Further, the lower case 9 is mounted so that one electrode of the matching capacitors 8a, 8b and 8c is joined, and the terminating resistor 7 is also mounted so that one electrode is joined.

On the electrodes of the matching capacitors 8a, 8b, 8c, the terminal portion 4 provided at the end of the strip line.
d, 4e, and 4f are respectively joined, and both of the terminal resistor 7 and the electrode of the matching capacitor 8c are joined to the terminal portion 4f.

The input / output terminal 3 is provided on the terminal portions 4d and 4e of the strip lines 4a and 4b to which the terminating resistor 7 is not connected.
a and 3b are joined. The input / output terminals 3a and 3b are integrally molded with the terminal base 3.
Are terminals 4d, 4e, 4f and matching capacitors 8a,
It is arranged so as to press down the joint portion with 8b and 8c.

The magnet 2 for applying a DC magnetic field to the ferrite plate 5 is fixed to the upper cover 1 and combined with the lower case 9 to which the terminal base 3 is joined so as to sandwich the heat conductor 10 having an insulating property. A mold isolator is assembled. At this time, the shape of the heat conductor 10 to be sandwiched is closely attached to the resistor 7, for example, the amount of the heat conductor 10 in the portion in contact with the resistor 7 is made larger than in other portions (for example, on the resistor 7). The thickness of the heat conductor 10 to be provided is made thicker than other portions). A cross-sectional view of an example at this time is shown in FIG.

Each structure will be described below.

First, the heat conductor 10 that fills the space of the nonreciprocal circuit device will be described.

The constituent material of the heat conductor 10 must include a material having an insulating property and a high heat conductivity. For example, oil compound (grease-like compounded with alumina powder), condensation type silicone RTV rubber (which cures and bonds by reacting with moisture in the air), addition type liquid silicone rubber / gel (heat curing type one liquid , Which has a two-component property) and the like can be preferably used. By forming the heat conductor 10 with a generally soft material as described above, the heat conductor 10 is easily deformed due to the pressing force between other members in the element, the storage is facilitated, and the adhesion between the members is also improved. Get better,
Moreover, it easily spreads in the space inside the non-reciprocal circuit element. A grease-like material is also preferably used as the heat conductor 10, but it is preferable that the heat conductor 10 has a viscosity (at 150 ° C. or less) at which it does not flow out when stored inside the element. . That is, as mentioned above,
A sheet-like material or a highly viscous grease-like material is preferably used. On the contrary, a material which, when cured, exerts a large stress on the internal parts of the element is not very preferable. That is, when it is hardened, a large stress is applied to a component or the like, which may result in deterioration of characteristics or disconnection.

In particular, it is most preferable to use a resin material such as silicone rubber having a thermal conductivity of 1 W / m · ° C. or more for the heat conductor 10 because of its electrical characteristics and flame retardancy.

Also, the heat conductor 10 is preferably a resistor 7
It is preferable to contact with or be provided in the vicinity. That is, this resistor 7 has the largest amount of heat generation, and by increasing the number of places where heat is dissipated through the heat conductor 10, it is possible to prevent the temperature from becoming higher than a predetermined temperature (130 ° C.). In addition, as described above, by increasing the thickness and amount of the heat conductor 10 provided on the resistor 7, the heat generated in the resistor 7 can be efficiently guided to the heat conductor 10, and the temperature of the element The rise can be further suppressed.

The heat conductor 10 is particularly preferable because it can easily dissipate heat to the outside by contacting the magnet 2, the lower case 9 or the upper cover 1.

The volume of the heat conductor 10 is set to 2% or more and 75% or less of the volume of the non-reciprocal circuit element (L × W × T in FIG. 2) without impairing the function of the non-reciprocal circuit element. The resistor 7 and the magnet 2 or the lower case 9 and the upper cover 1 can be brought into contact with each other, and the heat radiation effect can be improved. More preferably, the volume of the non-reciprocal circuit element is set to 10% or more and 50% or less, without deteriorating the characteristics of the non-reciprocal circuit element.
A greater heat dissipation effect can be obtained.

Each member inside the non-reciprocal circuit device is a heat conductor 1.
0 can be easily sandwiched, and a plurality of heat conductors can be used at the same time regardless of the shape of the heat conductor. In the case of a sheet, it is possible to use a plurality of layers as a layer. is there. Furthermore, if this heat conductor has adhesiveness or has an adhesive layer, positioning and fixing of components inside the non-reciprocal circuit element are facilitated, and even if a shock is applied to the element, It is preferable because the heat conductor 10 can be prevented from moving and the characteristic change can be prevented. The same effect can be obtained by using an adhesive instead of the adhesive layer.

