JP4504117B2 - 欠陥の深さを判定する方法 - Google Patents

欠陥の深さを判定する方法 Download PDF

Info

Publication number
JP4504117B2
JP4504117B2 JP2004190615A JP2004190615A JP4504117B2 JP 4504117 B2 JP4504117 B2 JP 4504117B2 JP 2004190615 A JP2004190615 A JP 2004190615A JP 2004190615 A JP2004190615 A JP 2004190615A JP 4504117 B2 JP4504117 B2 JP 4504117B2
Authority
JP
Japan
Prior art keywords
component
crack
infrared radiation
laser beam
radiation detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004190615A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005024556A (ja
JP2005024556A5 (enExample
Inventor
ジョン・ウィリアム・デビット
アンソニー・エス・バウコ
クレイグ・アラン・カンテロ
ケビン・ジー・ハーディング
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2005024556A publication Critical patent/JP2005024556A/ja
Publication of JP2005024556A5 publication Critical patent/JP2005024556A5/ja
Application granted granted Critical
Publication of JP4504117B2 publication Critical patent/JP4504117B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/72Investigating presence of flaws

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2004190615A 2003-06-30 2004-06-29 欠陥の深さを判定する方法 Expired - Fee Related JP4504117B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/609,812 US6874932B2 (en) 2003-06-30 2003-06-30 Methods for determining the depth of defects

Publications (3)

Publication Number Publication Date
JP2005024556A JP2005024556A (ja) 2005-01-27
JP2005024556A5 JP2005024556A5 (enExample) 2007-08-09
JP4504117B2 true JP4504117B2 (ja) 2010-07-14

Family

ID=33540927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004190615A Expired - Fee Related JP4504117B2 (ja) 2003-06-30 2004-06-29 欠陥の深さを判定する方法

Country Status (6)

