JP4493350B2 - 放熱モジュールの構造およびその製造方法 - Google Patents
放熱モジュールの構造およびその製造方法 Download PDFInfo
- Publication number
- JP4493350B2 JP4493350B2 JP2004010221A JP2004010221A JP4493350B2 JP 4493350 B2 JP4493350 B2 JP 4493350B2 JP 2004010221 A JP2004010221 A JP 2004010221A JP 2004010221 A JP2004010221 A JP 2004010221A JP 4493350 B2 JP4493350 B2 JP 4493350B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- base plate
- fins
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 230000017525 heat dissipation Effects 0.000 title claims description 14
- 230000005855 radiation Effects 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 8
- 238000005304 joining Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004010221A JP4493350B2 (ja) | 2004-01-19 | 2004-01-19 | 放熱モジュールの構造およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004010221A JP4493350B2 (ja) | 2004-01-19 | 2004-01-19 | 放熱モジュールの構造およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005203665A JP2005203665A (ja) | 2005-07-28 |
| JP2005203665A5 JP2005203665A5 (zh) | 2006-01-12 |
| JP4493350B2 true JP4493350B2 (ja) | 2010-06-30 |
Family
ID=34823015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004010221A Expired - Fee Related JP4493350B2 (ja) | 2004-01-19 | 2004-01-19 | 放熱モジュールの構造およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4493350B2 (zh) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100464621C (zh) * | 2006-05-12 | 2009-02-25 | 富准精密工业(深圳)有限公司 | 散热装置 |
| JP5041346B2 (ja) * | 2006-06-02 | 2012-10-03 | 株式会社安川電機 | モータ制御装置 |
| KR100790790B1 (ko) | 2006-09-14 | 2008-01-02 | (주)셀시아테크놀러지스한국 | 집적회로용 히트싱크 및 쿨러 |
| TW200830976A (en) * | 2007-01-11 | 2008-07-16 | Delta Electronics Inc | Heat dissipating apparatus, heat dissipating base and its manufacturing method |
| TW200821811A (en) * | 2008-01-11 | 2008-05-16 | Chung-Shian Huang | Heat dissipation device without a base |
| KR200447710Y1 (ko) * | 2008-02-04 | 2010-02-11 | 충-시엔 후앙 | 열파이프를 구비한 개선된 방열기 |
| KR20110033596A (ko) * | 2009-09-25 | 2011-03-31 | 잘만테크 주식회사 | 전자부품용 냉각장치 |
| WO2011087117A1 (ja) * | 2010-01-18 | 2011-07-21 | 古河電気工業株式会社 | ヒートシンク |
| JP5373829B2 (ja) * | 2011-01-17 | 2013-12-18 | 奇▲こう▼科技股▲ふん▼有限公司 | 散熱モジュールの組合せ方法 |
| CN110227397B (zh) * | 2018-03-06 | 2024-03-29 | 山东豪迈化工技术有限公司 | 一种可视流动微反应器 |
-
2004
- 2004-01-19 JP JP2004010221A patent/JP4493350B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005203665A (ja) | 2005-07-28 |
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