The heat conductor 10 is preferably provided between the magnet 2 and the substrate 6, and a part of the heat conductor 10 is preferably in contact with the resistor 7. As shown in FIG. 1, a configuration in which a sheet-shaped heat conductor 10 is provided between the magnet 2 and the substrate 6 is the most preferable process.

As described above, by providing the insulating heat conductor 10 in the element, for example, the antenna of the communication device is damaged, and total reflection causes high power in the reverse direction to the nonreciprocal circuit element. When there is an input, even if the resistor 7 causes abnormal heat generation due to high power, the heat conductor 10 can efficiently guide the heat radiated from the resistor 7 to another portion, so that the non-reciprocal circuit device. Can be prevented, and accordingly, high-current current can be prevented from flowing in the reverse direction to an amplifier such as an operational amplifier connected to the nonreciprocal circuit element, and the amplifier can be prevented from being damaged.

Next, the strip lines 4a, 4b and 4c
Will be described.

The strip lines 4a, 4b and 4c are
It is preferable to form a metal material such as copper, gold and silver into a sheet having a predetermined shape, and it is particularly preferable to use copper or a copper alloy or copper to which a predetermined amount of additive is added to obtain electrical characteristics and workability. ， It becomes very advantageous in each aspect of cost.

Further, in the present embodiment, three strip lines 4a, 4b, 4c are used, but four or more strip lines may be used.

Further, in the present embodiment, the strip lines 4a, 4b, 4c are formed integrally with each other in the central portion (not shown) to have a substantially Y shape.
The a, 4b, and 4c may be configured separately.

Further, in this embodiment, the ferrite plate 5 is used.
Is wound around the strip lines 4a, 4b and 4c, the strip lines 4a,
Since 4b and 4c are bent along the side surface of the ferrite and further bent along the side surface facing the side surface on the same ferrite, the magnetic filling rate can be increased as much as possible, and the nonreciprocal circuit due to miniaturization can be achieved. This is preferable because it can prevent an increase in insertion loss of the element.

The strip lines 4a, 4b, 4c
An insulating sheet 6 is provided between each of them and electrically insulated.

Further, specifically, the strip line 4
As a, 4b, and 4c, rolled copper foil (25 μm to 60 μm
m) is preferably used, and when it is 25 μm or less,
It is easy for wire breakage to occur, resulting in poor productivity. 6
If it is 0 μm or more, it is not suitable for thin type. In addition, a conductive metal material such as silver or gold is applied to the rolled copper foil to a thickness of 1 μm
It is preferable to plate with a thickness of 5 μm. With this configuration, the conductivity of the surface of the strip line can be improved, and the characteristics can be improved.

Next, the ferrite plate 5 will be described.

The ferrite plate 5 can be in the shape of a disc, a square plate, an ellipse, a polygon, or the like, and it is preferable that the disc 5 is disc-shaped in view of its characteristics.

The ferrite plate 5 is made of Fe, Y, Al,
A magnetic material containing Gd or the like is preferable.

When the strip line is wound around the ferrite plate 5, it is possible to prevent the breakage of the strip line and the characteristic deterioration due to the rubbing with the ferrite plate 5 by providing a predetermined chamfer at the corner. .

The size of the ferrite plate 5 is 0.2 mm to 0.8 mm (preferably 0.3 mm to) as a thickness.
0.6 mm) is preferable from the viewpoint of characteristics and strength, and is characterized by being thicker than the thickness of the matching capacitor. For example, when the ferrite plate 5 has a disk shape, the diameter is 1.6 mm to 3.5 mm (preferably 2.5 mm to
2.9 mm) is preferable in terms of downsizing and characteristics.

Further, both main surfaces of the ferrite plate 5 are formed into a predetermined thickness by polishing or the like,
It is possible to suppress variations in characteristics.

Next, the magnet 2 will be described.

It is preferable that the magnet 2 is black because it is easy to recognize an image during assembly. In addition, the ferrite plate 5
It is preferable to have a magnetic force capable of applying a magnetic field, and as a particularly preferable material, Sr type ferrite is preferably used.

Further, the size of the magnet 2 is preferably larger than the ferrite plate 5, and the ferrite plate 5 is preferably housed within the projected area of the magnet 2.
It is particularly preferable to arrange the magnet 2 and the ferrite plate 5 so that their centers coincide with each other, because a magnetic field can be uniformly applied to the ferrite plate 5, and it is most preferable from the viewpoint of characteristics.

The specific shape of the magnet 2 may be a disk shape, a rectangular plate shape, an elliptical plate shape, a polygonal plate shape, or the like. In particular, the ferrite plate 5 is a disk shape. In this case, the rectangular plate shape is preferable because a uniform magnetic field can be applied to the ferrite plate 5 and positioning is easy.

The magnet 2 has a thickness of 0.3 mm to 1.
The thickness of 5 mm is preferable in view of thinning and strength of magnetic field.

Next, the lower case 9 and the upper cover 1 will be described.

The lower case 9 is generally made of a metal material having good conductivity, and particularly preferably, a conductive metal substrate containing copper, silver, iron or the like is preferably used, and further, a conductive metal substrate. It is preferable to form a metal material having good conductivity such as silver or gold by 1 μm to 5 μm by plating or the like from the viewpoint of electrical characteristics and bondability with other parts. Also, lower case 9
In addition to the wall portion 9a, a protrusion 9b is provided on this, and this protrusion 9b may be used as a ground terminal.

The insulator 11 provided in the lower case 9 is the hot terminal side of the resistor 7 and the matching capacitor 8
The a, 8b, and 8c are formed on the side surface of the lower case near the lower case 9. It is preferable that the insulator is formed by at least one method of sticky sheet or non-sticky sheet or printing.

The lower case 9 has strip lines 4a, 4
The ground conductor portions b and 4c are joined at least with a conductive joining material or the like.

The lower case 9 has a substantially U-shaped cross section, and is not provided with an adjusting window or the like.

The upper cover 1 is also made of the same material, and is not provided with an adjusting window or the like, and at least the magnet 2 is bonded to the upper cover 1 by a bonding material.

Next, the terminating resistor 7 will be described.

It is preferable to use a fixed chip resistor as the terminating resistor 7 in view of its small size and mountability. Further, when using a plurality of resistors in parallel, it is preferable to use a multiple chip resistor because the number of mounted components can be reduced.

Next, the matching capacitors 8a, 8b, 8c
Will be described.

As the matching capacitors 8a, 8b and 8c, it is preferable to use a parallel plate type capacitor from the viewpoints of variations in capacitance and miniaturization of the non-reciprocal circuit device, especially thinning.

The electrodes used at this time are copper, silver,
It is composed of an electrode material selected from at least one of nickel.

Further, the matching capacitors 8a, 8b, 8c
It is advantageous in terms of mounting and positioning that the outer shape of is preferably square. Also, as the outer shape,
It may be circular or elliptical.

Next, the terminal base 3 will be described.

The feature of the terminal base 3 is that it can be provided so as to surround the ferrite plate 5 and the mounting position can be defined. Furthermore, by inserting the input / output terminals 3a and 3b into the terminal base, the ferrite plate 5 and the strip line can be formed. 4a, 4
b, 4c and the input / output terminals 3a, 3b can be stabilized in positional relationship, characteristic variations are reduced, and manufacturing is facilitated. Preferably, the ferrite plate 5 is not completely surrounded and has a missing portion, and it is preferable that there is a missing portion of 10% or more from the point of disposing the heat conductor 10 around the resistor 7, positioning of the ferrite plate 5, and In order to keep the positional relationship with the input / output terminals 3a and 3b stable, and to form the input / output terminals 3a and 3b on the terminal base 3, the missing portion is 50%.
The following is preferable. More preferably 10 to 2
If set to 5%, the terminal portions 4d, 4e, 4f provided at the tips of the strip lines 4a, 4b, 4c and the matching capacitor 8 are provided.
The structure that holds down the joints with a, 8b, and 8c is not impaired, and joint defects during assembly are reduced.

The terminal base 3 has a structure in which the input / output terminals 3a and 3b are provided by non-conductive material such as resin (epoxy resin, liquid crystal polymer, etc.) and ceramics by using insert molding or the like. When the terminal base 3 is made of resin having poor heat conductivity, it is preferable from the viewpoint of improving heat dissipation that a plurality of missing portions are provided to create a space in which a heat conductor having good heat conductivity can be arranged. The terminal base 3 may be divided into a plurality of parts.

The input / output terminals 3a and 3b are made of a conductive material such as brass, and it is preferable that the conductive material is plated with a good conductor such as silver.

Further, since the terminal base 3 is likely to be heated when it is mounted on another circuit board with a bonding material or the like, it is preferably made of a material having heat resistance. Specifically, it is 250 ° C or higher (preferably 29 ° C).
It preferably has a heat resistance of 0 ° C. or higher).

The terminal base 3 is the matching capacitors 8a, 8
b and the strip line 4 between the input / output terminals 3a and 3b.
It is provided so as to sandwich the terminal portions 4d and 4e provided at the tips of a and 4b, and is joined to at least the lower case 7 with an adhesive or fitting.

Further, preferably, if the terminal base 3 is not provided with terminals other than the input / output terminals 3a and 3b and an electrode pattern, the terminal base 3 can be further reduced in size and weight.

In this embodiment, the input / output terminal 3 is formed by insert molding on the terminal base 3 made of resin or the like.
Although a and 3b are provided, the input / output terminals 3a and 3b may be adhered to the terminal base 3 with an adhesive material or the like, or the terminal base 3 may be provided with a locking portion or the like and the locking portion may be deformed. A method of mechanically fixing the input / output terminals 3a and 3b may be used,
In this case, an adhesive material or the like may be used to ensure the fixation. Furthermore, in this embodiment, the input / output terminals 3a and 3b are
The plate-like body made of a conductive material such as metal was bent, and the input / output terminals 3a and 3b were formed on the terminal base 3 by a thin film forming technique such as plating or sputtering. In this case, the input / output terminals 3a and 3b may be formed on the surface of the terminal base 3, or the input / output terminals 3a and 3b may be formed inside the terminal base 3 and part of them may be formed.
It may be configured to be exposed on the surface of.

Further, as shown in FIG. 1, the terminal base 3 is formed in a substantially C-shape, and the resistor 7 is exposed in the opening 3c, that is, in the resistance shape. With the configuration in which the heat conductor 10 is provided between the magnet 2 and the terminal base 3, the resistor 7 and the heat conductor 10 can be reliably brought into contact with each other by configuring the heat conductor 10 so as not to exist.

The heat dissipation of the nonreciprocal circuit device according to the embodiment of the present invention will be described below.

In the space between the upper cover 1 or the magnet 2 attached to the upper cover 1 and the terminal base 3 and the space between the ferrite plate 5 and the heat conductor 10 having good heat conductivity, the heat conductor 10 having a volume of about 16 of the non-reciprocal circuit element volume is provided. Inserted as a percentage of the total. In the present embodiment, the silicone rubber sheet TC-50TXS manufactured by Shin-Etsu Silicone Co., Ltd. is used as the heat conductor 10 having good heat conductivity, but it may be in the form of a sheet, an oil compound or a curable rubber. Further, in this embodiment, two resistors 7 are configured in parallel as shown in FIG.
One or three or more terminations may be used, or multiple chip resistors may be used.

As the evaluation of the isolator in the present embodiment, the breakdown power (Table 1) and the electrical characteristics (Table 2) of the nonreciprocal circuit device due to the reverse input are shown in (Table 1) and (Table 2).

[0076]

[Table 1]

[0077]

[Table 2]

As can be seen from (Table 1), in the case of the present embodiment, the breakdown voltage in the reverse direction is 10 times or more that of the conventional product, and as shown in (Table 2), the characteristics are the same as those of the conventional product. Almost the same.

Further, as shown in FIG. 4, the temperature of the isolator when the signal from the standard signal generator is amplified by the amplifier and passed through the isolator in the forward direction is about 60 ° C. as shown in FIG. , Not much different from conventional products. Also,
As shown in FIG. 6, when the signal from the standard signal generator is amplified by the amplifier and is fed in the reverse direction, even if a current of 2.5 W is fed, the temperature of the isolator is 120 as shown in FIG. The temperature is below ℃, and there is no temperature rise enough to deteriorate the characteristics of the isolator.

The relationship between the surface temperature of the resistor inside the non-reciprocal circuit device and the volume of the heat conductor at the time of inputting 2 W in the reverse direction is shown in FIG.
It can be seen that there is a heat dissipation effect due to the relationship shown in.

In the present embodiment, 887 MHz.
An isolator that operates at 925 MHz (center frequency of 906 MHz) was produced, but the present invention is not limited to this frequency band. Further, the present invention is not limited to an isolator and is effective as a circulator.

Further, by inserting the heat conductor 10 having good heat conductivity into the space inside the non-reciprocal circuit element and bringing the heat conductor 10 into close contact with the resistor 7, the characteristics of the conventional non-reciprocal circuit element can be improved. A non-reciprocal circuit device that can guarantee forward 5 W and reverse 2 W without any loss becomes possible.

[0083]

According to the present invention, a magnetic substrate, strip lines insulated from each other on the main surface of the substrate and intersecting at a predetermined angle, a magnet for applying a magnetic field to the substrate, and a strip line are provided. Since the connected capacitor, the terminating resistor connected to the strip line, the case that houses each component, and the insulating heat conductor provided in the case are provided, the current flowing in the opposite direction can be prevented. Even if it becomes large, the heat generated inside can be efficiently diffused to other parts, and the heat dissipation effect can be improved. In addition, a larger operating power than that of the conventional non-reciprocal circuit device can be guaranteed, and a non-reciprocal circuit device having the same electrical characteristics and shape as those of the related art can be obtained.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a nonreciprocal circuit device according to an embodiment of the present invention.

FIG. 2 is a diagram showing external dimensions of a non-reciprocal circuit device.

FIG. 3 is a cross-sectional view of a nonreciprocal circuit device according to an embodiment of the present invention.

FIG. 4 is a diagram showing a measurement concept when 5 W is input in a forward direction to the non-reciprocal circuit device according to the embodiment of the present invention.

FIG. 5 is a graph showing a relationship between time and surface temperature of the nonreciprocal circuit device according to the embodiment of the present invention.

FIG. 6 is a diagram showing a measurement concept when electric power is input in the reverse direction to the non-reciprocal circuit device according to the embodiment of the present invention.

FIG. 7 is a graph showing the relationship between time and surface temperature for each power input in the reverse direction to the nonreciprocal circuit device according to the embodiment of the present invention.

FIG. 8 shows the relationship between the volume filling rate of the heat conductor and the temperature of the resistor inside the nonreciprocal circuit element when 2 W is input in the reverse direction to the nonreciprocal circuit element according to the embodiment of the present invention. Graph

FIG. 9 is a conceptual diagram showing a current flow of a general non-reciprocal circuit device.

FIG. 10 is a conceptual diagram showing a current flow of a general non-reciprocal circuit device.

FIG. 11 is an exploded perspective view showing a conventional non-reciprocal circuit device.

[Explanation of symbols]

1 Top cover 2 magnets 3 terminal base 3a, 3b Input / output terminals 4a, 4b, 4c Strip line 4d, 4e, 4f terminals 5 Ferrite plate 6 Insulation sheet 7 resistors 8a, 8b, 8c matching capacitors 9 lower case 9a Side surface of lower case 9b Lower case terminal (ground terminal) 10 heat conductor 11 Insulator

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Munenori Fujimura             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Hitoshi Uchi             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Hiroshi Kono             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5J013 EA01 FA00

Claims (10)

[Claims] 1. A magnetic substrate, a stripline insulated from each other on the main surface of the substrate and intersecting at a predetermined angle, a magnet for applying a magnetic field to the substrate, and a stripline connected to the stripline. A capacitor, a terminating resistor connected to a strip line, a case accommodating each of the constituent members, and an insulating heat conductor that occupies 2% to 75% of the volume of the nonreciprocal circuit device in the case. And a non-reciprocal circuit device. 2. The nonreciprocal circuit device according to claim 1, wherein a heat conductor is provided near the terminating resistor or in contact with the terminating resistor. 3. The nonreciprocal circuit device according to claim 1, wherein the heat conductor is made of a material having plasticity or elasticity. 4. The nonreciprocal circuit device according to claim 3, wherein the heat conductor is made of a resin material. 5. The nonreciprocal circuit device according to claim 2, wherein the thickness of the heat conductor provided on the terminating resistor is made larger than the thickness of the heat conductor provided on the other portion. 6. The nonreciprocal circuit device according to claim 1, wherein the heat conductor is brought into contact with at least one of the magnet and the case. 7. The nonreciprocal circuit device according to claim 1, wherein the heat conductor has adhesiveness, and the heat conductor is fixed in the case. 8. The nonreciprocal circuit device according to claim 1, wherein the heat conductor is made of a solid material or a material having a viscosity that does not flow out of the case. 9. The terminal base is further provided in the case, the terminal base having a housing portion for housing the substrate, and the shape of the terminal base is defined so that a part of the terminal base is not disposed on the terminating resistor. The nonreciprocal circuit device according to claim 1, wherein 10. The terminal base has an annular shape, a substrate is accommodated in a central portion of the terminal base, and an opening is provided in the terminal base as if a part of the terminal base was cut away, and the opening is the central portion. 10. It is connected with
The described non-reciprocal circuit device.