Country Link
US (1) US6874932B2 (enExample)
EP (1) EP1505384A1 (enExample)
JP (1) JP4504117B2 (enExample)
BR (1) BRPI0402556A (enExample)
CA (1) CA2471334C (enExample)
SG (1) SG128465A1 (enExample)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7591583B2 (en) * 2005-05-18 2009-09-22 Federal-Mogul World Wide, Inc. Transient defect detection algorithm
US7467049B2 (en) * 2005-05-27 2008-12-16 American Electric Power Company, Inc. System and method for detecting impaired electric power equipment
US7632012B2 (en) * 2005-09-01 2009-12-15 Siemens Energy, Inc. Method of measuring in situ differential emissivity and temperature
US7553070B2 (en) * 2006-11-06 2009-06-30 The Boeing Company Infrared NDI for detecting shallow irregularities
JP5027606B2 (ja) * 2007-09-26 2012-09-19 株式会社キーエンス レーザ加工装置、加工データ生成方法及びコンピュータプログラム
US8393784B2 (en) * 2008-03-31 2013-03-12 General Electric Company Characterization of flaws in composites identified by thermography
US10853873B2 (en) 2008-10-02 2020-12-01 Ecoatm, Llc Kiosks for evaluating and purchasing used electronic devices and related technology
DE202009019027U1 (de) * 2008-10-02 2015-09-21 ecoATM, Inc. Sekundärmarkt und Verkaufssystem für Geräte
US9881284B2 (en) 2008-10-02 2018-01-30 ecoATM, Inc. Mini-kiosk for recycling electronic devices
US7881965B2 (en) 2008-10-02 2011-02-01 ecoATM, Inc. Secondary market and vending system for devices
US20130124426A1 (en) * 2008-10-02 2013-05-16 ecoATM, Inc. Method And Apparatus For Recycling Electronic Devices
US11010841B2 (en) 2008-10-02 2021-05-18 Ecoatm, Llc Kiosk for recycling electronic devices
US20100140236A1 (en) * 2008-12-04 2010-06-10 General Electric Company Laser machining system and method
WO2010106639A1 (ja) * 2009-03-17 2010-09-23 西日本高速道路エンジニアリング四国株式会社 構造物の損傷深さ判定方法とその装置及び構造物の損傷処置判定方法とその装置
JP5414058B2 (ja) * 2010-03-10 2014-02-12 独立行政法人産業技術総合研究所 熱拡散率測定装置
CA3210819A1 (en) 2011-04-06 2012-10-11 Ecoatm, Llc Method and kiosk for recycling electronic devices
US8755044B2 (en) * 2011-08-15 2014-06-17 Kla-Tencor Corporation Large particle detection for multi-spot surface scanning inspection systems
KR101429348B1 (ko) * 2012-09-05 2014-08-13 한국원자력연구원 시편의 내부결함 검출을 위한 비접촉식 영상 검사 방법 및 장치
US9041408B2 (en) * 2013-01-16 2015-05-26 Hrl Laboratories, Llc Removable surface-wave networks for in-situ material health monitoring
US8759770B1 (en) * 2013-04-08 2014-06-24 General Electric Company System and method for qualifying usability risk associated with subsurface defects in a multilayer coating
KR101580844B1 (ko) * 2014-05-08 2015-12-30 한국수력원자력(주) 발전소 가열 및 냉각 운전 과도사건의 피로평가에서 보정계수 산출방법
JP6304880B2 (ja) * 2014-06-17 2018-04-04 株式会社Ihi 非破壊検査装置
WO2016047093A1 (ja) * 2014-09-25 2016-03-31 日本電気株式会社 状態判定装置および状態判定方法
US10401411B2 (en) 2014-09-29 2019-09-03 Ecoatm, Llc Maintaining sets of cable components used for wired analysis, charging, or other interaction with portable electronic devices
CA2964214C (en) 2014-10-02 2020-08-04 ecoATM, Inc. Wireless-enabled kiosk for recycling consumer devices
CA2964223C (en) 2014-10-02 2020-04-14 ecoATM, Inc. Application for device evaluation and other processes associated with device recycling
US10445708B2 (en) 2014-10-03 2019-10-15 Ecoatm, Llc System for electrically testing mobile devices at a consumer-operated kiosk, and associated devices and methods
EP3213280B1 (en) 2014-10-31 2021-08-18 ecoATM, LLC Systems and methods for recycling consumer electronic devices
WO2016069742A1 (en) 2014-10-31 2016-05-06 ecoATM, Inc. Methods and systems for facilitating processes associated with insurance services and/or other services for electronic devices
CA3227945A1 (en) 2014-11-06 2016-05-12 Ecoatm, Llc Methods and systems for evaluating and recycling electronic devices
WO2016094789A1 (en) 2014-12-12 2016-06-16 ecoATM, Inc. Systems and methods for recycling consumer electronic devices
CN105784754A (zh) * 2016-02-25 2016-07-20 山西省交通科学研究院 一种预应力混凝土结构预应力孔道密实度检测系统及方法
FR3049701B1 (fr) * 2016-03-31 2018-04-27 Espci Procede, methode et dispositif de determination de la profondeur d'une fissure dans un solide
US10127647B2 (en) 2016-04-15 2018-11-13 Ecoatm, Llc Methods and systems for detecting cracks in electronic devices
US9885672B2 (en) 2016-06-08 2018-02-06 ecoATM, Inc. Methods and systems for detecting screen covers on electronic devices
US10269110B2 (en) 2016-06-28 2019-04-23 Ecoatm, Llc Methods and systems for detecting cracks in illuminated electronic device screens
FR3053469B1 (fr) * 2016-06-30 2018-08-17 Areva Np Procede d'inspection d'une surface metallique et dispositif associe
CN109804119B (zh) * 2016-12-30 2021-03-19 同济大学 基于红外热像图分析的沥青路面裂缝发育程度检测方法
US10241036B2 (en) * 2017-05-08 2019-03-26 Siemens Energy, Inc. Laser thermography
CN108254410B (zh) * 2017-12-27 2020-04-03 中国人民解放军陆军装甲兵学院 基于红外检测的喷涂层接触疲劳寿命预测方法及装置
US10551327B2 (en) * 2018-04-11 2020-02-04 General Electric Company Cooling hole inspection system
CN109614892A (zh) * 2018-11-26 2019-04-12 青岛小鸟看看科技有限公司 一种疲劳驾驶检测方法、装置和电子设备
EP3884475A1 (en) 2018-12-19 2021-09-29 ecoATM, LLC Systems and methods for vending and/or purchasing mobile phones and other electronic devices
US12322259B2 (en) 2018-12-19 2025-06-03 Ecoatm, Llc Systems and methods for vending and/or purchasing mobile phones and other electronic devices
EP3924918A1 (en) 2019-02-12 2021-12-22 ecoATM, LLC Kiosk for evaluating and purchasing used electronic devices
CA3129917A1 (en) 2019-02-12 2020-08-20 Ecoatm, Llc Connector carrier for electronic device kiosk
KR20210127199A (ko) 2019-02-18 2021-10-21 에코에이티엠, 엘엘씨 전자 디바이스의 신경망 기반의 물리적 상태 평가, 및 관련된 시스템 및 방법
US12380420B2 (en) 2019-12-18 2025-08-05 Ecoatm, Llc Systems and methods for vending and/or purchasing mobile phones and other electronic devices
WO2022040668A1 (en) 2020-08-17 2022-02-24 Ecoatm, Llc Evaluating an electronic device using optical character recognition
US12271929B2 (en) 2020-08-17 2025-04-08 Ecoatm Llc Evaluating an electronic device using a wireless charger
EP4197083B1 (en) 2020-08-17 2024-10-09 ecoATM, LLC Connector carrier for electronic device kiosk
US11922467B2 (en) 2020-08-17 2024-03-05 ecoATM, Inc. Evaluating an electronic device using optical character recognition
JP2023538776A (ja) 2020-08-25 2023-09-11 エコエーティーエム, エルエルシー 電子デバイスの評価および再生利用
US11810288B2 (en) 2020-09-04 2023-11-07 General Electric Company Systems and methods for generating a single observation image to analyze coating defects
US11603593B2 (en) 2020-09-04 2023-03-14 General Electric Company Systems and methods for automatic detection of coating defects
JP2024525616A (ja) 2021-07-09 2024-07-12 エコエーティーエム, エルエルシー 経時変化する情報を使用した電子デバイスの識別
DE102021124565A1 (de) * 2021-09-22 2023-03-23 Infineon Technologies Ag Vorrichtung und verfahren zum aufspüren von rissen in proben mit hilfe von infrarotstrahlung

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US511048A (en) * 1893-12-19 Work-bench for saloons
USRE32166E (en) * 1979-01-17 1986-06-03 Elkem A/S Detection of flaws in metal members
US4266185A (en) * 1979-02-16 1981-05-05 Dover & Partners Limited Probes and apparatus for and methods of measuring crack depths
US4345457A (en) * 1979-12-27 1982-08-24 Kuroki Kogyosho Co., Ltd. Method for detecting the depth of cracks in rolls used for transferring hot steel ingot bloom and rolls used therefor
DE3034944C2 (de) * 1980-09-01 1985-01-17 Gerhard Dr. 8029 Sauerlach Busse Verfahren und Einrichtung zur photothermischen Struktur-Untersuchung fester Körper
US4647220A (en) * 1984-07-09 1987-03-03 Lockheed Corporation Method of and apparatus for detecting corrosion utilizing infrared analysis
JPS62126339A (ja) * 1985-11-28 1987-06-08 Komatsu Ltd 内部欠陥の検出方法および装置
GB2197465B (en) * 1986-09-17 1990-05-30 Atomic Energy Authority Uk Crack sizing
US4760304A (en) * 1986-11-24 1988-07-26 General Electric Company Dark field coaxial ultrasonic transducer
JPH01151246A (ja) * 1987-12-08 1989-06-14 Ricoh Co Ltd 半導体集積回路装置の多層配線
US4983836A (en) * 1988-06-30 1991-01-08 Nkk Corporation Method for detecting thinned out portion on inner surface or outer surface of pipe
JPH0212044A (ja) * 1988-06-30 1990-01-17 Nkk Corp 赤外線カメラによる欠陥部の検出方法
US5131758A (en) * 1990-05-16 1992-07-21 Administrator Of The National Aeronautics And Space Administration Method of remotely characterizing thermal properties of a sample
US5111048A (en) * 1990-09-27 1992-05-05 General Electric Company Apparatus and method for detecting fatigue cracks using infrared thermography
US5748003A (en) * 1991-07-29 1998-05-05 Colorado State University Research Foundation Microwaves used for determining fatigue and surface crack features on metal surfaces
JPH05296956A (ja) * 1992-04-24 1993-11-12 Toshiba Corp 表面探傷装置
US5302830A (en) * 1993-03-05 1994-04-12 General Research Corporation Method for measuring thermal differences in infrared emissions from micro devices
US5810477A (en) * 1993-04-30 1998-09-22 International Business Machines Corporation System for identifying surface conditions of a moving medium
US20020018510A1 (en) * 1996-07-31 2002-02-14 Murphy John C. Thermal-based methods for nondestructive evaluation
FR2760528B1 (fr) * 1997-03-05 1999-05-21 Framatome Sa Procede et dispositif d'examen photothermique d'un materiau
JPH11337511A (ja) * 1998-05-25 1999-12-10 Advantest Corp 回路検査装置および方法
US7083327B1 (en) * 1999-04-06 2006-08-01 Thermal Wave Imaging, Inc. Method and apparatus for detecting kissing unbond defects
US6236049B1 (en) * 1999-09-16 2001-05-22 Wayne State University Infrared imaging of ultrasonically excited subsurface defects in materials
US6437334B1 (en) * 1999-09-16 2002-08-20 Wayne State University System and method for detecting cracks in a tooth by ultrasonically exciting and thermally imaging the tooth
US6751342B2 (en) * 1999-12-02 2004-06-15 Thermal Wave Imaging, Inc. System for generating thermographic images using thermographic signal reconstruction
DE10158095B4 (de) * 2001-05-05 2012-03-22 Lpkf Laser & Electronics Ag Vorrichtung zur Kontrolle einer Schweißnaht in einem aus schweißfähigem Kunststoff bestehenden Werkstück

Also Published As

Publication number Publication date
BRPI0402556A (pt) 2005-05-03
CA2471334C (en) 2010-02-09
CA2471334A1 (en) 2004-12-30
US20040262521A1 (en) 2004-12-30
US6874932B2 (en) 2005-04-05
JP2005024556A (ja) 2005-01-27
SG128465A1 (en) 2007-01-30
EP1505384A1 (en) 2005-02-09

Similar Documents

Publication Publication Date Title
JP4504117B2 (ja) 欠陥の深さを判定する方法
US5111048A (en) Apparatus and method for detecting fatigue cracks using infrared thermography
CA2671741C (en) Improved laser-ultrasound inspection using infrared thermography
US10605662B2 (en) Material property determination using photothermal speckle detection
EP0129205B1 (en) Noncontacting ultrasonic flaw detecting method
US10094794B2 (en) Characterization of wrinkles and periodic variations in material using infrared thermography
Burrows et al. Thermographic detection of surface breaking defects using a scanning laser source
JP6301951B2 (ja) サーモグラフィを用いた試料の検査方法およびシステム
US7966883B2 (en) Non-destructive inspection using laser-ultrasound and infrared thermography
JP5307155B2 (ja) レーザ超音波及び赤外線サーモグラフィを使用する非破壊検査
US6226079B1 (en) Defect assessing apparatus and method, and semiconductor manufacturing method
KR102355963B1 (ko) 레이저 서모그래피
Pech‐May et al. Robot‐assisted crack detection on complex shaped components using constant‐speed scanning infrared thermography with laser line excitation
US20130088707A1 (en) Method and system for crack detection
An et al. Laser lock-in thermography for fatigue crack detection in an uncoated metallic structure
JP2007315964A (ja) 水中欠陥検査装置及び水中欠陥検査方法
US7302360B2 (en) Defect size projection
Lehtiniemi et al. A photothermal line-scanning system for NDT of plasma-sprayed coatings of nuclear power plant components
Clough Uncertainty in Thermographic Non-destructive Testing
WO2024050586A3 (de) Thermographische bauteilprüfung

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070626

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070626

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080805

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20081104

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20081107

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090204

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090609

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091008

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20091008

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20091008

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20091102

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100330

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100422

R150 Certificate of patent or registration of utility model

Ref document number: 4504117

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130430

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130430

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140430

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees